JP7288610B2 - Animal and plant growing LED lighting sheet, animal and plant growing LED lighting module, animal and plant growing shelf plate, animal and plant growing shelf, and animal and plant growing factory - Google Patents

Description

The present disclosure relates to an animal and plant growing LED lighting sheet, an animal and plant growing LED lighting module, an animal and plant growing shelf board, an animal and plant growing shelf, and an animal and plant growing factory.

BACKGROUND ART In recent years, there has been an increasing demand for lighting devices that use LEDs, which consume less power, as light sources in place of conventional fluorescent lamps, high-pressure sodium lamps, and the like, as lighting devices used in plant growing factories.

As an example of a plant cultivation factory using a lighting device using LEDs as light sources, there is known a plant cultivation device in which a plurality of straight tube type plant growing lights using LEDs as light sources are arranged on the shelf board of a plant cultivation shelf. (See Patent Document 1, for example).

There has also been proposed an LED lighting device for cultivating animals and plants, in which a plurality of LED chips are arranged on a flexible circuit board to form a planar light source (see Patent Document 2, for example).

JP 2008-118957 A JP 2013-251230 A

The present disclosure provides an LED lighting sheet for raising animals and plants, an LED lighting module for raising animals and plants, a shelf board for raising animals and plants, a shelf for raising animals and plants, and a factory for raising animals and plants, which can obtain animals and plants with a good yield. I will provide a.

The LED lighting sheet for cultivating animals and plants according to the present embodiment is an LED lighting sheet for cultivating animals and plants in which a plurality of LED chips are arranged, and has a total luminous flux of 3000 lm or more.

In the LED lighting sheet for cultivating animals and plants according to this embodiment, the LED chip may have a luminous efficiency of 150 lm/W or more.

In the LED lighting sheet for cultivating animals and plants according to the present embodiment, ten or more of the LED chips may be arranged in series, and four or more rows of the LED chips may be arranged in parallel.

In the LED lighting sheet for growing animals and plants according to this embodiment, the LED chips may be covered with a transparent protective film.

The LED lighting sheet for cultivating animals and plants according to the present embodiment includes a substrate film and a metal wiring portion formed on the surface of the substrate film, and the plurality of LED chips are mounted on the metal wiring portion. good too.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the thickness at the thickest portion may be 5 mm or less.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the total luminous flux may be 3900 lm or more.

The LED lighting module for cultivating animals and plants according to the present embodiment is an LED lighting module for cultivating animals and plants. and a control unit connected externally, wherein the control unit is externally connected to the LED lighting sheet for growing animals and plants.

In the LED lighting module for growing animals and plants according to the present embodiment, a constant voltage may be applied from the control unit to the LED lighting sheet for growing animals and plants.

In the LED lighting module for cultivating animals and plants according to the present embodiment, the controller may be capable of controlling dimming of the LED chip.

The shelf board for growing animals and plants according to the present embodiment is a shelf board for growing animals and plants, and comprises a substrate and an LED lighting sheet for growing animals and plants according to the present embodiment attached to the substrate. Alternatively, the LED illumination module for cultivating animals and plants according to the present embodiment is provided.

The animal and plant growing shelf according to the present embodiment is an animal and plant growing shelf, and includes a shelf board, and the shelf board is attached to the lower surface side of a substrate. The LED lighting for animal and plant growth according to the present embodiment a sheet or an LED lighting module for cultivating animals and plants according to the present embodiment.

In the animal and plant growing rack according to the present embodiment, the animal and plant growing LED lighting sheet may be further arranged on the side surface side of the shelf board.

An animal and plant growing factory according to the present embodiment includes a building and the animal and plant growing shelf according to the present embodiment arranged inside the building.

According to this embodiment, animals and plants can be obtained in good yields.

FIG. 1 is a schematic diagram showing an LED lighting module according to one embodiment. FIG. 2 is a plan view showing an LED lighting sheet according to one embodiment. FIG. 3 is a plan view showing a modification of the LED lighting sheet. FIG. 4A is a graph showing the relationship between time and voltage when a constant voltage is applied from the control unit to the LED lighting sheet, and FIG. 10 is a graph showing the relationship between time and voltage when FIG. 5 is a cross-sectional view (cross-sectional view taken along line VV in FIG. 2) showing an LED lighting sheet according to one embodiment. 6(a)-(h) are cross-sectional views showing a method for manufacturing an LED lighting sheet according to one embodiment. FIG. 7 is a schematic perspective view showing a plant growing factory according to one embodiment. FIG. 8 is a schematic perspective view showing a plant growing shelf according to one embodiment. FIGS. 9(a) and 9(b) are diagrams showing modified examples of the plant growing shelf.

In the LED lighting sheet for growing animals and plants according to the present embodiment, a plurality of LED chips are arranged and the total luminous flux amount (of the LED lighting sheet) is 3000 lm or more.

Since the LED lighting sheet for cultivating animals and plants according to the present embodiment is a sheet-shaped LED lighting device, the overall thickness can be made thinner than an LED bar light in which a plurality of straight tube LEDs are arranged. Therefore, by narrowing the vertical interval between the shelf boards of the animal and plant growing shelf, the yield of animals and plants to be grown per floor area of the animal and plant growing factory can be improved. In addition, since the thickness of the LED chips is smaller than the thickness of the straight LED tubes, the LED lighting sheet compensates for the height difference between the part where the LED chips are arranged and the part where the LED chips are not arranged. It can be made smaller than the height difference between the place where the LED straight tube is arranged and the place where the LED straight tube is not arranged. Therefore, since shadows on the sides of the LED chips are less likely to occur, variations in the light emitted to the animals and plants can be suppressed even when the animals and plants grow and approach the LED lighting sheet. In an LED lighting device for raising animals and plants, it is important to suppress the variation in the light emitted to animals and plants, because it reduces the number of non-conforming products by keeping the size and quality of the animals and plants to be raised within a certain range. be. In the growth of animals and plants, it is important to control the light and heat applied to animals and plants in the late stage of growth when the animals and plants grow and photosynthesis becomes active. The LED lighting sheet for cultivating animals and plants according to the present embodiment can suppress variations in the relatively strong light emitted to the animals and plants when the animals and plants are close to each other.

Since the LED lighting sheet for raising animals and plants according to the present embodiment has a total luminous flux of 3000 lm or more, it is possible to increase the amount of animals and plants to be raised while suppressing a decrease in the yield of animals and plants to be raised. Animals and plants are obtained in good yields. In an LED lighting device for growing animals and plants, even if an attempt is made to increase the amount of growing animals and plants by simply increasing the amount of light, if the variation in the light cannot be suppressed, the variation will increase and the number of nonconforming products will increase. Yield may decrease. According to the sheet-shaped LED lighting device, even when the total luminous flux is light of 3000 lm or more, variation is suppressed and a good yield can be obtained.

