JP7340166B2 - LED lighting sheets for growing animals and plants, LED lighting modules for growing animals and plants, shelves for growing shelves for animals and plants, shelves for growing animals and plants, and plants for growing animals and plants - Google Patents

Description

The present disclosure relates to an LED lighting sheet for growing animals and plants, an LED lighting module for growing animals and plants, a shelf board for a shelf for growing animals and plants, a shelf for growing animals and plants, and an animal and plant growing factory.

BACKGROUND ART In recent years, there has been an increasing demand for lighting devices that use LEDs as light sources, which consume less power, in place of conventional fluorescent lamps, high-pressure sodium lamps, and the like, as lighting devices used in animal and plant breeding factories.

As an example of an animal and plant growing factory that uses a lighting device that uses LEDs as a light source, there is a known plant growing device in which a plurality of straight-tube plant growing lights that use LEDs as a light source are arranged on the shelves of a plant growing shelf. (For example, see Patent Document 1).

An LED lighting device for growing animals and plants in which a plurality of LED chips are arranged on a flexible circuit board to form a planar light source has also been proposed (see, for example, Patent Document 2).

Japanese Patent Application Publication No. 2008-118957 JP2013-251230A

The present disclosure provides an LED lighting sheet for growing animals and plants, an LED lighting module for growing animals and plants, a shelf board for growing shelves for animals and plants, a shelf for growing animals and plants, and a plant growing factory that can protect LED chips. .

The LED lighting sheet for growing animals and plants according to the present embodiment is an LED lighting sheet for growing animals and plants, and includes a substrate film, a metal wiring section formed on the surface of the substrate film, and a metal wiring section mounted on the metal wiring section. and a protective portion that covers at least a portion of a side surface of the LED chip and protects the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the LED chip is mounted on the metal wiring part via a solder part, and the solder part extends from the back surface of the LED chip to the side surface of the LED chip. The protection part may cover the solder part located on the side of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protection portion includes a central portion that covers at least a portion of the surface of the LED chip, and a curved portion that covers at least a portion of the side surface of the LED chip. and a flat portion formed adjacent to the curved portion.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the central portion may cover the entire surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the thickness of the central portion may gradually increase toward the center of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the curved portion may cover the entire side surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the thickness of the curved portion may gradually become thicker as it approaches the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, in a cross section perpendicular to the light emitting surface of the LED lighting sheet for growing animals and plants, the curved portion is from the light emitting surface side of the LED lighting sheet for growing animals and plants, The light emitting surface may have a concave shape that is depressed toward a surface opposite to the light emitting surface.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the curved portion may cover the solder portion located on the side of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, in a cross section perpendicular to the light emitting surface of the LED lighting sheet for growing animals and plants, the portion of the solder portion located on the side of the LED chip is It may have a curved shape that swells toward the surface.

In the LED lighting sheet for growing animals and plants according to the present embodiment, in a cross section perpendicular to the light emitting surface of the LED lighting sheet for growing animals and plants, the thickest part of the solder portion is located on the side surface of the LED chip. They don't have to be in contact.

In the LED lighting sheet for growing animals and plants according to the present embodiment, when viewed from the light emitting surface side of the LED lighting sheet for growing animals and plants, the portion of the solder portion located on the side of the LED chip is It may be formed so as to partially surround the side surface of the LED chip.

The LED lighting sheet for growing animals and plants according to the present embodiment further includes a light-reflective insulating protective film disposed to cover the metal wiring portion, and the protective portion covers the light-reflecting insulating protective film. It's okay.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protection portion may cover the entire surface and side surfaces of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion may have a transparent protective film.

In the LED lighting sheet for growing animals and plants according to the present embodiment, a gap may be formed between the transparent protective film and the side surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion may further include an adhesive layer that adheres the LED chip and the transparent protective film.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion may cover a side surface of the LED chip with the adhesive layer.

In the LED lighting sheet for growing animals and plants according to the present embodiment, ten or more LED chips may be arranged in series, and four or more rows of the LED chips may be arranged in parallel.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the thickness at the thickest portion may be 5 mm or less.

The LED lighting module for growing animals and plants according to the present embodiment is an LED lighting module for growing animals and plants, which includes the LED lighting sheet for growing animals and plants according to the present embodiment, and the LED lighting sheet for growing animals and plants. The control unit is externally connected to the LED lighting sheet for growing animals and plants.

In the LED lighting module for growing animals and plants according to the present embodiment, a constant voltage may be applied from the control section to the LED lighting sheet for growing animals and plants.

In the LED lighting module for growing animals and plants according to the present embodiment, the control unit may be able to control dimming of the LED chip.

The shelf board for growing animals and plants according to the present embodiment is a shelf board for growing animals and plants, and includes a substrate and an LED lighting sheet for growing animals and plants according to the present embodiment, which is attached to the substrate. Alternatively, it includes the LED lighting module for growing animals and plants according to the present embodiment.

The shelf for growing animals and plants according to the present embodiment is a shelf for growing plants and animals, and includes a shelf board, and the shelf board is provided with an LED lighting for growing plants and animals according to the present embodiment, which is attached to the lower surface side of a substrate. A sheet or an LED lighting module for growing animals and plants according to the present embodiment.

In the shelf for growing animals and plants according to the present embodiment, the LED lighting sheet for growing plants and animals may be further arranged on the side surface of the shelf board.

The plant and animal breeding factory according to the present embodiment includes a building and the shelf for growing the plants and animals according to the present embodiment, which is arranged inside the building.

According to this embodiment, the LED chip can be protected.

FIG. 1 is a schematic diagram illustrating an LED lighting module according to one embodiment. FIG. 2 is a plan view showing an LED lighting sheet according to one embodiment. FIGS. 3(a) and 3(b) are plan views showing modified examples of the LED lighting sheet. FIG. 4(a) is a graph showing the relationship between time and voltage when a constant voltage is applied to the LED lighting sheet from the control unit, and FIG. 4(b) is a graph showing the relationship between time and voltage when a constant voltage is applied to the LED lighting sheet as a comparative example. 2 is a graph showing the relationship between time and voltage when FIG. 5A is a cross-sectional view (a cross-sectional view taken along the line VA-VA in FIG. 2) showing an LED lighting sheet according to one embodiment. FIG. 5B is an enlarged view (an enlarged view corresponding to section VB in FIG. 5A) showing a protection part of the LED lighting sheet according to one embodiment. FIG. 6 is a plan view (a view taken in the direction of arrow VI in FIG. 5A) showing the LED chips of the LED lighting sheet according to one embodiment. FIGS. 7(a)-(i) are cross-sectional views showing a method of manufacturing an LED lighting sheet according to an embodiment. FIG. 8 is a schematic perspective view showing a plant growing factory according to one embodiment. FIG. 9 is a schematic perspective view showing a plant growing shelf according to one embodiment. FIGS. 10(a) and 10(b) are diagrams showing modified examples of plant growing shelves. FIG. 11 is a sectional view showing a modification of the LED lighting sheet according to one embodiment. FIG. 12 is a sectional view showing a modification of the LED lighting sheet according to one embodiment. FIG. 13 is a sectional view showing a modification of the LED lighting sheet according to one embodiment. FIG. 14 is a sectional view showing a modification of the LED lighting sheet according to one embodiment. FIG. 15 is a sectional view showing a modification of the LED lighting sheet according to one embodiment. FIG. 16 is a sectional view showing a modification of the LED lighting sheet according to one embodiment. FIG. 17 is a sectional view showing a modification of the LED lighting sheet according to one embodiment.

The LED lighting sheet for growing animals and plants according to the present embodiment includes a substrate film, a metal wiring section formed on the surface of the substrate film, an LED chip mounted on the metal wiring section, and a side surface of the LED chip. and a protection part that covers at least a portion of the LED chip and protects the LED chip.

Since the LED lighting sheet for growing animals and plants according to the present embodiment is a sheet-shaped LED lighting device, the overall thickness can be made thinner than an LED bar light in which a plurality of straight tube LEDs are arranged. Therefore, by narrowing the vertical interval between the shelves of the animal and plant growing shelves, it is possible to improve the yield of animals and plants to be grown per floor area of the plant and animal growing factory. In addition, since the thickness of the LED chip is smaller than the thickness of the LED straight tube, the LED lighting sheet can compensate for the difference in height between the place where the LED chip is placed and the place where the LED chip is not placed. The height difference can be made smaller than the difference in height between the place where the LED straight pipe is placed and the place where the LED straight pipe is not placed. Therefore, shadows on the sides of the LED chips are less likely to occur, so even when animals and plants grow close to the LED lighting sheet, variations in the light irradiated to animals and plants can be suppressed. In LED lighting equipment for raising animals and plants, it is important to suppress variations in the light irradiated to animals and plants because it keeps the size and quality of the animals and plants grown within a certain standard range and reduces non-conforming products. be. In the cultivation of animals and plants, it is important to control the light and heat irradiated to the animals and plants in the later stages of growth, when they grow and photosynthesis becomes active. The LED lighting sheet for growing animals and plants according to the present embodiment can suppress variations in relatively strong light irradiated to animals and plants when the animals and plants are close to the LED lighting sheet.

