JP5503760B1 - LIGHT SOURCE DEVICE, LIGHTING DEVICE EQUIPPED WITH THE SAME, AND METHOD FOR MANUFACTURING LIGHT SOURCE DEVICE - Google Patents

Abstract

A low-cost light source device that has good productivity and can be adapted to various illumination devices, an illumination device including the light source device, and a method for manufacturing the light source device.
A light source device K according to the present invention includes a metal layer 2, a resin layer 3 provided on the metal layer 2, and a metal wiring pattern 4a1 provided on the resin layer 3 for supplying power. ... 4c2 mounting substrate 5, wiring pattern 41, ... 4c2, light-emitting diode chip 1 electrically connected to mounting substrate 5, and covering light-emitting diode chip 1 to mounting substrate 5 A light-emitting diode light source p having a lens 1r to be formed, and the mounting substrate 5 is bendable.
[Selection] Figure 1

Description

  The present invention relates to a light source device using a light emitting diode as a light source, an illumination device using the same, and a method for manufacturing the light source device.

FIG. 28 (a) is a top view showing a light source device K100 in which the conventional light emitting diode chip 101 is used, and FIG. 28 (b) is a view in the direction of arrow G in FIG. 28 (a). (c) is the HH sectional view taken on the line of Fig.28 (a).
In the light source device K100 using the light emitting diode chip 101 used for illumination or the like, conventionally, a copper foil is pasted on an epoxy resin 103 formed by bonding to a metal base plate 102 of copper or aluminum, and the copper foil is etched. A wiring pattern 104 (see FIG. 28C) is formed to form a wiring board. The wiring patterns 104 are soldered (h) to the external electrodes 101d1 and 101d2 of the light emitting diode package 101p. In addition, there is also a glass epoxy resin wiring board containing glass fibers without using copper or an aluminum plate.

The metal base plate 102 is a plate made of aluminum or the like and has a thickness of about 1 mm and cannot be bent. In some cases, the epoxy resin 103 is filled with a filler to increase thermal conductivity.
The light emitting diode package 101p shown in FIG. 28 is configured as follows.

A light emitting diode chip 101 is mounted on a lead frame 101p1 shown in FIG. 28C using a die bond material 101p2, and the light emitting diode chip 101 is connected to external electrodes 101d1 and 101d2 by wires 101a and 101b. Further, the periphery of the light emitting diode chip 101 is sealed with silicone containing phosphor to form a lens 101p3, thereby forming a light emitting diode package 101p.
In addition, there exist the following patent documents 1-3 as a literature well-known invention which concerns on this application.

JP 2010-205955 A JP 2008-202127 A JP 2011-124550 A

By the way, the above-mentioned light source device K100 is manufactured by one piece, and it is necessary to manufacture a different shape each time. That is, it is necessary to remake the light source device K100 according to the illumination device that uses the light source device K100.
The light source device K100 is plate-shaped and can only have a fixed shape. Further, it is practically impossible to cut or deform the light source device K100, and it is impossible to manufacture a light source device that is too large in space.

Also, in terms of production, the light source device K100 is manufactured as a single sheet, so that the productivity is not good.
Furthermore, when the light source device K100 is mass-produced, the metal base plate 102 having a thickness of about 1 mm using aluminum increases the consumption of metal resources.

Therefore, it is difficult to say that the cost is low in terms of processability and resource consumption.
Further, since the light emitting diode package 101p is mounted on the metal base plate 102 having a thickness of about 1 mm, the height He is high.

  In view of the above circumstances, an object of the present invention is to provide a low-cost light source device that has good productivity and can be adapted to various illumination devices, an illumination device including the light source device, and a method for manufacturing the light source device.

To achieve the above object, a light source device according to claim 1 includes a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power. by the light emitting diode chip having a substrate, a plurality of light emitting diode chips mounted on the mounting substrate are electrically connected to the wiring pattern, and a lens formed the said mounting substrate to cover the light emitting diode chips each a light source device, the mounting substrate Ri bendable der, part of the wiring pattern, around the respective light-emitting diode chip, instead of a circle centered on the light-emitting diode chip so as to surround the light-emitting diode chips Jo on that have been formed.
According to the light source device of the first aspect, since the mounting substrate is bendable, it can be deformed and attached to various places.
Further, the circular wiring pattern becomes a substantially uniform resistor with the light emitting diode chip as the center, and the lens material spreads circularly around the light emitting diode chip, so that an isotropic lens can be formed.

A light source device according to claim 2 includes a mounting board having a metal layer, a resin layer provided on the metal layer, a metal wiring pattern provided on the resin layer and supplying power, and the wiring pattern. A light emitting diode light source having a plurality of light emitting diode chips that are electrically connected and mounted on the mounting board; and a light emitting diode light source that covers the light emitting diode chips and is formed on the mounting board; and the mounting board is bent The wiring pattern connected to each light emitting diode chip is formed in a shape that serves as a weir with respect to the lens.
According to the light source device of the second aspect, the lens material spreading on the resin layer spreads in an elliptical shape with the wiring pattern on the plus / minus side as a weir. That is, a lens having an elliptical shape is formed.
A light source device according to a third aspect includes a mounting board having a metal layer, a resin layer provided on the metal layer, a metal wiring pattern provided on the resin layer and supplying power, and the wiring pattern. A light emitting diode light source having a plurality of light emitting diode chips that are electrically connected and mounted on the mounting board; and a light emitting diode light source that covers the light emitting diode chips and is formed on the mounting board; and the mounting board is bent The wiring pattern formed in the lens is formed in a circle around the light emitting diode chip, and connected to the circular wiring pattern and extends radially around the light emitting diode chip. The circular wiring pattern and the radial wiring pattern are formed so as to be connected to the light emitting diode chip. Connected to said wiring pattern on the positive side the wiring pattern and the negative side of being formed.
According to the light source device of the third aspect, the dropped lens material spreads evenly around the light emitting diode chip. Therefore, a lens formed by curing the lens material can be formed in an isotropic shape without anisotropy.

The light source device according to claim 4 is the light source device according to any one of claims 1 to 3 , wherein the plus side wiring pattern and the minus side wiring pattern are integrally connected. A wiring pattern for supplying power is provided, and a bendable harness portion is provided integrally with the mounting substrate and extends outside in a strip shape.

According to the light source device of the fourth aspect , the wiring pattern for supplying power is formed by connecting the plus-side wiring pattern and the minus-side wiring pattern integrally, and extends to the outside integrally with the mounting substrate. Since the bendable harness portion is provided, the harness for connecting the power source becomes unnecessary, and the cost is reduced. Also, the light source device can be easily assembled.

The light source device according to claim 5 is the light source device according to any one of claims 1 to 4, wherein the light emitting diode chip is provided with an electrode disposed on the wiring pattern side. It is electrically connected to the wiring pattern via an anisotropic conductive paste.

According to the light source device of claim 5 , since the electrode of the light emitting diode chip is disposed and provided on the wiring pattern side, and the electrode is electrically connected to the wiring pattern via the anisotropic conductive paste, the light source device The number of steps during the production is reduced. Further, since the light emitting diode chip can be connected without using a wire, it is not necessary to consider the external force applied to the wire even when the light source device is wound in the manufacturing process of the light source device, and the reliability is improved.

The light source device according to claim 6 is the light source device according to any one of claims 1 to 5 , wherein the metal layer is aluminum, the resin layer is polyethylene terephthalate, and the wiring pattern is Aluminum.
According to the light source device of the sixth aspect , the raw material cost of the light source device is low.