Further, the LED lighting module for cultivating animals and plants according to the present embodiment includes an LED lighting sheet for cultivating animals and plants, and a control unit electrically connected to the LED lighting sheet. The sheet has a total luminous flux amount of 3000 lm or more, and the control unit is externally connected to the LED lighting sheet.

Since the LED lighting module for raising animals and plants according to the present embodiment has an external control unit, it is possible to increase the amount of animals and plants to be raised while suppressing a decrease in the yield of the animals and plants to be raised. are obtained in good yields. The heat locally generated in the vicinity of the control unit strongly affects animals and plants growing near the control unit, and has a low effect on animals and plants growing far from the control unit. As a result, there is a risk that the growing conditions of animals and plants will vary, resulting in a large number of nonconforming products and a decrease in yield. As the light intensity of the LED lighting sheet increases, the heat generated from the control section increases. According to the LED lighting module in which the control unit is externally connected to the LED lighting sheet, even if the LED lighting sheet that emits light with a total luminous flux of 3000 lm or more is used, the control unit can be placed anywhere, it is possible to suppress the variation and obtain a good yield.

The shelf board for the animal and plant growing shelf, the animal and plant growing shelf, and the animal and plant growing factory according to the present embodiment are equipped with the LED lighting sheet or module for animal and plant growing according to the above-described present embodiment. can be obtained with

An embodiment will be specifically described below with reference to the drawings. Each figure shown below is shown typically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In addition, it is possible to modify and implement as appropriate without departing from the technical idea. In addition, in each figure shown below, the same code|symbol is attached|subjected to the same part and detailed description may be partially abbreviate|omitted. In addition, numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as parallel, orthogonal, perpendicular, etc., not only have strict meanings but also include substantially the same states. As used herein, animals and plants mean animals and/or plants. In the following, for the sake of convenience, the case of growing (cultivating) plants by the LED lighting module will be described as an example, but the present invention can also be applied to the case of growing animals as long as there is no contradiction.

(LED lighting module for growing plants)
The LED lighting module 10 for growing plants according to the present embodiment (hereinafter also referred to as the LED lighting module 10) shown in FIG. It is installed and grows plants. Such an LED lighting module 10 includes an LED lighting sheet 20 for growing plants (hereinafter also referred to as an LED lighting sheet 20 ) and a control section 40 electrically connected to the LED lighting sheet 20 .

As shown in FIG. 2, the LED lighting sheet 20 has a plurality of LED chips 21 arranged on the light-emitting surface side of the sheet surface (the side facing toward the plant during use). By using such a direct type LED lighting sheet 20, the irradiation light from the LED chip 21 passes through the light emitting surface as it is and reaches the plant directly under it, so that the amount of light is increased to promote the growth of the plant. In addition, by reducing the thickness of the entire sheet, it is possible to make the side shadows of the LED chips 21 less likely to occur. Although FIG. 2 shows an example of the direct type LED lighting sheet 20, it is not limited to this, and an edge type LED lighting sheet with a light guide plate or the like interposed may be used. The edge-type LED lighting sheet tends to suppress variations in the amount of light emitted from the light-emitting surface. The LED lighting sheet 20 of FIG. 2 includes a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30 . By using such a flexible wiring board 30, it is possible to obtain the LED lighting sheet 20 having a relatively large sheet surface area. In general, in a plant growing factory or a plant growing shelf, a plurality of LED lighting sheets 20 are arranged and used, but if the positions of adjacent LED lighting sheets 20 vary, the amount of light varies, resulting in plant yield. may decrease. Since the number of LED lighting sheets 20 to be used can be reduced with the LED lighting sheets 20 having a relatively large sheet surface area, variations in the amount of light due to the arrangement of the plurality of LED lighting sheets 20 can be suppressed. Although FIG. 2 shows an example of the LED lighting sheet 20 having the flexible wiring board 30, the present invention is not limited to this, and an LED lighting sheet having a rigid wiring board may be used. An LED lighting sheet with a rigid wiring board has high resistance to stress and is less likely to break. In FIG. 2, illustration of a light-reflective insulating protective film 34 and a transparent protective film 35, which will be described later, is omitted.

In this case, the LED chips 21 are arranged in a grid pattern in a plan view inside the flexible wiring board 30 . That is, the LED chips 21 are arranged in multiple rows and columns in a matrix, and N rows R of LED chips 21 connected in series are arranged. For example, in FIG. 2, 14 (M=14) LED chips 21 are connected in series along the first arrangement direction (X direction) of the LED chips 21 . Further, the row R having the 14 LED chips 21 is arranged in 10 rows (N=10) in parallel along the second arrangement direction (Y direction) of the LED chips 21 . Note that the number of LED chips 21 to be arranged is not limited to this. Specifically, 10 or more and 14 or less (14≧M≧10) LED chips 21 are arranged in series in the first arrangement direction (X direction), and this row R is the second arrangement of the LED chips 21. It is preferable to arrange 4 or more and 10 or less (10≧N≧4) rows in parallel in the direction (Y direction). By arranging 10 or more LED chips 21 in series, the LED chips 21 can be arranged at short intervals along the first arrangement direction (X direction), and in-plane variations in the illuminance of the LED lighting sheet 20 can be reduced. It is possible to suppress variations in the light irradiating the plants. By arranging 14 or less LED chips 21 in series, power consumption can be reduced, and running costs such as utility costs in the plant growing factory 90 can be reduced. Further, by arranging four or more rows of the LED chips 21 in parallel in the second arrangement direction (Y direction) of the LED chips 21, even if a specific LED chip 21 is damaged, the LED chips 21 in the other rows , and the illuminance of the entire LED lighting sheet 20 can be prevented from being extremely lowered. Further, by limiting the range where the illuminance of the LED lighting sheet 20 is lowered, it is possible to limit the range where there is a possibility that nonconforming products may occur, thereby suppressing a decrease in yield. In order to make the LED lighting sheet 20 that irradiates light with a total luminous flux amount of 3000 lm or more, it is necessary to improve the performance of the LED chips 21 . Therefore, it is important from the viewpoint of risk management to limit the impact of damage to a specific LED chip 21 as much as possible. In addition, when the LED lighting sheet 20 is a direct type, there is a high risk of damage due to accidental strong contact with the LED chip 21 during installation or cleaning. is important from the viewpoint of Furthermore, by arranging 10 or less rows of the LED chips 21 in parallel, power consumption can be reduced, and running costs such as utility costs in the plant growing factory 90 can be reduced.

