JP2016006832A - Optical element, light-emitting element package, and method for manufacturing light-emitting element package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-performance light-emitting element package that achieves reduction in size, an optical element used for the package, and a method for manufacturing a light-emitting element package.SOLUTION: The optical element is formed by using a thermoplastic perfluoro resin and has a lens shape on one surface and a concave shape on the other surface making a pair with the lens shape. In the concave shape, an opening area decreases from a surface opening to the inside of the concave. The light-emitting element package of the present invention comprises a substrate, a light-emitting element joined to the substrate, an encapsulation layer encapsulating the light-emitting element joined to the substrate, and an optical element stacked on the encapsulation layer and having a lens shape on one surface. The encapsulation layer and the optical element are formed by using a thermoplastic perfluoro resin; and at least in a region where the lens shape is formed, the other surface of the optical element is tightly adhered to the encapsulation layer.

Description

  The present invention relates to an optical element that exhibits a lens effect such that at least part of incident light is refracted or diffracted and emitted, a light emitting element package including the optical element, and a method for manufacturing the light emitting element package.

  UV light sources are used in various fields such as decomposition of chemical substances, inspection / measurement, treatment, resin curing / adhesion, and printing. In recent years, the use of sterilization using ultraviolet rays (200 nm to 400 nm), particularly ultraviolet rays having a wavelength band of less than 280 nm (UV-C) is also considered.

  In recent years, sterilization by ultraviolet rays has been used in water treatment facilities and the like as a safe and efficient method because it does not require chlorine. For example, since DNA in bacterial cells has an absorption band at a wavelength of 250 nm to 280 nm, the bacteria can be efficiently killed by irradiating with ultraviolet rays having wavelengths in the vicinity thereof.

  Conventionally, most of UV light sources used for sterilizing UV light sources and industrial resin curing and UV ink printers are mercury lamps. While a mercury lamp can provide a large light output, it requires a standby time when it is lit, so it cannot be turned on and off frequently, and it must be lit at all times. In addition, since the light source device is large, there is a problem that it is difficult to apply to small devices such as home appliances. In order to overcome these problems, in recent years, ultraviolet LEDs (Light Emitting Diodes) have been developed and partially put into practical use.

  Particularly recently, an LED having a wavelength in the UV-C band has been developed and expected to be applied to sterilization. However, an LED having a wavelength in the UV-C band cannot be said to have sufficient light output, durability, and life compared with a mercury lamp, and further development is expected. In addition, the LED often cannot satisfy a desired specification due to absorption deterioration with respect to ultraviolet rays having a short wavelength when a conventionally used material is used as a peripheral member such as a lens or a sealing window material. For example, expensive materials must be used, which increases the price and hinders popularization.

  By the way, in some light source devices or light emitting element packages, a lens is formed so as to cover the light emitting elements in order to change the light distribution of the light emitted from the light emitting elements or to improve the extraction efficiency. is there.

  For example, Patent Document 1 describes a light-emitting diode lens formed using a silicone resin, a silicone rubber, and / or a fluororesin because of its excellent ultraviolet resistance.

  Further, as a technique related to the present invention, for example, Patent Document 2 and Patent Document 3 show examples of a cover lens arranged to cover individual LED chips and an array thereof.

JP 2006-237191 A JP 2012-042670 A International Publication No. 2010/016199 Pamphlet

  In a white LED or the like used for general illumination, an epoxy resin or a silicone resin is used as a sealing material covering a light emitting element and a lens material laminated thereon. Since these resins are thermosetting, they can be formed relatively easily in the shape of a lens that also serves as a sealing material, for example, by potting by appropriately adjusting the viscosity and process conditions of the monomer material. However, many of these (resin) material systems absorb ultraviolet rays, and in particular, in the deep ultraviolet region having a short wavelength, the material is significantly deteriorated and cannot be used. Therefore, although quartz glass and borosilicate glass can generally be used as materials having excellent ultraviolet transmittance, these are difficult to mold compared to resins, and are materials for lenses that also serve as sealing materials that cover light-emitting elements. It is often difficult to use.

  In addition, some resin materials do not absorb ultraviolet rays, and a fluororesin is an example of a resin excellent in ultraviolet transmittance. For example, Cytop (Asahi Glass (registered trademark)) is known as a material that does not absorb ultraviolet rays including the UV-C region because of the characteristics of amorphous perfluorinated resin. The resin that cures with energy such as heat and ultraviolet rays as described above absorbs ultraviolet rays because the functional group contributing to curing absorbs ultraviolet rays, and deteriorates due to irradiation. On the other hand, CYTOP (registered trademark) is a thermoplastic resin, and has a characteristic of being excellent in transparency and resistance because there is no site for absorbing ultraviolet rays.

