JP2021022572A - Led lighting device for animal/plant growth, led lighting module for animal/plant growth, shelf board for animal/plant growth shelf, animal/plant growth shelf, and animal/plant growth factory - Google Patents

Abstract

To provide an led lighting device for animal/plant growth, an LED lighting module for animal/plant growth, a shelf board for animal/plant growth shelf, an animal/plant growth shelf, and an animal/plant growth factory such that animals or plants can be obtained in an excellent yield.SOLUTION: In an LED lighting module 10 for animal/plant growth, an LED lighting sheet 20 has a plurality of LED chips 21 arrayed on a flexible wiring board 30, and a light emission spectrum of an LED chip 21 has a first peak at which a center wavelength is 610-630 nm, a second peak at which a center wavelength is 440-460 nm, and a third peak at which a center wavelength is 510-530 nm, wherein a relative light emission intensity at the first peak is larger than a relative light emission intensity at the second peak, and a relative light emission intensity at the third peak is smaller than the relative light emission intensity at the second peak.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to an LED lighting device for growing animals and plants, an LED lighting module for growing animals and plants, a shelf board for growing shelves for animals and plants, a shelf for growing animals and plants, and a plant for growing animals and plants.

In recent years, there has been an increasing demand for lighting devices that use LEDs as a light source, which consume less power, in place of conventional fluorescent lamps, high-pressure sodium lamps, and the like as lighting devices used in animal and plant growing factories.

As an example of an animal and plant growing factory using a lighting device using an LED as a light source, a plant growing device in which a plurality of straight tube type plant growing lights using an LED as a light source are arranged on a shelf board of a plant growing shelf is known. (See, for example, Patent Document 1).

An LED lighting device for growing animals and plants in which a plurality of LED chips are arranged on a flexible type circuit board to form a planar light source has also been proposed (see, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2008-118957 Japanese Unexamined Patent Publication No. 2013-251230

The present disclosure discloses an LED lighting device for growing animals and plants, an LED lighting module for growing animals and plants, a shelf board for growing shelves for animals and plants, a shelf for growing animals and plants, and a plant for growing animals and plants, which can obtain animals and plants in a good yield. I will provide a.

The LED lighting device for growing animals and plants according to the present embodiment is an LED lighting device for growing animals and plants in which a plurality of LED chips are arranged, and the light source color of the LED chips is a light source specified in JIS Z 9112. Of the colors, it is light bulb color or warm white.

In the LED lighting device for growing animals and plants according to the present embodiment, the light source color of the LED chip may be the light bulb color.

The LED lighting device for growing animals and plants according to the present embodiment is an LED lighting device for growing animals and plants in which a plurality of LED chips are arranged, and the emission spectrum of light from the LED chips has a center wavelength of 610 nm or more. It has a first peak having a center wavelength of 630 nm or less, a second peak having a center wavelength of 440 nm or more and 460 nm or less, and a third peak having a center wavelength of 510 nm or more and 530 nm or less, and is relative to the first peak. The light emission intensity is larger than the relative light emission intensity at the second peak, and the relative light emission intensity at the third peak is smaller than the relative light emission intensity at the second peak.

The LED lighting device for growing animals and plants according to the present embodiment is an LED lighting device for growing animals and plants in which a plurality of LED chips are arranged, and the light from the LED chips has a center wavelength of 610 nm or more and 630 nm or less. A first component having a half-value width of 90 nm or more and 110 nm or less, a second component having a center wavelength of 440 nm or more and 460 nm or less and a half-value width of 10 nm or more and 20 nm or less, and a center wavelength of 510 nm or more and 530 nm or less. It also has a third component having a half-value width of 50 nm or more and 60 nm or less, and the relative emission intensity of the first component at the center wavelength is larger than the relative emission intensity of the second component at the center wavelength. The relative emission intensity of the third component at the center wavelength is smaller than the relative emission intensity of the second component at the center wavelength.

In the LED lighting device for growing animals and plants according to the present embodiment, the relative emission intensity of the second component at the center wavelength is 0.5 times or more and 0.7 times the relative emission intensity of the first component at the center wavelength. The relative emission intensity of the third component at the center wavelength may be 0.3 times or more and 0.5 times or less of the relative emission intensity of the first component at the center wavelength.

The LED lighting device for growing animals and plants according to the present embodiment is an LED lighting device for growing animals and plants in which a plurality of LED chips are arranged, and the chromaticity of light from the LED chips is shown in the xy chromaticity diagram. , (0.39, 0.36), (0.41, 0.44), (0.46, 0.44), (0.42, 0.36) of the square connecting the four chromaticity coordinates. It is in the area.

In the LED lighting device for growing animals and plants according to the present embodiment, 10 or more LED chips may be arranged in series, and 4 or more rows of the LED chips may be arranged in parallel.

In the LED lighting device for growing animals and plants according to the present embodiment, the LED chip may be covered with a transparent protective film.

The LED lighting device for growing animals and plants according to the present embodiment includes a substrate film and a metal wiring portion formed on the surface of the substrate film, and the plurality of LED chips are mounted on the metal wiring portion. May be good.

In the LED lighting device for growing animals and plants according to the present embodiment, the thickness at the thickest portion may be 5 mm or less.

The LED lighting module for growing animals and plants according to the present embodiment is an LED lighting module for growing animals and plants, and the LED lighting device for growing animals and plants according to the present embodiment and the LED lighting device for growing animals and plants are electrically connected. A control unit is provided, and the control unit is externally connected to the LED lighting device for growing animals and plants.

In the LED lighting module for growing animals and plants according to the present embodiment, a constant voltage may be applied from the control unit to the LED lighting device for growing animals and plants.

In the LED lighting module for growing animals and plants according to the present embodiment, the control unit may be able to control the dimming of the LED chip.

The shelf board for growing animals and plants according to the present embodiment is a shelf board for growing animals and plants, and is a substrate and an LED lighting device for growing animals and plants according to the present embodiment attached to the substrate. Alternatively, it is provided with the LED lighting module for growing animals and plants according to the present embodiment.

The animal and plant growing shelf according to the present embodiment is an animal and plant growing shelf, and includes a shelf board, and the shelf board is attached to the lower surface side of the substrate and is LED lighting for growing the animals and plants according to the present embodiment. It is provided with an apparatus or an LED lighting module for growing animals and plants according to the present embodiment.

In the animal and plant growing shelf according to the present embodiment, the LED lighting device for growing animals and plants may be further arranged on the side surface side of the shelf board.

The animal and plant growing factory according to the present embodiment includes a building and a shelf for growing the animals and plants according to the present embodiment arranged inside the building.

According to this embodiment, animals and plants can be obtained in a good yield.

FIG. 1 is a schematic view showing an LED lighting module according to an embodiment. FIG. 2 is a plan view showing an LED lighting sheet according to an embodiment. 3 (a)-(b) are plan views showing a modified example of the LED lighting sheet. FIG. 4A is a graph showing the relationship between time and voltage when a constant voltage is applied to the LED lighting sheet from the control unit, and FIG. 4B is a graph in which a pulse is applied to the LED lighting sheet as a comparative example. It is a graph which shows the relationship between time and voltage in the case where it is done. FIG. 5 is a cross-sectional view (VV line cross-sectional view of FIG. 2) showing an LED lighting sheet according to one embodiment. FIG. 6 is a diagram showing each component and emission spectrum of light from the LED chip of the LED lighting sheet according to the embodiment. FIG. 7 is an xy chromaticity diagram showing the chromaticity of light from the LED chip of the LED lighting sheet according to the embodiment, and is an xy chromaticity diagram in which isothermal lines of color temperature are described. 8 (a)-(h) are cross-sectional views showing a method of manufacturing an LED lighting sheet according to an embodiment. FIG. 9 is a schematic perspective view showing a plant growing plant according to one embodiment. FIG. 10 is a schematic perspective view showing a plant growing shelf according to one embodiment. 11 (a)-(b) is a diagram showing a modified example of a plant growing shelf.

In the LED lighting device for growing animals and plants according to the present embodiment, a plurality of LED chips are arranged, and the light source color of the LED chips is a light bulb color or a warm white color among the light source colors specified in JIS Z 9112.

