JP5530830B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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JP5530830B2
JP5530830B2 JP2010146234A JP2010146234A JP5530830B2 JP 5530830 B2 JP5530830 B2 JP 5530830B2 JP 2010146234 A JP2010146234 A JP 2010146234A JP 2010146234 A JP2010146234 A JP 2010146234A JP 5530830 B2 JP5530830 B2 JP 5530830B2
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sealing resin
shield layer
semiconductor device
view
substrate
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JP2012009745A5 (enExample
JP2012009745A (ja
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貞和 赤池
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2010146234A 2010-06-28 2010-06-28 半導体装置及びその製造方法 Active JP5530830B2 (ja)

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JP2010146234A JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

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JP2010146234A JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

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JP2012009745A JP2012009745A (ja) 2012-01-12
JP2012009745A5 JP2012009745A5 (enExample) 2013-06-06
JP5530830B2 true JP5530830B2 (ja) 2014-06-25

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5751079B2 (ja) * 2011-08-05 2015-07-22 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP2014146624A (ja) * 2013-01-25 2014-08-14 Murata Mfg Co Ltd モジュールおよびその製造方法
KR102060307B1 (ko) 2018-01-30 2019-12-30 공주대학교 산학협력단 반도체 패키지
WO2020196522A1 (ja) 2019-03-26 2020-10-01 株式会社村田製作所 モジュール
WO2021006141A1 (ja) 2019-07-08 2021-01-14 株式会社村田製作所 モジュールおよびその製造方法
WO2021131774A1 (ja) * 2019-12-27 2021-07-01 株式会社村田製作所 モジュール
WO2021220373A1 (ja) * 2020-04-27 2021-11-04 三菱電機株式会社 半導体装置
US11610847B2 (en) 2021-05-07 2023-03-21 STATS ChipPAC Pte. Ltd. Laser-based redistribution and multi-stacked packages

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552821B2 (ja) * 2010-01-28 2014-07-16 Ｔｄｋ株式会社 回路モジュール

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