  However, when molding a thermoplastic resin, it is necessary to melt the material at a fairly high temperature before molding, and since the melt has a relatively high viscosity, the sealing material that melts directly on the light emitting element and covers the light emitting element It is very difficult to accurately form the shape of a lens that also serves as a lens.

  In addition, as a lens, the form which controls the light distribution of light by arrange | positioning a shaping | molding lens in the position away from the light emitting element, for example, the upper part of a package, etc. can exist. In this case, it is necessary to enlarge the lens according to the distance from the light emitting element to the lens, which may increase the material cost in addition to increasing the package size. In addition, unlike a lens formed so as to cover the light emitting element, it is difficult to capture the ultraviolet light emitted in the lateral direction of the light emitting element or at an angle close to the horizontal (based on the mounting surface of the light emitting element). Therefore, there is a problem inferior in terms of luminous efficiency.

  Therefore, the present invention is a light emitting device package including a light emitting device and an optical device that exhibits a lens effect, and a high performance light emitting device package that can be miniaturized, an optical device used therefor, and a light emitting device package The purpose is to provide a manufacturing method.

  The optical element according to the present invention is formed using a thermoplastic perfluoro resin, has a lens shape on one surface, and has a concave shape that is paired with the lens shape on the other surface. The opening area decreases as it goes inward from the opening.

  The optical element may have a plurality of pairs of lens shape and concave shape, and the optical axis of the lens shape may coincide with the center of the concave shape in each pair of the lens shape and the concave shape. Here, if the center of the concave shape is located on the optical axis of the lens shape, or if the center of the concave shape is at a distance within a predetermined error range from the optical axis of the lens shape, the two coincide with each other You can consider it. The same applies to the coincidence between axes and points other than those described above.

  Moreover, the center of the virtual spherical surface which approximated the lens shape to the spherical surface may be positioned in the corresponding concave concave portion.

  The optical element may have a thickness of 1.0 mm or less at the lens-shaped optical axis.

  The light emitting device package according to the present invention includes a substrate, a light emitting device bonded to the substrate, a sealing layer for sealing the light emitting device bonded to the substrate, and a laminate on the sealing layer. An optical element having a lens shape, and the sealing layer and the optical element are formed using a thermoplastic perfluoro resin, and at least in the region where the lens shape is formed, the other surface of the optical element And the sealing layer are in close contact with each other.

  In the light emitting element package, the lens shape of the optical element is paired with the light emitting element, and the radius of curvature of the virtual spherical surface that approximates the curved surface of the lens shape of the optical element is 2 of the side length of the corresponding light emitting element. It may be 5 times or less.

  In the light emitting element package, the optical element may be any of those described above.

  In the light emitting element package, the composition of the perfluoro resin that is the material of the optical element may be different from the composition of the perfluoro resin that is the material of the sealing layer. For example, the glass transition temperature of the perfluoro resin which is the material of the optical element may be a combination of materials which is higher than the glass transition temperature of the perfluoro resin which is the material of the sealing layer.

  In the light emitting device package, the perfluoro resin which is a material of the sealing layer may contain allyl vinyl ether.

  In the light emitting device package, the center wavelength of the light emitting device may be 380 nm or less.

  A method of manufacturing a light emitting device package according to the present invention is a method of manufacturing a light emitting device package including a light emitting device bonded to a substrate and an optical device that exhibits a lens effect. After a solution containing a perfluoro resin is dropped, a solvent is diffused to form a sealing layer forming a sealing layer for sealing the light emitting element, and one surface is formed of a thermoplastic perfluoro resin. Of the optical element having a lens shape that forms a pair with the light emitting element, and a concave shape that forms a pair with the lens shape on the other surface, and the opening area decreases toward the inside from the surface opening. An alignment process for aligning the lens-shaped optical axis and the center of the corresponding light-emitting element, and an optical element is laminated on the sealing layer, and the sealing layer and the optical element are adhered to each other Adhesion process Characterized in that it comprises a.

