JP2020115788A - Led illumination sheet for raising animals and plants, led illumination module for raising animals and plants, shelf board for raising shelf of animals and plants, raising shelf of animals and plants, and raising factory of animals and plants - Google Patents

Abstract

To provide an LED illumination sheet for raising animals and plants, an LED illumination module for raising animals and plants, a shelf board for raising shelf of animals and plants, a raising shelf of animals and plants, and a raising factory of animals and plants in which animals and plants can be obtained at excellent yield.SOLUTION: An LED illumination sheet 20 for raising animals and plants in which a plurality of LED chips 21 are arrayed, and the total amount of luminous flux is 3000lm or more. An LED illumination module for raising animals and plants is equipped with an LED illumination sheet for raising animals and plants and a control part electrically connected to the LED illumination sheet for raising animals and plants, in which the control part is externally connected to the LED illumination sheet for raising animals and plants. A shelf board for raising shelf of animals and plants is equipped with a substrate and the LED illumination sheet for raising animals and plants or the LED illumination module for raising animals and plants which is attached to the substrate. A raising factory of animals and plants is equipped with a building and the raising shelf of animals and plants arranged inside the building.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to an LED lighting sheet for growing animals and plants, an LED lighting module for growing animals and plants, a shelf board for growing shelves of animals and plants, a growing shelf for animals and plants, and an animal and plant growing factory.

As a lighting device used in a plant growing factory, in recent years, the demand for a lighting device using an LED with low power consumption as a light source has been expanding in place of a conventional fluorescent lamp or a high-pressure sodium lamp.

As an example of a plant cultivation factory using a lighting device having an LED as a light source, there is known a plant cultivation device in which a plurality of straight tube type plant growing lights having LEDs as a light source are arranged on a shelf plate of a plant cultivation shelf. (For example, refer to Patent Document 1).

An LED lighting device for growing plants and animals has also been proposed in which a plurality of LED chips are arranged on a flexible type circuit board to form a planar light source (see, for example, Patent Document 2).

JP, 2008-118957, A JP, 2013-251230, A

The present disclosure provides an LED lighting sheet for growing animals and plants, an LED lighting module for growing animals and plants, a shelf plate for growing shelves of animals and plants, a growing shelf for animals and plants, and an animal and plant growing plant that can obtain animals and plants in good yield. I will provide a.

The LED lighting sheet for growing animals and plants according to the present embodiment is an LED lighting sheet for growing animals and plants in which a plurality of LED chips are arranged, and the total luminous flux is 3000 lm or more.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the LED chip may have a luminous efficiency of 150 lm/W or more.

In the LED lighting sheet for growing animals and plants according to the present embodiment, 10 or more of the LED chips may be arranged in series, and 4 or more rows of the LED chips may be arranged in parallel.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the LED chip may be covered with a transparent protective film.

In the LED lighting sheet for growing animals and plants according to the present embodiment, a substrate film and a metal wiring portion formed on the surface of the substrate film are provided, and the plurality of LED chips are mounted on the metal wiring portion. Good.

In the LED lighting sheet for growing plants and animals according to the present embodiment, the thickest portion may have a thickness of 5 mm or less.

In the LED lighting sheet for growing plants and animals according to the present embodiment, the total luminous flux may be 3900 lm or more.

An LED lighting module for growing animals and plants according to the present embodiment is an LED lighting module for growing animals and plants, wherein the LED lighting sheet for growing animals and plants according to the present embodiment and the LED lighting sheet for growing animals and plants are electrically connected. And a control unit that is electrically connected, the control unit being externally connected to the LED lighting sheet for growing plants and animals.

In the LED lighting module for growing animals and plants according to the present embodiment, a constant voltage may be applied from the controller to the LED lighting sheet for growing animals and plants.

In the LED lighting module for growing plants and animals according to the present embodiment, the control unit may be capable of controlling dimming of the LED chip.

The shelf board for growing shelves of animals and plants according to the present embodiment is a shelf board for growing shelves of animals and plants, and a substrate and an LED lighting sheet for growing animals and plants according to the present embodiment, which is attached to the board. Alternatively, the LED lighting module for growing animals and plants according to the present embodiment is provided.

The animal and plant growing shelf according to the present embodiment is an animal and plant growing shelf, and includes a shelf board, and the shelf board is attached to the lower surface side of the substrate, and the LED lighting for growing animals and plants according to the present embodiment. A sheet or the LED lighting module for growing animals and plants according to the present embodiment.

In the animal and plant growing shelf according to the present embodiment, the LED lighting sheet for growing animals and plants may be further arranged on the side surface side of the shelf board.

The plant and animal cultivating plant according to the present embodiment includes a building, and the plant and animal cultivating shelf according to the present embodiment arranged inside the building.

According to the present embodiment, animals and plants can be obtained in good yield.

FIG. 1 is a schematic diagram showing an LED lighting module according to one embodiment. FIG. 2 is a plan view showing an LED lighting sheet according to one embodiment. FIG. 3 is a plan view showing a modified example of the LED lighting sheet. FIG. 4A is a graph showing the relationship between time and voltage when a constant voltage is applied to the LED lighting sheet from the control unit, and FIG. 4B is a comparative example, in which a pulse is applied to the LED lighting sheet. It is a graph which shows the relationship between time and voltage in the case of being. FIG. 5 is a cross-sectional view (cross-sectional view taken along line VV in FIG. 2) showing the LED lighting sheet according to the embodiment. 6A to 6H are cross-sectional views showing a method for manufacturing an LED lighting sheet according to an embodiment. FIG. 7 is a schematic perspective view showing a plant growing factory according to one embodiment. FIG. 8 is a schematic perspective view showing a plant growth shelf according to one embodiment. 9(a) and 9(b) are diagrams showing a modified example of the plant growth shelf.

In the LED lighting sheet for growing animals and plants according to the present embodiment, a plurality of LED chips are arranged, and the total luminous flux amount (of the LED lighting sheet) is 3000 lm or more.

Since the LED lighting sheet for growing animals and plants according to the present embodiment is a sheet-shaped LED lighting device, the entire thickness can be made thinner than an LED bar light in which a plurality of straight tube LEDs are arranged. Therefore, the vertical spacing between the shelves of the animal and plant growing shelf can be narrowed to improve the yield of the animals and plants to be grown per floor area of the animal and plant growing factory. In addition, since the thickness of the LED chip is smaller than the thickness of the LED straight tube, the LED lighting sheet has an LED straight tube with a height difference between a portion where the LED chip is arranged and a portion where the LED chip is not arranged. It can be made smaller than the height difference between the place where the LED straight tube is placed and the place where the LED straight tube is not placed. Therefore, the shadow on the side of the LED chip is less likely to occur, so that even when the animal or plant grows and comes close to the LED lighting sheet, it is possible to suppress the variation in the light irradiating the animal or plant. In the LED lighting device for growing animals and plants, it is important to suppress variations in the light that irradiates the animals and plants, because it reduces the size and quality of the animals and plants to be grown within a certain standard range and reduces nonconforming products. is there. In the growth of animals and plants, it is important to control the light and heat applied to the animals and plants at the latter stage of growth when the animals and plants grow and photosynthesis becomes active. The LED lighting sheet for growing animals and plants according to the present embodiment can suppress variations in relatively strong light emitted to the animals and plants when the animals and plants are close to each other.