The LED lighting sheet 20 has a plurality of metal wiring portions 22, and the plurality of metal wiring portions 22 are arranged along the first arrangement direction (X direction). A plurality of metal wiring portions 22 arranged along the first arrangement direction (X direction) correspond to the respective rows R of the LED chips 21 . The LED chips 21 are arranged so as to straddle a pair of metal wiring portions 22 adjacent to each other in the X direction. Each terminal (not shown) of the LED chip 21 is electrically connected to a pair of metal wiring portions 22, respectively. The plurality of metal wiring portions 22 constitute a power feeding portion for the LED chips 21, and by supplying power to the plurality of metal wiring portions 22, all the LED chips 21 arranged in the row R are lit. . In addition, the plurality of metal wiring portions 22 constitute a part of a metal wiring portion 32 to be described later.

The interval Px between the LED chips 21 in the first arrangement direction (X direction) is preferably 37 mm or more and 50 mm or less. Moreover, it is preferable that the interval Py between the LED chips 21 in the second arrangement direction (Y direction) is set to 37 mm or more and 100 mm or less. By setting the interval between the LED chips 21 within the above range, the luminance of the LED lighting sheet 20 is made uniform in the plane, the variation in the light irradiated to the plants is suppressed, and the power consumption of the LED lighting sheet 20 is suppressed. can be done.

The thickness of the thickest portion of the LED lighting sheet 20 is preferably 5 mm or less. By reducing the thickness of the LED lighting sheet 20 in this way, it is possible to narrow the vertical interval between the substrates 81 (FIG. 8) on which the LED lighting sheet 20 is installed, thereby allowing each plant to grow on the growing shelf 80 ( The number of substrates 81 per FIG. 8) can be increased. As a result, the yield of plants per unit area can be increased. Moreover, when the plant and the LED lighting sheet 20 are close to each other, variations in the relatively strong light emitted to the plant can be further suppressed.

The arrangement of the LED chips 21 is not limited to the grid pattern in plan view, and may be arranged in a zigzag pattern in plan view as shown in FIG. 3(a). Also, the LED chips 21 may not be arranged uniformly within the surface of the LED lighting sheet 20 . For example, the density of the LED chips 21 may be increased in the periphery of the LED lighting sheet 20 . Specifically, as shown in FIG. 3B, the LED chips 21 are arranged in a grid pattern in the central portion of the LED lighting sheet 20 (lower portion in FIG. 3B), and the peripheral edge portion of the LED lighting sheet 20 The LED chips 21 may be arranged in a staggered manner (in the upper part of FIG. 3(b)). As a result, it is possible to suppress a decrease in brightness of the LED lighting sheet 20 at the periphery of the LED lighting sheet 20, make the brightness of the LED lighting sheet 20 uniform in the plane, and suppress variations in the light irradiated to the plants. .

The overall shape of the LED lighting sheet 20 is rectangular in plan view, but the size and planar shape of the LED lighting sheet 20 are not particularly limited. Since the LED lighting sheet 20 has a high degree of freedom in processing the size and shape, it is possible to flexibly meet various demands in this regard. In addition, by taking advantage of its flexibility, it is possible to attach it not only to a flat installation surface but also to installation surfaces of various shapes.

In FIG. 2, the length Lx of the LED lighting sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more and 700 mm or less, more preferably 550 mm or more and 650 mm or less. The length Ly of the LED lighting sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more and 500 mm or less, more preferably 350 mm or more and 450 mm or less. By setting the size of the LED lighting sheet 20 within the above range, the LED lighting sheet 20 can be adapted to a substrate 81 (FIG. 8) for general plant cultivation, and the dead space of the substrate 81 can be reduced. . In addition, since the size of each LED lighting sheet 20 is not excessively large, when a specific LED chip 21 is damaged, the other LED chips 21 are minimized to be affected, and the entire shelf board It is possible to prevent the illuminance of the lamp from being extremely lowered and to limit the range in which the illuminance is lowered.

In this embodiment, the total luminous flux of the LED lighting sheet 20 is 3000 lm or more, more preferably 3900 lm or more. The total luminous flux can be measured using a light distribution measuring device (for example, a spectral orientation measuring system GP-2000 manufactured by Otsuka Electronics Co., Ltd.). The total luminous flux amount is measured under the condition that a DC voltage of 44 V is applied to the LED lighting sheet 20 for 5 minutes, and the measurement is made in a stable state. The LED lighting sheet 20 is installed on a biaxial rotating stage, and the vertical angle is rotated from 0° to 360° in 5° increments, and the luminous intensity (cd) at a photometric distance of 12 m is measured. Thereby, a light distribution with a horizontal angle of 0° to 180° is obtained. By rotating the LED lighting sheet 20 by 90° and measuring the vertical angle in the same manner, a light distribution with a horizontal angle of 90° to 270° can be obtained. The total luminous flux (lm) is calculated from data on the angular dependence of luminous intensity. When the LED lighting sheet 20 is dimmable, the maximum setting value is adopted in the present embodiment.

By increasing the total luminous flux from the LED lighting sheet 20 in this way, it is possible to speed up the growth of plants, increase the amount of growth of plants, and shorten the number of days for growth while suppressing a decrease in yield. can. As a result, the yield of plants in the plant growing factory 90 can be improved. That is, conventional straight tube LED light bars vary in the amount of light that irradiates the plant when the lighting device and the plant are close to each other, and planar light source sheets have only low output. In the present embodiment, by setting the total luminous flux of the LED lighting sheet 20 to 3000 lm or more, more preferably 3900 lm or more, compared with the case of using a conventional straight tube type LED light bar or planar light source sheet, can improve plant yield.

The photosynthetic photon flux density PPFD (photosynthetic photon flux density) of the LED lighting sheet 20 is preferably 50 μmol m ⁻² s ⁻¹ or more and 300 μmol m ⁻² s ⁻¹ or less, and 200 μmol m ⁻² More preferably, s ⁻¹ or more and 300 μmol·m ⁻² ·s ⁻¹ or less. This PPFD is a value measured directly below the LED chip 21 and at a distance of 20 cm from the LED chip 21 . By setting the PPFD within the above range, the plant growing factory 90 can sufficiently provide the PPFD required for growing plants, and promote the growth of plants. PPFD can be measured by a measuring device such as a photon meter (for example, photon sensor LI-190R and light meter LI-250A manufactured by LI-COR, USA). The light quantum sensor LI-190R is arranged horizontally to the cultivation surface (or light source), arranged discretely in a matrix according to the cultivation area, and the numerical value is read when the number indicating the light amount is stable. Numerical readings are performed with a light meter calibrated to the eigenvalues of the sensor. In this embodiment, the numerical value of PPFD is represented by the average value of the numerical values measured in the matrix.