The light source device according to claim 7 is the light source device according to any one of claims 1 to 5 , wherein the metal layer is aluminum, and the resin layer is polyethylene naphthalate or polyimide. The wiring pattern is copper.
According to the light source device of the seventh aspect , since the resin layer is polyethylene naphthalate or polyimide and has heat resistance, the light emitting diode chip can be attached to the wiring pattern by soldering.

The light source device according to claim 8 is the light source device according to any one of claims 1 to 7 , wherein the pressure-sensitive adhesive layer attaches the light source device to the opposite surface of the metal layer on which the resin layer is disposed. have.
According to the light source device of the eighth aspect, since the adhesive layer is provided on the opposite surface of the metal layer on which the resin layer is disposed, the light source device can be attached to a lighting device or the like using the adhesive layer.

Lighting device according to claim 9 is an illumination device comprising a light source device according to claim 1 to any one of claims 8.
According to the illumination apparatus of claim 9, the effect of the light source apparatus according to any one of claims 1 to 8 is obtained.

A manufacturing method of a light source device according to claim 10 includes: a mounting substrate having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power; A light emitting diode light source having a plurality of light emitting diode chips electrically connected to a wiring pattern and mounted on the mounting substrate; and a lens formed on the mounting substrate so as to cover each of the light emitting diode chips. A method of manufacturing a light source device in which a substrate is bendable, wherein a first adhesive layer is formed on one surface of a first metal sheet serving as the metal layer fed out from a first roll, and the first metal sheet By the first adhesive layer, a resin sheet to be the resin layer fed out from the second roll is stuck to the first metal sheet, and is opposite to the first metal sheet of the resin sheet. A second adhesive layer is formed on the side surface, and a metal foil fed out from a third roll is adhered to the resin sheet by the second adhesive layer of the resin sheet, and the metal foil on the resin sheet from a part of the wiring pattern, said at around each LED chip is formed on the light emitting diode shaped changing circle centered the light emitting diode chip so as to surround the chip, said first metal sheet An adhesive layer is formed on the surface opposite to the resin sheet, and release paper is attached to the adhesive layer of the first metal sheet.
According to the light source device manufacturing method of the tenth aspect, the light source device is manufactured in a sheet shape, so that the productivity is high. Moreover, since it has an adhesion layer, a light source device can be easily attached by an adhesion layer.

A manufacturing method of a light source device according to claim 11 includes: a mounting substrate having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power; A light emitting diode light source having a plurality of light emitting diode chips electrically connected to a wiring pattern and mounted on the mounting substrate; and a lens formed on the mounting substrate so as to cover each of the light emitting diode chips. A method of manufacturing a light source device in which a substrate is bendable, wherein a first adhesive layer is formed on one surface of a first metal sheet serving as the metal layer fed out from a first roll, and the first metal sheet By the first adhesive layer, a resin sheet to be the resin layer fed out from the second roll is stuck to the first metal sheet, and is opposite to the first metal sheet of the resin sheet. A second adhesive layer is formed on the side surface, and a metal foil fed out from a third roll is adhered to the resin sheet by the second adhesive layer of the resin sheet, and the metal foil on the resin sheet The wiring pattern connected to each light emitting diode chip is formed in a shape that becomes a weir with respect to the lens , and an adhesive layer is formed on the surface of the first metal sheet opposite to the resin sheet A release paper is attached to the adhesive layer of the first metal sheet.
According to the method of manufacturing the light source device of the eleventh aspect, the lens material spreading on the resin layer spreads in an elliptical shape with the wiring pattern on the plus / minus side as a weir. That is, a lens having an elliptical shape is formed.
The light source device manufacturing method according to claim 12 is the light source device manufacturing method according to claim 10 or 11, wherein the light emitting diode chip is mounted on the wiring pattern by being electrically connected thereto, and the light emitting device. The lens is formed to cover the diode chip to produce a light emitting diode light source, and a light source device sheet including a front metal layer, the resin layer, the wiring pattern, and the light emitting diode light source is produced.
According to the light source device manufacturing method of the twelfth aspect, since the light source device sheet on which the light emitting diode light source is mounted is manufactured, the light source device can be easily manufactured and the productivity is high.
A method of manufacturing a light source device according to claim 13 includes a mounting substrate having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power. A light emitting diode light source having a plurality of light emitting diode chips electrically connected to a wiring pattern and mounted on the mounting substrate; and a lens formed on the mounting substrate so as to cover each of the light emitting diode chips. A method of manufacturing a light source device in which a substrate is bendable, wherein a first adhesive layer is formed on one surface of a first metal sheet serving as the metal layer fed out from a first roll, and the first metal sheet By the first adhesive layer, a resin sheet to be the resin layer fed out from the second roll is stuck to the first metal sheet, and is opposite to the first metal sheet of the resin sheet. A second adhesive layer is formed on the side surface, and a metal foil fed out from a third roll is adhered to the resin sheet by the second adhesive layer of the resin sheet, and the metal foil on the resin sheet Thus, the wiring pattern formed in the lens is formed in a circle centering on the light emitting diode chip, and is connected to the circular wiring pattern and extends radially around the light emitting diode chip. An adhesive layer is formed on the surface of the first metal sheet opposite to the resin sheet, and a release paper is attached to the adhesive layer of the first metal sheet.
According to the light source device manufacturing method of the thirteenth aspect, the dropped lens material spreads evenly around the light emitting diode chip. Therefore, a lens formed by curing the lens material can be formed in an isotropic shape without anisotropy.

The light source device manufacturing method according to claim 14 is the light source device manufacturing method according to claim 13 , wherein the light emitting diode chip is mounted on the radial wiring pattern by being electrically connected thereto, and the light emitting diode chip is mounted. The lens is formed so as to cover the surface of the light emitting diode light source, and the light source device sheet including the front metal layer, the resin layer, the wiring pattern, and the light emitting diode light source is manufactured.

  According to the light source device manufacturing method of the fourteenth aspect, since the light source device sheet on which the light emitting diode light source is mounted is manufactured, the light source device can be easily manufactured and the productivity is high.

Method for producing a light source apparatus according to claim 15 is the manufacturing method of the light source apparatus according to 請 Motomeko 14, the light emitting diode chip is provided the electrode is disposed on the wiring pattern side, the electrode is different It is electrically connected to the wiring pattern via an anisotropic conductive paste.

According to the method for manufacturing the light source device of claim 15, the light emitting diode chip is provided with the electrode disposed on the wiring pattern side, and the electrode is electrically connected to the wiring pattern via the anisotropic conductive paste. Therefore, it is not necessary to use a wire for electrical connection of the light emitting diode chip, and manufacturing is easy. Moreover, since it is not necessary to use a wire for electrical connection of the light emitting diode chip, it is not necessary to consider the external force applied to the wire, and the reliability of the light source device is high.

The light source device manufacturing method according to claim 16 is the light source device manufacturing method according to claim 12 , claim 14, or claim 15 , wherein a harness portion that is bendable integrally with the mounting substrate is the mounting substrate. A wiring pattern that is provided in a band shape toward the outside of the wiring board and that supplies power formed by integrally connecting the wiring pattern on the plus side and the wiring pattern on the minus side is formed on the harness portion. A light source device sheet is produced.

According to the method of manufacturing the light source device of claim 16, the light source device sheet is provided in a band shape toward the outside of the mounting substrate, and the plus side wiring pattern and the minus side wiring pattern are integrally connected. Since a harness part having a wiring pattern for supplying a power source can be manufactured at the same time, a separate harness is not required, the assembly is simplified, and the manufacturing cost of the lighting device is low.