In the LED lighting device for growing animals and plants according to the present embodiment, the light source color of the LED chip is a light bulb color or warm white among the light source colors specified in JIS Z 9112, so that the yield of the animals and plants to be grown is increased. It is possible to increase the amount of animals and plants to be cultivated while suppressing the decrease, and the animals and plants can be obtained with a good yield. By the way, improving profitability is mentioned as a main issue of animal and plant growing factories that cultivate plants by artificial light. In the case of plants, for example, in the case of plants, in addition to selecting cultivated objects with a high unit price, growth promotion for large growth in a short period of time, reduction of costs such as initial cost and running cost, etc. are considered as factors to improve profitability. Be done. For example, as a plan for promoting growth by promoting photosynthesis, there is a growth control technique using two types of LED chips, a red LED chip and a blue LED chip. However, when two types of LED chips are used, it is necessary to prepare two types of LED chips, and it is difficult to reduce the cost. In recent years, it has been proved that even leafy vegetables absorb green light and perform photosynthesis. Therefore, a white LED chip is sufficient as a light source, and it is desired to efficiently grow plants by an LED lighting device using a mass-produced white LED chip. On the other hand, according to the present embodiment, since the light source color of the LED chip is a light bulb color or warm white among the light source colors defined in JIS Z 9112, plants can be efficiently grown. , Good yield is obtained.

Further, in the LED lighting device for growing animals and plants according to the present embodiment, a plurality of LED chips are arranged, and the emission spectrum of the light from the LED chips has a center wavelength of 610 nm or more and 630 nm or less. It has a second peak having a wavelength of 440 nm or more and 460 nm or less, and a third peak having a center wavelength of 510 nm or more and 530 nm or less, and the relative light emission intensity at the first peak is relative to the second peak. It is larger than the light emission intensity, and the relative light emission intensity at the third peak is smaller than the relative light emission intensity at the second peak.

In the LED lighting device for growing animals and plants according to the present embodiment, the emission spectrum S of the light from the LED chip 21 has a first peak P1 having a center wavelength of 610 nm or more and 630 nm or less and a center wavelength of 440 nm or more and 460 nm or less. It has a second peak P2 and a third peak P3 having a center wavelength of 510 nm or more and 530 nm or less. Further, the relative emission intensity at the center wavelength of the first peak P1 is larger than the relative emission intensity at the center wavelength of the second peak P2, and the relative emission intensity at the center wavelength of the third peak P3 is the second peak. It is smaller than the relative emission intensity at the center wavelength of P2. As a result, the light from the LED chip 21 becomes white, and the light source color of the LED chip 21 can be changed to a light bulb color or a warm white color. Therefore, the above-mentioned effect can be obtained.

In the LED lighting device for growing animals and plants according to the present embodiment, a plurality of LED chips are arranged, and the light from the LED chips has a center wavelength of 610 nm or more and 630 nm or less and a half width of 90 nm or more and 110 nm or less. And the second component having a center wavelength of 440 nm or more and 460 nm or less and a half-value width of 10 nm or more and 20 nm or less, and a third component having a center wavelength of 510 nm or more and 530 nm or less and a half-value width of 50 nm or more and 60 nm or less. The relative emission intensity of the first component at the center wavelength is larger than the relative emission intensity of the second component at the center wavelength, and the relative emission intensity of the third component at the center wavelength is , It is smaller than the relative emission intensity at the center wavelength of the second component.

In the LED lighting device for growing animals and plants according to the present embodiment, the light from the LED chip 21 has a center wavelength of 610 nm or more and 630 nm or less and a first component C1 having a half width of 90 nm or more and 110 nm or less and a center wavelength. The second component C2 having a half-value width of 10 nm or more and 20 nm or less and the third component C3 having a center wavelength of 510 nm or more and 530 nm or less and a half-value width of 50 nm or more and 60 nm or less. Have. Further, the relative emission intensity at the center wavelength of the first component C1 is larger than the relative emission intensity at the center wavelength of the second component C2, and the relative emission intensity at the center wavelength of the third component C3 is the second component. It is smaller than the relative emission intensity at the center wavelength of C2. As a result, the light from the LED chip 21 becomes white, and the light source color of the LED chip 21 can be changed to a light bulb color or a warm white color. Therefore, the above-mentioned effect can be obtained.

In the LED lighting device for growing animals and plants according to the present embodiment, a plurality of LED chips are arranged, and the chromaticity of the light from the LED chips is (0.39, 0.36), (0) in the xy chromaticity diagram. It is in the area of the quadrangle connecting the four chromaticity coordinates of .41, 0.44), (0.46, 0.44), and (0.42, 0.36).

In the LED lighting device for growing animals and plants according to the present embodiment, the chromaticity of the light from the LED chip 21 is (0.39, 0.36), (0.41, 0.44) in the xy chromaticity diagram. , (0.46, 0.44), (0.42, 0.36) are in a rectangular area connecting the four chromaticity coordinates. In this case, the light from the LED chip 21 becomes white, and the light source color of the LED chip 21 can be a light bulb color or a warm white color. Therefore, the above-mentioned effect can be obtained.

Further, the LED lighting module for growing animals and plants according to the present embodiment includes an LED lighting device for growing animals and plants and a control unit electrically connected to the LED lighting device, and the control unit is the LED. It is externally connected to the lighting device.

Since the LED lighting module for growing animals and plants according to the present embodiment has an external control unit, it is possible to increase the amount of animals and plants to be grown while suppressing a decrease in the yield of animals and plants to be grown. Can be obtained with good yield. The heat generated locally near the control unit strongly affects the animals and plants grown near the control unit, and has a low effect on the animals and plants grown far from the control unit. Therefore, there is a risk that the growing state of animals and plants will vary, the number of nonconforming products will increase, and the yield will decrease. According to the LED lighting module in which the control unit is externally connected to the LED lighting device, the control unit can be installed at an arbitrary place, so that variation can be suppressed and a good yield can be obtained.

The shelves for growing animals and plants according to the present embodiment, the shelves for growing animals and plants, and the plant for growing animals and plants are provided with the LED lighting device or module for growing animals and plants according to the above embodiment, so that good yields of animals and plants can be obtained. Can be obtained at.

Hereinafter, one embodiment will be specifically described with reference to the drawings. Each figure shown below is schematically shown. Therefore, the size and shape of each part are exaggerated as appropriate to facilitate understanding. In addition, it is possible to make appropriate changes within the range that does not deviate from the technical concept. In each of the figures shown below, the same parts are designated by the same reference numerals, and some detailed description thereof may be omitted. Further, numerical values such as dimensions of each member and material names described in the present specification are examples of embodiments, and are not limited to these, and can be appropriately selected and used. In the present specification, terms that specify a shape and geometric conditions, such as parallel, orthogonal, and vertical, are intended to include substantially the same state in addition to the exact meaning. As used herein, the term "animals and plants" means animals and / or plants. In the following, for convenience, a case of growing (cultivating) a plant by an LED lighting module will be described as an example, but it can also be applied to a case of raising an animal within a range where no contradiction occurs.

(LED lighting module for growing plants)
The LED lighting module 10 (hereinafter, also referred to as LED lighting module 10) for growing plants according to the present embodiment shown in FIG. 1 is located in a plant growing factory 90 (FIG. 9) using artificial light, as will be described later. It is installed and grows plants. Such an LED lighting module 10 includes an LED lighting sheet (LED lighting device) 20 for growing plants (hereinafter, also referred to as LED lighting sheet 20) and a control unit 40 electrically connected to the LED lighting sheet 20. I have.

As shown in FIG. 2, the LED lighting sheet 20 is a so-called planar light source sheet, in which a plurality of LED chips 21 are arranged on the light emitting surface side (the side facing the plant direction at the time of use) of the sheet surface. is there. By using such a direct type LED lighting sheet 20, the irradiation light from the LED chip 21 passes through the light emitting surface as it is and reaches the plant directly under it, so that the amount of light is strengthened to promote the growth of the plant. In addition, the thickness of the entire sheet can be reduced to make it difficult for shadows on the side side of the LED chip 21 to be generated. Note that FIG. 2 shows an example of the direct type LED lighting sheet 20, but the present invention is not limited to this, and an edge light type LED lighting sheet with a light guide plate or the like interposed may be used. The edge light type LED lighting sheet can easily suppress variations in the amount of light from the light emitting surface. The LED lighting sheet 20 of FIG. 2 includes a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30. By using such a flexible wiring board 30, it is possible to obtain an LED lighting sheet 20 having a relatively large sheet surface area. Generally, in a plant growing factory or a plant growing shelf, a plurality of LED lighting sheets 20 are arranged and used, but if the positions of adjacent LED lighting sheets 20 vary, the amount of light varies and the yield of plants occurs. May decrease. Since the LED lighting sheet 20 having a relatively large sheet surface area can reduce the number of LED lighting sheets 20 used, it is possible to suppress variations in the amount of light due to the arrangement of the plurality of LED lighting sheets 20. Note that FIG. 2 shows an example of the LED lighting sheet 20 provided with the flexible wiring board 30, but the present invention is not limited to this, and an LED lighting sheet provided with the rigid wiring board may be used. The LED lighting sheet provided with the rigid wiring board has high resistance to stress and is not easily damaged. In FIG. 2, the display of the light-reflecting insulating protective film 34 and the transparent protective film 35, which will be described later, is omitted.