Further, in the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion covers at least a part of the side surface of the LED chip to protect the LED chip. Thereby, even if a worker comes into contact with the LED chip, it is possible to prevent the LED chip from peeling off from the LED lighting sheet. Therefore, it is possible to prevent the LED chip from falling onto the plant being grown, and it is possible to prevent the phosphor of the LED chip from coming into contact with the plant. Therefore, the sanitary conditions of the plants to be grown can be maintained in good condition.

Further, the LED lighting module for growing animals and plants according to the present embodiment includes an LED lighting sheet for growing animals and plants, and a control section electrically connected to the LED lighting sheet, and the control section is configured to control the LED lighting for growing plants and animals. It is connected externally to the lighting sheet.

Since the LED lighting module for growing plants and animals according to the present embodiment has an external control section, it is possible to increase the amount of plants and animals to be grown while suppressing a decrease in the yield of plants and animals to be grown. can be obtained in good yield. The heat generated locally near the control section has a strong effect on plants and animals growing near the control section, and has a low effect on plants and animals growing far from the control section. As a result, there may be variations in the growing conditions of plants and animals, resulting in a large number of non-conforming products, which may reduce yields. As the amount of light from the LED lighting sheet increases, the heat generated from the control section increases. According to the LED lighting module in which the control section is externally connected and externally connected to the LED lighting sheet, the control section can be installed at any desired location, so variations can be suppressed and a good yield can be obtained.

The shelf board for the animal and plant growing shelf, the animal and plant growing shelf, and the plant and animal growing factory according to the present embodiment are equipped with the above-mentioned LED lighting sheet or module for growing animals and plants according to the present embodiment, so that a good yield of animals and plants can be obtained. You can get it at

Hereinafter, one embodiment will be specifically described with reference to the drawings. Each figure shown below is shown schematically. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Further, it is possible to implement the invention with appropriate changes within the scope of the technical concept. In each figure shown below, the same parts are given the same reference numerals, and some detailed explanations may be omitted. In addition, the numerical values such as dimensions and material names of each member described in this specification are examples of embodiments, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as terms such as parallel, perpendicular, and perpendicular, are not only meant strictly, but also include substantially the same state. In this specification, animals and plants mean animals and/or plants. In the following, for convenience, the case where plants are grown (cultivated) using an LED lighting module will be explained as an example, but the present invention can also be applied to the case where animals are grown as long as there is no contradiction.

(LED lighting module for plant growth)
The LED lighting module 10 (hereinafter also referred to as LED lighting module 10) for growing plants according to the present embodiment shown in FIG. 1 is installed in a plant growing factory 90 (FIG. 8) using artificial light, as described later. It is used to grow plants. Such an LED lighting module 10 includes an LED lighting sheet 20 for growing plants (hereinafter also referred to as LED lighting sheet 20) and a control unit 40 electrically connected to the LED lighting sheet 20.

As shown in FIG. 2, the LED lighting sheet 20 has a plurality of LED chips 21 arranged on the light emitting surface 20a side of the sheet surface (the side facing the plant when in use). By using such a direct-type LED lighting sheet 20, the irradiated light from the LED chips 21 passes through the light emitting surface 20a and directly reaches the plants directly below, so the amount of light is increased and the growth of plants is promoted. In addition, by reducing the thickness of the entire sheet, shadows on the sides of the LED chips 21 can be made less likely to occur. Although FIG. 2 shows an example of a direct-type LED illumination sheet 20, the present invention is not limited thereto, and an edge-type LED illumination sheet with a light guide plate or the like interposed therebetween may be used. The edge-type LED lighting sheet can easily suppress variations in the amount of light from the light emitting surface 20a. The LED lighting sheet 20 in FIG. 2 includes a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30. By using such a flexible wiring board 30, an LED lighting sheet 20 having a relatively large sheet surface area can be obtained. Generally, in plant growing factories and plant growing shelves, a plurality of LED lighting sheets 20 are used in an array, but if the positions of adjacent LED lighting sheets 20 vary, the amount of light will vary, which will reduce the yield of plants. may decrease. Since the LED illumination sheet 20 having a relatively large sheet surface area can reduce the number of LED illumination sheets 20 used, it is possible to suppress variations in the amount of light due to the arrangement of the plurality of LED illumination sheets 20. Although FIG. 2 shows an example of the LED lighting sheet 20 including the flexible wiring board 30, the present invention is not limited to this, and an LED lighting sheet including a rigid wiring board may be used. LED lighting sheets equipped with rigid wiring boards have high resistance to stress and are less likely to break. Note that in FIG. 2, illustrations of a light reflective insulating protective film 34 and a transparent protective film 35, which will be described later, are omitted.

In this case, the LED chips 21 are arranged in a grid pattern in the flexible wiring board 30 in a plan view. That is, the LED chips 21 are arranged in multiple stages and rows in a matrix, and N rows R of M LED chips 21 connected in series are arranged. For example, in FIG. 2, 14 (M=14) LED chips 21 are connected in series along the first arrangement direction (X direction) of the LED chips 21. Further, 10 rows (N=10) of rows R having these 14 LED chips 21 are arranged in parallel along the second arrangement direction (Y direction) of the LED chips 21. Note that the number of LED chips 21 arranged is not limited to this. Specifically, 10 or more and 14 or less (14≧M≧10) LED chips 21 are arranged in series in a first arrangement direction (X direction), and this row R is arranged as a second arrangement of LED chips 21. It is preferable to arrange them in parallel in the direction (Y direction) from 4 to 10 rows (10≧N≧4). By arranging ten or more LED chips 21 in series, the LED chips 21 can be arranged at short intervals along the first arrangement direction (X direction), and in-plane variations in illuminance of the LED lighting sheet 20 can be reduced. It is possible to suppress variations in light irradiated to plants. By arranging 14 or less LED chips 21 in series, power consumption can be reduced, and running costs such as utility costs in the plant growing factory 90 can be reduced. Furthermore, by arranging four or more rows of LED chips 21 in parallel in the second arrangement direction (Y direction) of the LED chips 21, even if a particular LED chip 21 is damaged, the LED chips 21 in other rows It is possible to prevent the illuminance of the entire LED illumination sheet 20 from being extremely reduced. Moreover, by limiting the range where the illuminance of the LED illumination sheet 20 has decreased, it is possible to limit the range where non-conforming products may occur and suppress a decrease in yield. In addition, if the LED lighting sheet 20 is a direct type, there is a high risk of damage due to strong contact with the LED chips 21 during installation or cleaning, so it is important to take measures in the event of damage. This is important from the perspective of Furthermore, by arranging ten or less rows of LED chips 21 in parallel, power consumption can be reduced, and running costs such as utility costs in the plant growing factory 90 can be reduced.

The LED lighting sheet 20 has a plurality of metal wiring parts 22, and the plurality of metal wiring parts 22 are arranged along a first arrangement direction (X direction). The plurality of metal wiring portions 22 arranged along the first arrangement direction (X direction) correspond to each row R of the LED chips 21, respectively. The LED chips 21 are arranged so as to straddle a pair of metal wiring sections 22 that are adjacent to each other in the X direction. Further, each terminal (not shown) of the LED chip 21 is electrically connected to a pair of metal wiring portions 22, respectively. The plurality of metal wiring sections 22 constitute a power supply section to the LED chips 21, and by supplying power to the plurality of metal wiring sections 22, all the LED chips 21 arranged in the column R are lit. . Note that the plurality of metal wiring sections 22 constitute a part of a metal wiring section 32 that will be described later.

The distance Px between the LED chips 21 in the first arrangement direction (X direction) is preferably 37 mm or more and 50 mm or less. Moreover, it is preferable that the interval Py between the LED chips 21 in the second arrangement direction (Y direction) is 37 mm or more and 100 mm or less. By setting the interval between the LED chips 21 within the above range, the brightness of the LED illumination sheet 20 is made uniform within the surface, and variations in the light irradiated to plants are suppressed, and the power consumption of the LED illumination sheet 20 is suppressed. I can do it.

The thickness of the thickest portion of the LED lighting sheet 20 is preferably 5 mm or less. By reducing the thickness of the LED lighting sheet 20 in this way, it is possible to narrow the vertical distance between the substrates 81 (FIG. 9) on which the LED lighting sheets 20 are installed, and thereby the growing shelf 80 ( The number of substrates 81 per FIG. 9) can be increased. As a result, the yield of plants per unit area can be increased. Further, when the plants and the LED lighting sheet 20 are close to each other, variations in relatively strong light irradiated to the plants can be further suppressed.