The light source device manufacturing method according to claim 17 is the light source device manufacturing method according to any one of claims 12 or 14 to 16, wherein the light source device sheet is cut and the light source device is cut. A device has been made.

According to the light source device manufacturing method of claim 17, since the light source device sheet is cut to produce the light source device, the light source device sheet is cut to a desired length by cutting the light source device sheet to a desired length. A light source device with brightness and size (size) can be obtained.

  According to the present invention, it is possible to realize a low-cost light source device that has good productivity and can be adapted to various illumination devices, an illumination device including the light source device, and a method for manufacturing the light source device.

The perspective view which shows the light source device in which the light emitting diode of embodiment which concerns on this invention is used. The perspective view which looked at the light source device from the back side. FIG. 2 is an enlarged sectional view taken along line AA in FIG. 1. The top view which looked at the light emitting diode package mounted on the board | substrate of the comparative example (conventional) from the upper direction. (a) The enlarged plan view which looked at the LED chip mounted on the flexible mounting board of embodiment from the upper part, (b) which looked at the LED chip mounted on the flexible mounting board of another wiring pattern from the upper part FIG. (a) is a manufacturing process figure of a flexible mounting board | substrate, (b) is a formation process figure of the wiring pattern of a flexible mounting board | substrate, (c) is a formation process figure of the adhesion layer to a flexible mounting board | substrate. The flowchart which shows the process in which the light emitting diode package of a comparative example (conventional) is mounted on a metal base substrate. (a)-(d) is a figure which shows each process of the process of mounting the light emitting diode package of a comparative example (conventional) on a metal base substrate. The flowchart which shows the process in which the LED chip of embodiment is mounted in a flexible mounting board sheet. (a)-(c) is a figure which shows each process of the process which mounts the light emitting diode chip | tip of embodiment on a flexible mounting board | substrate sheet | seat. The perspective view which shows the state which wound up the light source device sheet | seat in which the light emitting diode chip was mounted in the flexible mounting board | substrate in roll shape. The flowchart which shows the process in which the light emitting diode chip of the other example 1 is mounted in a flexible mounting board sheet. (a)-(c) is a figure which shows each process of the process which mounts the light emitting diode chip | tip of the other example 1 on a flexible mounting board | substrate sheet | seat. The enlarged plan view which shows the shape of the wiring pattern of the other example 1 which looked at the LED chip mounted on the flexible mounting board | substrate in the case of FIG. 12, FIG. 13 from upper direction. (a)-(d) is process drawing which shows the process of mounting in the flexible mounting board | substrate sheet | seat of another example of the light emitting diode chip. The perspective view which shows the usage method of a light source device sheet | seat. The perspective view which shows another example of the usage method of a light source device sheet | seat. The perspective view which shows one example of the state at the time of use of the light source device cut | disconnected from the light source device sheet wound up in roll shape. (a) is a perspective view which shows the structure which uses the light source device of Example 1 for an illuminating device, (b) is an external view at the time of using the light source device of Example 1 for an illuminating device. The cross-sectional structure figure at the time of using a light source device for a household illuminating device. The cross-sectional structure figure at the time of using a light source device for the illuminating device for signs. The cross-section figure which shows an example at the time of using a light source device for the reverse Fuji type existing lamp. Sectional structure figure which shows another example at the time of using a light source device for an embedded type existing lamp. (a) is a figure which shows the connection of the light source device and connector which supplies a power supply at the time of applying a light source device to an illuminating device, (b) is sectional drawing which shows the internal structure of the illuminating device to which a light source device is applied. Sectional drawing which shows the internal structure which twisted the tail part of the light source device and was attached inside the illuminating device. (a) is a perspective view which shows the assembly process of an illuminating device, (b) is a perspective view which shows the external appearance of an illuminating device. (a) is a perspective view which shows the assembly process of an illuminating device, (b) is a perspective view which shows the external appearance of an illuminating device. (a) is a top view which shows the light source device in which the conventional light emitting diode is used, (b) is a G direction arrow line view of (a), (c) is the HH sectional view taken on the line (a).

Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a perspective view showing a light source device K in which a light emitting diode according to an embodiment of the present invention is used, and FIG. 2 is a perspective view of the light source device K viewed from the back side.
The light source device K of the embodiment has a characteristic that it can be bent. The light source device K includes a metal layer 2 that radiates heat from a light-emitting diode chip 1 (refer to FIG. 3; hereinafter referred to as an LED chip 1), a resin layer 3 that is an insulating layer, and a wiring pattern 4a1 on the (+) side. 4a2 and (−) side wiring patterns 4c1 and 4c2. The laminate of the metal layer 2, the resin layer 3, and the wiring patterns 4a1,..., 4c2 on the (+) / (−) side is hereinafter referred to as a flexible mounting substrate 5 (see FIG. 3).

n3a is an adhesive layer for attaching the light source device K, sp is a release paper for protecting the adhesive layer n3a, and details will be described later.
The metal layer 2 is made of aluminum or the like, and the thickness is preferably 100 μm to 300 μm. When the thickness of the metal layer 2 is less than 100 μm, the strength as a support material is insufficient, and when it is thicker than 300 μm, the flexibility is deteriorated.

The resin layer 3 to be affixed on the metal layer 2 is made of PET (Polyethylene terephthalate) or the like, and the thickness is preferably 25 μm to 100 μm. If the thickness of the resin layer 3 is less than 25 μm, there may be a problem in insulation, and if it is greater than 100 μm, the thermal resistance increases and the thermal conductivity deteriorates.
The wiring patterns 4a1,..., 4c2 on the (+) / (−) side are formed by etching the metal foil 4m as described later.
The metal foil 4m on which the (+) and (−) side wiring patterns 4a1,..., 4c2 are etched preferably has a thickness of 12 μm to 50 μm. (Please tell us the thickness of the metal foil 4m.)
That is, the thickness of the (+) / (−) side wiring patterns 4a1,..., 4c2 is preferably 12 μm to 50 μm.

  For example, the thickness of the metal foil 4m is 35 μm. If the thickness of the metal foil 4m is less than 12 μm, there may be a problem in required strength and conductivity as the wiring patterns 4a1,..., 4c2, and if it is larger than 50 μm, the etching property becomes worse or more than necessary. It may become the thickness of.

A plurality of LED chips 1 are connected in parallel to the (+) side wiring pattern 4a2 and the (−) side wiring pattern 4c12.
As a result, current flows from the (+) side wiring patterns 4a1 and 4a2 through the LED chip 1 to the (−) side wiring patterns 4c1 and 4c2.

In other words, the light-emitting diode light sources p (p11, 12,..., P21, p22,..., P31, in which the light-emitting diode 1 is sealed are provided on the (+) and (−) side wiring patterns 4a2, 4c1. p32,...) are implemented in parallel.
Thereby, the current supplied from the power source is changed from the (+) side wiring patterns 4a1, 4a2 to the photodiode light sources p (p11, 12,..., P21, p22,..., P31, 32,...). Is emitted and flows through the (−) side wiring patterns 4c1 and 4c2.

<Flexible mounting substrate 5>
At one end of the light source device K, a tail portion Kb having a (+)-side wiring pattern Kb1 for supplying power and a (−)-side wiring pattern Kb2 is provided. It is integrally connected to Ka (flexible mounting substrate 5). The wiring pattern Kb1 on the (+) side of the tail part Kb is formed integrally with the wiring pattern 4a1 on the (+) side of the light emitter part Ka. Further, the (−) side wiring pattern Kb2 of the tail portion Kb is formed integrally with the (−) side wiring pattern 4c2 of the light emitter Ka.