In this case, the LED chips 21 are arranged in a grid pattern in the flexible wiring board 30 in a plan view. That is, the LED chips 21 are arranged in multiple stages in a matrix, and rows R of M LED chips 21 connected in series are arranged in N rows. For example, in FIG. 2, 14 LED chips 21 (M = 14) are connected in series along the first arrangement direction (X direction) of the LED chips 21. Further, rows R having the 14 LED chips 21 are arranged in parallel in 10 rows (N = 10) along the second arrangement direction (Y direction) of the LED chips 21. The number of LED chips 21 arranged is not limited to this. Specifically, 10 or more and 14 or less (14 ≧ M ≧ 10) LED chips 21 are arranged in series in the first arrangement direction (X direction), and this row R is arranged in the second arrangement of the LED chips 21. It is preferable to arrange them in parallel in the direction (Y direction) of 4 rows or more and 10 rows or less (10 ≧ N ≧ 4). By arranging 10 or more LED chips 21 in series, the LED chips 21 can be arranged at short intervals along the first arrangement direction (X direction), and the in-plane variation of the illuminance of the LED lighting sheet 20 can be caused. It can be suppressed, and the variation of the light irradiating the plant can be suppressed. By arranging 14 or less LED chips 21 in series, power consumption can be reduced, and running costs such as utility costs in the plant growing plant 90 can be reduced. Further, by arranging four or more rows of LED chips 21 in parallel in the second arrangement direction (Y direction) of the LED chips 21, even if a specific LED chip 21 is damaged, the LED chips 21 in other rows are arranged. It is possible to prevent the LED lighting sheet 20 from being extremely reduced in illuminance. Further, by limiting the range in which the illuminance of the LED lighting sheet 20 is reduced, the range in which nonconforming products may occur can be limited, and the decrease in yield can be suppressed. Further, when the LED lighting sheet 20 is a direct type, there is a high possibility that the LED chip 21 may be accidentally and strongly contacted during installation or cleaning and damaged. Therefore, it is risk management to take measures in case of damage. It is important from the viewpoint of. Further, by arranging 10 or less rows of LED chips 21 in parallel, power consumption can be reduced, and running costs such as utility costs in the plant growing plant 90 can be reduced.

The LED lighting sheet 20 has a plurality of metal wiring portions 22, and the plurality of metal wiring portions 22 are arranged along the first arrangement direction (X direction). The plurality of metal wiring portions 22 arranged along the first arrangement direction (X direction) correspond to each row R of the LED chip 21. The LED chips 21 are arranged so as to straddle a pair of metal wiring portions 22 adjacent to each other in the X direction. Further, each terminal (not shown) of the LED chip 21 is electrically connected to the pair of metal wiring portions 22. The plurality of metal wiring units 22 form a power supply unit for the LED chips 21, and when power is supplied to the plurality of metal wiring units 22, all the LED chips 21 arranged in the row R are lit. .. The plurality of metal wiring portions 22 form a part of the metal wiring portion 32 described later.

The distance Px between the LED chips 21 in the first arrangement direction (X direction) is preferably 37 mm or more and 50 mm or less. Further, the distance Py between the LED chips 21 in the second arrangement direction (Y direction) is preferably 37 mm or more and 100 mm or less. By setting the distance between the LED chips 21 to the above range, the brightness of the LED lighting sheet 20 can be made uniform in the plane, the variation of the light irradiating the plants can be suppressed, and the power consumption of the LED lighting sheet 20 can be suppressed. Can be done.

The thickness of the thickest portion of the LED lighting sheet 20 is preferably 5 mm or less. By reducing the thickness of the LED lighting sheet 20 in this way, the vertical distance between the substrates 81 (FIG. 10) on which the LED lighting sheet 20 is installed can be narrowed, whereby the growing shelf 80 of each plant (FIG. 10) can be narrowed. The number of substrates 81 per FIG. 10) can be increased. As a result, the yield of plants per unit area can be increased. In addition, it is possible to further suppress variations in the relatively strong light emitted to the plant when the plant and the LED lighting sheet 20 are in close proximity to each other.

The arrangement of the LED chips 21 is not limited to the point shape of the grid in a plan view, and may be arranged in a staggered pattern in a plan view as shown in FIG. 3 (a). Further, the LED chips 21 do not have to be uniformly arranged in the plane of the LED lighting sheet 20. For example, the density of the LED chip 21 may be further increased in the peripheral portion of the LED lighting sheet 20. Specifically, as shown in FIG. 3B, the LED chips 21 are arranged in a grid pattern at the central portion (lower part of FIG. 3B) of the LED lighting sheet 20, and the peripheral portion of the LED lighting sheet 20. The LED chips 21 may be arranged in a staggered pattern (upper part of FIG. 3B). As a result, it is possible to suppress a decrease in the brightness of the LED lighting sheet 20 at the peripheral edge of the LED lighting sheet 20, make the brightness of the LED lighting sheet 20 uniform in the plane, and suppress variations in the light irradiating the plant. ..

The overall shape of the LED lighting sheet 20 is a rectangular shape in a plan view, but the size and plane shape of the LED lighting sheet 20 are not particularly limited. Since the LED lighting sheet 20 has a high degree of freedom in processing the size and shape, it is possible to flexibly meet various demands in this regard. Further, taking advantage of its flexibility, it can be mounted not only on a flat installation surface but also on an installation surface having various shapes. Further, since the LED lighting sheet 20 itself has rigidity, for example, by bending the LED lighting sheet 20 into a cylindrical shape so that the LED chip 21 is on the outside, the LED lighting sheet 20 alone can be used for lighting even if there is no installation surface. It is also possible.

In FIG. 2, the length Lx of the LED lighting sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more and 700 mm or less, and more preferably 550 mm or more and 650 mm or less. The length Ly of the LED lighting sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more and 500 mm or less, and more preferably 350 mm or more and 450 mm or less. By setting the size of the LED lighting sheet 20 in the above range, the LED lighting sheet 20 can be adapted to a general plant growing substrate 81 (FIG. 10), and the dead space of the substrate 81 can be reduced. .. In addition, since the size of each LED lighting sheet 20 is not excessively large, if a specific LED chip 21 is damaged, the influence on other LED chips 21 is minimized, and plants are grown. It is possible to prevent the illuminance of the entire shelf board 83 (FIG. 10) for shelves from being extremely reduced and to limit the range in which the illuminance is reduced.

Next, the control unit 40 will be described. As shown in FIG. 1, the control unit 40 supplies electric power to the LED lighting sheet 20 and controls light emission and the like of the LED lighting sheet 20. The control unit 40 is detachably connected to the LED lighting sheet 20 via a first connector 44A provided on the LED lighting sheet 20. That is, the control unit 40 is configured separately from the LED lighting sheet 20 and is externally connected to the LED lighting sheet 20. That is, the control unit 40 is not integrated with the LED lighting sheet 20. As a result, the control unit 40, which is a heat source, can be separated from the LED lighting sheet 20, and the heat from the control unit 40 does not affect the growth of the plant.

Further, the control unit 40 includes a power input unit 41, an AC / DC converter (driver) 42, and a PWM control unit 43. Of these, the power input unit 41 is supplied with an AC voltage having an arbitrary voltage of, for example, 100V to 240V. The AC / DC converter 42 converts an AC voltage of 100V to 240V into a DC voltage of a constant pressure (for example, 44V). The PWM control unit 43 adjusts the LED chip 21 of the LED lighting sheet 20 by arbitrarily changing the pulse width of the constant voltage waveform from the AC / DC converter 42. That is, the PWM control unit 43 also serves as a dimming control unit that controls the dimming of the LED lighting sheet 20. The constant voltage output from the PWM control unit 43 is applied to the LED lighting sheet 20 via the first connector 44A.

By applying a constant voltage to the LED lighting sheet 20 from the PWM control unit 43 of the control unit 40, the dimming of the LED chip 21 is performed, unlike the case where a rectified pulse voltage is directly applied to the LED lighting sheet 20. It becomes possible to do. That is, the PWM control unit 43 can arbitrarily control the illuminance of the LED chip 21 by appropriately changing the duty ratio of the DC voltage from the AC / DC converter 42. For example, as shown in FIG. 4A, the PWM control unit 43 suppresses the duty ratio of the constant voltage from the AC / DC converter 42 from 100% (solid line) to 50% (dotted line), so that the LED chip 21 The illuminance of the can be reduced.