The arrangement of the LED chips 21 is not limited to a lattice pattern in plan view, but may be arranged in a staggered pattern in plan view, as shown in FIG. 3(a). Further, the LED chips 21 do not have to be arranged uniformly within the surface of the LED lighting sheet 20. For example, the density of the LED chips 21 may be further increased in the peripheral portion of the LED lighting sheet 20. Specifically, as shown in FIG. 3(b), the LED chips 21 are arranged in a lattice pattern at the center of the LED lighting sheet 20 (the lower part of FIG. 3(b)), and the LED chips 21 are arranged in the shape of grid points at the center of the LED lighting sheet 20 (the lower part of FIG. 3(b)), and The LED chips 21 may be arranged in a staggered manner (in the upper part of FIG. 3(b)). Thereby, it is possible to suppress a decrease in the brightness of the LED lighting sheet 20 at the peripheral portion of the LED lighting sheet 20, make the brightness of the LED lighting sheet 20 uniform within the surface, and suppress variations in the light irradiated to the plants. .

Although the overall shape of the LED lighting sheet 20 is rectangular in plan view, the size and planar shape of the LED lighting sheet 20 are not particularly limited. Since the LED lighting sheet 20 has a high degree of freedom in processing its size and shape, it can flexibly respond to various demands in this regard. Furthermore, by taking advantage of its flexibility, it is possible to attach it not only to flat installation surfaces but also to installation surfaces of various shapes.

In FIG. 2, the length Lx of the LED lighting sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more and 700 mm or less, and more preferably 550 mm or more and 650 mm or less. The length Ly of the LED lighting sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more and 500 mm or less, and more preferably 350 mm or more and 450 mm or less. By setting the size of the LED lighting sheet 20 within the above range, the LED lighting sheet 20 can be adapted to a general plant growing substrate 81 (FIG. 9), and the dead space of the substrate 81 can be reduced. . In addition, since the size of each LED lighting sheet 20 is not excessively large, even if a specific LED chip 21 is damaged, the influence on other LED chips 21 can be minimized, and the growth of plants can be improved. It is possible to prevent the illuminance of the entire shelf board 83 (FIG. 9) from decreasing extremely and to limit the range in which the illuminance decreases.

Next, the control section 40 will be explained. As shown in FIG. 1, the control unit 40 supplies power to the LED illumination sheet 20 and controls light emission and the like of the LED illumination sheet 20. This control unit 40 is detachably connected to the LED illumination sheet 20 via a first connector 44A provided on the LED illumination sheet 20. That is, the control unit 40 is configured separately from the LED lighting sheet 20 and is connected to the LED lighting sheet 20 externally. That is, the control unit 40 is not integrated with the LED lighting sheet 20. Thereby, the control unit 40 serving as a heat source can be separated from the LED lighting sheet 20, and the heat from the control unit 40 can be prevented from affecting the growth of plants.

The control unit 40 also includes a power input unit 41, an AC/DC converter (driver) 42, and a PWM control unit 43. Among these, the power input section 41 is supplied with an AC voltage having an arbitrary voltage of, for example, 100V to 240V. The AC/DC converter 42 converts an alternating current voltage of 100V to 240V into a constant voltage (for example, 44V) direct current voltage. The PWM control unit 43 controls the light of the LED chips 21 of the LED lighting sheet 20 by arbitrarily changing the pulse width of the constant voltage waveform from the AC/DC converter 42 . That is, the PWM control section 43 also serves as a dimming control section that controls dimming of the LED lighting sheet 20. A constant voltage output from the PWM control section 43 is applied to the LED lighting sheet 20 via the first connector 44A.

By applying a constant voltage to the LED lighting sheet 20 from the PWM control unit 43 of the control unit 40, the dimming of the LED chip 21 is controlled, unlike the case where a rectified pulse voltage is directly applied to the LED lighting sheet 20. It becomes possible to do so. That is, the PWM control unit 43 can arbitrarily control the illuminance of the LED chip 21 by appropriately changing the duty ratio of the DC voltage from the AC/DC converter 42. For example, as shown in FIG. 4(a), the PWM control unit 43 suppresses the duty ratio of the constant voltage from the AC/DC converter 42 from 100% (solid line) to 50% (dotted line). The illumination intensity can be reduced.

By appropriately adjusting the illuminance of the LED chips 21 in this way, the illuminance of the LED illumination sheet 20 can be adjusted according to the growth stage of the plants, and the degree of growth of the plants can be adjusted. For example, the illuminance of the LED illumination sheet 20 may be lowered during the early stages of growth when the leaves of the plant are small, and the illumination intensity of the LED illumination sheet 20 may be increased during the later stages of growth when the leaves of the plant are large. Alternatively, in the early stage of growth when the plant is short, the distance between the plant and the LED chip 21 is large, so the illuminance of the LED lighting sheet 20 is increased, and in the late stage of growth when the plant is large, the distance between the plant and the LED chip 21 is increased. 21, the illuminance of the LED illumination sheet 20 may be lowered. As another example of adjusting the illuminance of the LED lighting sheet 20, the illuminance may be set high for a type of plant that requires high illuminance, and the illuminance may be set low for a type of plant that can be grown even with low illuminance. If you want to speed up the shipping time, you can increase the illuminance, and if you want to delay the shipping time, you can lower the illuminance.

Further, by applying a constant voltage to the LED illumination sheet 20 from the PWM control unit 43, the integrated amount of light per unit time from the LED illumination sheet 20 can be increased. That is, for example, the cumulative light amount when a constant voltage is applied to the LED illumination sheet 20 (the area of the shaded part in FIG. 4(b)). Thereby, the luminous efficiency of light from the LED lighting sheet 20 can be increased, and the efficiency of growing plants can be improved.

Referring to FIG. 1 again, the LED lighting sheet 20 is provided with a regulator 45. In this case, regulators 45 are provided corresponding to each row of LED chips 21, and specifically, 10 regulators 45 are provided corresponding to 10 rows of LED chips 21. . This regulator 45 serves to maintain a constant current flowing through the plurality of LED chips 21 in each column. Thereby, even if one LED chip 21 is damaged, it is possible to suppress excessive current from flowing to the LED chips 21 in other rows and prevent the LED chips 21 in other rows from being damaged. As a result, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from being extremely reduced, and it is possible to suppress variations in the light irradiated to the plants. In addition, the regulator 45 can control the amount of current for each column by the connected resistance value. For example, by changing the control resistance values of the first column and the last column, only the output of peripheral columns can be controlled. I can give it to you. Normally, this aims to ensure uniformity by laying the LED lighting sheets 20 close together without any gaps, but from the viewpoint of cost and ensuring ventilation, it is assumed that the LED lighting sheets 20 are spaced approximately 5 cm to 10 cm apart. You can also expect the effect of erasing the seams.

Further, the LED lighting sheet 20 is provided with a power supply line 46 branching from the first connector 44A. Further, a second connector 44B is provided on the LED lighting sheet 20. The power supply line 46 is not electrically connected to the LED chips 21 of the LED lighting sheet 20, but is electrically connected to the wiring of other LED lighting sheets 200 having the same configuration as the LED lighting sheet 20. Connected. That is, the power supply line 46 is detachably connected to the wiring of the LED lighting sheet 200 via the second connector 44B and another first connector 44A provided on the other LED lighting sheet 200. Current from the power supply line 46 is supplied to the other LED lighting sheets 200 via the second connector 44B and the other first connector 44A. Thereby, the two LED lighting sheets 20, 200 can be connected and these two LED lighting sheets 20, 200 can be controlled simultaneously by one control unit 40. Since a plurality of LED lighting sheets 20 can be controlled simultaneously by one control unit 40, the number of control units 40, which are heat generation sources, can be reduced, so that the growth of plants due to the heat from the control unit 40 can be reduced. Variations are less likely to occur and a decrease in yield can be suppressed.

(Each component of LED lighting sheet)
Next, each member constituting the LED lighting sheet 20 will be explained. As shown in FIG. 5A, the LED lighting sheet 20 includes a flexible wiring board 30 and a plurality of LED chips 21 arranged on the flexible wiring board 30. Among these, the flexible wiring board 30 has a flexible substrate film 31 and a metal wiring portion 32 formed on the surface of the substrate film 31 (the surface on the light emitting surface 20a side). The metal wiring section 32 is laminated on the substrate film 31 via an adhesive layer 33.

Each LED chip 21 is mounted on the metal wiring section 32 in a manner that allows conduction. In this LED lighting sheet 20, since the LED chips 21 are mounted on the flexible wiring board 30, it is possible to arrange a plurality of LED chips 21 at a desired high density.

A light reflective insulating protective film 34 is formed to cover an area of the LED illumination sheet 20 except for the area where the LED chip 21, the regulator 45, and the connector 44 are provided and the surrounding area. This light reflective insulating protective film 34 is arranged to cover the metal wiring section 32. The light reflective insulating protective film 34 is a layer that has both an insulating function that contributes to improving the anti-migration characteristics of the LED lighting sheet 20 and a light reflecting function that contributes to improving the optical environment created by the LED lighting sheet 20. This layer is formed from an insulating resin composition containing a white pigment. If anti-migration characteristics and a light reflecting function can be obtained only with the metal wiring portion 32 described above and the transparent protective film 35 described below, a structure without the light reflective insulating protective film 34 is also possible.