  In other words, the tail portion Kb having the (+) side wiring pattern Kb1 and the (−) side wiring pattern Kb2 for supplying power to the light emitting body portion Ka of the light source device K has the metal layer 2, The resin layer 3 and the (+) and (−) side wiring patterns Kb1 and Kb2 are formed in layers.

  In this manner, the tail portion Kb having the (+) side wiring pattern Kb1 and the (−) side wiring pattern Kb2 corresponding to the harness for supplying the power is formed integrally with the light emitter Ka, so that the power is supplied. There is no need to manufacture the harness to be supplied separately. Therefore, the manufacture of the light source device K is simplified and the manufacturing process can be reduced.

<Light emitting diode light source p>
FIG. 3 is an enlarged cross-sectional view taken along line AA in FIG.
The LED chip 1 is mounted on the flexible mounting substrate 5 by a die bond material 1c. Aluminum wires 1a1 and 1a2 extending from the electrode 1d of the LED chip 1 are wire-bonded to the (+) side wiring pattern 4a2 and the (−) side wiring pattern 4c1 on the flexible mounting substrate 5, respectively.

  The LED chip 1 mounted on the flexible mounting substrate 5 is dripped and cured with a yellow phosphor-containing silicone 1s, and is sealed with a resin to form a lens 1r, thereby forming a light emitting diode light source p. The LED chip 1 emits blue light, and the light emitting diode light source p emits white light by the yellow fluorescent lens 1r.

Next, the (+) / (−) side wiring patterns 4a2, 4c1 around the LED chip 1 will be described.
<(+) / (-) Side wiring patterns 4a2, 4c1 around LED chip 1>
FIG. 4 is a plan view of the light emitting diode package 101p mounted on the substrate 105 of the comparative example (conventional) as viewed from above.
On the substrate 105, near the LED chip 101, a (+) side wiring pattern 104a and a (−) side wiring pattern 104b are formed in a straight line.

Here, the wiring patterns 104a and 104b have a thickness of about 30 μm.
Conventionally, as shown in FIG. 28, since the lens 101p3 is already formed in the light emitting diode package 101p, there is no problem in forming the lens 101p3.
FIG. 5A is an enlarged plan view of the LED chip 1 mounted on the flexible mounting substrate 5 (see FIG. 1) of the embodiment as viewed from above, and FIG. 5B shows another wiring pattern. It is the enlarged plan view which looked at the LED chip 1 mounted on the flexible mounting board | substrate 5 (refer FIG. 1) from upper direction.

Therefore, in the embodiment, as shown in FIG. 5A, a part of the (+) / (−) side wiring patterns 4a2, 4c1 formed on the resin layer 3 of the flexible mounting substrate 5 is replaced with an LED chip. 1 is formed in a circular wiring pattern 4e around the LED chip 1 so as to surround the LED chip 1.
Thereby, in order to seal the LED chip 1 on the flexible mounting substrate 5, yellow phosphor-containing silicone 1 s is dropped on the LED chip 1, but the circular wiring pattern 4 e is substantially centered on the LED chip 1. It becomes a uniform resistor, and the yellow phosphor-containing silicone 1s spreads in a circular shape around the center of the LED chip 1, thereby forming an isotropic lens 1r.

  Therefore, the light from the LED chip 1 of the light-emitting diode light source p travels through the isotropic lens 1r, and isotropic light is emitted from the light-emitting diode light source p through the lens 1r, and the light efficiency is good. Further, the yellow phosphor in the lens 1r functions without being influenced by the direction, and its action is not hindered, and uniform light can be obtained.

Alternatively, as shown in FIG. 5B, the (+) side wiring pattern 4a2 and the (−) side wiring pattern 4c1 are arranged outside the lens 1r.
According to this structure, when the yellow phosphor-containing silicone 1s is dropped onto the LED chip 1, the (1) wiring patterns 4a2 and 4c1 on the (+) and (−) sides serve as weirs in the silicone 1s spreading on the resin layer 3. Will spread into an oval shape. That is, the lens 1r spreading in an elliptical shape is formed.

<Method for Manufacturing Light Source Device K>
Next, a method for manufacturing the light source device K will be described.
First, the manufacturing method of the flexible mounting board 5 (refer FIG. 3) which has the metal layer 2, the resin layer 3, and wiring pattern 4a1, ..., 4c2 is demonstrated.
FIG. 6 is a diagram schematically showing the manufacturing process of the flexible mounting substrate 5.
6 (a) is a manufacturing process diagram of the flexible mounting board 5, and FIG. 6 (b) is a process chart of forming the wiring patterns 4a1,..., 4c2 of the flexible mounting board 5. FIG. These are the formation process figures of the adhesion layer n3a to the flexible mounting board | substrate 5. FIG.

  As shown in FIG. 6 (a), a metal sheet 2m such as aluminum is fed out from a roll r1, and an adhesive material n1 is coated on one side of the metal sheet 2m in an adhesive material coating process I and dried. Then, the metal sheet 2m coated on one side with the adhesive n1 is adhered by the action of the resin sheet 3j fed out from the roll r2 and the adhesive n1 on one side of the metal sheet 2m. 2m, 3j).

  Thereafter, the first sheet 5A is dried after the adhesive n2 is coated on one side in the adhesive coating step II. And the 1st sheet | seat 5A by which the adhesive material n2 was coated on the single side | surface is stuck by the function of the metal foil 4m drawn | fed out from the roll r3, and the adhesive material n2 of the single side | surface of the 1st sheet | seat 5A, and one 2nd sheet | seat 5B (2m, 3j, 4m). The second sheet 5B (2m, 3j, 4m) is wound around the roll r4.

  Thereafter, as shown in FIG. 6B, the second sheet 5B (2m, 3j, 4m) fed out from the roll r4 has a resist solution re applied to the metal foil 4m of the second sheet 5B in the resist wiring pattern printing process. Gravure printing is performed by the gravure cylinder gc, and a portion where the resist solution re is exposed and not removed is masked.

  And the 2nd sheet | seat 5B which has the metal foil 4 with which the resist liquid re was apply | coated is immersed in the etching liquid el in an etching tank. Thereby, the portion where the resist solution re is not printed out of the metal foil 4m of the second sheet 5B, that is, the portion that is not masked is removed (etched) by the etching solution el and dried, and depending on the portion of the metal foil 4m that is not removed, Wiring patterns 4a1,..., 4c2 (see FIG. 1) are formed.

And it becomes the 3rd sheet | seat 5C (2m, 3j, 4a1, ..., 4c2), and is wound by the roll r5.
Subsequently, as shown in FIG. 6C, the third sheet 5C (2m, 3j, 4a1,..., 4c2) fed out from the roll r5 has the adhesive material n3 coated on one side in the adhesive material coating process. The adhesive layer n3a is dried and formed on the back surface of the metal sheet 2m (metal layer 2).
The third sheet 5C coated on one side with the adhesive material n3 is bonded to the separator paper sp fed from the roll r6 by the function of the adhesive layer n3a (adhesive material n3) on one side of the third sheet 5C. The flexible mounting substrate sheet 5S is wound around the roll r7.

<Mounting LED chip 1>
Next, the process of mounting the LED chip 1 on the flexible mounting substrate sheet 5S manufactured as described above will be described.
Here, for comparison with the embodiment, a process of mounting the light emitting diode package 101p shown in FIG. 28C as a comparative example on the metal base plate 102 will be described first.

