JP5542623B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP5542623B2 JP5542623B2 JP2010250536A JP2010250536A JP5542623B2 JP 5542623 B2 JP5542623 B2 JP 5542623B2 JP 2010250536 A JP2010250536 A JP 2010250536A JP 2010250536 A JP2010250536 A JP 2010250536A JP 5542623 B2 JP5542623 B2 JP 5542623B2
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- 239000004065 semiconductor Substances 0.000 title claims description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000012535 impurity Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 210000000746 body region Anatomy 0.000 description 33
- 230000015556 catabolic process Effects 0.000 description 16
- 239000010410 layer Substances 0.000 description 16
- 239000011229 interlayer Substances 0.000 description 12
- 238000005468 ion implantation Methods 0.000 description 10
- 230000003071 parasitic effect Effects 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 230000005684 electric field Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1087—Substrate region of field-effect devices of field-effect transistors with insulated gate characterised by the contact structure of the substrate region, e.g. for controlling or preventing bipolar effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66515—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned selective metal deposition simultaneously on the gate and on source or drain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
- H01L29/7835—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with asymmetrical source and drain regions, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
- H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
- H01L29/1041—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
- H01L29/1045—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface the doping structure being parallel to the channel length, e.g. DMOS like
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
図1は、第1実施形態に係る半導体装置の模式平面図であり、ドレイン領域25、ソース領域24、バックゲート領域26およびゲート電極28の平面レイアウトを示す。
図2(a)は図1におけるA−A’断面図であり、図2(b)は図1におけるB−B’断面図である。
図6は、第2実施形態に係る半導体装置の模式平面図であり、ドレイン領域25、ソース領域24、バックゲート領域46およびゲート電極28の平面レイアウトを示す。
図7(a)は図6におけるC−C’断面図であり、図7(b)は図6におけるD−D’断面図である。
Claims (3)
- 第1の領域と、前記第1の領域に対して離間した第2の領域とを有する半導体層と、
前記第1の領域の表面に設けられた第1導電形のソース領域と、
前記第1の領域の表面に前記ソース領域に隣接して設けられた第2導電形のバックゲート領域と、
前記第2の領域の表面に設けられた第1導電形のドレイン領域と、
前記第1の領域と前記第2の領域との間の前記半導体層の表面上に設けられたゲート絶縁膜と、
前記ゲート絶縁膜上に設けられたゲート電極と、
前記ソース領域及び前記バックゲート領域に接して設けられたソース電極と、
前記ドレイン領域に接して設けられたドレイン電極と、
を備え、
前記バックゲート領域は、平面視で前記ソース領域から離間し前記ソース領域よりも前記ドレイン領域側に突出した領域を有し、
前記ゲート電極は、前記バックゲート領域の前記突出した領域の上を部分的に欠いた平面パターンを有することを特徴とする半導体装置。 - 前記ゲート電極において、前記バックゲート領域と前記ドレイン領域との間の部分の長さは、前記ソース領域と前記ドレイン領域との間の部分の長さよりも短いことを特徴とする請求項1記載の半導体装置。
- 半導体層における第1の領域と第2の領域との間の表面上に、ゲート絶縁膜を形成する工程と、
前記ゲート絶縁膜上に、ゲート電極を形成する工程と、
前記第1の領域の表面に第1導電形のソース領域を、前記第2の領域の表面に第1導電形のドレイン領域を形成する工程と、
前記第1の領域の表面に、前記ソース領域よりも前記ドレイン領域側の端を前記ドレイン領域側に突出させて前記ソース領域に隣接した第2導電形のバックゲート領域を形成する工程と、
前記ソース領域及び前記バックゲート領域上にソース電極を形成する工程と、
前記ドレイン領域上にドレイン電極を形成する工程と、
を備え、
前記ゲート電極における前記第1の領域側の一部を、平面視で凹状に形成し、