Further, a protective portion 35A is provided to cover the light reflective insulating protective film 34 and the LED chip 21 to protect the LED chip 21. The protective portion 35A includes a transparent protective film 35. This transparent protective film 35 is a resinous film formed on the outermost surface (the surface located closest to the light emitting surface 20a) of the LED lighting sheet 20, mainly to ensure waterproofness of the LED lighting sheet 20. The transparent protective film 35 according to the present embodiment is formed, for example, by a method of spraying a transparent resin composition (hereinafter referred to as "spray coating method") or a method of forming by a curtain coating method. Good too.

A solder portion 36 is provided on the metal wiring portion 32. Each LED chip 21 is electrically connected to a metal wiring section 32 via a solder section 36, respectively. Note that each LED chip 21 may be mounted on the metal wiring section 32 via a conductive resin.

(Substrate film)
As the substrate film 31 shown in FIG. 5A, a flexible resin film can be used. In this specification, "having flexibility" means "having a radius of curvature of at least 1 m or less, preferably 50 cm, more preferably 30 cm, still more preferably 10 cm, particularly preferably 5 cm. "thing".

As the material for the substrate film 31, a thermoplastic resin having high heat resistance and insulation properties may be used. As such a resin, polyimide resin (PI) and polyethylene naphthalate (PEN), which are excellent in heat resistance, dimensional stability during heating, mechanical strength, and durability, can be used. Among these, polyethylene naphthalate (PEN), which has improved heat resistance and dimensional stability by performing heat resistance improvement treatment such as annealing treatment, can be preferably used. Alternatively, polyethylene terephthalate (PET) whose flame retardance has been improved by adding a flame retardant inorganic filler or the like may be used.

The thickness of the substrate film 31 is not particularly limited, but is approximately 10 μm or more and 500 μm from the viewpoints of not becoming a bottleneck as a heat dissipation path, having heat resistance and insulation properties, and balancing manufacturing costs. Hereinafter, it is preferably 50 μm or more and 250 μm or less. Further, from the viewpoint of maintaining good productivity when manufacturing by roll-to-roll method, the thickness is preferably within the above range.

(Adhesive layer)
As the adhesive forming the adhesive layer 33, a known resin adhesive can be appropriately used. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, acrylic-based, or epoxy-based adhesives can be particularly preferably used.

(Metal wiring part)
The metal wiring portion 32 is a wiring pattern formed on the surface of the substrate film 31 (the surface on the light emitting surface 20a side) using a conductive base material such as metal foil. This metal wiring portion 32 is preferably formed on the surface of the substrate film 31 via an adhesive layer 33 by a dry lamination method. The metal wiring section 32 includes the plurality of metal wiring sections 22 described above. The plurality of metal wiring parts 22 include a first metal wiring part 22A and a second metal wiring part 22B arranged apart from the first metal wiring part 22A. The LED chip 21 is mounted on the first metal wiring section 22A and the second metal wiring section 22B, and the LED chip 21 is electrically connected to the first metal wiring section 22A and the second metal wiring section 22B. has been done. The LED chip 21 is turned on by power supplied to the first metal wiring section 22A and the second metal wiring section 22B.

The metal wiring portion 32 preferably has a high level of both heat dissipation and electrical conductivity, and may be made of copper foil, for example. In this case, the heat dissipation from the LED chips 21 is stabilized and an increase in electrical resistance can be prevented, so that variations in light emission between the LED chips 21 are reduced and stable light emission is possible. Furthermore, the life of the LED chip 21 is also extended. Furthermore, since deterioration of peripheral members such as the substrate film 31 due to heat can be prevented, the product life of the LED lighting sheet 20 can also be extended. Examples of the metal forming the metal wiring portion 32 include metals such as aluminum, gold, and silver in addition to the above-mentioned copper.

The thickness of the metal wiring portion 32 may be appropriately set depending on the magnitude of withstand current required of the flexible wiring board 30 and the like. However, in order to suppress warping due to heat shrinkage of the substrate film 31 during soldering processing using a reflow method or the like, it is preferable that the thickness of the metal wiring portion 32 is 10 μm or more. On the other hand, the thickness of the metal wiring portion 32 is preferably 50 μm or less, thereby making it possible to maintain sufficient flexibility of the flexible wiring board 30 and preventing deterioration in handling properties due to increased weight. be able to.

(Solder part)
The solder portion 36 is for joining the metal wiring portion 32 and the LED chip 21. This solder bonding can be performed by a reflow method. As shown in FIG. 5B, the solder portion 36 according to this embodiment extends from the back surface 21c of the LED chip 21 to the side surface 21b. Further, in a cross section perpendicular to the light emitting surface 20a of the LED lighting sheet 20, a portion of the solder portion 36 located on the side of the LED chip 21 has a curved shape that bulges toward the light emitting surface 20a. In this embodiment, the portion of the solder portion 36 located on the side of the LED chip 21 is formed into a substantially semicircular shape in a cross section perpendicular to the light emitting surface 20a of the LED illumination sheet 20. Note that in this specification, "a cross section perpendicular to the light emitting surface of the LED lighting sheet" refers to a section along a direction (Z direction) perpendicular to the first arrangement direction (X direction) and the second arrangement direction (Y direction). means a cross section.

Further, as shown in FIGS. 5A and 5B, in the cross section perpendicular to the light emitting surface 20a of the LED lighting sheet 20, the thickest portion A of the solder portion 36 does not contact the side surface 21b of the LED chip 21. . As a result, as shown in FIG. 5B, a transparent protective film 35 is interposed between the side surface 21b of the LED chip 21 and the solder portion 36. Therefore, the adhesion between the transparent protective film 35 and the LED chip 21 can be improved. As a result, the transparent protective film 35 can effectively protect the LED chip 21. Furthermore, since the transparent protective film 35 is interposed between the side surface 21b of the LED chip 21 and the solder part 36, even if an operator comes into contact with the LED chip 21, the transparent protective film 35 will not touch the LED chip 21. The LED chip 21 can be effectively prevented from peeling off from the LED lighting sheet 20.

Further, as shown in FIG. 6, when viewed from the light emitting surface 20a side, the portion of the solder portion 36 located on the side of the LED chip 21 is formed so as to surround a part of the side surface 21b of the LED chip 21. has been done. Thereby, the bonding strength between the LED chip 21 and the solder portion 36 can be improved. Therefore, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

On the other hand, as shown in FIG. 5B, a portion of the solder portion 36 located on the back surface 21c side of the LED chip 21 extends continuously over the metal wiring portion 32. As shown in FIG. As will be described later, the shape of the solder portion 36 is such that the solder 36a (see FIGS. 7(g) to 7(h)) is pressed against the LED chip 21 when the solder portion 36 is formed by the reflow method. It is formed by being crushed. Although not shown, the portion of the solder portion 36 located on the back surface 21c side of the LED chip 21 may be composed of a plurality of portions spaced apart from each other. That is, there may be a region on the back surface 21c side of the LED chip 21 where the solder portion 36 is not formed. As described above, when forming the solder portion 36, the solder 36a is pressed against the LED chip 21 and crushed. Thereby, the solder 36a is pushed out from the back surface 21c side of the LED chip 21, and an area where the solder portion 36 is not formed can be formed on the back surface 21c side of the LED chip 21. Note that the solder bonding may be performed using a laser method.

(LED chip)
The LED chip 21 is a light emitting element that utilizes light emission at a PN junction where a P-type semiconductor and an N-type semiconductor are joined. The LED chip 21 may have a structure in which a P-type electrode and an N-type electrode are provided on the upper and lower surfaces of the element, respectively, or a structure in which both a P-type electrode and an N-type electrode are provided on one side of the element. It's okay.

Further, as the LED chip 21, it is preferable to select one with high luminous efficiency. Specifically, as the LED chip 21, it is preferable to use one having a luminous efficiency of 150 lm/W or more, and it is more preferable to use one having a luminous efficiency of 180 lm/W or more. By increasing the luminous efficiency of the LED chips 21 to 150 lm/W or more, it is possible to reduce the number of LED chips 21 mounted (density) and reduce heat generation due to Joule heat from the LED chips 21. This makes it difficult for variations in plant growth to occur due to this, and can suppress a decrease in yield.

As described above, the LED lighting sheet 20 is one in which the LED chips 21 are directly mounted on the metal wiring portion 32 that can exhibit high heat dissipation. As a result, even when the LED chips 21 are arranged at a high density, the excess heat generated when the LED chips 21 are lit is quickly diffused through the metal wiring section 32, and is transferred to the outside of the LED lighting sheet 20 via the substrate film 31. Since heat from the LED chip 21 can be sufficiently dissipated, variations in plant growth due to heat from the LED chip 21 are less likely to occur, and a decrease in yield can be suppressed.