<Mounting of Light-Emitting Diode Package 101p of Comparative Example to Metal Base Plate 102>
FIG. 7 is a flowchart illustrating a process of mounting the light emitting diode package 101p of the comparative example (conventional) on the metal base plate 102.
FIG. 8A to FIG. 8D are diagrams showing respective steps in the process of mounting the light emitting diode package 101p of the comparative example (conventional) on the metal base plate 102. FIG.

First, as shown in FIG. 8A, the LED chip 101 is bonded and mounted on the ceramic substrate 100 with a die bonding material (S101 in FIG. 7).
Subsequently, as shown in FIG. 8B, the wire 101a of the lead wire of the LED chip 101 is wire-bonded to the external electrode 101b soldered to the wiring pattern printed on the ceramic substrate 100 (S102).

  Subsequently, as shown in FIG. 8C, the LED chip 101 mounted on the ceramic substrate 100 is immersed in the silicone 108 injected into each lens mold 109a of the silicone mold 109, and the resin of the silicone 108 is replaced with ceramic. The LED chip 101 on the substrate 100 is formed to be sealed (S103). Then, the silicone 108 is cured to form the lens 108r of the LED chip 101 as shown in FIG. 8D (S104). In FIGS. 8A to 8D, the shape of the ceramic substrate 100 is simplified.

Subsequently, as indicated by a two-dot chain line in FIG. 8D, the ceramic substrate 100 in which the lenses 108r are formed on the plurality of LED chips 101 is cut (S105), and each of the light emitting diode packages 101p (FIG. 28C) is cut. )) Is completed.
Then, as shown in FIGS. 28A and 28B, the light emitting diode package 101p is mounted on the metal base plate 102 and mounted (S106).

<Mounting of Light Emitting Diode Light Source p on Flexible Mounting Board 5>
Next, a process of mounting the light emitting diode light source p shown in FIG. 3 of the embodiment on the flexible mounting substrate sheet 5S (flexible mounting substrate 5) will be described.
FIG. 9 is a flowchart showing a process of mounting the LED chip 1 of the embodiment on the flexible mounting substrate sheet 5S.
FIG. 10A to FIG. 10C are diagrams showing each step of the process of mounting the light-emitting diode light source p of the embodiment on the flexible mounting substrate sheet 5S.

First, as shown in FIG. 10A, the LED chip 1 is bonded (mounted) on the flexible mounting substrate sheet 5S by the die bonding material 1c (S11 in FIG. 9).
Then, the aluminum wires 1a1 and 1a2 extending from the electrode 1d of the LED chip 1 are connected to the (+) and (−) side wiring patterns 4a2 and 4c1 on the flexible mounting substrate 5 by ultrasonic waves or the like using a wire bonder. Bonding is performed (see FIG. 10B) (S12 in FIG. 9).

Subsequently, in order to fabricate the lens 1r of the LED chip 1, a yellow phosphor-containing silicone 1s is injected from above into the LED chip 1 on the flexible mounting substrate 5 (S13 in FIG. 9), and the LED chip 1 is sealed. (See FIG. 10C). Then, the silicone 1s sealing the LED chip 1 is cured to form the lens 1r (S14 in FIG. 9), and the light emitting diode light source p is completed. Thus, the light source device sheet Ks in which the light emitting diode light source p is mounted on the flexible mounting substrate sheet 5S is produced.
Since the LED chip 1 emits blue light, the light emitting diode light source p emits white light by the yellow phosphor-containing lens 1r.

  The mounting process of the light emitting diode light source p of FIGS. 9 and 10 to the flexible mounting substrate sheet 5S (flexible mounting substrate 5) of the above-described embodiment is the same as the metal base plate of the light emitting diode package 101p of FIGS. Compared with the mounting process to 102, the manufacturing process is simplified by the absence of the “cut into each package” step of S105 in FIG. 7 and the “package mounting” step of S106 in FIG. Therefore, manufacturing becomes easy and manufacturing cost is reduced.

  In this way, the light source device sheet Ks on which the light-emitting diode light source p is mounted on the flexible mounting substrate 5 has a bendable configuration, and therefore, as shown in FIG. Become. FIG. 11 is a perspective view showing a state in which the light source diode light source p is wound up in a roll shape on the light source device sheet Ks mounted on the flexible mounting substrate 5.

  FIG. 11 shows a case where the tail portion Kb having the (+) side wiring pattern Kb1 and the (−) side wiring pattern Kb2 shown in FIG. 1 is not provided, but (+) shown in FIG. The configuration in which the tail portion Kb having the (−) side wiring patterns Kb1 and Kb2 is provided is also the same.

<Mounting of Light Emitting Diode Light Source 2p of Other Example 1 on Flexible Mounting Board 5>
Next, a process of mounting the light emitting diode light source 2p of the other example 1 on the flexible mounting substrate sheet 5S (flexible mounting substrate 5) will be described.
FIG. 12 is a flowchart showing a process of mounting the LED chip 1 of the other example 1 on the flexible mounting substrate sheet 5S (flexible mounting substrate 5).

FIG. 13A to FIG. 13C are diagrams showing each step of the process of mounting the LED chip 1 of the other example 1 on the flexible mounting substrate sheet 5S (flexible mounting substrate 5).
Mounting of the light emitting diode light source 2p of the other example 1 on the flexible mounting substrate sheet 5S (flexible mounting substrate 5) is characterized in that wire bonding is not performed.

  First, as shown in FIG. 13A, with respect to the anisotropic conductive paste (ACP) 1i stacked on the (+) and (−) wiring patterns 4a2 and 4c1 of the flexible mounting substrate sheet 5S, Turn the LED chip 1 upside down so that the electrode 1d of the LED chip 1 is down ((+) / (−) wiring pattern 4a2, 4c1 side), and the LED chip 1 is Via the anisotropic conductive paste 1i, the (+) • (−) wiring patterns 4a2, 4c1 of the flexible mounting substrate 5 are pressed and electrically connected, and the LED chip 1 is connected to the (+) • of the flexible mounting substrate 5. (−) Mounted on the wiring patterns 4a2 and 4c1 (see FIG. 13B) (S21 in FIG. 12).

  Thereafter, as shown in FIG. 13 (c), yellow phosphor-containing silicone 1s is injected onto the LED chip 1 disposed on the (+) and (−) wiring patterns 4a2 and 4c1 of the flexible mounting substrate 5 ( Dripping) (S22 in FIG. 12) and curing (S23) to form the lens 1r. Thus, the light source device sheet Ks having the light emitting diode light source 2p is manufactured.

  The mounting of the light emitting diode light source 2p of FIGS. 12 and 13 on the flexible mounting substrate 5 is performed on the flexible mounting substrate sheet 5S (flexible mounting substrate 5) of the light emitting diode light source p of FIGS. Compared with the mounting, the manufacturing process is reduced by the absence of the “internal wiring” process of FIG. 9, and the manufacturing cost can be reduced.

  As shown in FIG. 11, when the light source device sheet Ks is wound in a roll shape, when the wire bonding shown in FIGS. 9 and 10 of the embodiment is adopted, pressure is applied to the wires 1a1 and 1a2. There is an inconvenience. However, the mounting method of the light-emitting diode light source 2p of FIGS. 12 and 13 in the other example of the embodiment on the flexible mounting substrate 5 does not use a wire, so this inconvenience is solved.

