JP2012009745A5 - - Google Patents
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- Publication number
- JP2012009745A5 JP2012009745A5 JP2010146234A JP2010146234A JP2012009745A5 JP 2012009745 A5 JP2012009745 A5 JP 2012009745A5 JP 2010146234 A JP2010146234 A JP 2010146234A JP 2010146234 A JP2010146234 A JP 2010146234A JP 2012009745 A5 JP2012009745 A5 JP 2012009745A5
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- shield layer
- semiconductor device
- recess
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010146234A JP5530830B2 (ja) | 2010-06-28 | 2010-06-28 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010146234A JP5530830B2 (ja) | 2010-06-28 | 2010-06-28 | 半導体装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012009745A JP2012009745A (ja) | 2012-01-12 |
| JP2012009745A5 true JP2012009745A5 (enExample) | 2013-06-06 |
| JP5530830B2 JP5530830B2 (ja) | 2014-06-25 |
Family
ID=45539931
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010146234A Active JP5530830B2 (ja) | 2010-06-28 | 2010-06-28 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5530830B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5751079B2 (ja) * | 2011-08-05 | 2015-07-22 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
| JP2014146624A (ja) * | 2013-01-25 | 2014-08-14 | Murata Mfg Co Ltd | モジュールおよびその製造方法 |
| KR102060307B1 (ko) | 2018-01-30 | 2019-12-30 | 공주대학교 산학협력단 | 반도체 패키지 |
| WO2020196522A1 (ja) | 2019-03-26 | 2020-10-01 | 株式会社村田製作所 | モジュール |
| WO2021006141A1 (ja) | 2019-07-08 | 2021-01-14 | 株式会社村田製作所 | モジュールおよびその製造方法 |
| WO2021131774A1 (ja) * | 2019-12-27 | 2021-07-01 | 株式会社村田製作所 | モジュール |
| WO2021220373A1 (ja) * | 2020-04-27 | 2021-11-04 | 三菱電機株式会社 | 半導体装置 |
| US11610847B2 (en) | 2021-05-07 | 2023-03-21 | STATS ChipPAC Pte. Ltd. | Laser-based redistribution and multi-stacked packages |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5552821B2 (ja) * | 2010-01-28 | 2014-07-16 | Ｔｄｋ株式会社 | 回路モジュール |
-
2010
- 2010-06-28 JP JP2010146234A patent/JP5530830B2/ja active Active
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