Next, the controller 40 will be described. As shown in FIG. 1, the control unit 40 supplies power to the LED lighting sheet 20 and controls light emission of the LED lighting sheet 20 and the like. The control unit 40 is detachably connected to the LED lighting sheet 20 via a first connector 44A provided on the LED lighting sheet 20 . That is, the control unit 40 is configured separately from the LED lighting sheet 20 and is externally connected to the LED lighting sheet 20 . That is, the controller 40 is not integrated with the LED lighting sheet 20 . As a result, the control unit 40 serving as a heat source can be separated from the LED lighting sheet 20, and the heat from the control unit 40 can be prevented from affecting the growth of plants.

The control unit 40 also has a power input unit 41 , an AC/DC converter (driver) 42 and a PWM control unit 43 . Among them, the power input unit 41 is supplied with an AC voltage having an arbitrary voltage of 100V to 240V, for example. The AC/DC converter 42 converts an AC voltage of 100V to 240V into a constant voltage (for example, 44V) DC voltage. The PWM control section 43 arbitrarily changes the pulse width of the constant voltage waveform from the AC/DC converter 42 to perform light control of the LED chips 21 of the LED lighting sheet 20 . That is, the PWM control section 43 also serves as a dimming control section that controls dimming of the LED lighting sheet 20 . A constant voltage output from the PWM control unit 43 is applied to the LED lighting sheet 20 via the first connector 44A.

By applying a constant voltage to the LED lighting sheet 20 from the PWM control unit 43 of the control unit 40, unlike the case where a rectified pulse voltage is directly applied to the LED lighting sheet 20, the LED chip 21 is dimmed. can be done. That is, the PWM controller 43 can arbitrarily control the illuminance of the LED chip 21 by appropriately changing the duty ratio of the DC voltage from the AC/DC converter 42 . For example, as shown in FIG. 4A, the PWM control unit 43 controls the duty ratio of the constant voltage from the AC/DC converter 42 from 100% (solid line) to 50% (dotted line), so that the LED chip 21 illuminance can be reduced.

By appropriately adjusting the illuminance of the LED chips 21 in this manner, the illuminance of the LED lighting sheet 20 can be adjusted according to the growth stage of the plant, and the degree of growth of the plant can be adjusted. For example, the illuminance of the LED lighting sheet 20 may be reduced in the early stage of growth when the leaves of the plant are small, and the illuminance of the LED lighting sheet 20 may be increased in the late stage of growth when the leaves of the plant are large. Alternatively, since the distance between the plant and the LED chip 21 is long at the early stage of growth when the plant is short, the illuminance of the LED lighting sheet 20 is increased, and at the late stage of growth when the plant is tall, the plant and the LED chip 21, the illuminance of the LED lighting sheet 20 may be lowered. As another example of adjusting the illuminance of the LED lighting sheet 20, the illuminance may be increased for plants that require high illuminance, and may be decreased for plants that can be grown at low illuminance. The illuminance may be increased to accelerate the shipment, and may be decreased to delay the shipment. The LED lighting sheet 20 that irradiates light with a total luminous flux of 3000 lm or more has a wide range in which the illuminance can be adjusted. In the case of the LED lighting sheet 20 with a low amount of light, even if the light control function is provided, the illuminance will be used at near maximum illuminance after all, and the advantage of having the light control function is small.

Further, by applying a constant voltage from the PWM control unit 43 to the LED lighting sheet 20, the integrated amount of light per unit time from the LED lighting sheet 20 can be increased. That is, for example, the integrated light amount when a constant voltage is applied to the LED lighting sheet 20 (the area of the shaded portion in FIG. 4A) is compared with the integrated light amount when a pulse voltage is applied as a comparative example (Fig. 4(b), the area of the shaded portion)). Thereby, the luminous efficiency of the light from the LED lighting sheet 20 can be increased, and the plant growing efficiency can be improved.

Referring to FIG. 1 again, the LED lighting sheet 20 is provided with a regulator 45 . In this case, the regulators 45 are provided corresponding to the respective columns of the LED chips 21. Specifically, ten regulators 45 are provided corresponding to the ten columns of the LED chips 21. . This regulator 45 serves to keep constant the current flowing through the plurality of LED chips 21 in each column. As a result, even if one LED chip 21 is damaged, it is possible to prevent an excessive current from flowing to the LED chips 21 in other columns, thereby preventing the LED chips 21 in other columns from being damaged. As a result, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from being extremely lowered, and to suppress variations in the light emitted to the plants. In addition, the regulator 45 can control the amount of current controlled by the connected resistance value for each column. I can give As a result, usually, the aim is to ensure uniformity by laying the LED lighting sheets 20 together without any gaps, but from the viewpoint of cost and ensuring breathability, even if the LED lighting sheets 20 are spaced about 5 cm to 10 cm, Also, you can expect the effect of erasing the seams.

Furthermore, the LED lighting sheet 20 is provided with a power supply line 46 branched from the first connector 44A. A second connector 44B is provided on the LED lighting sheet 20 . The power supply line 46 is not electrically connected to the LED chip 21 of the LED lighting sheet 20, but is electrically connected to wiring of another LED lighting sheet 200 having the same configuration as the LED lighting sheet 20. Connected. That is, the power supply line 46 is detachably connected to the wiring of the LED lighting sheet 200 via the second connector 44B and the other first connector 44A provided on the other LED lighting sheet 200 . A current from the power supply line 46 is supplied to the other LED lighting sheet 200 via the second connector 44B and the other first connector 44A. Thereby, the two LED lighting sheets 20 can be connected and these two LED lighting sheets 20 and 200 can be controlled simultaneously by one controller 40 . By simultaneously controlling a plurality of LED lighting sheets 20 and 200 by one controller 40, the number of controllers 40, which are sources of heat generation, can be reduced. Even when the LED lighting sheet 20 for irradiation is used, variations in plant growth due to heat from the control unit 40 are less likely to occur, and a decrease in yield can be suppressed.

(Each member of the LED lighting sheet)
Next, each member constituting the LED lighting sheet 20 will be described. As shown in FIG. 5 , the LED lighting sheet 20 includes a flexible wiring board 30 and a plurality of LED chips 21 arranged on the flexible wiring board 30 . Among them, the flexible wiring board 30 has a substrate film 31 having flexibility and a metal wiring portion 32 formed on the surface of the substrate film 31 (the surface on the light emitting surface side). The metal wiring portion 32 is laminated on the substrate film 31 with an adhesive layer 33 interposed therebetween.