  Regarding the electrical connection between the LED chip 1 using the anisotropic conductive paste 1i shown in FIGS. 12 and 13 and the (+) and (−) wiring patterns 4a2 and 4c1 of the flexible mounting substrate 5, (+) · Depending on the shape of the (−) wiring patterns 4a2, 4c1, the resistance of the yellow phosphor-containing silicone 1s dripping onto the LED chip 1 is different, and the lens 1r is formed with anisotropy. there is a possibility.

FIG. 14 is an enlarged plan view showing the shape of the wiring pattern of the other example 1 when the LED chip 1 mounted on the flexible mounting substrate 5 (see FIG. 1) in the case of FIGS. 12 and 13 is viewed from above.
Therefore, as shown in FIG. 14, the wiring pattern 4 f in the lens 1 r on the resin layer 3 is formed in a circle around the LED chip 1, and a wiring pattern 4 g extending radially around the LED chip 1 is formed. . Then, the circular wiring pattern 4f and the radial wiring pattern 4g are formed to be connected to the (+) / (−) wiring patterns 4a2 and 4c1 outside the lens 1r.

  According to this configuration, the resistance of the yellow phosphor-containing silicone 1 s dropped on the LED chip 1 becomes substantially equal, and the dropped silicone 1 s spreads evenly around the LED chip 1. Therefore, the lens 1r formed by curing the silicone 1s can be formed in an isotropic shape without anisotropy.

  As a result, the light from the LED chip 1 travels evenly through the isotropic lens 1r, and light isotropically emitted from the light emitting diode light source 2p through the lens 1r, so that the light efficiency is good. Further, the yellow phosphor in the lens 1r works without being influenced by the direction, and can fully exert its action and is not hindered.

Next, a process of mounting the light emitting diode light source 3p of the other example 2 on the flexible mounting substrate 5 will be described.
15A to 15D are process diagrams showing a process of mounting the LED chip 1 of another example on the flexible mounting board sheet 5S (flexible mounting board 5).
Another example of mounting the light-emitting diode light source 3p on the flexible mounting substrate sheet 5S (flexible mounting substrate 5) employs flip chip connection as follows.

First, as shown in FIG. 15A, for example, gold bumps 4ba are provided on the (+) and (−) wiring patterns 4a2 and 4c1 of the flexible mounting substrate sheet 5S. Note that bumps other than gold may be used.
Subsequently, as shown in FIG. 15 (b), the electrodes 1d and 1d of the LED chip 1 are connected to (+ ) .- (-) The gold bumps 4ba and 4ba on the wiring patterns 4a2 and 4c1 are joined using ultrasonic waves (see FIG. 15C).

  Subsequently, in order to manufacture the lens 1r of the LED chip 1, as shown in FIG. 15D, a yellow phosphor-containing silicone 1s is injected into the LED chip 1 on the flexible mounting substrate sheet 5S from above, and the LED 1 The chip 1 is sealed and cured to form the lens 1r, and the light emitting diode light source 3p is completed. In this way, the light source device sheet Ks is produced.

  The mounting method of the flexible mounting substrate 5 of the light emitting diode light source 3p of another example shown in FIG. 15 has the same merit as the method of mounting the light emitting diode light source 2p of the other example 1 of FIGS. 12 and 13 on the flexible mounting substrate 5. . In the case of the Philip chip connection shown in FIG. 15, the shape of the wiring pattern shown in FIG. 14 can be similarly applied.

<Usage of light source device sheet Ks>
FIG. 16 is a perspective view showing how to use the light source device sheet Ks.
As described above, the light source device sheet Ks on which the light-emitting diode light source p (2p, 3p) is mounted has a wiring pattern on the light source device sheet Ks on one side in the short direction as shown in FIG. ) Side wiring patterns 4a1 and 4a2 are formed, and (−) side wiring patterns 4c1 and 4c2 are formed on the other side in the lateral direction.

  As described above, the power supply current flows from the wiring patterns 4a1 and 4a2 through the LED chip 1 to the wiring patterns 4c1 and 4c2. Therefore, as shown in FIG. 16, it can be cut into a length having a number of light emitting diode light sources p corresponding to the brightness of illumination.

  Then, the wiring on the (+) side of the harness is connected to the wiring pattern 4a2 on the (+) side in each cut light source device K, and the wiring on the (−) side of the harness is connected to the wiring pattern 4c1 on the (−) side. Then, a power supply current may be supplied.

By adopting such wiring patterns 4a1,..., 4c2, it is possible to obtain the light source device K used for the illumination device having various brightnesses from one roll of the light source device sheet Ks.
As shown in FIG. 1, a light source device sheet Ks on which a tail portion Kb for forming a (+) side wiring pattern Kb1 and a (−) side wiring pattern Kb2 is formed, and a light emitter portion Ka and a tail portion are produced. A configuration of cutting out as the light source device K having Kb can be performed in the same manner.

FIG. 17 is a perspective view showing another example of usage of the light source device sheet Ks.
FIG. 17 shows the (+) side wiring pattern 4a1 connected to the (+) side wiring pattern 4a2 and the (−) side according to the length of the light source device sheet Ks wound around the roll r9. The wiring pattern 4c2 on the (−) side that is connected to the wiring pattern 4c1 is integrated at one location.

  Further, with respect to the wiring patterns 4a1 and 4c2 for supplying power on one side, the next pattern in which the end of the wiring pattern 4a2 on the other side (+) and the end of the wiring pattern 4c1 on the (−) side are closed. By adopting the configuration subsequent to, wiring management can be formed for each light source device K.

FIG. 18 is a perspective view showing an example of a state in use of the light source device K cut from the light source device sheet Ks wound up in a roll shape.
As shown in FIG. 18, the harness H that supplies power is connected to the (+) side wiring pattern 4 a 1 and the (−) side wiring pattern 4 c 2, so that the lighting apparatus can be used.
As described above, the light source device K shown in FIG. 1 is different from FIG. 18 in that the tail portion Kb corresponding to the harness H that supplies power is integrally connected to the light emitter Ka (flexible mounting substrate 5). The (+) side wiring pattern Kb1 and the (−) side wiring pattern Kb2 are connected to the (+) side wiring pattern 4a1 and the (−) side wiring pattern 4c2, respectively, and are integrally formed. ing. As described above, the light source device K in FIG. 1 has a configuration that is simplified and contributes to cost reduction because it is not necessary to use the harness H that supplies power.

Next, an example in which the light source device K is actually used for a lighting device will be described.
FIG. 19A is a perspective view showing a configuration in which the light source device K1 of Example 1 is used for the lighting device S1, and FIG. 19B is a case where the light source device K1 of Example 1 is used for the lighting device S1. It is an external view.
A light source device K1 (see FIG. 19) having a configuration similar to that of the light source device K of FIG. 18 has an adhesive layer n3a of an adhesive material n3 formed on the back surface side, and prevents separator paper sp from sticking to an unintended thing. Is attached.

Therefore, the separator paper sp on the back side of the light source device K1 is peeled off to expose the adhesive layer n3a on the back side of the light source device K1.
And as shown to Fig.19 (a), the light source device K1 is stuck by the adhesion layer n3a in case k1 of illuminating device S1.

  Then, as shown in FIG. 19B, the light source device K1 and a part of the case k1 are covered with an illumination cover c1 made of hard glass or the like to form an illumination device S1. The cable r1 from the power supply harness H1 is connected to a power supply connector (not shown).