Since the LED lighting sheet for growing animals and plants according to the present embodiment has a total luminous flux of 3000 lm or more, it is possible to increase the amount of growing animals and plants while suppressing a decrease in the yield of the animals and plants to be grown, Animals and plants can be obtained in good yield. In an LED lighting device for growing animals and plants, even if the amount of light is simply increased to increase the amount of growing animals and plants, if the variation in the light cannot be suppressed, the variation becomes larger and the number of non-conforming products increases. Yield may decrease. According to the sheet-shaped LED lighting device, even if the total luminous flux is 3000 lm or more, it is possible to suppress variations and obtain a good yield.

Moreover, the LED lighting module for growing animals and plants according to the present embodiment includes an LED lighting sheet for growing animals and plants, and a controller electrically connected to the LED lighting sheet, and the LED lighting for growing animals and plants is provided. The sheet has a total luminous flux of 3000 lm or more, and the control unit is externally connected to the LED lighting sheet.

Since the LED lighting module for growing animals and plants according to the present embodiment has an external control unit, it is possible to increase the amount of animals and plants to be grown while suppressing a decrease in the yield of the animals and plants to be grown. In good yield. The heat locally generated in the vicinity of the control unit strongly affects the plants and animals cultivated in the vicinity of the control unit, and has a small influence on the plants and animals cultivated in the place distant from the control unit. Therefore, the growing state of animals and plants may vary, the number of non-conforming products increases, and the yield may decrease. The larger the light quantity of the LED lighting sheet, the larger the heat generated from the control unit. According to the LED lighting module in which the control unit is externally connected to the LED lighting sheet, the control unit is used even when the LED lighting sheet that irradiates light with a total luminous flux of 3000 lm or more is used. Can be installed at any place, so that variation can be suppressed and good yield can be obtained.

Since the shelf plate for animal and plant growing shelves according to the present embodiment, the animal and plant growing shelf, and the animal and plant growing plant are provided with the LED lighting sheet or module for animal and plant growing according to the above-described present embodiment, a good yield of animals and plants can be obtained. Can be obtained at

An embodiment will be specifically described below with reference to the drawings. Each drawing shown below is a schematic illustration. Therefore, the size and shape of each part are exaggerated as appropriate for easy understanding. In addition, it is possible to appropriately change and implement the embodiments without departing from the technical idea. In the drawings shown below, the same reference numerals are given to the same parts, and detailed description may be partially omitted. Further, the numerical values such as the dimensions of each member and the material names described in the present specification are examples of the embodiments, and the present invention is not limited to these and can be appropriately selected and used. In the present specification, terms that specify a shape or a geometric condition, such as parallel, orthogonal, and vertical terms, mean not only the strict meaning but also substantially the same state. As used herein, an animal or plant means an animal and/or a plant. In the following, for convenience, a case of growing (cultivating) a plant with an LED lighting module will be described as an example, but the present invention can also be applied to a case of growing an animal within a range where no contradiction occurs.

(LED lighting module for growing plants)
The LED lighting module 10 for plant cultivation according to the present embodiment (hereinafter, also referred to as LED lighting module 10) shown in FIG. 1 is provided in a plant cultivation factory 90 (FIG. 7) using artificial light as described later. It is installed and grows plants. Such an LED lighting module 10 includes an LED lighting sheet 20 for plant growth (hereinafter, also referred to as an LED lighting sheet 20) and a control unit 40 electrically connected to the LED lighting sheet 20.

As shown in FIG. 2, the LED lighting sheet 20 has a plurality of LED chips 21 arranged on the light emitting surface side (the side facing the plant direction when in use) of the sheet surface. By using the LED lighting sheet 20 of the direct type as described above, the irradiation light from the LED chip 21 directly passes through the light emitting surface and reaches the plant directly below, so that the amount of light is increased to promote the growth of the plant. In addition, it is possible to reduce the thickness of the entire sheet so that the shadow on the side of the LED chip 21 is less likely to occur. Although FIG. 2 shows an example of the direct type LED lighting sheet 20, the present invention is not limited to this, and an edge type LED lighting sheet having a light guide plate or the like may be used. The edge type LED lighting sheet easily suppresses the variation in the amount of light from the light emitting surface. The LED illumination sheet 20 of FIG. 2 includes a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30. By using such a flexible wiring board 30, the LED lighting sheet 20 having a relatively large sheet surface area can be obtained. Generally, in a plant growing factory or a plant growing shelf, a plurality of LED lighting sheets 20 are arranged and used. However, if the positions of the adjacent LED lighting sheets 20 vary, the light quantity varies and the yield of plants increases. May decrease. The LED lighting sheet 20 having a relatively large sheet surface area can reduce the number of LED lighting sheets 20 to be used, so that it is possible to suppress variations in the light amount due to the arrangement of the plurality of LED lighting sheets 20. Although FIG. 2 shows an example of the LED lighting sheet 20 including the flexible wiring board 30, the present invention is not limited to this, and an LED lighting sheet including a rigid wiring board may be used. The LED lighting sheet provided with the rigid wiring board has high resistance to stress and is not easily damaged. Note that, in FIG. 2, the display of the light-reflective insulating protective film 34 and the transparent protective film 35 described later is omitted.

In this case, the LED chips 21 are arranged in the flexible wiring substrate 30 in a grid point shape in a plan view. That is, the LED chips 21 are arranged in a matrix form in multiple stages and multiple rows, and the rows R of M LED chips 21 connected in series are arranged in N rows. For example, in FIG. 2, 14 (M=14) LED chips 21 are connected in series along the first array direction (X direction) of the LED chips 21. Further, the row R having the 14 LED chips 21 is arranged in parallel in 10 rows (N=10) along the second arrangement direction (Y direction) of the LED chips 21. The number of LED chips 21 arranged is not limited to this. Specifically, 10 or more and 14 or less (14≧M≧10) LED chips 21 are arranged in series in the first array direction (X direction), and this row R is the second array of the LED chips 21. It is preferable to arrange them in parallel in the direction (Y direction) from 4 rows to 10 rows (10≧N≧4). By arranging 10 or more LED chips 21 in series, the LED chips 21 can be arranged at short intervals along the first arrangement direction (X direction), and the in-plane variation of the illuminance of the LED lighting sheet 20 can be reduced. It is possible to suppress, and it is possible to suppress variations in the light that irradiates the plant. By arranging 14 or less LED chips 21 in series, power consumption can be reduced and running costs such as utility costs in the plant growing factory 90 can be reduced. Further, by arranging the rows of the LED chips 21 in parallel in four rows or more in the second arrangement direction (Y direction) of the LED chips 21, even if a specific LED chip 21 is damaged, the LED chips 21 of the other rows are arranged. Therefore, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from extremely decreasing. Further, by limiting the range in which the illuminance of the LED lighting sheet 20 is reduced, the range in which an incompatible product may be generated is limited, and the reduction in yield can be suppressed. In order to make the LED lighting sheet 20 that irradiates light with a total luminous flux of 3000 lm or more, it is necessary to improve the performance of the LED chip 21. Therefore, it is important from the viewpoint of risk management to limit the influence when the specific LED chip 21 is damaged as much as possible. Further, when the LED lighting sheet 20 is of a direct type, there is a high possibility that the LED chip 21 will be accidentally strongly contacted and damaged during installation or cleaning. Therefore, it is risk management to take measures against the damage. Is important in terms of. Furthermore, by arranging 10 or less rows of the LED chips 21 in parallel, power consumption can be reduced and running costs such as utility costs in the plant growing factory 90 can be reduced.