Each LED chip 21 is mounted in such a manner that it can be electrically connected to the metal wiring portion 32 . In this LED lighting sheet 20, since the LED chips 21 are mounted on the flexible wiring board 30, it is possible to arrange the plurality of LED chips 21 at a desired high density.

A light-reflective insulating protective film 34 is formed to cover a region of the LED lighting sheet 20 excluding the region where the LED chip 21 is provided and the peripheral region thereof. This light-reflective insulating protective film 34 is arranged so as to cover the metal wiring portion 32 . The light-reflective insulating protective film 34 is a layer that has both an insulating function that contributes to improving the migration resistance of the LED lighting sheet 20 and a light reflecting function that contributes to improving the light environment created by the LED lighting sheet 20 . This layer is formed from an insulating resin composition containing a white pigment. A structure without the light-reflective insulating protective film 34 is also possible when the migration resistance and the light-reflecting function can be obtained only with the metal wiring portion 32 described above and the transparent protective film 35 described later.

A transparent protective film 35 is formed to cover the light-reflective insulating protective film 34 and the LED chip 21 . The transparent protective film 35 is a resinous film formed on the outermost surface (the surface closest to the light emitting surface) mainly to ensure waterproofness of the LED lighting sheet 20 .

A solder portion 36 is provided on the metal wiring portion 32 . Each LED chip 21 is electrically connected to the metal wiring portion 32 via a solder portion 36 .

(substrate film)
A flexible resin film can be used for the substrate film 31 . In this specification, "having flexibility" means "having a radius of curvature of at least 1 m or less, preferably 50 cm, more preferably 30 cm, still more preferably 10 cm, and particularly preferably 5 cm. "Things"

As the material of the substrate film 31, a thermoplastic resin having high heat resistance and insulating properties may be used. Polyimide resin (PI) and polyethylene naphthalate (PEN), which are excellent in heat resistance, dimensional stability when heated, mechanical strength, and durability, can be used as such a resin. Among them, polyethylene naphthalate (PEN), which is improved in heat resistance and dimensional stability by applying heat resistance improvement treatment such as annealing treatment, can also be preferably used. Polyethylene terephthalate (PET), which is improved in flame retardancy by adding a flame retardant inorganic filler or the like, may also be used.

The thickness of the substrate film 31 is not particularly limited, but is generally 10 μm to 500 μm from the viewpoints of not becoming a bottleneck as a heat dissipation path, having heat resistance and insulation, and balancing manufacturing costs. Hereinafter, it is preferably 50 μm or more and 250 μm or less. Moreover, it is preferable that the thickness is within the above range also from the viewpoint of maintaining good productivity in the case of manufacturing by a roll-to-roll method.

(adhesive layer)
As the adhesive for forming the adhesive layer 33, a known resin-based adhesive can be appropriately used. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, ester-based or epoxy-based adhesives can be particularly preferably used.

(Metal wiring part)
The metal wiring portion 32 is a wiring pattern formed on the surface of the substrate film 31 (the surface on the side of the light emitting surface) with a conductive base material such as metal foil. The metal wiring portion 32 is preferably formed on the surface of the substrate film 31 with an adhesive layer 33 interposed therebetween by a dry lamination method. The metal wiring portion 32 includes the plurality of metal wiring portions 22 described above. The multiple metal wiring portions 22 include a first metal wiring portion 22A and a second metal wiring portion 22B spaced apart from the first metal wiring portion 22A. The LED chip 21 is mounted on the first metal wiring portion 22A and the second metal wiring portion 22B, and the LED chip 21 is electrically connected to the first metal wiring portion 22A and the second metal wiring portion 22B. It is The LED chip 21 is lit by power supplied to the first metal wiring portion 22A and the second metal wiring portion 22B.

The metal wiring part 32 preferably has both heat radiation and electrical conductivity at a high level, and for example, copper foil can be used. In this case, heat dissipation from the LED chips 21 is stabilized, and an increase in electrical resistance can be prevented, so that variations in light emission among the LED chips 21 are reduced and stable light emission becomes possible. Also, the life of the LED chip 21 is extended. Furthermore, since deterioration of peripheral members such as the substrate film 31 due to heat can be prevented, the product life of the LED lighting sheet 20 can be extended. Examples of metals forming the metal wiring portion 32 include metals such as aluminum, gold, and silver, in addition to the above copper.

The thickness of the metal wiring portion 32 may be appropriately set according to the magnitude of withstand current required for the flexible wiring board 30 and the like. However, the thickness of the metal wiring portion 32 is preferably 10 μm or more in order to suppress warping due to heat shrinkage of the substrate film 31 during soldering processing such as a reflow method. On the other hand, the thickness of the metal wiring portion 32 is preferably 50 μm or less, so that sufficient flexibility of the flexible wiring board 30 can be maintained and deterioration of handling performance due to an increase in weight can be suppressed. be able to.

(solder part)
The solder portion 36 joins the metal wiring portion 32 and the LED chip 21 . This solder bonding can be performed by either a reflow method or a laser method.

(LED chip)
The LED chip 21 is a light-emitting element utilizing light emission at a PN junction where a P-type semiconductor and an N-type semiconductor are joined. The LED chip 21 may have a structure in which a P-type electrode and an N-type electrode are respectively provided on the upper and lower surfaces of the element, or a structure in which both the P-type electrode and the N-type electrode are provided on one side of the element. can be

In this embodiment, the total luminous flux of the LED lighting sheet 20 is increased to 3000 lm or more, more preferably 3900 lm or more. For this reason, it is preferable to use LED chips 21 having a large luminous flux. Specifically, the LED chip 21 preferably has a luminous flux of 30 lm or more, and more preferably has a luminous flux of 35 lm or more. Moreover, it is preferable to select the LED chip 21 having high luminous efficiency. Specifically, the LED chip 21 preferably has a luminous efficiency of 150 lm/W or more, and more preferably has a luminous efficiency of 180 lm/W or more. By increasing the luminous efficiency of the LED chips 21 to 150 lm/W or more, the number (density) of the LED chips 21 mounted can be reduced, and the heat generated by the Joule heat from the LED chips 21 can be reduced. It is possible to suppress the decrease in yield by making it difficult for variations in plant growth to occur.

As described above, the LED lighting sheet 20 has the LED chips 21 directly mounted on the metal wiring portion 32 capable of exhibiting high heat dissipation. As a result, even when the LED chips 21 are arranged at a high density, excessive heat generated when the LED chips 21 are turned on can be quickly diffused through the metal wiring portion 32, and the heat generated from the outside of the LED lighting sheet 20 can be diffused through the substrate film 31. Since the heat from the LED chip 21 is less likely to cause variations in plant growth, it is possible to suppress a decrease in yield.