(Light reflective insulation protective film)
The light reflective insulating protective film 34 is a layer formed in a region excluding the region where the LED chip 21 is provided and its peripheral region. This light reflective insulating protective film 34 is a so-called resist layer that improves the migration resistance characteristics of the flexible wiring board 30 by having sufficient insulation, and also reduces the luminance of the light environment created by the LED lighting sheet 20. This is a light reflective layer with light reflective properties that contributes to improvement.

The light-reflective insulating protective film 34 can be formed from various resin compositions that use a urethane resin or the like as a base resin and further contain a white pigment made of an inorganic filler such as titanium oxide. As the base resin of the resin composition used to form the light-reflective insulating protective film 34, in addition to urethane resins, acrylic polyurethane resins, polyester resins, phenol resins, and the like can be used as appropriate. As the base resin of the resin composition forming the light-reflective insulating protective film 34, it is more preferable to use the same or similar resin as the resin composition forming the transparent protective film 35. Regarding the transparent protective film 35, it is preferable to use acrylic polyurethane resin as the main material resin, as will be described later. From this, when the base resin of the resin composition for forming the transparent protective film 35 is an acrylic polyurethane resin, the base resin of the resin composition for forming the light reflective insulating protective film 34 is a urethane resin or More preferably, it is an acrylic polyurethane resin.

Inorganic fillers to be included as white pigments in the resin composition forming the light-reflective insulating protective film 34 include, in addition to titanium oxide, alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, At least one selected from talc, calcium carbonate, zinc oxide, silica, mica powder, powdered glass, powdered nickel, and powdered aluminum can be used.

The thickness of the light reflective insulating protective film 34 is 5 μm or more and 50 μm or less, more preferably 7 μm or more and 20 μm or less. If the thickness of the light-reflective insulating protective film 34 is less than 5 μm, the light-reflecting insulating protective film becomes thin, especially at the edge portion of the metal wiring portion 32, and if the metal wiring cannot be covered and is exposed. The risk of not being able to maintain insulation increases. On the other hand, from the viewpoint of preserving the light-reflecting insulating protective film 34 from substrate curvature during handling, transportation, etc., the thickness of the light-reflecting insulating protective film 34 is preferably 50 μm or less.

In addition, the light reflective insulating protective film 34 preferably has an average reflectance of 65% or more, more preferably 70% or more, and 80% or more in all wavelengths from 400 nm to 780 nm. is even more preferable. The LED lighting sheet 20 includes, for example, 20 parts by mass or more of titanium oxide based on 100 parts by mass of a urethane-based or acrylic polyurethane base resin, so that the thickness of the light-reflective insulating protective film 34 is 8 μm. In this case, the light reflectance of the same layer can be 75% or more.

(Transparent protective film)
The transparent protective film 35 is formed on the outermost surface of the LED lighting sheet 20 so as to cover the LED chips 21. The transparent protective film 35 has waterproofness and transparency. The waterproof property of the transparent protective film 35 can prevent water from entering the inside of the device when the LED lighting sheet 20 is used as a light source for growing plants. Furthermore, the transparent protective film 35 can also prevent the LED chips 21 from peeling off from the LED lighting sheet 20.

The transparent protective film 35 can be formed from various resin compositions using acrylic polyurethane resin or the like as a base resin. For example, the transparent protective film 35 may be formed of a two-part curable acrylic polyurethane resin containing fluorine. Further, as the base resin of the resin composition used to form the transparent protective film 35, in addition to acrylic polyurethane resin, urethane resin, polyester resin, phenol resin, etc. can be used as appropriate. As the base resin of the resin composition forming the transparent protective film 35, it is more preferable to use the same or similar resin as the resin composition forming the light reflective insulating protective film 34. A preferred specific combination is a combination in which the base resin of the resin composition forming the light reflective insulating protective film 34 is a urethane resin, and the same resin forming the transparent protective film 35 is an acrylic polyurethane resin. can.

Next, the transparent protective film 35 according to this embodiment will be explained in more detail with reference to FIG. 5B. As shown in FIG. 5B, the transparent protective film 35 according to this embodiment covers the entire surface (surface on the light emitting surface 20a side) 21a and side surface 21b of the LED chip 21. In this case, the transparent protective film 35 includes a central portion 35a that covers the front surface 21a of the LED chip 21, a curved portion 35b that is formed around the central portion 35a and covers the side surface 21b of the LED chip 21, and a curved portion 35b that is adjacent to the curved portion 35b. It includes a flat portion 35c formed by. Of these, the central portion 35a covers the entire surface 21a of the LED chip 21. Thereby, the phosphor 21d, which can be placed approximately in the center of the surface 21a of the LED chip 21, can be reliably protected from moisture scattered during the growth of plants. Moreover, since the central portion 35a covers the entire surface 21a of the LED chip 21, when the LED lighting sheet 20 is used in a plant growing factory, it is possible to suppress the grown plants from coming into contact with the phosphor 21d. I can do it. Furthermore, since the central portion 35a covers the entire surface 21a of the LED chip 21, it is possible to suppress the phosphor 21d of the LED chip 21 from falling onto the plant being grown, and the phosphor 21d can be It is possible to prevent contact with Therefore, the sanitary conditions of the plants to be grown can be maintained in good condition.

Moreover, the thickness of the central portion 35a is formed on the surface 21a of the LED chip 21 so that it gradually becomes thicker toward the center of the LED chip 21. Thereby, it is possible to increase the thickness of the portion of the central portion 35a that covers the phosphor 21d, which may be placed approximately at the center of the front surface 21a of the LED chip 21. Therefore, it is possible to more reliably protect the phosphor 21d, which can be disposed approximately at the center of the surface 21a of the LED chip 21, from moisture scattered during the growth of plants.

Further, the thickness of the thickest portion of the central portion 35a of the transparent protective film 35 is 5 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. Since the thickness of the thickest portion of the central portion 35a is 40 μm or less, the LED lighting sheet 20 has good flexibility, thinness, and lightness, and good optical properties required for plant cultivation applications. can be maintained effectively. Further, since the thickness of the thickest portion of the central portion 35a is 10 μm or more, the LED lighting sheet 20 can be provided with sufficient waterproofness required for plant cultivation.

The curved portion 35b of the transparent protective film 35 covers the entire side surface 21b of the LED chip 21. Thereby, even if an operator comes into contact with the LED chip 21, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

Further, the thickness of the curved portion 35b is formed to gradually increase as it approaches the LED chip 21. As a result, even if the operator comes into contact with the LED chip 21, it is possible to suppress the application of a large force locally to the joint between the LED chip 21 and the solder portion 36, and the LED chip 21 peeling off from the solder portion 36 can be more effectively suppressed.

Further, the curved portion 35b has a concave shape that is depressed from the light emitting surface 20a side toward the surface opposite to the light emitting surface 20a in a cross section perpendicular to the light emitting surface 20a of the LED lighting sheet 20. Thereby, even if an operator comes into contact with the LED chip 21, it is possible to effectively prevent the transparent protective film 35 from being damaged due to the force applied to the LED chip 21. . In this case, the radius of curvature r of the concave shape may be, for example, approximately 200 μm or more and 5000 μm or less.

Furthermore, the curved portion 35b covers the solder portion 36 located on the side of the LED chip 21. Thereby, the solder portion 36 can be protected from moisture that scatters during the growth of plants. Further, since the solder portion 36 is covered by the curved portion 35b of the transparent protective film 35, it is possible to prevent grown plants from coming into contact with the solder portion 36. Furthermore, since the solder portion 36 is covered by the curved portion 35b, it is possible to suppress the solder portion 36 from peeling off from the LED chip 21. In particular, in this embodiment, the portion of the solder portion 36 located on the side of the LED chip 21 is formed into a substantially semicircular shape. Thereby, the bonding area between the portion of the solder portion 36 located on the side of the LED chip 21 and the side surface 21b of the LED chip 21 can be reduced. Therefore, the bonding strength between the portion of the solder portion 36 located on the side of the LED chip 21 and the side surface 21b of the LED chip 21 may be reduced. In this embodiment, since the solder portion 36 is covered by the curved portion 35b of the transparent protective film 35, the portion of the solder portion 36 located on the side of the LED chip 21 is formed into a substantially semicircular shape. Even when the solder portion 36 is peeled off from the LED chip 21, it is possible to effectively prevent the solder portion 36 from peeling off from the LED chip 21. This can prevent the solder from coming into contact with plants. Therefore, the sanitary conditions of the plants to be grown can be maintained in good condition.

The flat portion 35c of the transparent protective film 35 has a substantially constant thickness. The thickness of the flat portion 35c is 5 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. When the thickness of the flat portion 35c is 40 μm or less, good flexibility, thinness, and lightness of the LED lighting sheet 20 can be effectively maintained. Further, by having the thickness of the flat portion 35c of 5 μm or more, the LED lighting sheet 20 can be provided with sufficient waterproofness required for plant growing applications.