The LED lighting sheet 20 has a plurality of metal wiring portions 22, and the plurality of metal wiring portions 22 are arranged along the first arrangement direction (X direction). The plurality of metal wiring portions 22 arranged along the first arrangement direction (X direction) correspond to the respective columns R of the LED chips 21. The LED chips 21 are arranged so as to straddle a pair of metal wiring portions 22 adjacent to each other in the X direction. Each terminal (not shown) of the LED chip 21 is electrically connected to the pair of metal wiring portions 22. The plurality of metal wiring portions 22 form a power feeding portion to the LED chips 21, and when the power is supplied to the plurality of metal wiring portions 22, all the LED chips 21 arranged in the row R are turned on. .. The plurality of metal wiring portions 22 form a part of the metal wiring portion 32 described later.

The interval Px between the LED chips 21 in the first array direction (X direction) is preferably 37 mm or more and 50 mm or less. Further, the interval Py between the LED chips 21 in the second arrangement direction (Y direction) is preferably 37 mm or more and 100 mm or less. By setting the interval between the LED chips 21 within the above range, the brightness of the LED lighting sheet 20 is made uniform in the plane, the variation of the light irradiating the plants is suppressed, and the power consumption of the LED lighting sheet 20 is suppressed. You can

The thickness of the thickest part of the LED lighting sheet 20 is preferably 5 mm or less. By thus reducing the thickness of the LED lighting sheet 20, the vertical space between the substrates 81 (FIG. 8) on which the LED lighting sheet 20 is installed can be narrowed, whereby the growing shelf 80 ( The number of substrates 81 per (FIG. 8) can be increased. As a result, the yield of plants per unit area can be increased. Moreover, when the plant and the LED lighting sheet 20 are close to each other, it is possible to further suppress the variation in the relatively strong light with which the plant is irradiated.

The array of the LED chips 21 is not limited to the grid point shape in plan view, and may be arranged in a staggered pattern in plan view as shown in FIG. Further, the LED chips 21 do not have to be evenly arranged in the plane of the LED lighting sheet 20. For example, the density of the LED chips 21 may be increased in the peripheral portion of the LED lighting sheet 20. Specifically, as shown in FIG. 3B, the LED chips 21 are arranged in a grid pattern at the center of the LED lighting sheet 20 (the lower part of FIG. 3B), and the peripheral edge of the LED lighting sheet 20 is arranged. The LED chips 21 may be arranged in a staggered manner (in the upper part of FIG. 3B). Accordingly, it is possible to suppress a decrease in the brightness of the LED lighting sheet 20 in the peripheral portion of the LED lighting sheet 20, make the brightness of the LED lighting sheet 20 uniform in the plane, and suppress the variation of the light that illuminates the plant. ..

The overall shape of the LED lighting sheet 20 is a rectangular shape in plan view, but the size and the planar shape of the LED lighting sheet 20 are not particularly limited. Since the LED illumination sheet 20 has a high degree of freedom in processing the size and shape, it is possible to flexibly meet various demands in this regard. Further, by utilizing its flexibility, it is possible to attach to not only a flat installation surface but also various shapes of installation surfaces.

In FIG. 2, the length Lx of the LED lighting sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more and 700 mm or less, and more preferably 550 mm or more and 650 mm or less. The length Ly of the LED lighting sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more and 500 mm or less, and more preferably 350 mm or more and 450 mm or less. By setting the size of the LED lighting sheet 20 within the above range, the LED lighting sheet 20 can be adapted to the general substrate 81 (FIG. 8) for plant cultivation, and the dead space of the substrate 81 can be reduced. .. Further, since the size of each LED lighting sheet 20 is not excessively large, it is possible to minimize the influence on other LED chips 21 when a specific LED chip 21 is damaged, and the entire shelf board. It is possible to prevent the illuminance from falling extremely and to limit the range in which the illuminance drops.

In the present embodiment, the total luminous flux of the LED lighting sheet 20 is 3000 lm or more, more preferably 3900 lm or more. The total luminous flux can be measured by a light distribution measurement device (for example, Spectral Orientation Measurement System GP-2000 manufactured by Otsuka Electronics Co., Ltd.). The measurement condition of the total luminous flux is performed in a stable state after 5 minutes with a DC voltage of 44 V applied to the LED lighting sheet 20. The LED illumination sheet 20 is installed on the biaxial rotation stage, the vertical angle is rotated from 0° to 360° in 5° steps, and the luminous intensity (cd) at a photometric distance of 12 m is measured. As a result, a light distribution with a horizontal angle of 0° to 180° can be obtained. By rotating the LED lighting sheet 20 by 90° and measuring the vertical angle in the same manner, a light distribution with a horizontal angle of 90° to 270° can be obtained. The total luminous flux (lm) is calculated from the data of the angle dependence of luminous intensity. When the LED lighting sheet 20 is dimmable, the maximum setting value is adopted in the present embodiment.

As described above, by increasing the total luminous flux from the LED lighting sheet 20, it is possible to accelerate the growth of plants, suppress the decrease in yield, increase the growth amount of plants, and shorten the growth days. it can. As a result, the yield of plants in the plant growing factory 90 can be improved. That is, conventionally, in the straight tube type LED light bar, the light radiated to the plant when the lighting device and the plant are close to each other varies, and the planar light source sheet only has a low output. In the present embodiment, the total luminous flux of the LED lighting sheet 20 is set to 3000 lm or more, and more preferably 3900 lm or more, so as to compare with the case of using the conventional straight tube type LED light bar or planar light source sheet. Therefore, the yield of plants can be improved.

Photosynthetic photon flux of the LED illumination sheet 20 Density PPFD (photosynthetic photon flux density) is preferably in the 50μmol ^{· m} -2 ^{· s -1} or 300μmol ^{· m} -2 ^{· s -1} or less, 200 [mu] mol · ^{m -2} · More preferably, it is s ⁻¹ or more and 300 μmol·m ⁻² s ⁻¹ or less. This PPFD is a value measured immediately below the LED chip 21 and at a position 20 cm away from the LED chip 21. By setting the PPFD within the above range, it is possible to sufficiently provide the PPFD required for growing the plant in the plant growing factory 90 and promote the growth of the plant. The PPFD can be measured with a measuring device such as a photon meter (for example, photon sensor LI-190R and light meter LI-250A manufactured by LI-COR, USA). The photon sensor LI-190R is arranged so as to be horizontal with respect to the cultivation surface (or light source) and discretely arranged in a matrix according to the cultivation area, and the numerical value is read in a state in which the numerical value indicating the amount of light is stable. Numerical values are read with the light meter calibrated to the unique value of the sensor. In the present embodiment, the numerical value of PPFD is represented by the average value of the numerical values measured in the matrix.

