JP5504812B2 - ポリアミド樹脂およびポリアミド樹脂組成物 - Google Patents

ポリアミド樹脂およびポリアミド樹脂組成物 Download PDF

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Publication number
JP5504812B2
JP5504812B2 JP2009233993A JP2009233993A JP5504812B2 JP 5504812 B2 JP5504812 B2 JP 5504812B2 JP 2009233993 A JP2009233993 A JP 2009233993A JP 2009233993 A JP2009233993 A JP 2009233993A JP 5504812 B2 JP5504812 B2 JP 5504812B2
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Japan
Prior art keywords
acid
polyamide resin
weight
component
resin according
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Expired - Fee Related
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JP2009233993A
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English (en)
Japanese (ja)
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JP2010121113A (ja
JP2010121113A5 (https=
Inventor
大 秋田
公哉 加藤
英夫 松岡
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Toray Industries Inc
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Toray Industries Inc
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Priority to JP2009233993A priority Critical patent/JP5504812B2/ja
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  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polyamides (AREA)
JP2009233993A 2008-10-22 2009-10-08 ポリアミド樹脂およびポリアミド樹脂組成物 Expired - Fee Related JP5504812B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009233993A JP5504812B2 (ja) 2008-10-22 2009-10-08 ポリアミド樹脂およびポリアミド樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008271874 2008-10-22
JP2008271874 2008-10-22
JP2009233993A JP5504812B2 (ja) 2008-10-22 2009-10-08 ポリアミド樹脂およびポリアミド樹脂組成物

Publications (3)

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JP2010121113A JP2010121113A (ja) 2010-06-03
JP2010121113A5 JP2010121113A5 (https=) 2012-09-06
JP5504812B2 true JP5504812B2 (ja) 2014-05-28

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ID=42322715

Family Applications (1)

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JP2009233993A Expired - Fee Related JP5504812B2 (ja) 2008-10-22 2009-10-08 ポリアミド樹脂およびポリアミド樹脂組成物

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JP (1) JP5504812B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5369676B2 (ja) * 2008-12-26 2013-12-18 東レ株式会社 ポリアミド樹脂
ES2620755T3 (es) 2010-07-27 2017-06-29 Mitsubishi Gas Chemical Company, Inc. Resina de poliamida
JP5567928B2 (ja) * 2010-07-30 2014-08-06 ユニチカ株式会社 ポリアミドの製造方法
CN103732653A (zh) 2011-08-17 2014-04-16 东丽株式会社 结晶性聚酰胺树脂的制造方法
US9932444B2 (en) 2012-11-12 2018-04-03 Mitsui Chemicals, Inc. Semiaromatic polyamide, semiaromatic polyamide resin composition, and molded article
CN113330052B (zh) * 2019-01-22 2024-06-25 索尔维特殊聚合物美国有限责任公司 半芳香族、半晶质聚酰胺聚合物及相应聚合物组合物和制品
CN113214474B (zh) * 2020-01-21 2023-07-04 上海凯赛生物技术股份有限公司 一种聚酰胺热熔胶及其制备方法
CN115260487B (zh) * 2022-08-30 2023-04-18 浙江新力新材料股份有限公司 一种低吸水性的生物基聚酰胺树脂及其制备方法与应用
WO2024219348A1 (ja) * 2023-04-18 2024-10-24 Ｕｂｅ株式会社 共重合ポリアミド樹脂並びにそれを含む組成物、成形品、フィルム及びモノフィラメント
CN116675990A (zh) * 2023-06-06 2023-09-01 黄河科技学院 一种含有空心微球吸波剂的3d打印用光敏树脂

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003599A (ja) * 2000-06-19 2002-01-09 Toray Ind Inc ポリアミドの製造方法、それから得られるポリアミドおよびポリアミド成形体
JP2002003600A (ja) * 2000-06-19 2002-01-09 Toray Ind Inc ポリアミドの製造方法、それから得られるポリアミドおよびポリアミド成形品
JP2003292614A (ja) * 2002-04-05 2003-10-15 Toray Ind Inc ポリアミド樹脂
JP4192622B2 (ja) * 2003-02-19 2008-12-10 東レ株式会社 ポリアミド樹脂組成物

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JP2010121113A (ja) 2010-06-03

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