In the method for manufacturing a light emitting device package according to the present invention, in the adhesion step, the temperature of the sealing layer in a state where the surface on which the concave shape of the optical element is formed is in contact with the surface of the sealing layer. The temperature of the optical element is equal to or lower than the temperature of the sealing layer so that the viscosity of the perfluororesin is less than 1 × 10 ⁴ Pa · s or higher than the glass transition temperature of the material perfluororesin. There may be included a step of heating to a temperature not higher than 30 ° C. higher than the glass transition temperature of the perfluoro resin as the material of the optical element.

  In the method for manufacturing a light emitting device package according to the present invention, a solution containing a thermoplastic perfluoro resin is dropped from above the sealing layer after the sealing layer forming step and before the step of laminating the optical elements. Including the steps, and in the adhesion step, the temperature of the optical element is 50 ° C. or higher and the glass transition temperature of the perfluoro resin that is the material of the optical element, and the temperature of the sealing layer is the temperature of the optical element. A heating step of heating so as to be higher than that may be included.

  According to the present invention, it is possible to provide a high-performance light-emitting element package that can be miniaturized, an optical element used therefor, and a method for manufacturing the light-emitting element package.

1 is a configuration diagram illustrating an example of a light emitting element package 10. It is explanatory drawing which shows the example of the concave shape 142 of the lens. It is explanatory drawing which compares and shows the light emitting element package 10 and the conventional light emitting element package 90. FIG. FIG. 11 is an explanatory diagram showing an example of a method for manufacturing the light emitting element package 10. FIG. 10 is an explanatory view showing another example of the method for manufacturing the light emitting element package 10. FIG. 11 is an explanatory diagram showing an example of a light emitting element package 20. FIG. 10 is an explanatory diagram showing another example of the lens array 24 in the light emitting element package 20. FIG. 10 is an explanatory diagram showing another example of the lens array 24 in the light emitting element package 20. It is explanatory drawing which shows the example of the position alignment process in 2nd Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram illustrating an example of a light emitting device package of the present embodiment. FIG. 1A is a schematic cross-sectional view showing the main part of the light emitting device package 10 of the present embodiment. FIG. 1B is a cross-sectional view of the main part of the light emitting element package 10 before the lens 14 is laminated. FIG. 1C is a top view of the light emitting element package 10. 1A is a cross-sectional view taken along the line A-A ′ in FIG.

  As shown in FIGS. 1A to 1C, a light emitting device package 10 includes a substrate 11, a light emitting device 12 bonded to the substrate 11, and a sealing layer formed so as to cover the light emitting device 12. 13 and a lens 14 laminated on the sealing layer 13.

  The light emitting element 12 is an LED element that emits light having a wavelength of 380 nm or less. The light emitting elements 12 are electrically connected via a wiring pattern (not shown) formed on the substrate 11.

  The sealing layer 13 is a layer that seals the light emitting element 12 in a state where the light emitting element 12 is bonded to the substrate 11. The sealing layer 13 is formed so as to cover at least a portion of the surface of the light emitting element 12 that is in contact with the outside world. In the case of the light-emitting element 12 that is flip-chip connected, the sealing layer 13 is formed so as to fill not only the top and side surfaces of the light-emitting element 12 but also the gap between the substrate 11 and the light-emitting element 12. Is more preferable.

  The lens 14 is an optical element that exhibits a lens effect such as refracting or diffracting at least part of the light emitted from the light emitting element 12. As shown in FIG. 1B, the lens 14 has a lens shape 141 on one surface and a concave shape 142 on the other surface. Further, the lens 14 may have an edge portion 143 around the lens shape 141. Hereinafter, the recessed portion formed by the recessed shape 142 may be referred to as a recessed portion 144.

  The lens shape 141 of the lens 14 is not particularly limited as long as it is, for example, a spherical surface, an aspherical surface, a diffractive surface, or the like and exhibits a lens effect. The lens shape 141 generally corresponds to a portion of the surface of the lens 14 on the light emitting side excluding the edge portion 145 described later. More specifically, it may be said that the portion of the surface exhibits a predetermined light extraction effect.

  The lens shape 141 and the concave shape 142 are formed in a pair with the light emitting element 12. The concave shape 142 is also paired with the lens shape 141. Further, from the viewpoint of reducing the amount of material used for the lens 14, the lens shape 141 has a curvature radius of a virtual spherical surface obtained by approximating the lens shape 141 to a curved surface, which is 2 of the side length of the corresponding light emitting element 12. 5 times or less, or 1.0 mm or less in thickness at the optical axis is preferable. Note that when the shape of the corresponding light-emitting element 12 is not square, the radius of curvature may be 2.5 times or less the length of the long side of the light-emitting element 12. However, from the viewpoint of light extraction efficiency, the radius of curvature is more preferably 2.0 times or more the length of the side (long side) of the corresponding light emitting element 12.