Next, the control unit 40 will be described. As shown in FIG. 1, the control unit 40 supplies electric power to the LED lighting sheet 20 and controls light emission and the like of the LED lighting sheet 20. The control unit 40 is detachably connected to the LED lighting sheet 20 via a first connector 44A provided on the LED lighting sheet 20. That is, the control unit 40 is configured separately from the LED lighting sheet 20, and is externally connected to the LED lighting sheet 20. That is, the control unit 40 is not integrated with the LED lighting sheet 20. As a result, the control unit 40 serving as a heat source can be separated from the LED lighting sheet 20, and the heat from the control unit 40 can be prevented from affecting the growth of plants.

The control unit 40 also includes a power input unit 41, an AC/DC converter (driver) 42, and a PWM control unit 43. Of these, the power input unit 41 is supplied with an alternating voltage having an arbitrary voltage of 100 V to 240 V, for example. The AC/DC converter 42 converts an AC voltage of 100V to 240V into a DC voltage of a constant pressure (for example, 44V). The PWM control unit 43 controls the LED chip 21 of the LED lighting sheet 20 by arbitrarily changing the pulse width of the constant voltage waveform from the AC/DC converter 42. That is, the PWM control unit 43 also serves as a dimming control unit that controls dimming of the LED lighting sheet 20. The constant voltage output from the PWM control unit 43 is applied to the LED lighting sheet 20 via the first connector 44A.

By applying a constant voltage to the LED lighting sheet 20 from the PWM control unit 43 of the control unit 40, unlike the case where the rectified pulse voltage is directly applied to the LED lighting sheet 20, the dimming of the LED chip 21 is performed. It becomes possible to do it. That is, the PWM control unit 43 can arbitrarily control the illuminance of the LED chip 21 by appropriately changing the duty ratio of the DC voltage from the AC/DC converter 42. For example, as shown in FIG. 4A, the PWM control unit 43 suppresses the duty ratio of the constant voltage from the AC/DC converter 42 from 100% (solid line) to 50% (dotted line), so that the LED chip 21 The illuminance of can be reduced.

In this way, by appropriately adjusting the illuminance of the LED chip 21, the illuminance of the LED lighting sheet 20 can be adjusted according to the growth stage of the plant and the degree of growth of the plant can be adjusted. For example, the illuminance of the LED lighting sheet 20 may be lowered in the early stage of growth of small plant leaves, and the illuminance of the LED lighting sheet 20 may be increased in the latter stage of growth of large plant leaves. Alternatively, since the distance between the plant and the LED chip 21 is large in the early growth stage when the plant is short, the illuminance of the LED lighting sheet 20 is increased, and in the latter growth stage when the plant is large in height, the plant and the LED chip 21 are long. The illuminance of the LED illumination sheet 20 may be lowered because the distance from the LED illumination sheet 20 becomes shorter. As another example of adjusting the illuminance of the LED lighting sheet 20, the illuminance may be increased when the type of plant requires high illuminance, and the illuminance may be decreased when the type of plant that can be grown with low illuminance. The illuminance may be increased when the shipping time is desired to be advanced, and the illuminance may be decreased when the shipping time is desired to be delayed. The LED illumination sheet 20 that irradiates light with a total luminous flux of 3000 lm or more has a wide range in which the illuminance can be adjusted, and thus has a great advantage that the dimming of the LED chip 21 can be controlled. In the case of the LED lighting sheet 20 having a low light quantity, even if the LED lighting sheet 20 is provided with a dimming function, it is eventually used at an illuminance near the maximum, and the advantage of having the dimming function was small.

Further, by applying a constant voltage from the PWM control unit 43 to the LED lighting sheet 20, it is possible to increase the integrated light amount of the light from the LED lighting sheet 20 per unit time. That is, for example, the integrated light amount when the constant voltage is applied to the LED lighting sheet 20 (the area of the shaded portion of FIG. 4A) is the integrated light amount when the voltage is applied by the pulse as a comparative example (FIG. 4(b)). Thereby, the light emission efficiency of the light from the LED lighting sheet 20 can be increased and the plant growth efficiency can be improved.

Referring again to FIG. 1, the LED lighting sheet 20 is provided with the regulator 45. In this case, the regulators 45 are provided corresponding to the respective columns of the LED chips 21, and specifically, the ten regulators 45 are provided corresponding to the 10 columns of the LED chips 21. .. The regulator 45 plays a role of maintaining a constant current flowing through the plurality of LED chips 21 in each column. Accordingly, even if one LED chip 21 is damaged, it is possible to prevent an excessive current from flowing to the LED chips 21 in the other columns and prevent the LED chips 21 in the other columns from being damaged. As a result, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from being extremely reduced, and it is possible to suppress variations in the light that illuminates the plants. Further, the regulator 45 can control the amount of current controlled for each column by the resistance value to be connected. For example, by changing the control resistance value of the first column and the last column, only the peripheral column output is performed. I can give you. Thereby, usually, the aim is to ensure uniformity by laying the LED lighting sheets 20 together without any gaps, but from the viewpoint of cost and ensuring air permeability, it is assumed that the LED lighting sheets 20 are separated by about 5 cm to 10 cm. However, the effect that the seam can be erased can be expected.

Further, the LED lighting sheet 20 is provided with a power supply line 46 branching from the first connector 44A. A second connector 44B is provided on the LED lighting sheet 20. The power supply line 46 is not electrically connected to the LED chip 21 of the LED lighting sheet 20, but is electrically connected to the wiring of another LED lighting sheet 200 having the same configuration as the LED lighting sheet 20. Connected. That is, the power supply line 46 is detachably connected to the wiring of the LED lighting sheet 200 via the second connector 44B and the other first connector 44A provided on the other LED lighting sheet 200. The current from the power supply line 46 is supplied to the other LED lighting sheet 200 via the second connector 44B and the other first connector 44A. Thus, the two LED lighting sheets 20 can be connected and the two LED lighting sheets 20 and 200 can be controlled simultaneously by the single control unit 40. Since it is possible to simultaneously control a plurality of LED lighting sheets 20 and 200 by one control unit 40, it is possible to reduce the number of control units 40 that are heat generation sources, so that the total luminous flux is 3000 lm or more. Even when the LED lighting sheet 20 for irradiating is used, variation in plant growth due to heat from the control unit 40 is less likely to occur, and a decrease in yield can be suppressed.