The surface of the transparent protective film 35 described above may be hydrophilic. Thereby, when water adheres to the transparent protective film 35, the adhered water is distributed so as to spread along the surface of the transparent protective film 35. Therefore, it is possible to suppress the attached water from remaining as droplets on the surface 21a of the LED chip 21 at a position corresponding to the phosphor 21d. As a result, good optical characteristics of the LED lighting sheet 20 can be effectively maintained.

In addition, the water resistance of the LED lighting sheet 20 due to the transparent protective film 35 is such that it is possible to suppress deterioration of the LED chips 21 when water for growing plants is sprayed on the LED lighting sheet 20. If so, there are no particular limitations. As for such water resistance, it is preferable to exhibit IPX4 or higher according to the waterproof and dustproof protection standards defined by the IEC (International Electrotechnical Commission). Waterproofness of IPX4 or higher is such that the LED chip 21 is not adversely affected by water splashes from any direction. Specifically, when water was sprayed from a water nozzle at a water rate of 10 L/min for 5 minutes over the entire range of ±180° with respect to the normal direction of the LED lighting sheet 20, there was no harmful effect on the LED chips 21. It is said that it will not happen.

(Manufacturing method of LED lighting sheet)
Next, a method for manufacturing the LED lighting sheet 20 according to this embodiment will be described with reference to FIGS. 7(a) to 7(h).

First, a substrate film 31 is prepared (FIG. 7(a)). Next, a metal foil 32A such as copper foil, which is the material of the metal wiring portion 32, is laminated on the surface of the substrate film 31 (FIG. 7(b)). The metal foil 32A is bonded to the surface of the substrate film 31 with an adhesive layer 33 such as a urethane adhesive. Alternatively, the metal foil 32A may be directly formed on the surface of the substrate film 31 by an electrolytic plating method or a vapor phase film forming method (sputtering, ion plating, electron beam evaporation, vacuum evaporation, chemical vapor deposition, etc.). Alternatively, the substrate film 31 may be directly welded to the metal foil 32A.

Next, an etching mask 37 patterned into the shape required for the metal wiring section 32 is formed on the surface of the metal foil 32A (FIG. 7(c)). This etching mask 37 is provided so that the portion of the metal foil 32A that will become the metal wiring portion 32 corresponding to the wiring pattern is not corroded by the etching solution. The method for forming the etching mask 37 is not particularly limited, and for example, it may be formed by exposing a photoresist or dry film to light through a photomask and then developing it, or by printing the metal foil 32A using a printing technique such as an inkjet printer. An etching mask may be formed on the surface.

Next, the metal foil 32A located at a portion not covered by the etching mask 37 is removed using an immersion liquid (FIG. 7(d)). As a result, the portions of the metal foil 32A other than the portions that will become the metal wiring portions 32 are removed.

Thereafter, the etching mask 37 is removed using an alkaline stripping solution. As a result, the etching mask 37 is removed from the surface of the metal wiring section 32 (FIG. 7(e)).

Subsequently, a light reflective insulating protective film 34 is laminated on the metal wiring portion 32 (FIG. 7(f)). The formation of the light-reflective insulating protective film 34 is not particularly limited as long as it is a coating method that can uniformly apply the material resin composition constituting the light-reflective insulating protective film 34, such as screen printing, offset printing, Methods such as dip coater and brush coating can be used. Alternatively, it may be formed by coating the entire surface with a photosensitive insulating protective film material, exposing only necessary areas to light through a photomask, and then developing.

Next, the LED chip 21, parts of the regulator 45, and the connector 44 are mounted on the metal wiring section 32 (FIGS. 7(g) to 7(h)). Note that in FIG. 7(h) and FIG. 7(i) to be described later, illustration of parts of the regulator 45 is omitted for clarity of drawing. In this case, the LED chip 21 is joined to the metal wiring part 32 by soldering via the solder part 36. At this time, first, the solder 36a is laminated on the metal wiring portion 32 (FIG. 7(g)). Next, the LED chip 21 is placed on the solder 36a (FIG. 7(h)). Thereby, the solder 36a is crushed by being pressed against the LED chip 21, and the solder 36a is formed so as to extend from the back surface 21c of the LED chip 21 to the side surface 21b. Next, the LED chip 21 is mounted on the metal wiring part 32 via the solder part 36 by heating the solder 36a in a reflow oven (not shown). In this case, the portion of the solder portion 36 located on the side of the LED chip 21 is formed into a substantially semicircular shape. Note that this joining by soldering may be performed by a laser method or by joining using a conductive resin.

Next, a transparent protective film 35 is formed to cover the light reflective insulating protective film 34, the parts of the LED chip 21, the regulator 45, and the connector 44 (FIG. 7(i)). The formation of the transparent protective film 35 is preferably performed by a spray coating method or a curtain coating method. Formation of the transparent protective film 35 by the spray coating method is performed, for example, by spraying a coating liquid for spray coating treatment containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 using a spray coating machine to form a coating film. This can be done by forming a The transparent protective film 35 is formed by the curtain coating method, for example, by dropping a coating solution for curtain coating treatment containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 using a curtain coating machine, and applying a coating film to the flexible wiring board 30. This can be done by forming a In these cases, the thickness of the transparent protective film 35 can be maintained within a predetermined range, and the shape of the transparent protective film 35 can be easily made to follow the shape of the LED chip 21. At this time, by appropriately adjusting the conditions of the spray coating method or curtain coating method, a transparent protective film 35 including a central portion 35a, a curved portion 35b, and a flat portion 35c is formed (see FIG. 5B).

Note that the LED lighting sheet 20 according to the present embodiment can be produced not only by the method described above but also by a conventionally known method for manufacturing a flexible wiring board for an LED chip or various LED modules formed by mounting an LED chip on the flexible wiring board for an LED chip. It can also be produced by a method.

(Plant growing factory and plant growing shelves)
FIG. 8 is a diagram schematically showing the configuration of a plant growing factory 90 using the LED lighting sheet 20 according to this embodiment. The plant growing factory 90 includes a building 91 and a plurality of plant growing shelves 80 arranged inside the building 91.

As shown in FIG. 9, the plant growing shelf 80 includes a plurality of (four) pillars 82 and a plurality of substrates 81 arranged along the pillars 82 at intervals in the vertical direction. . A medium area for cultivating plants PL is provided on the upper surface of each substrate 81 except for the uppermost substrate 81. The lower surface of each board 81 except for the bottom board 81 constitutes a ceiling surface with respect to the board 81 located below the board 81, and the LED lighting sheets 20 are arranged in parallel. In this case, the control unit 40 is placed sufficiently away from the LED lighting sheet 20. Therefore, there is little possibility that the heat from the control unit 40 will cause variations in growth between the plants PL located close to the control unit 40 and the plants PL located far away. Moreover, the board 81 and the LED lighting sheet 20 attached to the lower surface side of the board 81 constitute a shelf board 83 for a plant growing shelf. Alternatively, the board 81 and the LED lighting module 10 attached to the lower surface of the board 81 constitute a shelf board 83 for a plant growing shelf. In this embodiment, a plant growing shelf 83 (FIG. 9), a plant growing shelf 80 (FIG. 9), and a plant growing factory 90 (FIG. 8) including the plant growing shelf 80 are used. Also provided.

Since the LED lighting sheet 20 according to this embodiment is flexible and lightweight, it is easier to attach the LED lighting sheet 20 to the lower surface of each board 81 than with a conventional straight tube lighting device. can be done. Furthermore, since the LED lighting sheet 20 has flexibility, the LED lighting sheet 20 can be attached to ceiling surfaces of various sizes and shapes. As a result, the LED lighting sheet 20 according to the present embodiment can be applied to various plant growing shelves 80 and plant growing factories 90.

Furthermore, the LED lighting sheet 20 is thinner than a conventional straight tube lighting device. Thereby, the interval between the substrates 81 in the vertical direction can be narrowed, and the number of substrates 81 included in each plant growing shelf 80 can be increased. As a result, the yield of plant PL per unit area can be increased.

Note that, as shown in FIGS. 10(a) and 10(b), the LED lighting sheet 20 may be arranged not only on the lower surface of the substrate 81 but also on the side surface of the substrate 81. This side LED lighting sheet 20 is suspended from a substrate 81 located above toward a substrate 81 located below the substrate 81 . In this case, as shown in FIG. 10(a), the LED lighting sheet 20 may reach the substrate 81 located below. Alternatively, as shown in FIG. 10(b), the LED lighting sheet 20 may cover only the upper side of the space located between the upper and lower substrates 81 without reaching the substrate 81 located below. In this way, by further arranging the LED lighting sheet 20 on the side surface of the substrate 81, the amount of light at the periphery of the substrate 81, where illuminance tends to be weak, is compensated for, and the brightness of the LED lighting sheet 20 is made uniform within the plane. be able to. As a result, the growth of the plants can be made uniform within the surface, and the yield of the plants to be grown can be improved.