By appropriately adjusting the illuminance of the LED chip 21 in this way, the illuminance of the LED lighting sheet 20 can be adjusted according to the growth stage of the plant, and the degree of growth of the plant can be adjusted. For example, the illuminance of the LED lighting sheet 20 may be lowered in the early stage of small growth of plant leaves, and the illuminance of the LED lighting sheet 20 may be high in the late stage of growth of large leaves of plants. Alternatively, since the distance between the plant and the LED chip 21 is increased in the early stage of growth when the plant is short, the illuminance of the LED lighting sheet 20 is increased, and in the late stage of growth when the plant is tall, the plant and the LED chip are increased. Since the distance from 21 is reduced, the illuminance of the LED lighting sheet 20 may be lowered. As another example of adjusting the illuminance of the LED lighting sheet 20, the illuminance may be increased when the type of plant requires high illuminance, and may be decreased when the type of plant can be grown even with low illuminance. The illuminance may be increased when the shipping time is to be advanced, and the illuminance may be decreased when the shipping time is to be delayed.

Further, by applying a constant voltage from the PWM control unit 43 to the LED lighting sheet 20, the integrated amount of light from the LED lighting sheet 20 per unit time can be increased. That is, for example, the integrated light amount when a constant voltage is applied to the LED lighting sheet 20 (the area of the shaded portion in FIG. 4A) is used as a comparative example, and the integrated light amount when a pulse voltage is applied (FIG. It can be made larger than the area of the shaded portion of 4 (b)). As a result, the luminous efficiency of the light from the LED lighting sheet 20 can be increased, and the plant growing efficiency can be improved.

Referring to FIG. 1 again, the LED lighting sheet 20 is provided with a regulator 45. In this case, the regulator 45 is provided corresponding to each row of the LED chips 21, and specifically, 10 regulators 45 are provided corresponding to 10 rows of the LED chips 21. .. The regulator 45 serves to keep the current flowing through the plurality of LED chips 21 in each row constant. As a result, even if one LED chip 21 is damaged, it is possible to prevent an excessive current from flowing through the LED chips 21 in the other row and prevent the LED chips 21 in the other row from being damaged. As a result, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from being extremely lowered, and it is possible to suppress variations in the light irradiating the plants. Further, the regulator 45 can control the amount of current controlled by the connected resistance value for each column. For example, by changing the control resistance value of the first column and the last column, only the peripheral columns are output. I can give it. As a result, the aim is usually to ensure uniformity by laying the LED lighting sheets 20 together without gaps, but from the viewpoint of cost and ensuring breathability, it is assumed that the LED lighting sheets 20 are separated by about 5 cm to 10 cm. However, the effect of erasing the seams can be expected.

Further, the LED lighting sheet 20 is provided with a power supply line 46 branched from the first connector 44A. Further, a second connector 44B is provided on the LED lighting sheet 20. The power supply line 46 is not electrically connected to the LED chip 21 of the LED lighting sheet 20, but is electrically connected to the wiring of another LED lighting sheet 200 having the same configuration as the LED lighting sheet 20. Be connected. That is, the power supply line 46 is detachably connected to the wiring of the LED lighting sheet 200 via the second connector 44B and another first connector 44A provided on the other LED lighting sheet 200. The current from the power supply line 46 is supplied to the other LED lighting sheet 200 via the second connector 44B and the other first connector 44A. As a result, the two LED lighting sheets 20 and 200 can be connected, and the two LED lighting sheets 20 and 200 can be controlled simultaneously by one control unit 40. Since a plurality of LED lighting sheets 20 and 200 can be controlled simultaneously by one control unit 40, the number of control units 40 which are heat sources can be reduced, so that the number of control units 40 generated by heat from the control unit 40 can be reduced. It is possible to suppress the decrease in yield by making it difficult for variations in growth to occur.

(Each member of LED lighting sheet)
Next, each member constituting the LED lighting sheet 20 will be described. As shown in FIG. 5, the LED lighting sheet 20 includes a flexible wiring board 30 and a plurality of LED chips 21 arranged on the flexible wiring board 30. Of these, the flexible wiring board 30 has a flexible substrate film 31 and a metal wiring portion 32 formed on the surface (the surface on the light emitting surface side) of the substrate film 31. The metal wiring portion 32 is laminated on the substrate film 31 via the adhesive layer 33.

Each LED chip 21 is mounted on the metal wiring portion 32 in a conductive manner. In the LED lighting sheet 20, since the LED chips 21 are mounted on the flexible wiring board 30, a plurality of LED chips 21 can be arranged at a desired high density.

The light-reflecting insulating protective film 34 is formed so as to cover the area of the LED lighting sheet 20 excluding the area where the LED chip 21, the regulator 45, the first connector 44A and the second connector 44B are provided and the peripheral area thereof. ing. The light-reflecting insulating protective film 34 is arranged so as to cover the metal wiring portion 32. The light-reflecting insulating protective film 34 is a layer having both an insulating function that contributes to improving the migration resistance of the LED lighting sheet 20 and a light reflecting function that contributes to improving the light environment created by the LED lighting sheet 20. This layer is formed of an insulating resin composition containing a white pigment. When the migration resistance characteristic and the light reflection function can be obtained only by the metal wiring portion 32 described above and the transparent protective film 35 described later, a structure without the light reflective insulating protective film 34 is also possible.

Further, a transparent protective film 35 is formed so as to cover the light-reflecting insulating protective film 34 and the LED chip 21. The transparent protective film 35 is a resin film formed mainly on the outermost surface (the surface located on the light emitting surface side) of the LED lighting sheet 20 in order to ensure the waterproof property.

A solder portion 36 is provided on the metal wiring portion 32. Each LED chip 21 is electrically connected to the metal wiring portion 32 via the solder portion 36, respectively.

(Substrate film)
As the substrate film 31, a flexible resin film can be used. In the present specification, "flexible" means that the radius of curvature can be bent to at least 1 m or less, preferably 50 cm, more preferably 30 cm, still more preferably 10 cm, and particularly preferably 5 cm. That means ".

As the material of the substrate film 31, a thermoplastic resin having high heat resistance and insulating properties may be used. As such a resin, a polyimide resin (PI) having excellent heat resistance, dimensional stability during heating, mechanical strength, and durability, or polyethylene naphthalate (PEN) can be used. Among them, polyethylene naphthalate (PEN) whose heat resistance and dimensional stability are improved by subjecting it to a heat resistance improving treatment such as an annealing treatment can also be preferably used. Further, polyethylene terephthalate (PET) having improved flame retardancy by adding a flame retardant inorganic filler or the like may be used.

The thickness of the substrate film 31 is not particularly limited, but is approximately 10 μm or more and 500 μm from the viewpoint of not causing a bottleneck as a heat dissipation path, having heat resistance and insulating properties, and balancing manufacturing costs. Hereinafter, it is preferably 50 μm or more and 250 μm or less. Further, it is preferably within the above thickness range from the viewpoint of maintaining good productivity in the case of manufacturing by the roll-to-roll method.

(Adhesive layer)
As the adhesive forming the adhesive layer 33, a known resin-based adhesive can be appropriately used. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, ester-based, or epoxy-based adhesives can be particularly preferably used.

(Metal wiring part)
The metal wiring portion 32 is a wiring pattern formed by a conductive base material such as a metal foil on the surface (the surface on the light emitting surface side) of the substrate film 31. The metal wiring portion 32 is preferably formed on the surface of the substrate film 31 by a dry laminating method via an adhesive layer 33. The metal wiring unit 32 includes the plurality of metal wiring units 22 described above. The plurality of metal wiring portions 22 include a first metal wiring portion 22A and a second metal wiring portion 22B arranged apart from the first metal wiring portion 22A. An LED chip 21 is mounted on the first metal wiring portion 22A and the second metal wiring portion 22B, and the LED chip 21 is electrically connected to the first metal wiring portion 22A and the second metal wiring portion 22B. Has been done. The LED chip 21 is lit by the electric power supplied to the first metal wiring portion 22A and the second metal wiring portion 22B.

The metal wiring portion 32 preferably has both heat dissipation and electrical conductivity at a high level, and for example, copper foil can be used. In this case, the heat dissipation from the LED chip 21 is stable and the increase in electrical resistance can be prevented, so that the variation in light emission between the LED chips 21 is reduced and stable light emission is possible. In addition, the life of the LED chip 21 is also extended. Further, since deterioration of peripheral members such as the substrate film 31 due to heat can be prevented, the product life of the LED lighting sheet 20 can be extended. Examples of the metal forming the metal wiring portion 32 include metals such as aluminum, gold, and silver in addition to the above-mentioned copper.

The thickness of the metal wiring portion 32 may be appropriately set according to the magnitude of the withstand current required for the flexible wiring board 30 and the like. However, in order to suppress warpage due to heat shrinkage of the substrate film 31 during the soldering process by the reflow method or the like, the thickness of the metal wiring portion 32 is preferably 10 μm or more. On the other hand, the thickness of the metal wiring portion 32 is preferably 50 μm or less, whereby sufficient flexibility of the flexible wiring board 30 can be maintained, and deterioration of handleability due to weight increase is suppressed. be able to.