(Each member of the LED lighting sheet)
Next, each member constituting the LED lighting sheet 20 will be described. As shown in FIG. 5, the LED lighting sheet 20 includes a flexible wiring board 30 and a plurality of LED chips 21 arranged on the flexible wiring board 30. Among them, the flexible wiring board 30 has a flexible substrate film 31 and a metal wiring portion 32 formed on the surface (the surface on the light emitting surface side) of the substrate film 31. The metal wiring portion 32 is laminated on the substrate film 31 via the adhesive layer 33.

Each LED chip 21 is mounted on the metal wiring portion 32 in a conductive manner. In the LED lighting sheet 20, the LED chips 21 are mounted on the flexible wiring board 30, so that the plurality of LED chips 21 can be arranged at a desired high density.

A light-reflective insulating protective film 34 is formed so as to cover the area of the LED lighting sheet 20 except the area where the LED chip 21 is provided and the peripheral area thereof. The light-reflective insulating protective film 34 is arranged so as to cover the metal wiring portion 32. The light-reflective insulating protective film 34 is a layer that has both an insulating function that contributes to the improvement of the migration resistance of the LED lighting sheet 20 and a light reflecting function that contributes to the improvement of the light environment created by the LED lighting sheet 20. This layer is formed of an insulating resin composition containing a white pigment. A structure without the light-reflective insulating protective film 34 is also possible when the migration resistance and the light reflection function are obtained only by the metal wiring portion 32 and the transparent protective film 35 described later.

A transparent protective film 35 is formed so as to cover the light-reflecting insulating protective film 34 and the LED chip 21. The transparent protective film 35 is a resin film mainly formed on the outermost surface (the surface located closest to the light emitting surface side) of the LED lighting sheet 20 in order to ensure waterproofness.

A solder portion 36 is provided on the metal wiring portion 32. Each LED chip 21 is electrically connected to the metal wiring portion 32 via the solder portion 36.

(Substrate film)
A resin film having flexibility can be used as the substrate film 31. In the present specification, "having flexibility" means that "the curvature radius can be bent to at least 1 m or less, preferably 50 cm, more preferably 30 cm, further preferably 10 cm, and particularly preferably 5 cm. That means.

As a material of the substrate film 31, a thermoplastic resin having high heat resistance and high insulation may be used. As such a resin, a polyimide resin (PI) or polyethylene naphthalate (PEN), which has excellent heat resistance, dimensional stability upon heating, mechanical strength, and durability, can be used. Among them, polyethylene naphthalate (PEN) having improved heat resistance and dimensional stability by performing heat resistance improvement treatment such as annealing treatment can be preferably used. Further, polyethylene terephthalate (PET) whose flame retardancy is improved by adding a flame retardant inorganic filler or the like may be used.

The thickness of the substrate film 31 is not particularly limited, but from the viewpoint of not becoming a bottleneck as a heat dissipation path, having heat resistance and insulation, and a balance of manufacturing cost, it is generally 10 μm or more and 500 μm or more. Hereafter, it is preferably 50 μm or more and 250 μm or less. The thickness is preferably within the above range from the viewpoint of maintaining good productivity when the roll-to-roll method is used.

(Adhesive layer)
As the adhesive forming the adhesive layer 33, a known resin-based adhesive can be appropriately used. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, ester-based or epoxy-based adhesives can be particularly preferably used.

(Metal wiring part)
The metal wiring portion 32 is a wiring pattern formed of a conductive base material such as a metal foil on the surface (light emitting surface side) of the substrate film 31. The metal wiring portion 32 is preferably formed on the surface of the substrate film 31 via the adhesive layer 33 by a dry laminating method. The metal wiring part 32 includes the plurality of metal wiring parts 22 described above. The plurality of metal wiring portions 22 include a first metal wiring portion 22A and a second metal wiring portion 22B arranged apart from the first metal wiring portion 22A. The LED chip 21 is mounted on the first metal wiring portion 22A and the second metal wiring portion 22B, and the LED chip 21 is electrically connected to the first metal wiring portion 22A and the second metal wiring portion 22B. Has been done. The LED chip 21 is turned on by the electric power supplied to the first metal wiring portion 22A and the second metal wiring portion 22B.

The metal wiring portion 32 preferably has both high heat dissipation and high electrical conductivity, and for example, a copper foil can be used. In this case, the heat dissipation from the LED chips 21 is stable and an increase in electrical resistance can be prevented, so that the variation in light emission between the LED chips 21 is reduced and stable light emission is possible. In addition, the life of the LED chip 21 is extended. Further, deterioration of peripheral members such as the substrate film 31 due to heat can be prevented, so that the product life of the LED lighting sheet 20 can be extended. Examples of the metal forming the metal wiring portion 32 include metals such as aluminum, gold, and silver in addition to the above copper.

The thickness of the metal wiring portion 32 may be appropriately set according to the magnitude of withstand current required for the flexible wiring board 30. However, the thickness of the metal wiring portion 32 is preferably 10 μm or more in order to suppress the warpage due to the heat shrinkage of the substrate film 31 during the soldering process by the reflow method or the like. On the other hand, the thickness of the metal wiring portion 32 is preferably 50 μm or less, whereby the flexibility of the flexible wiring substrate 30 can be maintained, and deterioration of handling property due to an increase in weight can be suppressed. be able to.

(Solder part)
The solder portion 36 joins the metal wiring portion 32 and the LED chip 21. The soldering can be performed by either a reflow method or a laser method.

(LED chip)
The LED chip 21 is a light emitting element that utilizes light emission at a PN junction portion in which a P-type semiconductor and an N-type semiconductor are joined. The LED chip 21 may have a structure in which a P-type electrode and an N-type electrode are provided on the upper surface and the lower surface of the element, respectively, and a structure in which both the P-type electrode and the N-type electrode are provided on one surface of the element. May be.

In the present embodiment, the total luminous flux of the LED lighting sheet 20 is increased to 3000 lm or more, more preferably 3900 lm or more. Therefore, it is preferable to use each LED chip 21 having a large luminous flux amount. Specifically, the LED chip 21 having a luminous flux of 30 lm or more is preferably used, and the LED chip having a luminous flux of 35 lm or more is more preferably used. Further, it is preferable to select the LED chip 21 having high luminous efficiency. Specifically, as the LED chip 21, it is preferable to use one having a luminous efficiency of 150 lm/W or more, and further preferable to use one having a luminous efficiency of 180 lm/W or more. By increasing the luminous efficiency of the LED chip 21 to 150 lm/W or more, the number of mounted (density) LED chips 21 can be reduced, and the heat generated by the Joule heat from the LED chips 21 can be reduced. As a result, it is possible to suppress variation in plant growth due to the above, and to suppress a decrease in yield.

As described above, the LED lighting sheet 20 is one in which the LED chip 21 is directly mounted on the metal wiring portion 32 that can exhibit high heat dissipation. As a result, even when the LED chips 21 are arranged at a high density, excessive heat generated when the LED chips 21 are turned on is quickly diffused through the metal wiring portion 32, and the outside of the LED lighting sheet 20 through the substrate film 31. The heat can be sufficiently radiated to the plant, variation in plant growth due to the heat from the LED chip 21 is less likely to occur, and a decrease in yield can be suppressed.