<Practical use of light source devices K2 and K3>
FIG. 20 is a cross-sectional structure diagram when the light source device K2 is used in a home lighting device S2.
The case where the light source device K2 is used for a home lighting device S2 will be described.
In the lighting device S2, a power source d2 is installed on the top of the housing k2, and a hooking ceiling k2a for attaching to the ceiling is attached to the housing k2.
The light source device K2 peels off the separator paper sp and attaches it to the one surface k2a of the housing k2 by the adhesive layer n3a.

Thereafter, the translucent lighting cover c2 is attached to the housing k2, and the lighting device S2 is assembled.
FIG. 21 is a cross-sectional structure diagram in the case where the light source device K3 is used for a sign lighting device S3.
The case where the light source device K3 is used for the sign lighting device S3 will be described.
In the lighting device S3, a power source d3 is installed inside the housing k3.
The light source device K3 peels off the separator paper sp and attaches it to the one surface k3a of the housing k3 by the adhesive layer n3a.
Thereafter, a translucent illumination cover c3 is attached to the housing k3 to form the illumination device S3.

<Use for existing lamps>
Next, the case where the light source device K is used for an existing lamp already attached will be described.
FIG. 22 is a cross-sectional structure diagram showing an example when the light source device K4 is used in an inverted Fuji type existing lamp T1.
When the light source device K4 is applied to the reverse Fuji type existing lamp T1, the separator paper sp of the light source device K4 is peeled off and attached to the one surface T1a of the existing lamp T1 by the adhesive layer n3a.
Thereafter, a translucent illumination cover c4 is attached so as to cover the light source device K4 to form the illumination device S4. The light source device K4 is connected to the power source d4 by a harness (not shown).

FIG. 23 is a cross-sectional structure diagram showing another example in the case where the light source device K5 is used for the embedded existing lamp T2.
The existing lamp T2 is already embedded in the ceiling.
The light source device K5 peels off the separator paper sp and attaches it to the one surface k5a of the fixture k5 by the adhesive layer n3a.
Thereafter, a translucent illumination cover c5 is attached so as to cover the light source device K5 to form the illumination device S5. The light source device K5 is connected to the power source d5 by a harness (not shown).

  FIG. 24A is a diagram showing the connection between the light source device K6 and the connector t1 that supplies power when the light source device K6 is applied to the illumination device S6. FIG. 24B shows the application of the light source device K6. It is sectional drawing which shows the internal structure of illuminating device S6. FIG. 24 is a schematic diagram, and a detailed configuration is omitted.

  When the light source device K6 having the same configuration as the light source device K of FIG. 1 is applied to the illumination device S6, as shown in FIG. 24A, the tail portion Kb of the wiring pattern band corresponding to the harness of the light source device K6 is provided. It is inserted into a connector t1 that supplies power, and a current can be supplied to the light source device K6 through the connector t1.

  Then, as shown in FIG. 24B, the tail part Kb having flexibility and a part of the light source device K6 are bent, and the connector t1 is attached to the support member S6a of the illumination device S6 by screws or the like. Then, the separator paper sp on the back surface of the light emitter portion Ka of the light source device K6 is peeled off, and the light emitter portion Ka of the light source device K6 is adhered to the inside by the adhesive layer n3a, so that the light source device K6 is mounted and illuminated. It becomes apparatus S6.

FIG. 25 is a cross-sectional view illustrating an internal configuration in which the tail portion Kb of the light source device K6 is twisted and attached to the inside of the illumination device S6A.
Since the light source device K6 is flexible, as shown in FIG. 25, the tail portion Kb is twisted and the light emitting body Ka is adhered to the inside of the lighting device S6A with the adhesive layer n3a, whereby the lighting device S6A. Can be attached to.

FIG. 26 shows an example in which the light source device K7 is rolled up. FIG. 26A is a perspective view showing the assembly process of the illumination device S7, and FIG. 26B is a perspective view showing the appearance of the illumination device S7.
FIG. 26 shows an example in which a flexible light source device K7 is applied to the columnar illumination device S7. The light source device K7 has the same configuration as the light source device K described above.
The illumination device S7 is assembled as follows.

  First, the flexible light source device K7 is peeled off the separator paper sp and bent along a fixture k7 having a cylindrical shape as shown in FIG. Stick to the fixture k7. An unillustrated hook-type ceiling for attaching the lighting device S7 to the ceiling or the like is installed at one end of the fixture k7 (the lower end of the fixture k7 in FIG. 26A).

Subsequently, a cylindrical translucent lighting cover c7 made of hard glass or the like was attached to the fixture k7 as shown by the white arrow in FIG. 26 (a) from the opening c7a having one end opened. Cover the light source device K7.
Thereby, the illuminating device S7 shown in FIG.26 (b) is assembled.
And the illuminating device S7 can be attached to a ceiling etc. by the hook-type sealing not shown.

  FIG. 27 shows an example in which the light source device K8 is bent and used. Fig.27 (a) is a perspective view which shows the assembly process of illuminating device S8, FIG.27 (b) is a perspective view which shows the external appearance of illuminating device S8.

FIG. 27 shows an example in which a flexible light source device K8 is applied to the triangular prism-shaped illumination device S8.
The illumination device S8 is assembled as follows.
First, as shown in FIG. 27A, the flexible light source device K8 is peeled off the separator paper sp, bent along a fixture k8 having a triangular prism shape in part, and the fixture having an adhesive layer n3a. Adhere to k8. A hook-type ceiling (not shown) for attaching the lighting device S8 to the ceiling or the like is installed at one end of the fixture k8.

Subsequently, a light source device K8 in which a cylindrical illumination cover c8 made of hard glass or the like is attached to a fixture k8 from an opening c8a having one end opened as indicated by a white arrow in FIG. Put on.
Thereby, the illumination device S8 shown in FIG. 27B is assembled. The illuminating device S8 can be attached to a ceiling or the like by a hook-type ceiling (not shown).

According to the said structure, the light source device K has three layers, the metal layer 2, the resin layer 3, and wiring pattern 4a1, ..., 4c2, and the thickness of the metal layer 2 is 100 micrometers-300 micrometers, The resin layer 3 has a thickness of 25 μm to 100 μm, and the wiring patterns 4a1,..., 4c2 have a thickness of 12 μm to 50 μm. Therefore, the thickness of the light source device K can be reduced.
Further, since the light source device K (K1 to K8) is thin and flexible, the light source device K (K1 to K8) can be bent and twisted and attached to the inside of the lighting devices S1 to S8 having various shapes. it can.

Furthermore, since the light source device K (K1-K8) is thin, its weight is light.
Further, since the light source device K is thin, the light source device K is manufactured as a sheet-like light source device sheet Ks, and the wiring pattern 4a1,..., 4c2 as shown in FIG. By cutting, it can be applied to lighting devices with various brightnesses.

Furthermore, since the light source device K is thin, the amount of metal and resin used is small, and resource saving is possible. Therefore, the material cost of the light source device K is low.
As described above, the light source device K is easy to manufacture because the sheet-like light source device sheet Ks can be produced and cut and applied in various lengths corresponding to lighting devices of various brightness. Cost can be reduced. Therefore, the total cost for manufacturing the light source device K is low.

  Therefore, it is possible to realize a low-cost light source device that has good productivity and can be adapted to various lighting devices, a lighting device using the light source device, and a method for manufacturing the light source device.