(Solder part)
The solder portion 36 joins the metal wiring portion 32 and the LED chip 21. The bonding by soldering can be performed by either a reflow method or a laser method.

(LED chip)
The LED chip 21 is a light emitting element that utilizes light emission at a PN junction where a P-type semiconductor and an N-type semiconductor are joined. The LED chip 21 may have a structure in which a P-type electrode and an N-type electrode are provided on the upper surface and the lower surface of the element, respectively, and has a structure in which both the P-type electrode and the N-type electrode are provided on one side of the element. You may.

In the present embodiment, the light source color of the LED chip 21 is a light bulb color or a warm white color among the light source colors defined in JIS Z 9112, and more preferably the light bulb color. The light source color can be measured by a spectroscopic irradiance meter (for example, CL-500A manufactured by Konica Minolta) in accordance with JIS Z 9112. When measuring the light source color, first, the spectroirradiance meter is calibrated. Next, the sensor of the spectral irradiance meter is aimed at the LED chip 21 to be measured. Then, by pressing the measurement button of the spectroirradiance meter, the measurement of the light source color is started.

As described above, when the light source color of the LED chip 21 is light bulb color or warm white, it is possible to accelerate the growth of plants, increase the amount of plants to grow, and shorten the number of days for growing plants. As a result, the yield of plants in the plant growing plant 90 can be improved. Further, since the light source color of the LED chip 21 is a light bulb color, the eyes of the worker working in the plant growing plant 90 are less likely to get tired, and the work efficiency can be improved. It should be noted that when the light source color of the LED chip 21 is a light bulb color or a warm white color, plants can be efficiently grown, which will be described with reference to Examples described later.

By the way, as described above, in the present embodiment, the LED lighting sheet 20 which is a so-called planar light source sheet includes an LED chip 21 whose light source color is a light bulb color or a warm white color. Here, light bulb color or warm white color is considered to have better quantum efficiency of photosynthesis than neutral white color. Therefore, when the light source color of the LED chip 21 is a light bulb color or a warm white color, the growth of the plant can be promoted as compared with the case where the light source color of the LED chip 21 is neutral white.

In this case, the color temperature of the light from the LED chip 21 is 2,600 K or more and 3,800 K or less, preferably 2,600 K or more and 3,250 K or less, and more preferably 2850 K or more and 3150 K or less. When the color temperature of the light from the LED chip 21 is 2,600 K or more and 3,800 K or less, it is possible to accelerate the growth of plants, increase the amount of plants to grow, and shorten the number of days for growing plants. As a result, the yield of plants in the plant growing plant 90 can be improved.

Further, as shown in FIG. 6, in the present embodiment, the emission spectrum S of the light from the LED chip 21 (see the solid line in FIG. 6) includes the first peak P1 having a center wavelength of 610 nm or more and 630 nm or less. It has a second peak P2 having a center wavelength of 440 nm or more and 460 nm or less, and a third peak P3 having a center wavelength of 510 nm or more and 530 nm or less. That is, the emission spectrum S has a first peak P1 existing in the red wavelength region, a second peak P2 existing in the blue wavelength region, and a third peak P3 existing in the green wavelength region. .. The emission spectrum of the light from the LED chip 21 can be measured in the same manner as the light source color by using a spectrophotometer (for example, CL-500A manufactured by Konica Minolta) used for measuring the light source color.

Further, in this case, the relative emission intensity at the center wavelength of the first peak P1 is larger than the relative emission intensity at the center wavelength of the second peak P2, and the relative emission intensity at the center wavelength of the third peak P3 is the third. It is smaller than the relative emission intensity at the center wavelength of the peak P2 of 2. That is, in the present specification, among the peaks of the emission spectrum S of the light from the LED chip 21, the peak having the highest relative emission intensity is referred to as the first peak P1, and the peak having the second highest relative emission intensity is referred to as the second peak. The peak with the third highest relative light emission intensity is referred to as the third peak P3. The light from the LED chip 21 may include four or more peaks. Since the emission spectrum S of the light from the LED chip 21 has the first peak P1, the second peak P2, and the third peak P3 as described above, the light from the LED chip 21 becomes white. At the same time, the light source color of the LED chip 21 can be a light bulb color or a warm white color.

Here, the component of light from the LED chip 21 can be derived based on the emission spectrum S described above. In this case, the light component can be derived by analysis using waveform separation software (for example, "fityk"). At this time, first, the emission spectrum S of the light is read by using the waveform separation software. Next, in the waveform separation software, each peak of the read emission spectrum S (for example, the first peak P1, the second peak P2, and the third peak P3) is selected. The Voigt function is then used to perform a fitting on the measured emission spectrum of the light. As a result, each component of light can be derived. In this case, in the waveform after fitting and the waveform of the emission spectrum, fitting may be repeated until the minimum square error in the height direction of the waveform becomes 1% or less, and each component of light may be derived.

As shown in FIG. 6, in the present embodiment, the light from the LED chip 21 has a center wavelength of 610 nm or more and 630 nm or less and a half width of 90 nm or more and 110 nm or less of the first component C1 (broken line in FIG. 6). (See), the second component C2 (see the alternate long and short dash line in FIG. 6) having a center wavelength of 440 nm or more and 460 nm or less and a half width of 10 nm or more and 20 nm or less, and a center wavelength of 510 nm or more and 530 nm or less and a half width. Has a third component C3 (see the alternate long and short dash line in FIG. 6) having a wavelength of 50 nm or more and 60 nm or less. Further, in this case, the relative emission intensity at the center wavelength of the first component C1 is larger than the relative emission intensity at the center wavelength of the second component C2, and the relative emission intensity at the center wavelength of the third component C3 is the third. It is smaller than the relative emission intensity at the center wavelength of the component C2 of 2. That is, in the present specification, among the light from the LED chip 21, the component having the highest relative emission intensity is referred to as the first component C1, and the component having the second highest relative emission intensity is referred to as the second component C2. The component having the third highest relative light emission intensity is referred to as the third component C3. The light from the LED chip 21 may contain four or more components. Since the light from the LED chip 21 has the first component C1, the second component C2, and the third component C3 as described above, the light from the LED chip 21 becomes white and the LED chip 21 becomes white. The light source color of 21 can be light bulb color or warm white.

Further, the relative emission intensity at the center wavelength of the second component C2 is 0.5 times or more and 0.7 times or less the relative emission intensity at the center wavelength of the first component C1, and the center wavelength of the third component C3. The relative emission intensity in the above is 0.3 times or more and 0.5 times or less the relative emission intensity at the center wavelength of the first component C1. As a result, the light source color of the LED chip 21 can be light bulb color or warm white. In this way, the light source color of the LED chip 21 can be a light bulb color or warm white, which is considered to have better photosynthetic quantum efficiency, as compared with neutral white, so that the growth of plants can be promoted. ..

Further, as shown in FIG. 7, in the present embodiment, the chromaticity of the light from the LED chip 21 is (0.39, 0.36), (0.41, 0.44) in the xy chromaticity diagram. ), (0.46, 0.44), and (0.42, 0.36) are in a rectangular area (shaded portion in FIG. 7) connecting the four chromaticity coordinates. In this case, the light from the LED chip 21 becomes white, and as shown in FIG. 7, the color temperature of the light from the LED chip 21 is about 2,900 K or more and about 3,600 K or less. As a result, it is possible to accelerate the growth of plants, increase the amount of plant growth, and shorten the number of growing days. Therefore, the yield of plants in the plant growing plant 90 can be improved. The chromaticity of the light from the LED chip 21 can be measured in the same manner as the light source color by using a spectral irradiance meter (for example, CL-500A manufactured by Konica Minolta) used for measuring the light source color.

Further, it is preferable to select an LED chip 21 having high luminous efficiency. Specifically, it is preferable to use an LED chip 21 having a luminous efficiency of 150 lm / W or more, and it is more preferable to use an LED chip 21 having a luminous efficiency of 180 lm / W or more. By increasing the luminous efficiency of the LED chip 21 to 150 lm / W or more, the number of mounted LED chips 21 (density) can be reduced, the heat generated by Joule heat from the LED chip 21 can be reduced, and the heat from the LED chip 21 can be reduced. It is possible to suppress the decrease in yield by making it difficult for variations in plant growth to occur.