(Light reflective insulating protective film)
The light-reflective insulating protective film 34 is a layer formed in a region except the region where the LED chip 21 is provided and the peripheral region thereof. The light-reflective insulating protective film 34 is a so-called resist layer that improves the migration resistance of the flexible wiring board 30 by having a sufficient insulating property, and contributes to the improvement of the light environment created by the LED lighting sheet 20. It is a light-reflecting layer having a light-reflecting property.

The light-reflective insulating protective film 34 can be formed of various resin compositions containing urethane resin as a base resin and further containing a white pigment made of an inorganic filler such as titanium oxide. As the base resin of the resin composition used for forming the light-reflective insulating protective film 34, an acrylic urethane-based resin, a polyester-based resin, a phenol-based resin, or the like can be appropriately used in addition to the urethane-based resin. As the base resin of the resin composition forming the light-reflective insulating protective film 34, it is more preferable to use the same or similar resin as the resin composition forming the transparent protective film 35. For the transparent protective film 35, it is preferable to use an acrylic urethane resin as the main material resin, as described later. From this, when the base resin of the resin composition forming the transparent protective film 35 is an acrylic urethane resin, the base resin of the resin composition for forming the light-reflective insulating protective film 34 is a urethane resin or It is more preferable to use an acrylic urethane resin.

As the inorganic filler to be contained as a white pigment in the resin composition forming the light-reflective insulating protective film 34, besides titanium oxide, alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, At least one selected from talc, calcium carbonate, zinc oxide, silica, mica powder, powder glass, powder nickel and powder aluminum can be used.

The thickness of the light reflective insulating protective film 34 is 5 μm or more and 50 μm or less, and more preferably 7 μm or more and 20 μm or less. When the thickness of the light-reflective insulating protective film 34 is less than 5 μm, the light-reflective insulating protective film becomes thin particularly at the edge portion of the metal wiring portion 32, and when the metal wiring cannot be covered and is exposed. The risk that insulation cannot be maintained increases. On the other hand, the thickness of the light-reflective insulating protective film 34 is preferably 50 μm or less from the viewpoint of holding the light-reflective insulating protective film 34 from the curvature of the substrate during handling and transportation.

The light-reflecting insulating protective film 34 has a light ray average reflectance at a wavelength of 400 nm to 780 nm both of preferably 65% or more, more preferably 70% or more, and more preferably 80% or more. Is more preferable. In the LED lighting sheet 20, for example, titanium oxide is contained in an amount of 20 parts by mass or more with respect to 100 parts by mass of the urethane-based or acrylic urethane-based base resin, so that the thickness of the light-reflecting insulating protective film 34 is set to 8 μm. In this case, the light reflectance of the same layer can be 75% or more.

(Transparent protective film)
The transparent protective film 35 is formed on the outermost surface of the LED lighting sheet 20 so as to cover the LED chip 21. The transparent protective film 35 has waterproofness and transparency. The waterproof property of the transparent protective film 35 can prevent water from entering the inside of the device when the LED lighting sheet 20 is used as a light source for growing plants. In the LED lighting sheet 20 that irradiates light with a total luminous flux amount of 3000 lm or more, it is necessary to improve the performance of the LED chip 21, and the influence when the specific LED chip 21 is damaged becomes large. Therefore, it is important from the viewpoint of risk management to prevent the LED chip 21 from being damaged as much as possible.

The transparent protective film 35 can be formed of various resin compositions having an acrylic urethane resin or the like as a base resin. As the base resin of the resin composition used for forming the transparent protective film 35, urethane-based resin, polyester-based resin, phenol-based resin, and the like can be appropriately used in addition to the acrylic urethane-based resin. As the base resin of the resin composition forming the transparent protective film 35, it is preferable to use the same or similar resin as the resin composition forming the light-reflective insulating protective film 34 as the base resin. A preferred specific combination is a combination in which the base resin of the resin composition forming the light-reflective insulating protective film 34 is a urethane resin and the resin forming the transparent protective film 35 is an acrylic urethane resin. it can.

The thickness of the transparent protective film 35 is 10 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. By setting the thickness of the transparent protective film 35 in the above range, it is possible to maintain good flexibility and thinness of the LED lighting sheet 20, lightness, and good optical characteristics required for plant growing applications. Further, the LED lighting sheet 20 can be provided with sufficient waterproofness required for plant growing applications.

Water resistance of the LED lighting sheet 20 by the transparent protective film 35 is such that deterioration of the LED chip 21 can be suppressed when water for growing plants is sprayed on the LED lighting sheet 20. It is not particularly limited. Such water resistance is preferably IPX4 or higher in the waterproof/dustproof protection standard established by the IEC (International Electrotechnical Commission). The waterproof property of IPX4 or higher is such that water droplets from all directions do not have a harmful effect on the LED chip 21. Specifically, when water is sprayed from the water spray nozzle at a water amount of 10 L/min for 5 minutes in the entire range of ±180° with respect to the normal direction of the LED lighting sheet 20, the LED chip 21 is adversely affected. It is said that it is not done.

(Method of manufacturing LED lighting sheet)
Next, a method for manufacturing the LED lighting sheet 20 according to the present embodiment will be described with reference to FIGS.

First, the substrate film 31 is prepared (FIG. 6A). Next, on the surface of the substrate film 31, a metal foil 32A such as a copper foil which is a material of the metal wiring portion 32 is laminated (FIG. 6B). The metal foil 32A is adhered to the surface of the substrate film 31 by an adhesive layer 33 such as a urethane-based adhesive agent. Alternatively, the metal foil 32A may be directly formed on the surface of the substrate film 31 by an electrolytic plating method or a vapor deposition method (sputtering, ion plating, electron beam vapor deposition, vacuum vapor deposition, chemical vapor deposition, etc.). Alternatively, the substrate film 31 may be directly welded to the metal foil 32A.

Next, the etching mask 37 patterned into the shape required for the metal wiring portion 32 is formed on the surface of the metal foil 32A (FIG. 6C). The etching mask 37 is provided so that the portion corresponding to the wiring pattern of the metal foil 32A to be the metal wiring portion 32 will not be corroded by the etching liquid. The method for forming the etching mask 37 is not particularly limited, and for example, it may be formed by exposing a photoresist or a dry film through a photomask and then developing it. An etching mask may be formed on the surface.

Next, the metal foil 32A located at a portion not covered with the etching mask 37 is removed with an immersion liquid (FIG. 6(d)). As a result, the portion of the metal foil 32A other than the portion that becomes the metal wiring portion 32 is removed.

After that, the etching mask 37 is removed using an alkaline stripping solution. As a result, the etching mask 37 is removed from the surface of the metal wiring portion 32 (FIG. 6E).

Then, a light-reflective insulating protective film 34 is laminated on the metal wiring portion 32 (FIG. 6F). The formation of the light-reflective insulating protective film 34 is not particularly limited as long as it is a coating means capable of uniformly coating the material resin composition forming the light-reflective insulating protective film 34, and examples thereof include screen printing, offset printing, A method such as a dip coater or brush coating can be used. Alternatively, the light-reflective insulating protective film 34 may be formed by applying an insulating protective film material having photosensitivity to the entire surface, exposing only a required portion through a photomask, and then developing.