(Light-reflective insulating protective film)
The light-reflective insulating protective film 34 is a layer formed in a region excluding the region where the LED chip 21 is provided and its peripheral region. This light-reflective insulating protective film 34 is a so-called resist layer that improves the migration resistance of the flexible wiring board 30 by having sufficient insulation, and contributes to the improvement of the light environment created by the LED lighting sheet 20. It is a light-reflecting layer with a light-reflecting property that

The light-reflective insulating protective film 34 can be formed from various resin compositions containing a base resin such as a urethane-based resin and a white pigment made of an inorganic filler such as titanium oxide. As the base resin of the resin composition used for forming the light-reflective insulating protective film 34, in addition to urethane resin, acrylic urethane resin, polyester resin, phenol resin, and the like can be appropriately used. As the base resin of the resin composition forming the light-reflective insulating protective film 34, it is more preferable to use the same or similar resin as the resin composition forming the transparent protective film 35 as the base resin. As for the transparent protective film 35, it is preferable to use acrylic urethane resin as the main material resin, as will be described later. From this, when the base resin of the resin composition forming the transparent protective film 35 is an acrylic urethane resin, the base resin of the resin composition for forming the light-reflective insulating protective film 34 is a urethane resin or It is more preferable to use an acrylic urethane resin.

Inorganic fillers contained as white pigments in the resin composition forming the light-reflective insulating protective film 34 include titanium oxide, alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, At least one selected from talc, calcium carbonate, zinc oxide, silica, mica powder, powdered glass, powdered nickel and powdered aluminum can be used.

The thickness of the light-reflective insulating protective film 34 is 5 μm or more and 50 μm or less, more preferably 7 μm or more and 20 μm or less. If the thickness of the light-reflective insulating protective film 34 is less than 5 μm, the light-reflective insulating protective film becomes thin particularly at the edge portion of the metal wiring portion 32, and if the metal wiring cannot be covered and is exposed, The risk that insulation cannot be maintained increases. On the other hand, the thickness of the light-reflective insulating protective film 34 is preferably 50 μm or less from the viewpoint of holding the light-reflective insulating protective film 34 against the curvature of the substrate during handling and transportation.

In addition, the light reflecting insulating protective film 34 preferably has an average light reflectance of 65% or more, more preferably 70% or more, and 80% or more at wavelengths of 400 nm or more and 780 nm or less. is more preferred. The LED lighting sheet 20 contains, for example, 20 parts by mass or more of titanium oxide with respect to 100 parts by mass of a urethane-based or acrylic urethane-based base resin, so that the thickness of the light-reflective insulating protective film 34 is 8 μm. In this case, the light reflectance of the same layer can be 75% or more.

(transparent protective film)
A transparent protective film 35 is formed on the outermost surface of the LED lighting sheet 20 so as to cover the LED chips 21 . The transparent protective film 35 has waterproofness and transparency. The waterproofness of the transparent protective film 35 can prevent water from entering the device when the LED lighting sheet 20 is used as a light source for growing plants. In the LED lighting sheet 20 that irradiates light with a total luminous flux of 3000 lm or more, it is necessary to improve the performance of the LED chips 21, and the damage of a specific LED chip 21 will have a greater impact. Therefore, it is important from the viewpoint of risk management to make the LED chip 21 as hard to be damaged as possible.

The transparent protective film 35 can be formed from various resin compositions using acrylic urethane resin or the like as a base resin. As the base resin of the resin composition used for forming the transparent protective film 35, in addition to acrylic urethane resin, urethane resin, polyester resin, phenolic resin, and the like can be appropriately used. As the base resin of the resin composition forming the transparent protective film 35, it is more preferable to use the same or similar resin as the resin composition forming the light-reflective insulating protective film 34 as the base resin. As a specific preferred combination, the base resin of the resin composition forming the light-reflective insulating protective film 34 is a urethane-based resin, and the same resin forming the transparent protective film 35 is an acrylic urethane-based resin. can.

The thickness of the transparent protective film 35 is 10 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. By setting the thickness of the transparent protective film 35 within the above range, it is possible to maintain good flexibility, thinness, and light weight of the LED lighting sheet 20 and good optical properties required for growing plants. In addition, it is possible to provide the LED lighting sheet 20 with sufficient waterproofness required for growing plants.

The water resistance of the LED lighting sheet 20 by the transparent protective film 35 is such that deterioration of the LED chips 21 can be suppressed when water for growing plants is sprayed on the LED lighting sheet 20. It is not particularly limited. As for such water resistance, it is preferable to exhibit IPX4 or more in the waterproof/dustproof protection standard defined by IEC (International Electrotechnical Commission). The waterproofness of IPX4 or higher is such that the LED chip 21 is not adversely affected by splashed water from all directions. Specifically, when water is sprayed from the water nozzle at a rate of 10 L/min for 5 minutes over the entire range of ±180° with respect to the normal direction of the LED lighting sheet 20, the LED chips 21 are adversely affected. to the extent that it is not

(Manufacturing method of LED lighting sheet)
Next, a method for manufacturing the LED lighting sheet 20 according to this embodiment will be described with reference to FIGS. 6(a) to 6(h).

First, a substrate film 31 is prepared (FIG. 6(a)). Next, on the surface of the substrate film 31, a metal foil 32A such as a copper foil, which is the material of the metal wiring portion 32, is laminated (FIG. 6(b)). The metal foil 32A is adhered to the surface of the substrate film 31 with an adhesive layer 33 such as a urethane-based adhesive. Alternatively, the metal foil 32A may be directly formed on the surface of the substrate film 31 by an electrolytic plating method or a vapor phase film forming method (sputtering, ion plating, electron beam deposition, vacuum deposition, chemical deposition, etc.). Alternatively, the substrate film 31 may be directly welded to the metal foil 32A.

Next, an etching mask 37 patterned into a shape required for the metal wiring portion 32 is formed on the surface of the metal foil 32A (FIG. 6(c)). The etching mask 37 is provided so that the portion corresponding to the wiring pattern of the metal foil 32A, which becomes the metal wiring portion 32, is not corroded by the etchant. The method of forming the etching mask 37 is not particularly limited, and for example, it may be formed by exposing a photoresist or dry film through a photomask and then developing it, and the metal foil 32A is formed by a printing technique such as an inkjet printer. An etching mask may be formed on the surface.