As described above, according to the present embodiment, the LED lighting sheet 20 includes the protection portion 35A that covers the side surface 21b of the LED chip 21 and protects the LED chip 21. Thereby, even if an operator comes into contact with the LED chips 21, it is possible to prevent the LED chips 21 from peeling off from the LED lighting sheet 20. Therefore, it is possible to prevent the LED chip 21 from falling onto the plant being grown, and it is possible to prevent the phosphor 21d of the LED chip 21 from coming into contact with the plant. Therefore, it is possible to maintain good sanitary conditions for the plants being grown.

Further, according to the present embodiment, the protection portion 35A covers the solder portion 36 located on the side of the LED chip 21. Thereby, it is possible to protect the solder portion 36 from moisture that scatters during the growth of plants, and to suppress short-circuiting of the solder portion 36 due to moisture. Furthermore, since the solder portion 36 is covered by the protection portion 35A, it is possible to prevent a grown plant from coming into contact with the solder portion 36. Furthermore, since the solder portion 36 is covered by the protective portion 35A, it is possible to suppress the solder portion 36 from peeling off from the LED chip 21. In particular, in this embodiment, the portion of the solder portion 36 located on the side of the LED chip 21 is formed into a substantially semicircular shape. This may reduce the bonding strength between the portion of the solder portion 36 located on the side of the LED chip 21 and the side surface 21b of the LED chip 21. In this embodiment, since the solder part 36 is covered with the transparent protective film 35, the part of the solder part 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape. Even if there is, it is possible to effectively prevent the solder portion 36 from peeling off from the LED chip 21. This can prevent the solder from coming into contact with plants. Therefore, the sanitary conditions of the plants to be grown can be maintained in good condition.

Further, according to this embodiment, the central portion 35a covers the entire surface 21a of the LED chip 21. Thereby, the phosphor 21d, which can be placed approximately in the center of the surface 21a of the LED chip 21, can be reliably protected from moisture scattered during the growth of plants. Moreover, since the central portion 35a covers the entire surface 21a of the LED chip 21, when the LED lighting sheet 20 is used in a plant growing factory, it is possible to suppress the grown plants from coming into contact with the phosphor 21d. I can do it. Furthermore, since the central portion 35a covers the entire surface 21a of the LED chip 21, it is possible to suppress the phosphor 21d of the LED chip 21 from falling onto the plant being grown, and the phosphor 21d can be It is possible to prevent contact with Therefore, the sanitary conditions of the plants to be grown can be maintained in good condition.

Further, according to the present embodiment, the thickness of the central portion 35a is formed to gradually increase toward the center of the LED chip 21. Thereby, it is possible to increase the thickness of the portion of the central portion 35a that covers the phosphor 21d, which may be placed approximately at the center of the front surface 21a of the LED chip 21. Therefore, it is possible to more reliably protect the phosphor 21d, which can be disposed approximately at the center of the surface 21a of the LED chip 21, from moisture scattered during the growth of plants.

Further, according to the present embodiment, the curved portion 35b of the transparent protective film 35 covers the entire side surface 21b of the LED chip 21. Thereby, even if an operator comes into contact with the LED chip 21, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

Further, according to the present embodiment, the thickness of the curved portion 35b is formed to gradually increase as it approaches the LED chip 21. As a result, even if the operator comes into contact with the LED chip 21, it is possible to suppress the application of a large force locally to the joint between the LED chip 21 and the solder portion 36, and the LED chip 21 peeling off from the solder portion 36 can be more effectively suppressed.

According to the present embodiment, the curved portion 35b has a concave shape that is depressed from the light emitting surface 20a side toward the surface opposite to the light emitting surface 20a in a cross section perpendicular to the light emitting surface 20a of the LED lighting sheet 20. have. Thereby, even if an operator comes into contact with the LED chip 21, it is possible to effectively prevent the transparent protective film 35 from being damaged due to the force applied to the LED chip 21. .

Further, according to the present embodiment, the curved portion 35b covers the solder portion 36 located on the side of the LED chip 21. Thereby, the solder portion 36 can be protected from moisture that scatters during the growth of plants. Further, since the solder portion 36 is covered by the curved portion 35b, it is possible to suppress a grown plant from coming into contact with the solder portion 36. Furthermore, since the solder portion 36 is covered by the curved portion 35b, it is possible to suppress the solder portion 36 from peeling off from the LED chip 21. Therefore, it is possible to prevent the solder from coming into contact with the plants, and it is possible to maintain good sanitary conditions for the plants to be grown.

Further, according to the present embodiment, in the cross section perpendicular to the light emitting surface 20a of the LED lighting sheet 20, the thickest portion A of the solder portion 36 does not contact the side surface 21b of the LED chip 21. Thereby, the transparent protective film 35 can be interposed between the side surface 21b of the LED chip 21 and the solder part 36, and the adhesion between the transparent protective film 35 and the LED chip 21 can be improved. As a result, the transparent protective film 35 can effectively protect the LED chip 21. Furthermore, since the transparent protective film 35 is interposed between the side surface 21b of the LED chip 21 and the solder part 36, even if an operator comes into contact with the LED chip 21, the transparent protective film 35 will not touch the LED chip 21. The LED chip 21 can be effectively prevented from peeling off from the LED lighting sheet 20.

Further, according to the present embodiment, when viewed from the light emitting surface 20a side, the portion of the solder portion 36 located on the side of the LED chip 21 is formed so as to surround a part of the side surface 21b of the LED chip 21. has been done. Thereby, the bonding strength between the LED chip 21 and the solder portion 36 can be improved. Therefore, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

Further, according to this embodiment, the transparent protective film 35 covers the light reflective insulating protective film 34. Thereby, the transparent protective film 35 can protect the light reflective insulating protective film 34.

Further, according to the present embodiment, the protection portion 35A covers the entire surface 21a and side surface 21b of the LED chip 21. Thereby, the LED chip 21 can be reliably protected from moisture that scatters during the growth of plants. Further, by covering the entire surface 21a of the LED chip 21 with the protective portion 35A, the sanitary conditions of the plants to be grown can be maintained even better.

Further, according to the present embodiment, ten or more LED chips 21 are arranged in series, and four or more rows of these LED chips 21 are arranged in parallel. Thereby, the LED chips 21 can be arranged uniformly within the plane, the LED chips 21 can be arranged in parallel, and the risk when the LED chips 21 are damaged can be distributed.

Further, according to the present embodiment, since the thickness of the LED lighting sheet 20 at its thickest part is 5 mm or less, the distance between the upper and lower substrates 81 of the plant growing shelf 80 can be reduced and the number of substrates 81 can be increased. , can increase plant yield per unit area.

Further, according to the present embodiment, since the control unit 40 is externally connected to the LED lighting sheet 20, the control unit 40 is separated from the LED lighting sheet 20, and the heat from the control unit 40 affects the plants. You can prevent this from happening.

Further, according to the present embodiment, since a constant voltage is applied from the control unit 40 to the LED illumination sheet 20, it is possible to increase the cumulative amount of light per unit time from the LED chips 21 and promote the growth of plants.

Further, according to the present embodiment, the control unit 40 can control the light intensity of the LED chip 21, so that the intensity of light from the LED chip 21 can be adjusted according to the growth stage of the plant. can.

Although an example has been described in which the transparent protective film 35 of the protective portion 35A covers the entire surface 21a and side surface 21b of the LED chip 21, the present invention is not limited to this. For example, as shown in FIG. 11, the vicinity of the corner 21e of the LED chip 21 may be exposed. In this case, the amount of resin used to form the transparent protective film 35 can be reduced. Also in this case, the above-mentioned effects can be obtained.

Further, in the present embodiment described above, an example in which the transparent protective film 35 was formed by a spray coating method or a curtain coating method was described, but the present invention is not limited to this. For example, the transparent protective film 35 may be formed by attaching a resin film to the LED chip 21 or the light reflective insulating protective film 34. In this case, the material for the resin film may be vinyl chloride-based or fluorine-based resin, or polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyethylene naphthalate (PEN), polyimide (PI), etc. Common resins can be used. In this way, even when the transparent protective film 35 is composed of a resin film, the above-mentioned effects can be obtained. Note that, as shown in FIG. 12, the resin film may be adhered to the light-reflective insulating protective film 34 via an adhesive 38, for example. Note that the resin film may be adhered to the light reflective insulating protective film 34 via an adhesive, for example. Further, although not shown, the resin film may be bonded to the light reflective insulating protective film 34, for example, by heat sealing.