Next, the LED chip 21 is mounted on the metal wiring portion 32 (FIG. 6(g)). In this case, the LED chip 21 is joined to the metal wiring portion 32 by soldering via the solder portion 36. The joining by the soldering process can be performed by a reflow method, a laser method, or a conductive resin.

Next, the transparent protective film 35 is formed so as to cover the light reflective insulating protective film 34 and the LED chip 21 (FIG. 6(h)). This transparent protective film 35 is preferably formed by a method of spraying a transparent resin composition by spraying (hereinafter referred to as “spray coating method”) or a method of forming by a curtain coating method. The transparent protective film 35 is formed by the spray coating method, for example, by spraying a coating liquid for spray coating treatment containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 by a spray coating machine. Can be formed. The transparent protective film 35 is formed by the curtain coating method by, for example, applying a curtain coating processing coating liquid containing an acrylic polyurethane resin to a desired area on the flexible wiring substrate 30 by a curtain coating machine. Can be formed.

The LED lighting sheet 20 according to the present embodiment is not limited to the above-described method, but is a known publicly known flexible wiring board for LED chips and various publicly known LED modules mounted with LED chips mounted thereon. It can also be produced by a method.

(Plant growing factory and plant growing shelf)
FIG. 7: is a figure which shows typically the structure of the plant cultivation factory 90 using the LED lighting sheet 20 by this Embodiment. The plant growing factory 90 includes a building 91 and a plurality of plant growing shelves 80 arranged inside the building 91.

As shown in FIG. 8, the plant growth shelf 80 has a plurality of (four) columns 82, and a plurality of substrates 81 arranged along the columns 82 at intervals in the vertical direction. .. A medium region for cultivating the plant PL is provided on the upper surface of each substrate 81 except the uppermost substrate 81. The lower surface of each substrate 81 except the lowermost substrate 81 constitutes a ceiling surface with respect to the substrate 81 located below the substrate 81, and the LED lighting sheets 20 are arranged in parallel. In this case, the control unit 40 is arranged at a place sufficiently distant from the LED lighting sheet 20. Therefore, there is less possibility that the plant PL located near the control unit 40 and the plant PL located far from the control unit 40 will have uneven growth due to heat from the control unit 40. Further, the substrate 81 and the LED lighting sheet 20 attached to the lower surface side of the substrate 81 constitute a shelf plate 83 for growing shelves of plants. Alternatively, the substrate 81 and the LED lighting module 10 attached to the lower surface side of the substrate 81 constitute a shelf plate 83 for a plant growing shelf. In the present embodiment, a shelf plate 83 (FIG. 8) for a plant growth shelf, a plant growth shelf 80 (FIG. 8), and a plant growth factory 90 (FIG. 7) including the plant growth shelf 80 are used in the present embodiment. Also provide.

Since the LED lighting sheet 20 according to the present embodiment is flexible and lightweight, the LED lighting sheet 20 can be attached to the lower surface of each substrate 81 more easily than the conventional straight tube type lighting device. Can be done. Furthermore, since the LED lighting sheet 20 has flexibility, the LED lighting sheet 20 can be attached to the ceiling surface having various sizes and shapes. As a result, the LED lighting sheet 20 according to the present embodiment can be applied to various plant growing shelves 80 and plant growing factories 90.

Further, the LED lighting sheet 20 is made thinner than the conventional straight tube type lighting device. Thereby, the space|interval of the board|substrate 81 of the up-down direction can be narrowed, and the number of the board|substrates 81 contained in the growing shelf 80 of each plant can be increased. As a result, the yield of plant PL per unit area can be increased.

As shown in FIGS. 9A and 9B, the LED lighting sheet 20 may be arranged not only on the lower surface of the substrate 81 but also on the side surface side of the substrate 81. The LED lighting sheet 20 on the side surface is hung from the board 81 located above to the board 81 located below the board 81. In this case, as shown in FIG. 9A, the LED lighting sheet 20 may reach the substrate 81 located below. Alternatively, as shown in FIG. 9B, the LED lighting sheet 20 may cover only the upper side of the space located between the upper and lower substrates 81 without reaching the substrate 81 located below. In this way, by further disposing the LED lighting sheet 20 on the side surface side of the substrate 81, the amount of light at the peripheral edge of the substrate 81 where the illuminance tends to be weakened is compensated, and the brightness of the LED lighting sheet 20 is made uniform within the surface. be able to. As a result, the growth of plants can be made uniform in the plane, and the yield of plants to be grown can be improved.

As described above, according to the present embodiment, since the total luminous flux of the LED lighting sheet 20 is 3000 lm or more, the light intensity required in the plant growing factory 90 can be sufficiently obtained from the LED lighting sheet 20. The plant growth can be improved.

Further, according to the present embodiment, the LED chip 21 has a luminous efficiency of 150 lm/W or more. As a result, the power consumption can be suppressed and the energy efficiency of the LED lighting sheet 20 can be increased while keeping the total luminous flux of the LED lighting sheet 20 high. Further, the number of mounted LED chips 21 (density) can be reduced, and the heat generated by Joule heat from the LED chips 21 can be reduced.

Further, according to the present embodiment, ten or more LED chips 21 are arranged in series, and four or more LED chips 21 are arranged in parallel. As a result, the LED chips 21 can be evenly arranged in the plane, the arrays of the LED chips 21 can be arranged in parallel, and the risk when the LED chips 21 are damaged can be dispersed.

Further, according to the present embodiment, since the LED chip 21 is covered with the transparent protective film 35, it is possible to protect the LED chip 21 from water splashed when the plant is grown.

Further, according to the present embodiment, since the thickest part of the LED lighting sheet 20 has a thickness of 5 mm or less, the distance between the upper and lower substrates 81 of the plant growth shelf 80 is reduced and the number of the substrates 81 is increased. , Can increase the yield of plants per unit area.

Further, according to the present embodiment, since the control unit 40 is externally connected to the LED lighting sheet 20, the control unit 40 is separated from the LED lighting sheet 20 and the plants are affected by the heat from the control unit 40. Can be kept below.

Further, according to the present embodiment, since a constant voltage is applied to the LED lighting sheet 20 from the control unit 40, it is possible to increase the integrated light amount per unit time from the LED chip 21 and promote the growth of plants.

Further, according to the present embodiment, since the control unit 40 can control the dimming of the LED chip 21, it is possible to adjust the intensity of the light from the LED chip 21 according to the growth stage of the plant. it can.

[Example]
Next, a specific example of the present embodiment will be described.

(Creation of LED lighting sheet)
The LED lighting sheets of Examples 1 and 2 and Comparative Example were produced as follows.