Next, the metal foil 32A located at the portion not covered with the etching mask 37 is removed with an immersion liquid (FIG. 6(d)). As a result, portions of the metal foil 32A other than the portion that will become the metal wiring portion 32 are removed.

After that, the etching mask 37 is removed using an alkaline remover. As a result, the etching mask 37 is removed from the surface of the metal wiring portion 32 (FIG. 6(e)).

Subsequently, a light-reflective insulating protective film 34 is laminated on the metal wiring portion 32 (FIG. 6(f)). The formation of the light-reflective insulating protective film 34 is not particularly limited as long as it is a coating means capable of uniformly applying the material resin composition constituting the light-reflective insulating protective film 34. Examples include screen printing, offset printing, and the like. Methods such as dip coater and brush coating can be used. Alternatively, the light-reflective insulating protective film 34 may be formed by coating the entire surface with a photosensitive insulating protective film material, exposing only necessary portions through a photomask, and developing the film.

Next, the LED chip 21 is mounted on the metal wiring portion 32 (FIG. 6(g)). In this case, the LED chip 21 is joined to the metal wiring portion 32 by soldering via the solder portion 36 . The joining by soldering can be performed by a reflow method or a laser method, or by using a conductive resin.

Next, a transparent protective film 35 is formed so as to cover the light-reflective insulating protective film 34 and the LED chip 21 (FIG. 6(h)). This transparent protective film 35 is preferably formed by a method of spraying a transparent resin composition by spraying (hereinafter referred to as "spray coating method") or a method of forming by a curtain coating method. The transparent protective film 35 is formed by spray coating, for example, by spraying a coating liquid for spray coating containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 with a spray coating machine to form a coating film. can be done by forming The transparent protective film 35 is formed by the curtain coating method, for example, by dropping a coating liquid for curtain coating containing an acrylic polyurethane resin onto a desired region on the flexible wiring substrate 30 using a curtain coating machine to form a coating film. can be done by forming

In addition, the LED lighting sheet 20 according to the present embodiment is not limited to the method described above. It can also be manufactured by a method.

(Plant growing factory and plant growing shelf)
FIG. 7 is a diagram schematically showing the configuration of a plant growing factory 90 using the LED lighting sheet 20 according to this embodiment. A plant growing factory 90 includes a building 91 and a plurality of plant growing racks 80 arranged inside the building 91 .

As shown in FIG. 8, the plant-growing rack 80 has a plurality of (four) supports 82 and a plurality of substrates 81 vertically spaced apart from each other along the supports 82 . . A culture medium area for cultivating plants PL is provided on the upper surface of each substrate 81 except for the substrate 81 on the uppermost stage. The lower surface of each substrate 81 except for the substrate 81 at the bottom constitutes a ceiling surface with respect to the substrate 81 positioned below the substrate 81, and the LED lighting sheets 20 are arranged in parallel. In this case, the control unit 40 is arranged at a place sufficiently distant from the LED lighting sheet 20 . Therefore, there is little possibility that the heat from the control unit 40 causes variation in growth between the plant PL located near the control unit 40 and the plant PL located far from the control unit 40 . Further, the board 81 and the LED lighting sheet 20 attached to the lower surface side of the board 81 constitute a shelf board 83 for a plant growing shelf. Alternatively, the board 81 and the LED lighting module 10 attached to the lower surface of the board 81 constitute a shelf board 83 for growing plants. In the present embodiment, the plant-growing shelf board 83 (FIG. 8), the plant-growing shelf 80 (FIG. 8), and the plant-growing factory 90 (FIG. 7) provided with the plant-growing shelf 80 also provide.

Since the LED lighting sheet 20 according to the present embodiment has flexibility and light weight, it is easier to attach the LED lighting sheet 20 to the lower surface of each substrate 81 than to attach the LED lighting sheet 20 using a conventional straight tube type lighting device or the like. can be done. Furthermore, since the LED lighting sheet 20 has flexibility, the LED lighting sheet 20 can be attached to ceiling surfaces of various sizes and shapes. As a result, the LED lighting sheet 20 according to the present embodiment can be applied to various plant growing shelves 80 and plant growing factories 90 .

In addition, the LED lighting sheet 20 is thinner than a conventional straight tube type lighting device. As a result, the space between substrates 81 in the vertical direction can be narrowed, and the number of substrates 81 included in each plant growing shelf 80 can be increased. As a result, the yield of plants PL per unit area can be increased.

9A and 9B, the LED lighting sheet 20 may be arranged not only on the bottom surface of the substrate 81 but also on the side surface of the substrate 81. FIG. The LED lighting sheet 20 on the side surface side hangs down from the substrate 81 positioned above toward the substrate 81 positioned below the substrate 81 . In this case, as shown in FIG. 9A, the LED lighting sheet 20 may reach the substrate 81 located below. Alternatively, as shown in FIG. 9(b), the LED lighting sheet 20 may cover only the upper side of the space positioned between the upper and lower substrates 81 without reaching the substrates 81 positioned below. In this way, by further arranging the LED lighting sheet 20 on the side surface side of the substrate 81, the amount of light at the periphery of the substrate 81, which tends to be weak, is compensated for, and the brightness of the LED lighting sheet 20 is made uniform within the surface. be able to. As a result, the growth of the plant can be made uniform within the plane, and the yield of the grown plant can be improved.

As described above, according to the present embodiment, since the total luminous flux of the LED lighting sheet 20 is 3000 lm or more, the light intensity required in the plant growing factory 90 can be sufficiently obtained from the LED lighting sheet 20. , can improve plant growth.

Moreover, according to this embodiment, the LED chip 21 has a luminous efficiency of 150 lm/W or more. As a result, while maintaining a high total luminous flux of the LED lighting sheet 20, the power consumption can be suppressed and the energy efficiency of the LED lighting sheet 20 can be enhanced. Also, the number (density) of the LED chips 21 mounted can be reduced, and heat generation due to Joule heat from the LED chips 21 can be reduced.

Further, according to the present embodiment, ten or more LED chips 21 are arranged in series, and four or more rows of the LED chips 21 are arranged in parallel. As a result, the LED chips 21 can be uniformly arranged in the plane, the LED chips 21 can be arranged in parallel, and the risk when the LED chips 21 are damaged can be dispersed.

Further, according to the present embodiment, since the LED chip 21 is covered with the transparent protective film 35, it is possible to protect the LED chip 21 from water splashed during plant growth.

Further, according to the present embodiment, the thickness of the thickest part of the LED lighting sheet 20 is 5 mm or less. , can increase the yield of plants per unit area.

