JP5518743B2 - 新規なポジ型感光性樹脂組成物 - Google Patents

新規なポジ型感光性樹脂組成物 Download PDF

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Publication number
JP5518743B2
JP5518743B2 JP2010545213A JP2010545213A JP5518743B2 JP 5518743 B2 JP5518743 B2 JP 5518743B2 JP 2010545213 A JP2010545213 A JP 2010545213A JP 2010545213 A JP2010545213 A JP 2010545213A JP 5518743 B2 JP5518743 B2 JP 5518743B2
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Japanese (ja)
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JP2011512552A5 (https=
JP2011512552A (ja
Inventor
エイ． ナイーニ、アーマッド
ラッシュキン、イリヤ
ディ． ウェーバー、ウィリアム
ダブリュ． ラシコット、ドナルド
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Fujifilm Electronic Materials USA Inc
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Fujifilm Electronic Materials USA Inc
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2010545213A 2008-02-04 2009-01-30 新規なポジ型感光性樹脂組成物 Active JP5518743B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US2607508P 2008-02-04 2008-02-04
US61/026,075 2008-02-04
PCT/US2009/032675 WO2009099954A1 (en) 2008-02-04 2009-01-30 Novel positive photosensitive resin compositions

Publications (3)

Publication Number Publication Date
JP2011512552A JP2011512552A (ja) 2011-04-21
JP2011512552A5 JP2011512552A5 (https=) 2013-12-26
JP5518743B2 true JP5518743B2 (ja) 2014-06-11

Family

ID=40931973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010545213A Active JP5518743B2 (ja) 2008-02-04 2009-01-30 新規なポジ型感光性樹脂組成物

Country Status (4)

Country Link
US (1) US9519216B2 (https=)
JP (1) JP5518743B2 (https=)
TW (1) TWI471361B (https=)
WO (1) WO2009099954A1 (https=)

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CA2640517A1 (en) * 2008-05-19 2009-11-19 Industry-University Cooperation Foundation, Hanyang University Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom
US8013103B2 (en) * 2008-10-10 2011-09-06 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
US8487064B2 (en) 2008-10-10 2013-07-16 Industry-University Cooperation Foundation, Hanyang University Polymer compounds and a preparation method thereof
JP2011186432A (ja) * 2009-12-15 2011-09-22 Rohm & Haas Electronic Materials Llc フォトレジストおよびその使用方法
JP5937104B2 (ja) 2010-12-29 2016-06-22 プロメラス， エルエルシー 仮接着のためのポリマー組成物
JP5745338B2 (ja) * 2011-05-24 2015-07-08 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法
KR101413078B1 (ko) * 2011-12-30 2014-07-02 제일모직 주식회사 포지티브형 감광성 수지 조성물
JP6260531B2 (ja) * 2012-05-17 2018-01-17 Jsr株式会社 酸拡散制御剤、感放射線性樹脂組成物及びレジストパターン形成方法
CN105814488B (zh) 2013-12-11 2019-11-05 富士胶片株式会社 感光性树脂组合物、固化膜的制造方法、固化膜、液晶显示装置及有机el显示装置
JPWO2015087830A1 (ja) * 2013-12-11 2017-03-16 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
TWI627502B (zh) * 2014-09-04 2018-06-21 Fujifilm Corp 感光性樹脂組成物、硬化膜的製造方法、硬化膜、液晶顯示裝置、有機電激發光顯示裝置及觸控面板
CN106796399B (zh) * 2014-10-02 2021-01-22 艾曲迪微系统股份有限公司 正型感光性树脂组合物、图案固化膜的制造方法、固化物、层间绝缘膜、覆盖涂层、表面保护膜和电子部件
CN106687864B (zh) * 2014-11-26 2020-07-03 日立化成株式会社 感光性树脂组合物、感光性元件、固化物、半导体装置、抗蚀图案的形成方法及电路基材的制造方法
JP6349335B2 (ja) * 2015-04-28 2018-06-27 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
WO2017151160A1 (en) * 2016-03-01 2017-09-08 Fujifilm Electronic Materials U.S.A., Inc. Dry film structure
TW202122468A (zh) * 2019-11-21 2021-06-16 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化性樹脂組成物的製造方法、硬化膜、積層體、硬化膜的製造方法及半導體元件
CN115280188A (zh) 2020-01-16 2022-11-01 富士胶片电子材料美国有限公司 干膜
JP2023534634A (ja) 2020-07-02 2023-08-10 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 誘電体膜形成組成物
TWI776586B (zh) * 2021-07-09 2022-09-01 律勝科技股份有限公司 聚苯并噁唑前驅物及其應用

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JP4659614B2 (ja) * 2005-12-28 2011-03-30 富士フイルム株式会社 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
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Also Published As

Publication number Publication date
TW200942566A (en) 2009-10-16
US20090197067A1 (en) 2009-08-06
WO2009099954A1 (en) 2009-08-13
US9519216B2 (en) 2016-12-13
TWI471361B (zh) 2015-02-01
JP2011512552A (ja) 2011-04-21

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