As described above, the LED lighting sheet 20 directly mounts the LED chip 21 on the metal wiring portion 32 capable of exhibiting high heat dissipation. As a result, even when the LED chips 21 are arranged at high density, the excess heat generated when the LED chips 21 are lit is quickly diffused through the metal wiring portion 32, and the outside of the LED lighting sheet 20 is quickly diffused through the substrate film 31. Sufficient heat can be dissipated to the LED chip 21, and variations in plant growth due to heat from the LED chip 21 are less likely to occur, and a decrease in yield can be suppressed.

(Light reflective insulating protective film)
As shown in FIG. 5, the light-reflecting insulating protective film 34 is a layer formed in a region excluding the region where the LED chip 21 is provided and the peripheral region thereof. The light-reflecting insulating protective film 34 is a so-called resist layer that improves the migration resistance of the flexible wiring board 30 by having sufficient insulating properties, and has the emission brightness of the light environment created by the LED lighting sheet 20. It is a light-reflecting layer having light reflectivity that contributes to improvement.

The light-reflecting insulating protective film 34 can be formed of various resin compositions using a urethane resin or the like as a base resin and further containing a white pigment made of an inorganic filler such as titanium oxide. As the base resin of the resin composition used for forming the light-reflecting insulating protective film 34, an acrylic polyurethane resin, a polyester resin, a phenol resin, or the like can be appropriately used in addition to the urethane resin. As the base resin of the resin composition that forms the light-reflecting insulating protective film 34, it is more preferable to use a resin that is the same as or similar to the resin composition that forms the transparent protective film 35 as the base resin. As for the transparent protective film 35, it is preferable to use an acrylic polyurethane resin as the main material resin, as will be described later. From this, when the base resin of the resin composition forming the transparent protective film 35 is an acrylic polyurethane resin, the base resin of the resin composition for forming the light-reflecting insulating protective film 34 is a urethane resin or It is more preferable to use an acrylic polyurethane resin.

Examples of the inorganic filler to be contained as a white pigment in the resin composition forming the light-reflecting insulating protective film 34 include titanium oxide, alumina, barium sulfate, magnesia, aluminum nitride, boron titanate, barium titanate, and kaolin. At least one selected from talc, calcium carbonate, zinc oxide, silica, mica powder, powdered glass, powdered nickel and powdered aluminum can be used.

The thickness of the light-reflecting insulating protective film 34 is 5 μm or more and 50 μm or less, more preferably 7 μm or more and 20 μm or less. If the thickness of the light-reflecting insulating protective film 34 is less than 5 μm, the light-reflective insulating protective film becomes thin, especially at the edge portion of the metal wiring portion 32, and the metal wiring cannot be covered and is exposed. The risk of not being able to maintain insulation increases. On the other hand, the thickness of the light-reflecting insulating protective film 34 is preferably 50 μm or less from the viewpoint of retaining the light-reflective insulating protective film 34 from the bending of the substrate during handling and transportation.

Further, the light-reflecting insulating protective film 34 has a light reflectance of 65% or more, more preferably 70% or more, and more preferably 80% or more at a wavelength of 400 nm or more and 780 nm or less. More preferred. For example, the LED lighting sheet 20 contains 20 parts by mass or more of titanium oxide with respect to 100 parts by mass of the base resin of urethane-based or acrylic-based polyurethane, so that the thickness of the light-reflecting insulating protective film 34 is 8 μm. In some cases, the light reflectance of the same layer can be 75% or more.

(Transparent protective film)
The transparent protective film 35 is formed on the outermost surface of the LED lighting sheet 20 so as to cover the LED chip 21. The transparent protective film 35 has both waterproofness and transparency. Due to the waterproof property of the transparent protective film 35, it is possible to prevent water from entering the inside of the device when the LED lighting sheet 20 is used as a light source for growing plants. When a LED chip 21 having a high luminous efficiency such as having a luminous efficiency of 150 lm / W or more is selected, the influence of damage to a specific LED chip 21 in the LED lighting sheet 20 becomes large. Therefore, it is important from the viewpoint of risk management to make the LED chip 21 as hard to be damaged as possible.

The transparent protective film 35 can be formed of various resin compositions using an acrylic polyurethane resin or the like as a base resin. As the base resin of the resin composition used for forming the transparent protective film 35, urethane-based resin, polyester-based resin, phenol-based tree and the like can be appropriately used in addition to acrylic polyurethane resin. As the base resin of the resin composition that forms the transparent protective film 35, it is more preferable to use a resin that is the same as or similar to the resin composition that forms the light-reflecting insulating protective film 34 as the base resin. As a preferable specific combination, a combination in which the base resin of the resin composition forming the light-reflecting insulating protective film 34 is a urethane resin and the resin forming the transparent protective film 35 is an acrylic polyurethane resin can be mentioned. it can.

The thickness of the transparent protective film 35 is 10 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. By setting the thickness of the transparent protective film 35 within the above range, it is possible to maintain the good flexibility, thinness, and lightness of the LED lighting sheet 20 and the good optical properties required for plant growing applications. In addition, the LED lighting sheet 20 can be provided with sufficient waterproofness required for plant growing applications.

The water resistance of the LED lighting sheet 20 due to the transparent protective film 35 is such that deterioration of the LED chip 21 can be suppressed when water for growing plants is sprayed on the LED lighting sheet 20. There is no particular limitation. As such water resistance, it is preferable to indicate IPX4 or higher in the waterproof / dustproof protection standard defined by the IEC (International Electrotechnical Commission). The waterproof property of IPX4 or higher is such that the LED chip 21 is not adversely affected by water droplets from all directions. Specifically, when watering from the watering nozzle at a watering amount of 10 L / min for 5 minutes over the entire range of ± 180 ° with respect to the normal direction of the LED lighting sheet 20, a harmful effect is exerted on the LED chip 21. It is said that it will not be done.

(Manufacturing method of LED lighting sheet)
Next, a method of manufacturing the LED lighting sheet 20 according to the present embodiment will be described with reference to FIGS. 8 (a)-(h).

First, the substrate film 31 is prepared (FIG. 8A). Next, a metal foil 32A such as a copper foil, which is a material for the metal wiring portion 32, is laminated on the surface of the substrate film 31 (FIG. 8 (b)). In the metal foil 32A, the metal foil 32A is adhered to the surface of the substrate film 31 by an adhesive layer 33 such as a urethane-based adhesive. Alternatively, the metal foil 32A may be directly formed on the surface of the substrate film 31 by an electrolytic plating method or a vapor phase film forming method (sputtering, ion plating, electron beam vapor deposition, vacuum vapor deposition, chemical vapor deposition, etc.). Alternatively, the substrate film 31 may be formed by directly welding the metal foil 32A.

Next, an etching mask 37 patterned in a shape required for the metal wiring portion 32 is formed on the surface of the metal foil 32A (FIG. 8 (c)). The etching mask 37 is provided so that the portion corresponding to the wiring pattern of the metal foil 32A, which is the metal wiring portion 32, is not corroded by the etching solution. The method for forming the etching mask 37 is not particularly limited, and for example, a photoresist or a dry film may be formed by subjecting it to light through a photomask and then developing it, and the metal foil 32A may be formed by a printing technique such as an inkjet printer. An etching mask may be formed on the surface.

Next, the metal foil 32A located at a portion not covered by the etching mask 37 is removed by an immersion liquid (FIG. 8 (d)). As a result, the portion of the metal foil 32A other than the portion that becomes the metal wiring portion 32 is removed.

The etching mask 37 is then removed using an alkaline stripper. As a result, the etching mask 37 is removed from the surface of the metal wiring portion 32 (FIG. 8 (e)).

Subsequently, the light-reflecting insulating protective film 34 is laminated and formed on the metal wiring portion 32 (FIG. 8 (f)). The formation of the light-reflecting insulating protective film 34 is not particularly limited as long as it is a coating means capable of uniformly coating the material resin composition constituting the light-reflective insulating protective film 34, and for example, screen printing, offset printing, etc. Methods such as dip coater and brush coating can be used. Alternatively, the light-reflecting insulating protective film 34 may be formed by applying a photosensitive insulating protective film material on the entire surface, exposing only necessary portions through a photomask, and then developing the film.

Next, the LED chip 21, the regulator 45, and the connectors 44A and 44B are mounted on the metal wiring portion 32 (FIG. 8 (g)). In addition, in FIG. 8 (g) and FIG. 8 (h) described later, the illustration of the regulator 45 and the like is omitted in order to clarify the drawings. In this case, the LED chip 21 is joined to the metal wiring portion 32 by soldering via the solder portion 36. The bonding by soldering can be performed by a reflow method, a laser method, or a bonding using a conductive resin.