1 LED chip (light emitting diode chip)
1i anisotropic conductive paste 1r lens 2 metal layer 3 resin layer 4 wiring pattern 4a1, 4a2 (+) side wiring pattern (plus side wiring pattern)
4c1, 4c2 (-) side wiring pattern (minus side wiring pattern)
4m metal foil 5 mounting board (flexible mounting board)
K light source device Ka body Kb tail (harness)
Kb1, Kb2 wiring pattern (wiring pattern for supplying power)
Ks light source device sheet n1 adhesive (first adhesive layer)
n2 adhesive (second adhesive layer)
n3 Adhesive material (adhesive layer)
n3a Adhesive layer (adhesive layer)
p, 2p, 3p, 21p, p11, 12, ..., p21, p22, ..., p31, p32, ... Light-emitting diode light sources S1, S2, S3, S4, S5, S6, S7, S8 Illumination device sp Separator Paper (release paper)

Claims (17)

A mounting board having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power;
A plurality of light emitting diode chips electrically connected to the wiring pattern and mounted on the mounting substrate; and a light emitting diode light source having a lens formed on the mounting substrate so as to cover each light emitting diode chip,
The mounting substrate is bendable,
A part of the wiring pattern is formed in a circular shape around the light emitting diode chip so as to surround the light emitting diode chip around each light emitting diode chip. A mounting board having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power;
A plurality of light emitting diode chips electrically connected to the wiring pattern and mounted on the mounting substrate; and a light emitting diode light source having a lens formed on the mounting substrate so as to cover each light emitting diode chip,
The mounting substrate is bendable,
The light source device, wherein the wiring pattern connected to each of the light emitting diode chips is formed in a shape serving as a weir with respect to the lens. A mounting board having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power;
A plurality of light emitting diode chips electrically connected to the wiring pattern and mounted on the mounting substrate; and a light emitting diode light source having a lens formed on the mounting substrate so as to cover each light emitting diode chip,
The mounting substrate is bendable,
The wiring pattern formed in the lens is
The light emitting diode chip is formed in a circular shape around the center, and is connected to the circular wiring pattern and extends radially around the light emitting diode chip to be connected to the light emitting diode chip.
The light source device, wherein the circular wiring pattern and the radial wiring pattern are connected to the positive wiring pattern and the negative wiring pattern outside the lens. A bendable harness having a wiring pattern for supplying power that is formed by integrally connecting the wiring pattern on the plus side and the wiring pattern on the minus side, and extending outside in a band shape integrally with the mounting board The light source device according to claim 1, further comprising a unit. The light emitting diode chip is provided with its electrodes arranged on the wiring pattern side,
The light source device according to any one of claims 1 to 4, wherein the electrode is electrically connected to the wiring pattern through an anisotropic conductive paste. The metal layer is aluminum;
The resin layer is polyethylene terephthalate,
The light source device according to any one of claims 1 to 5, wherein the wiring pattern is aluminum. The metal layer is aluminum;
The resin layer is polyethylene naphthalate or polyimide,
The light source device according to any one of claims 1 to 5, wherein the wiring pattern is copper. An adhesive layer for attaching the light source device to an opposite surface of the metal layer on which the resin layer is disposed;
The light source device according to claim 1, wherein the light source device is a light source device.   An illuminating device provided with the light source device as described in any one of Claims 1-8. A mounting board having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power;
A plurality of light emitting diode chips electrically connected to the wiring pattern and mounted on the mounting substrate; and a light emitting diode light source having a lens formed on the mounting substrate so as to cover each light emitting diode chip, and A method of manufacturing a light source device in which a mounting substrate is bendable,
A first adhesive layer is formed on one surface of the first metal sheet to be the metal layer fed out from the first roll,
By the first adhesive layer of the first metal sheet, a resin sheet to be the resin layer fed out from the second roll is attached to the first metal sheet,
A second adhesive layer is formed on the surface of the resin sheet opposite to the first metal sheet;
By the second adhesive layer of the resin sheet, a metal foil fed out from a third roll is attached to the resin sheet,
From the metal foil on the resin sheet, a part of the wiring pattern is formed in a circular shape around the light emitting diode chip so as to surround the light emitting diode chip around each light emitting diode chip,
An adhesive layer is formed on the surface of the first metal sheet opposite to the resin sheet,
A method for manufacturing a light source device, wherein release paper is attached to the adhesive layer of the first metal sheet. A mounting board having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power;
A plurality of light emitting diode chips electrically connected to the wiring pattern and mounted on the mounting substrate; and a light emitting diode light source having a lens formed on the mounting substrate so as to cover each light emitting diode chip, and A method of manufacturing a light source device in which a mounting substrate is bendable,
A first adhesive layer is formed on one surface of the first metal sheet to be the metal layer fed out from the first roll,
By the first adhesive layer of the first metal sheet, a resin sheet to be the resin layer fed out from the second roll is attached to the first metal sheet,
A second adhesive layer is formed on the surface of the resin sheet opposite to the first metal sheet;
By the second adhesive layer of the resin sheet, a metal foil fed out from a third roll is attached to the resin sheet,
From the metal foil on the resin sheet, the wiring pattern connected to each light emitting diode chip is formed in a shape that serves as a weir for the lens,
An adhesive layer is formed on the surface of the first metal sheet opposite to the resin sheet,
A method for manufacturing a light source device, wherein release paper is attached to the adhesive layer of the first metal sheet. The light emitting diode chip is electrically connected and mounted on the wiring pattern,
The lens is formed to cover the light emitting diode chip to produce a light emitting diode light source, and a light source device sheet including a front metal layer, the resin layer, the wiring pattern, and the light emitting diode light source is produced. The method for manufacturing a light source device according to claim 10 or 11. A mounting board having a metal layer, a resin layer provided on the metal layer, and a metal wiring pattern provided on the resin layer and supplying power;
A plurality of light emitting diode chips electrically connected to the wiring pattern and mounted on the mounting substrate; and a light emitting diode light source having a lens formed on the mounting substrate so as to cover each light emitting diode chip, and A method of manufacturing a light source device in which a mounting substrate is bendable,
A first adhesive layer is formed on one surface of the first metal sheet to be the metal layer fed out from the first roll,
By the first adhesive layer of the first metal sheet, a resin sheet to be the resin layer fed out from the second roll is attached to the first metal sheet,
A second adhesive layer is formed on the surface of the resin sheet opposite to the first metal sheet;
By the second adhesive layer of the resin sheet, a metal foil fed out from a third roll is attached to the resin sheet,
From the metal foil on the resin sheet, the wiring pattern formed in the lens,
The light emitting diode chip is formed in a circle around the center, connected to the circular wiring pattern and formed radially extending around the light emitting diode chip,
An adhesive layer is formed on the surface of the first metal sheet opposite to the resin sheet,
A method for manufacturing a light source device, wherein release paper is attached to the adhesive layer of the first metal sheet. The light emitting diode chip is electrically connected and mounted on the radial wiring pattern,
The lens is formed to cover the light emitting diode chip to produce a light emitting diode light source, and a light source device sheet including a front metal layer, the resin layer, the wiring pattern, and the light emitting diode light source is produced. The method for manufacturing a light source device according to claim 13. The light emitting diode chip is provided with its electrodes arranged on the wiring pattern side,
The electrode manufacturing method of the light source apparatus according to 請 Motomeko 14 characterized in that it is electrically connected to the wiring pattern through an anisotropic conductive paste. A harness part that is bendable integrally with the mounting board is provided in a band shape toward the outside of the mounting board,
The light source device sheet is produced in which a wiring pattern for supplying power formed by integrally connecting the wiring pattern on the plus side and the wiring pattern on the minus side is formed on the harness portion. The method of manufacturing a light source device according to claim 12, claim 14, or claim 15. The light source device manufacturing method according to any one of claims 12 to 14, wherein the light source device sheet is cut to produce the light source device.

Images