Moreover, in this case, as shown in FIG. 12, a gap G may be formed between the side surface 21b of the LED chip 21 and the transparent protective film 35. If a gap G is formed between the side surface 21b of the LED chip 21 and the transparent protective film 35, even if a worker contacts the LED chip 21, the force applied to the LED chip 21 may cause Therefore, damage to the transparent protective film 35 can be suppressed. Moreover, as shown in FIG. 13, a gap does not need to be formed between the side surface 21b of the LED chip 21 and the transparent protective film 35. When no gap is formed between the side surface 21b of the LED chip 21 and the transparent protective film 35, the adhesion between the LED chip 21 and the transparent protective film 35 can be improved, and the LED chip 21 and the solder part 36 can be can be protected more effectively. In this case, the transparent protective film 35 may be adhered to the LED chip 21 and the light-reflective insulating protective film 34 by, for example, a vacuum lamination method.

Further, in the present embodiment described above, an example has been described in which the protective portion 35A includes only the transparent protective film 35, but the present invention is not limited to this. For example, as shown in FIG. 14, the protective portion 35A may further include an adhesive layer (adhesive layer) 39 that adheres the LED chip 21 and the transparent protective film 35. In this case, the adhesive layer 39 preferably has insulation performance.
Thereby, it is possible to suppress a problem in which the adhesive layer 39 and the LED chip 21 are short-circuited and the phosphor 21d of the LED chip 21 does not emit light. In the modification shown in FIG. 14, a transparent protective film 35 is bonded to the LED chip 21 via an adhesive layer 39. Even in this case, the above-mentioned effects can be obtained.

Moreover, in this case, as shown in FIG. 14, a gap does not need to be formed between the side surface 21b of the LED chip 21 and the adhesive layer 39 of the protection part 35A. When no gap is formed between the side surface 21b of the LED chip 21 and the adhesive layer 39, the adhesion between the LED chip 21 and the transparent protective film 35 can be improved as in the example shown in FIG. , the LED chip 21 and the solder portion 36 can be more effectively protected. Further, as shown in FIG. 15, a gap G may be formed between the side surface 21b of the LED chip 21 and the adhesive layer 39 of the protective portion 35A. When a gap G is formed between the side surface 21b of the LED chip 21 and the adhesive layer 39, even if the operator touches the LED chip 21, as in the example shown in FIG. It is possible to prevent the transparent protective film 35 from being damaged due to the force applied to the transparent protective film 21.

Furthermore, as shown in FIG. 16, the adhesive layer 39 may cover the side surface 21b of the LED chip 21. In this case, as shown in FIG. 16, the surface 21a of the LED chip 21 and the surface 39a of the adhesive layer 39 may be flush with each other, or, although not shown, the surface 21a of the LED chip 21 An adhesive layer 39 may be interposed between the transparent protective film 35 and the adhesive layer 39 . In these cases, the entire surface (light emitting surface 20a) of the LED lighting sheet 20 becomes smooth. Thereby, the buffering properties of the LED lighting sheet 20 against external impacts can be improved. Also in these cases, the above-mentioned effects can be obtained.

Further, in the present embodiment described above, an example has been described in which the protective portion 35A covers the surface 21a of the LED chip 21, but the present invention is not limited to this. For example, as shown in FIG. 17, the protective portion 35A does not need to cover the surface 21a of the LED chip 21. Further, in this case, the protective portion 35A does not need to cover a part of the light reflective insulating protective film 34. That is, the transparent protective film 35 of the protective portion 35A does not need to include the central portion 35a and the flat portion 35c. Further, the curved portion 35b of the transparent protective film 35 may be configured to cover at least the solder portion 36 located on the side of the LED chip 21 without covering the entire side surface 21b of the LED chip 21. Even in this case, since the curved portion 35b of the transparent protective film 35 covers the solder portion 36 located on the side of the LED chip 21, the above-mentioned effect can be obtained.

It is also possible to appropriately combine the plurality of components disclosed in the above embodiments and modifications as necessary. Alternatively, some components may be deleted from all the components shown in the above embodiments and modifications.

10 LED lighting module 20 LED lighting sheet 20a light emitting surface 21 LED chip 21a front surface 21b side surface 21c back surface 21d phosphor 21e corner 22 metal wiring section 30 flexible wiring board 31 substrate film 32 metal wiring section 33 adhesive layer 34 light reflective insulation Protective film 35 Transparent protective film 35a Center part 35b Curved part 35c Flat part 38 Adhesive 39 Adhesive layer 36 Solder part 40 Control part 41 Power input part 42 AC/DC converter 43 PWM control part 44A First connector 44B Second connector 45 Regulator 46 Power supply line 80 Animal and plant growing shelf 81 Substrate 82 Support column 83 Shelf board for animal and plant growing shelf 90 Animal and plant growing factory 91 Building

Claims (21)

An LED lighting sheet for growing animals and plants,
a substrate film;
a metal wiring portion formed on the surface of the substrate film;
an LED chip mounted on the metal wiring part;
a light reflective insulating protective film disposed to cover the metal wiring portion;
a protective portion that covers at least a portion of the side surface of the light-reflective insulating protective film and the LED chip and protects the LED chip;
The protection part has a transparent protection film,
The transparent protective film is
a central portion that covers at least a portion of the surface of the LED chip;
a curved portion that covers at least a portion of the side surface of the LED chip;
a flat portion formed adjacent to the curved portion;
The transparent protective film is formed of a resin composition,
The thickness of the central portion and the flat portion of the transparent protective film is 5 μm or more and 40 μm or less, respectively,
An LED lighting sheet for growing animals and plants, wherein the light-reflective insulating protective film contains a white pigment and has an average reflectance of light at a wavelength of 400 nm or more and 780 nm or less of 65% or more. The LED lighting sheet for growing animals and plants according to claim 1, wherein the thickness of the central portion gradually increases toward the center of the LED chip. The LED lighting sheet for growing animals and plants according to claim 1 or 2 , wherein the protective portion has the transparent protective film containing an acrylic polyurethane resin. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 3 , wherein a gap is formed between the transparent protective film and the side surface of the LED chip. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 4 , wherein the protection part further includes an adhesive layer that adheres the LED chip and the transparent protective film. 6. The LED lighting sheet for growing animals and plants according to claim 5 , wherein the protective portion covers a side surface of the LED chip with the adhesive layer. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 6 , wherein the central portion covers the entire surface of the LED chip. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 7 , wherein the curved portion covers the entire area of the side surface of the LED chip. 9. The LED chip is mounted on the metal wiring part via a solder part, and the curved part covers the solder part located on a side of the LED chip. The LED lighting sheet for growing animals and plants as described in item 1. In a cross section perpendicular to a light emitting surface of the LED lighting sheet for growing animals and plants, a portion of the solder portion located on a side of the LED chip has a curved shape that swells toward the light emitting surface. 9. The LED lighting sheet for growing animals and plants according to 9 . The animal and plant growing according to claim 9 or 10 , wherein in a cross section perpendicular to the light emitting surface of the animal and plant growing LED lighting sheet, the thickest part of the solder portion does not contact the side surface of the LED chip. LED lighting sheet for. When viewed from the light emitting surface side of the LED lighting sheet for growing animals and plants, a portion of the solder portion located on a side of the LED chip is formed so as to surround a part of the side surface of the LED chip. The LED lighting sheet for growing animals and plants according to any one of claims 9 to 11 . The LED lighting sheet for growing animals and plants according to any one of claims 1 to 12 , wherein the protection part covers the entire surface and side surfaces of the LED chip. 14. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 13 , wherein ten or more LED chips are arranged in series, and four or more rows of the LED chips are arranged in parallel. An LED lighting module for growing animals and plants,
An LED lighting sheet for growing animals and plants according to any one of claims 1 to 14 ,
and a control unit electrically connected to the LED lighting sheet for growing animals and plants,
The control unit is an LED lighting module for growing animals and plants, which is externally connected to the LED lighting sheet for growing animals and plants. The LED lighting module for growing animals and plants according to claim 15 , wherein a constant voltage is applied from the control section to the LED lighting sheet for growing animals and plants. The LED lighting module for growing animals and plants according to claim 15 or 16 , wherein the control unit is capable of controlling dimming of the LED chip. A shelf board for growing animals and plants,
A substrate and
The LED lighting sheet for growing animals and plants according to any one of claims 1 to 14 or the LED lighting module for growing animals and plants according to any one of claims 15 to 17 attached to the substrate. , shelf board for growing animals and plants. A rack for growing animals and plants,
Equipped with shelves,
The shelf board is an LED lighting sheet for raising animals and plants according to any one of claims 1 to 14 , or an LED lighting sheet for raising animals and plants according to any one of claims 15 to 17 , which is attached to the lower surface side of the substrate. A shelf for growing plants and animals, equipped with an LED lighting module. 20. The shelf for growing animals and plants according to claim 19 , wherein the LED lighting sheet for growing plants and animals is further arranged on a side surface of the shelf board. building and
An animal and plant breeding factory, comprising: the animal and plant growing rack according to claim 19 or 20 , which is arranged inside the building.

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