Next, a transparent protective film 35 is formed so as to cover the light-reflecting insulating protective film 34, the LED chip 21, the regulator 45, and the connectors 44A and 44B (FIG. 8 (h)). The transparent protective film 35 is preferably formed by spraying a transparent resin composition by a spray treatment (hereinafter referred to as "spray coating method") or by a curtain coating method. To form the transparent protective film 35 by the spray coating method, for example, a coating liquid for spray coating treatment containing an acrylic polyurethane resin is sprayed onto a desired region on the flexible wiring substrate 30 by a spray coating machine to form the coating film. It can be done by forming. To form the transparent protective film 35 by the curtain coating method, for example, a coating liquid for curtain coating treatment containing an acrylic polyurethane resin is dropped onto a desired region on the flexible wiring substrate 30 by a curtain coating machine to form the coating film. It can be done by forming.

The LED lighting sheet 20 according to the present embodiment is not limited to the method described above, and is known for manufacturing a conventionally known flexible wiring board for an LED chip and various LED modules in which the LED chip is mounted therein. It can also be manufactured by the method.

(Plant growing factory and plant growing shelf)
FIG. 9 is a diagram schematically showing the configuration of a plant growing plant 90 using the LED lighting sheet 20 according to the present embodiment. The plant growing plant 90 includes a building 91 and a plurality of plant growing shelves 80 arranged inside the building 91.

As shown in FIG. 10, the plant growing shelf 80 has a plurality of (4) columns 82, and a plurality of substrates 81 arranged along the columns 82 at intervals in the vertical direction. .. A medium region for cultivating plant PL is provided on the upper surface of each substrate 81 except for the uppermost substrate 81. The lower surface of each substrate 81 except the lowermost substrate 81 constitutes a ceiling surface with respect to the substrate 81 located below the substrate 81, and the LED lighting sheets 20 are arranged in parallel. In this case, the control unit 40 is arranged at a position sufficiently distant from the LED lighting sheet 20. Therefore, there is little possibility that the growth of the plant PL located near the control unit 40 and the plant PL located far from the control unit 40 will vary due to the heat from the control unit 40. Further, the substrate 81 and the LED lighting sheet 20 attached to the lower surface side of the substrate 81 constitute a shelf board 83 for growing plants. Alternatively, the substrate 81 and the LED lighting module 10 attached to the lower surface side of the substrate 81 constitute a shelf board 83 for growing plants. In the present embodiment, a plant growing plant 90 (FIG. 9) including a shelf board 83 (FIG. 10) for such a plant growing shelf, a plant growing shelf 80 (FIG. 10), and a plant growing shelf 80 (FIG. 9). Also provide.

Since the LED lighting sheet 20 according to the present embodiment has flexibility and light weight, the LED lighting sheet 20 can be easily attached to the lower surface of each substrate 81 as compared with the conventional straight tube type lighting device or the like. Can be done. Further, since the LED lighting sheet 20 has flexibility, the LED lighting sheet 20 can be attached to a ceiling surface having various sizes and shapes. As a result, the LED lighting sheet 20 according to the present embodiment can be applied to various plant growing shelves 80 and plant growing factories 90.

Further, the LED lighting sheet 20 is thinner than the conventional straight tube type lighting device. As a result, the distance between the substrates 81 in the vertical direction can be narrowed, and the number of substrates 81 included in the growing shelf 80 of each plant can be increased. As a result, the yield of plant PL per unit area can be increased.

As shown in FIGS. 11A to 11B, the LED lighting sheet 20 may be arranged not only on the lower surface of the substrate 81 but also on the side surface side of the substrate 81. The LED lighting sheet 20 on the side surface side hangs down from the substrate 81 located above toward the substrate 81 located below the substrate 81. In this case, as shown in FIG. 11A, the LED lighting sheet 20 may reach the substrate 81 located below. Alternatively, as shown in FIG. 11B, the LED lighting sheet 20 may cover only the upper side of the space located between the upper and lower substrates 81 without reaching the substrate 81 located below. By further arranging the LED lighting sheet 20 on the side surface side of the substrate 81 in this way, the amount of light at the peripheral edge of the substrate 81 where the illuminance tends to be weak is supplemented, and the brightness of the LED lighting sheet 20 is made uniform in the plane. be able to. As a result, the growth of the plant can be made uniform in the plane, and the yield of the plant to be grown can be improved.

As described above, according to the present embodiment, the light source color of the LED chip 21 is a light bulb color or a warm white color among the light source colors defined in JIS Z 9112. As a result, it is possible to accelerate the growth of plants, increase the amount of plant growth, and shorten the number of growing days. That is, since the light source color of the LED chip 21 is a light bulb color or warm white, which is considered to have better photosynthetic quantum efficiency than neutral white, it is possible to promote the growth of plants. As a result, the yield of plants in the plant growing plant 90 can be improved.

Further, according to the present embodiment, the light source color of the LED chip 21 is the light bulb color among the light source colors defined in JIS Z 9112. As a result, the eyes of the workers working in the plant growing plant 90 are less likely to get tired, and the work efficiency can be improved.

Further, according to the present embodiment, the emission spectrum S of the light from the LED chip 21 has a first peak P1 having a center wavelength of 610 nm or more and 630 nm or less, and a second peak P1 having a center wavelength of 440 nm or more and 460 nm or less. It has a peak P2 and a third peak P3 having a center wavelength of 510 nm or more and 530 nm or less. Further, the relative emission intensity at the center wavelength of the first peak P1 is larger than the relative emission intensity at the center wavelength of the second peak P2, and the relative emission intensity at the center wavelength of the third peak P3 is the second peak. It is smaller than the relative emission intensity at the center wavelength of P2. As a result, the light from the LED chip 21 becomes white, and the light source color of the LED chip 21 can be changed to a light bulb color or a warm white color. Therefore, the above-mentioned effect can be obtained.

Further, according to the present embodiment, the light from the LED chip 21 has a center wavelength of 610 nm or more and 630 nm or less and a first component C1 having a half width of 90 nm or more and 110 nm or less and a center wavelength of 440 nm or more and 460 nm. It has a second component C2 having a half-value width of 10 nm or more and 20 nm or less, and a third component C3 having a center wavelength of 510 nm or more and 530 nm or less and a half-value width of 50 nm or more and 60 nm or less. .. Further, the relative emission intensity at the center wavelength of the first component C1 is larger than the relative emission intensity at the center wavelength of the second component C2, and the relative emission intensity at the center wavelength of the third component C3 is the second component. It is smaller than the relative emission intensity at the center wavelength of C2. As a result, the light from the LED chip 21 becomes white, and the light source color of the LED chip 21 can be changed to a light bulb color or a warm white color. Therefore, the above-mentioned effect can be obtained.

Further, according to the present embodiment, the relative emission intensity at the center wavelength of the second component C2 is 0.5 times or more and 0.7 times or less the relative emission intensity at the center wavelength of the first component C1. The relative emission intensity at the center wavelength of the third component C3 is 0.3 times or more and 0.5 times or less the relative emission intensity at the center wavelength of the first component C1. As a result, the light source color of the LED chip 21 can be light bulb color or warm white. In this way, the light source color of the LED chip 21 can be a light bulb color or warm white, which is considered to have better photosynthetic quantum efficiency, as compared with neutral white, so that the growth of plants can be promoted. ..

Further, according to the present embodiment, the chromaticity of the light from the LED chip 21 is (0.39, 0.36), (0.41, 0.44), (0. It is in the area of the quadrangle connecting the four chromaticity coordinates of 46, 0.44) and (0.42, 0.36). In this case, the light from the LED chip 21 becomes white, and the color temperature of the light from the LED chip 21 becomes about 2,900 K or more and about 3,600 K or less. As a result, it is possible to accelerate the growth of plants, increase the amount of plant growth, and shorten the number of growing days. Therefore, the yield of plants in the plant growing plant 90 can be improved.

Further, according to the present embodiment, 10 or more LED chips 21 are arranged in series, and 4 or more rows of the LED chips 21 are arranged in parallel. As a result, the LED chips 21 can be uniformly arranged in the plane, and the arrangement of the LED chips 21 can be arranged in parallel to disperse the risk when the LED chips 21 are damaged.

Further, according to the present embodiment, since the LED chip 21 is covered with the transparent protective film 35, the LED chip 21 can be protected from the moisture scattered during the growth of the plant.

Further, according to the present embodiment, since the thickness of the thickest portion of the LED lighting sheet 20 is 5 mm or less, the distance between the upper and lower substrates 81 of the plant growing shelf 80 is reduced, and the number of substrates 81 is increased. , The yield of plants per unit area can be increased.

Further, according to the present embodiment, since the control unit 40 is externally connected to the LED lighting sheet 20, the control unit 40 is separated from the LED lighting sheet 20 and the plant is affected by the heat from the control unit 40. Can be prevented from reaching.

Further, according to the present embodiment, since a constant voltage is applied from the control unit 40 to the LED lighting sheet 20, the integrated light amount per unit time from the LED chip 21 can be increased and the growth of plants can be promoted.