前記バックゲート領域を形成する工程は、前記ソース領域に対応する部分の上を覆い前記ゲート電極の前記凹状に形成した部分を露出させる開口を有する第1のマスクを前記ゲート電極の上に形成し、前記第1のマスクと前記ゲート電極とをマスクにして、前記ゲート電極の前記凹状に形成した部分であって前記ソース領域に対応する部分から離間した部分の下に第2導電形不純物を導入する工程を含むことを特徴とする半導体装置の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010250536A JP5542623B2 (ja) | 2010-11-09 | 2010-11-09 | 半導体装置及びその製造方法 |
US13/050,404 US8530942B2 (en) | 2010-11-09 | 2011-03-17 | Semiconductor device and method of fabricating the same |
US13/954,718 US9112016B2 (en) | 2010-11-09 | 2013-07-30 | Semiconductor device and method of fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2010250536A JP5542623B2 (ja) | 2010-11-09 | 2010-11-09 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
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JP2012104581A JP2012104581A (ja) | 2012-05-31 |
JP5542623B2 true JP5542623B2 (ja) | 2014-07-09 |
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JP2010250536A Expired - Fee Related JP5542623B2 (ja) | 2010-11-09 | 2010-11-09 | 半導体装置及びその製造方法 |
Country Status (2)
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US (2) | US8530942B2 (ja) |
JP (1) | JP5542623B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101867953B1 (ko) | 2011-12-22 | 2018-06-18 | 삼성전자주식회사 | 반도체 소자 및 반도체 소자의 형성 방법 |
CN103700703B (zh) * | 2013-12-30 | 2016-09-28 | 杭州电子科技大学 | 基于soi工艺的漏/源区介质(pn结)隔离前栅n-mosfet射频开关超低损耗器件 |
US9306059B2 (en) * | 2014-03-20 | 2016-04-05 | Kinetic Technologies | Power semiconductor transistor with improved gate charge |
JP7526010B2 (ja) * | 2020-03-04 | 2024-07-31 | ローム株式会社 | 半導体装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3186421B2 (ja) * | 1994-05-13 | 2001-07-11 | 富士電機株式会社 | 半導体装置の製造方法 |
US6489653B2 (en) | 1999-12-27 | 2002-12-03 | Kabushiki Kaisha Toshiba | Lateral high-breakdown-voltage transistor |
US20020079514A1 (en) * | 2000-12-27 | 2002-06-27 | Hower Philip L. | Metal-oxide-semiconductor transistor structure and method of manufacturing same |
US7671411B2 (en) * | 2006-03-02 | 2010-03-02 | Volterra Semiconductor Corporation | Lateral double-diffused MOSFET transistor with a lightly doped source |
JP2007258283A (ja) * | 2006-03-21 | 2007-10-04 | Toyota Motor Corp | 絶縁ゲート型半導体装置 |
JP5168914B2 (ja) * | 2007-01-23 | 2013-03-27 | 株式会社デンソー | 半導体装置の製造方法 |
JP2009277963A (ja) | 2008-05-16 | 2009-11-26 | Toshiba Corp | 半導体装置 |
JP2010278312A (ja) * | 2009-05-29 | 2010-12-09 | Sanyo Electric Co Ltd | 半導体装置 |
JP4897029B2 (ja) * | 2009-11-09 | 2012-03-14 | 株式会社東芝 | 半導体装置 |
US20120007140A1 (en) * | 2010-07-12 | 2012-01-12 | National Semiconductor Corporation | ESD self protecting NLDMOS device and NLDMOS array |
-
2010
- 2010-11-09 JP JP2010250536A patent/JP5542623B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-17 US US13/050,404 patent/US8530942B2/en not_active Expired - Fee Related
-
2013
- 2013-07-30 US US13/954,718 patent/US9112016B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US9112016B2 (en) | 2015-08-18 |
US8530942B2 (en) | 2013-09-10 |
US20120112274A1 (en) | 2012-05-10 |
US20140035031A1 (en) | 2014-02-06 |
JP2012104581A (ja) | 2012-05-31 |
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