In addition, according to the present embodiment, the control unit 40 is externally connected to the LED lighting sheet 20, so that the control unit 40 is separated from the LED lighting sheet 20 and the plants are affected by the heat from the control unit 40. can be prevented from reaching

Further, according to the present embodiment, since a constant voltage is applied from the control unit 40 to the LED lighting sheet 20, the integrated amount of light per unit time from the LED chips 21 can be increased, and the growth of plants can be promoted.

Further, according to the present embodiment, since the control unit 40 can control the light control of the LED chip 21, it is possible to adjust the intensity of the light from the LED chip 21 according to the stage of growth of the plant. can.

[Example]
Next, a specific example of this embodiment will be described.

(Creation of LED lighting sheet)
The LED lighting sheets of Examples 1 and 2 and Comparative Example were produced as follows.

(Example 1)
On one surface of a film substrate (polyethylene naphthalate, thickness 50 μm) of 560 mm × 390 mm size, copper foil (thickness 35 μm) for forming a metal wiring part is laminated, and then copper foil for metal wiring Etching was performed to form metal wiring portions of the same pattern in all the examples and comparative examples. Then, on the substrate film and the metal wiring part, an insulating ink made of urethane-based resin as a base resin and titanium oxide added at a rate of 20% by mass to the base resin is screen-printed to a thickness of 10 μm. A light-reflective insulating protective film was formed. Next, on the metal wiring portion, a plurality of LED chips ("NFSW757G-V2" (manufactured by Nichia Corporation)) are arranged in 10 rows of 14 rows at a pitch of 40 mm in the X direction and a pitch of 35 mm in the Y direction. Mounted by soldering. This LED chip is a top emission type light emitting element, and has a rectangular parallelepiped shape of 3.0 mm (length)×3.0 mm (width)×0.65 mm (height). Further, each of these LED chips has a color temperature of 3000 K, a luminous flux of 36.2 lm, and a luminous efficiency of 196 lm/W. Furthermore, a transparent protective film covering the insulating protective film and the LED chip was formed by a spray coating method. The LED lighting sheet produced as described above was used as the LED lighting sheet of Example 1.

(Example 2)
An LED lighting sheet of Example 2 was prepared in the same manner as in Example 1, except that the total luminous flux of the LED sheet was controlled to 3000 lm by a dimmer.

(Comparative example)
Manufactured in the same manner as in Example 1, except that an LED chip with a luminous flux of 12.6 lm and a luminous efficiency of 67 lm / W ("NFSW757D-V1" (manufactured by Nichia Corporation)) was used. The resulting LED lighting sheet was used as an LED lighting sheet of a comparative example.

Optical properties, specifically total luminous flux and photosynthetic photon flux density (PPFD), were measured for the LED lighting sheets of Examples 1 and 2 and Comparative Example. The total luminous flux was measured with a light distribution measuring device (for example, Otsuka Electronics Co., Ltd., spectral orientation measuring system GP-2000). The photosynthetic photon flux density (PPFD) was measured with a photon meter (photon sensor LI-190R manufactured by Meiwa Forsys Co., Ltd.). Further, the total luminous flux (lm/W) and the photosynthetic photon flux density (PPFD/W) with respect to the total input power (W) were calculated for the LED lighting sheets of Examples 1 and 2 and Comparative Example.

Subsequently, the LED lighting sheets of Examples 1 and 2 and Comparative Example were each attached to a plant growing shelf, and a plant (baby spinach) was actually cultivated. After that, the fresh weight (g/m ² ) was measured as the growth amount of the grown plants. This fresh weight measurement was calculated by measuring the above-ground fresh weight for each cultivation panel after completion of cultivation and calculating the weight per square meter. In addition, the daily production weight (g/m ² /day), which is the live weight per cultivation day, was calculated. Table 1 shows the above evaluation results.

As shown in Table 1 above, when the LED lighting sheets of Examples 1 and 2 were used, the live weight of plants could be increased more than when the LED lighting sheet of Comparative Example was used. In particular, when the LED lighting sheet of Example 1 was used, the fresh weight of plants could be significantly increased, even though the number of cultivation days was one day shorter than when the LED lighting sheet of Comparative Example was used. rice field. Specifically, when the LED lighting sheet of Example 1 (total luminous flux of 3900 lm) was used, the daily production weight (g/ m ² /day) could be increased by about 77%. In addition, when the LED lighting sheet of Example 2 (total luminous flux of 3000 lm) was used, the daily production weight (g/m ² / day) could be increased by about 39%. Thus, when the LED lighting sheets of Examples 1 and 2 were used, the productivity of plants could be improved by increasing the total luminous flux of light from the LED chips.

It is also possible to appropriately combine a plurality of constituent elements disclosed in the above embodiments and modifications as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiments and modifications.

REFERENCE SIGNS LIST 10 LED lighting module 20 LED lighting sheet 21 LED chip 22 metal wiring part 30 flexible wiring board 31 substrate film 32 metal wiring part 33 adhesive layer 34 light-reflective insulating protective film 35 transparent protective film 36 soldering part 40 control part 41 power input Section 42 AC/DC Converter 43 PWM Control Section 44A First Connector 44B Second Connector 45 Regulator 46 Power Supply Line 80 Plant Growing Shelf 81 Substrate 82 Post 83 Shelf Board for Plant Growing Shelf 90 Plant Growing Factory 91 Building

Claims (5)

An LED lighting sheet for cultivating animals and plants, in which a plurality of LED chips are arranged,
a substrate film;
a metal wiring portion having a thickness of 10 μm or more and 50 μm or less formed on the surface of the substrate film;
a light-reflective insulating protective film formed on the metal wiring portion;
A transparent protective film covering the light-reflective insulating protective film and the plurality of LED chips and formed on the outermost surface of the LED lighting sheet,
The plurality of LED chips are mounted on the metal wiring portion,
The total luminous flux is 3000 lm or more, and the thickness at the thickest part is 5 mm or less,
The light-reflective insulating protective film contains a white pigment and has an average light reflectance of 65% or more at a wavelength of 400 nm or more and 780 nm or less,
An LED lighting sheet for growing animals and plants, wherein the transparent protective film has a thickness of 10 μm or more and 40 μm or less. 2. The LED lighting sheet for growing animals and plants according to claim 1, wherein said LED chip has a luminous efficiency of 150 lm/W or more. 3. The LED lighting sheet for cultivating animals and plants according to claim 1, wherein 10 or more of said LED chips are arranged in series, and 4 or more rows of said LED chips are arranged in parallel. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 3, wherein the total luminous flux is 3900lm or more. A shelf board for raising animals and plants,
a substrate;
A shelf board for raising animals and plants, comprising the LED lighting sheet for raising animals and plants according to any one of claims 1 to 4, which is attached to the substrate.

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