Further, according to the present embodiment, since the control unit 40 can control the dimming of the LED chip 21, the intensity of the light from the LED chip 21 can be adjusted according to the growth stage of the plant. it can.

In the above-described embodiment, the case where the LED lighting device is a planar light source sheet has been described, but the present invention is not limited to this. For example, although not shown, the LED lighting device may be a straight tube type lighting device.

[Example]
Next, a specific example in the present embodiment will be described.

(Creation of LED lighting sheet)
The LED lighting sheets of Examples 1 and 2 and Comparative Example were produced as follows.

(Example 1)
A copper foil (thickness 35 μm) for forming a metal wiring portion is laminated on one surface of a film substrate (polyethylene naphthalate, thickness 50 μm) having a size of 560 mm × 390 mm, and then a copper foil for metal wiring is provided. Etching treatment was performed to form metal wiring portions having the same pattern in all the examples and comparative examples. Then, on the substrate film and the metal wiring part, a urethane resin is used as the base resin, and titanium oxide is added to the base resin at a ratio of 20% by mass, and screen printing is performed using an insulating ink having a thickness of 10 μm. A light-reflecting insulating protective film was formed. Next, in the metal wiring section, a plurality of LED chips ("NFSW757G-V2" (manufactured by Nichia Corporation)) are placed in 10 rows of 14 rows at a pitch of 40 mm in the X direction and a pitch of 35 mm in the Y direction. It was mounted by soldering. The LED chip is a top light emitting type light emitting element, and has an outer shape of a rectangular parallelepiped having a size of 3.0 mm (length) × 3.0 mm (width) × 0.65 mm (height). Further, the light source color of this LED chip is a light bulb color, and each color temperature is 3000K. Further, the above-mentioned insulating protective film and the transparent protective film for covering the LED chip were formed by a spray coating method. The LED lighting sheet produced as described above was used as the LED lighting sheet of Example 1.

(Example 2)
As the LED chip, an LED manufactured in the same manner as in Example 1 except that the light source color is warm white and the color temperature is 3500K (“NFSW757G-V2” (manufactured by Nichia Corporation)) is used. The lighting sheet was the LED lighting sheet of Example 2.

(Comparison example)
As the LED chip, an LED manufactured in the same manner as in Example 1 except that a light source color of neutral white and a color temperature of 5000 K (“NFSW757G-V2” (manufactured by Nichia Corporation)) was used. The lighting sheet was an LED lighting sheet of a comparative example.

The optical characteristics of the LED chips used in the LED lighting sheets of Examples 1 and 2 and Comparative Examples, specifically, the emission spectrum of light were measured. The emission spectrum of light was measured by a spectroscopic irradiance meter (CL-500A, manufactured by Konica Minolta). The measured emission spectrum had a first peak, a second peak and a third peak, respectively, and the center wavelengths of the first peak, the second peak and the third peak were measured, respectively.

Further, with respect to the LED chips used for the LED lighting sheets of Examples 1 and 2 and Comparative Example, the light component was derived from the measured emission spectrum by using the waveform separation software "fityk". At this time, first, the emission spectrum of the measured light was read, and the first peak, the second peak, and the third peak were selected. The Voigt function was then used to perform fittings on the measured emission spectrum of the light. Then, in the waveform after fitting and the waveform of the emission spectrum, fitting is repeated until the error in the height direction of the waveform becomes 1% or less, and the first component, the second component, and the third component of light are removed. Derived. Then, the center wavelength and the full width at half maximum of the derived first component, second component, and third component were measured, respectively.

Subsequently, the LED lighting sheets of Examples 1 and 2 and Comparative Example were attached to the growing shelves of the plants, respectively, and the plants (baby spinach) were actually cultivated. Then, the living body weight (g / m ² ) of the grown plant was measured. This biological weight was calculated by measuring the above-ground biological weight after cultivation for each cultivation panel and calculating the weight per square meter. In addition, the daily body weight (g / m ² / day), which is the living body weight per cultivation day, was calculated. The above evaluation results are shown in Table 1.

As shown in Table 1 above, when the LED lighting sheets of Examples 1 and 2 were used, the biological weight of the plant could be increased as compared with the case of using the LED lighting sheets of the comparative example. Specifically, when the LED lighting sheet of Example 1 (the light source color of the LED chip is the light bulb color) is used, it is compared with the case where the LED lighting sheet of the comparative example (the light source color of the LED chip is neutral white) is used. As a result, the daily production weight (g / m ² / day) could be increased by 9%. Further, when the LED lighting sheet of Example 2 (the light source color of the LED chip is warm white) is used, compared with the case where the LED lighting sheet of the comparative example (the light source color of the LED chip is neutral white) is used, Nissan The raw weight (g / m ² / day) could be increased by 6%. As described above, when the LED lighting sheets of Examples 1 and 2 were used, the productivity of the plant could be improved by changing the light source color of the LED chip to a light bulb color or a warm white color.

It is also possible to appropriately combine a plurality of components disclosed in the above-described embodiments and modifications as necessary. Alternatively, some components may be removed from all the components shown in the above embodiments and modifications.

10 LED lighting module 20 LED lighting sheet 21 LED chip 22 Metal wiring part 30 Flexible wiring board 31 Board film 32 Metal wiring part 33 Adhesive layer 34 Light reflective insulation protective film 35 Transparent protective film 36 Solder part 40 Control unit 41 Power input Part 42 AC / DC converter 43 PWM control unit 44A 1st connector 44B 2nd connector 45 Regulator 46 Power supply line 80 Plant growing shelf 81 Board 82 Pillar 83 Shelf board for plant growing shelf 90 Plant growing factory 91 Building

Claims (14)

An LED lighting device for growing animals and plants in which multiple LED chips are arranged.
The light from the LED chip includes a first component having a center wavelength of 610 nm or more and 630 nm or less.
A second component having a center wavelength of 440 nm or more and 460 nm or less,
It has a third component having a central wavelength of 510 nm or more and 530 nm or less.
An LED lighting device for growing animals and plants, wherein the relative emission intensity at the center wavelength of the third component is 0.3 times or more the relative emission intensity at the center wavelength of the first component. The first component has a half width of 90 nm or more and 110 nm or less.
The second component has a half width of 10 nm or more and 20 nm or less.
The LED lighting device for growing animals and plants according to claim 1, wherein the third component has a half width of 50 nm or more and 60 nm or less. The relative emission intensity of the first component at the center wavelength is larger than the relative emission intensity of the second component at the center wavelength.
The LED lighting device for growing animals and plants according to claim 1 or 2, wherein the relative emission intensity at the center wavelength of the third component is smaller than the relative emission intensity at the center wavelength of the second component. The LED lighting device for growing animals and plants according to any one of claims 1 to 3, wherein 10 or more LED chips are arranged in series, and 4 or more rows of the LED chips are arranged in parallel. The LED lighting device for growing animals and plants according to any one of claims 1 to 4, wherein the LED chip is covered with a transparent protective film. The animal or plant according to any one of claims 1 to 5, further comprising a substrate film and a metal wiring portion formed on the surface of the substrate film, and the plurality of LED chips are mounted on the metal wiring portion. LED lighting device for training. The LED lighting device for growing animals and plants according to any one of claims 1 to 6, wherein the thickness at the thickest portion is 5 mm or less. An LED lighting module for growing animals and plants
The LED lighting device for growing animals and plants according to any one of claims 1 to 7.
It is provided with a control unit electrically connected to the LED lighting device for growing animals and plants.
The control unit is an LED lighting module for growing animals and plants that is externally connected to the LED lighting device for growing animals and plants. The LED lighting module for growing animals and plants according to claim 8, wherein a constant voltage is applied from the control unit to the LED lighting device for growing animals and plants. The LED lighting module for growing animals and plants according to claim 8 or 9, wherein the control unit can control the dimming of the LED chip. It is a shelf board for growing animals and plants,
With the board
The LED lighting device for growing animals and plants according to any one of claims 1 to 7 or the LED lighting module for growing animals and plants according to any one of claims 8 to 10 is provided on the substrate. , Shelf board for growing plants and animals. It is a breeding shelf for animals and plants.
Equipped with shelves
The LED lighting device for growing animals and plants according to any one of claims 1 to 7 or the LED lighting device for growing animals and plants according to any one of claims 8 to 10 attached to the lower surface side of the substrate. An animal and plant growing shelf equipped with an LED lighting module. The animal and plant growing shelf according to claim 12, wherein the LED lighting device for growing animals and plants is further arranged on the side surface side of the shelf board. Building and
An animal and plant growing factory provided with the animal and plant growing shelves according to claim 12 or 13, which is arranged inside the building.

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