(Example 1)
A copper foil (thickness: 35 μm) for forming a metal wiring portion is laminated on one surface of a 560 mm×390 mm size film substrate (polyethylene naphthalate, thickness: 50 μm), and then a copper foil for metal wiring is formed. Etching was performed to form metal wiring portions having the same pattern in all the examples and comparative examples. Then, a urethane resin is used as a base resin on the substrate film and the metal wiring portion, and an insulating ink containing 20% by mass of titanium oxide is added to the base resin by screen printing to have a thickness of 10 μm. The light-reflective insulating protective film of Next, a plurality of LED chips (“NFSW757G-V2” (manufactured by Nichia Chemical Industry Co., Ltd.)) are provided in the metal wiring portion with 14 rows in 10 rows at 40 mm pitch in the X direction and 35 mm pitch in the Y direction. It was mounted by soldering. The LED chip is a top-emission type light-emitting element, and has an outer shape of a rectangular parallelepiped having a size of 3.0 mm (length)×3.0 mm (width)×0.65 mm (height). Further, each of the LED chips has a color temperature of 3000 K, a luminous flux of 36.2 lm, and a luminous efficiency of 196 lm/W. Furthermore, the above-mentioned insulating protective film and the transparent protective film that covers the LED chip were formed by a spray coating method. The LED lighting sheet produced as described above was used as the LED lighting sheet of Example 1.

(Example 2)
The LED lighting sheet manufactured in the same manner as in Example 1 was used as the LED lighting sheet in Example 2 except that the total light flux of the LED sheet was controlled to be 3000 lm by the dimmer.

(Comparative example)
Manufacturing was performed in the same manner as in Example 1 except that an LED chip having a luminous flux of 12.6 lm and a luminous efficiency of 67 lm/W (“NFSW757D-V1” (manufactured by Nichia Corporation) was used. The prepared LED lighting sheet was used as a comparative LED lighting sheet.

With respect to the LED lighting sheets of Examples 1 and 2 and Comparative Example, the optical characteristics, specifically, the total luminous flux and the photosynthetic photon flux density (PPFD) were measured. The total luminous flux was measured by a light distribution measuring device (for example, Spectral Orientation Measuring System GP-2000 manufactured by Otsuka Electronics Co., Ltd.). The photosynthetic photon flux density (PPFD) was measured by a photon meter (Photon quantum sensor LI-190R manufactured by Meiwa Forsys Co., Ltd.). Further, for the LED lighting sheets of Examples 1 and 2 and Comparative Example, the total luminous flux amount (lm/W) and the photosynthetic photon flux density (PPFD/W) with respect to the total input power (W) were calculated.

Subsequently, the LED lighting sheets of Examples 1 and 2 and Comparative Example were attached to plant growing shelves, and plants (baby spinach) were actually cultivated. Then, the fresh weight (g/m ² ) was measured as the growth amount of the grown plant. The measurement of the fresh weight was calculated by measuring the above-ground fresh weight after the cultivation for each cultivation panel and calculating the weight per square meter. Moreover, the daily production body weight (g/m ² /day), which is the fresh weight per cultivation days, was calculated. Table 1 shows the above evaluation results.

As shown in Table 1 above, when the LED lighting sheets of Examples 1 and 2 were used, the living weight of the plant could be increased more than when the LED lighting sheets of Comparative Examples were used. In particular, when the LED lighting sheet of Example 1 is used, the living weight of the plant can be significantly increased, although the number of cultivation days is one day shorter than when the LED lighting sheet of the comparative example is used. It was Specifically, in the case of using the LED lighting sheet of Example 1 (total luminous flux amount 3900 lm), the daily production body weight (g/g) was compared to the case of using the LED lighting sheet of Comparative Example (total luminous flux amount 2350 lm). m ² / day) was able to increase about 77%. Moreover, when the LED lighting sheet of Example 2 (total luminous flux amount of 3000 lm) was used, the daily production body weight (g/m ² /g/m) was compared with the case of using the LED lighting sheet of Comparative Example (total luminous flux amount of 2350 lm). Day) could be increased by about 39%. Thus, when the LED lighting sheets of Examples 1 and 2 were used, the productivity of plants could be improved by increasing the total luminous flux of light from the LED chips.

It is also possible to appropriately combine a plurality of constituent elements disclosed in the above-described embodiments and modifications. Alternatively, some constituent elements may be deleted from all the constituent elements shown in the above-described embodiments and modifications.

10 LED Lighting Module 20 LED Lighting Sheet 21 LED Chip 22 Metal Wiring Section 30 Flexible Wiring Board 31 Substrate Film 32 Metal Wiring Section 33 Adhesive Layer 34 Light Reflective Insulation Protective Film 35 Transparent Protective Film 36 Solder Section 40 Control Section 41 Power Input Part 42 AC/DC converter 43 PWM control part 44A First connector 44B Second connector 45 Regulator 46 Power supply line 80 Plant growing shelf 81 Substrate 82 Pillar 83 Shelf board for plant growing shelf 90 Plant growing factory 91 Building

Claims (14)

An LED lighting sheet for growing plants and animals, in which a plurality of LED chips are arranged,
An LED lighting sheet for growing animals and plants, which has a total luminous flux of 3000 lm or more. The LED lighting sheet according to claim 1, wherein the LED chip has a luminous efficiency of 150 lm/W or more. The LED lighting sheet according to claim 1 or 2, wherein 10 or more of the LED chips are arranged in series, and 4 or more rows of the LED chips are arranged in parallel. The LED lighting sheet according to any one of claims 1 to 3, wherein the LED chip is covered with a transparent protective film. The animal and plant according to claim 1, comprising a substrate film and a metal wiring portion formed on a surface of the substrate film, wherein the plurality of LED chips are mounted on the metal wiring portion. LED lighting sheet for growing. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 5, wherein the thickest portion has a thickness of 5 mm or less. The LED lighting sheet for growing plants and animals according to claim 1, wherein the total luminous flux is 3900 lm or more. An LED lighting module for growing animals and plants,
An LED lighting sheet for growing animals and plants according to any one of claims 1 to 7,
A control unit electrically connected to the LED lighting sheet for growing animals and plants;
The control unit is an LED lighting module for growing plants and animals, which is externally connected to the LED lighting sheet for growing plants and animals. The LED lighting module for growing animals and plants according to claim 8, wherein a constant voltage is applied from the control unit to the LED lighting sheet for growing animals and plants. The LED lighting module according to claim 8 or 9, wherein the control unit is capable of controlling light control of the LED chip. A shelf board for growing shelves of animals and plants,
Board,
An LED lighting sheet for growing animals and plants according to any one of claims 1 to 7, or an LED lighting module for growing animals and plants according to any one of claims 8 to 10, which is attached to the substrate. A shelf board for growing shelves of animals and plants. A shelf for growing animals and plants,
Equipped with shelves,
The said shelf board was attached to the lower surface side of the board|substrate, The LED lighting sheet for animal and plant growth of any one of Claim 1 thru|or 7, or the animal and plant growth of any one of Claims 8-10. An animal and plant growing shelf equipped with an LED lighting module. The animal and plant growing rack according to claim 12, wherein the LED lighting sheet for growing plants and animals is further arranged on a side surface of the shelf board. Building,
An animal and plant growing plant, comprising the animal and plant growing shelf according to claim 12 or 13, which is arranged inside the building.

Images