  In addition, it is preferable that the optical axis of the lens shape 141 and the center of the concave shape 142 coincide with each other, so that the optical axis of the lens shape 141 coincides with the center of the corresponding light emitting element 12. Note that the above “matching” includes substantially matching within a range of manufacturing errors such as a mounting position error of the light emitting element 12 with respect to the substrate 11 and a positional shift of the lens 14 with respect to the light emitting element 12. This is preferable because the center axis of the light emitting element 12 and the center of curvature of the lens 14 are likely to overlap, so that the light extraction efficiency can be improved and a uniform light distribution state without deviation can be obtained. Here, the central axis of the light emitting element 12 is an axis that passes through the center (center of gravity) of the light emitting element and extends in a direction perpendicular to the surface of the substrate 11.

  The lens shape 141 is such that the center of curvature of the lens, which is the center of a virtual spherical surface obtained by approximating the lens shape 141 to the spherical surface, is located in the concave portion 144 formed by the corresponding concave shape 142, or the lens shape 141 is a spherical surface. It is preferable that the center of curvature of the minute curved surface at an arbitrary place that can be approximated is located in the recess 144. In the present embodiment, as shown in FIG. 1A, the light emitting element 12 is located in the concave portion 144 of the lens 14. Therefore, it is preferable to form the lens shape 141 and the concave shape 142 of the lens 14 so that the center of curvature of the lens is in the concave portion 144 because the center axis of the light emitting element 12 and the center of curvature of the lens 14 are likely to coincide with each other.

  Furthermore, it is more preferable that the center of curvature of the lens is on a line connecting the center of the surface opening 1441 and the center of the bottom surface 1442 in the corresponding recess 144 in the explanatory diagram of FIG. Here, the surface opening 1441 indicates an opening formed on the flat surface along the outermost layer of the lens 14 by the concave shape 142.

  FIG. 2 is an explanatory view showing an example of the concave shape 142. As shown in FIG. 2, the concave shape 142 may be trapezoidal or upside down. Here, as shown in FIG. 2A, when the shapes of the surface opening 1441 and the bottom surface 1442 are difficult to understand, such as when the concave shape 142 is entirely inclined, the following is performed. You may define the shape of the surface opening part 1441 and the bottom face part 1442. That is, when the lens 14 is placed on a flat surface, the shape of the region defined by the tangent at the point where the absolute value of the first derivative of the gradient 142 of the concave shape 142 of the lens 14 becomes the largest on the surface is defined. The shape of the surface opening 1441 may be considered. Similarly, the shape of the region delimited by the set of tangent lines on the surface parallel to the flat surface at the lowest position of the concave shape 142 may be regarded as the shape of the bottom surface portion 1442 of the concave portion 144. Further, the center of the concave shape 142 refers to the center of the bottom surface portion 1442 of the concave portion 144.

  The concave shape 142 of the lens 14 is preferably a shape that substantially matches the convex shape that is the surface shape of the sealing layer 13 that covers the corresponding light emitting element 12, but the volume of the concave portion 144 is sealed with the light emitting element 12. It may be smaller than the sum of the volumes of the layers 13. If it does so, since it will become difficult to make a clearance gap between the sealing layer 13 and the lens 14, it becomes difficult to produce the fall of light extraction efficiency, and nonuniformity, and it is preferable. Here, the volume of the sealing layer 13 may be calculated by the product of the dropping amount of the solution dropped when forming the sealing layer 13 and the solid content concentration. The volume of the concave portion 144 corresponds to the volume of the concave portion on the inner side from the plane along the surface opening 1441. Further, the concave shape 142 of the lens 14 is such that the area of the surface opening 1441 is larger than the area of the bottom surface 1442, and the opening area that is the area of the opening of the recess 144 as it goes inward from the surface opening 1441. Specifically, a shape in which the opening area, which is the cross-sectional area of the recess 144 when cut in a plane parallel to the surface opening 1441, is small is preferable.

  The sealing layer 13 has a convex shape substantially corresponding to the shape of the light emitting element 12. In addition, the shape of the sealing layer 13 may be a convex shape having an inclined surface portion, and the peripheral portion may be a shape that is lower than the height of the light emitting element 12, but the height increases from the highest position to the outside. A surface shape that draws a curve that monotonously decreases is more preferable.

  In addition, such a sealing layer 13 is obtained, for example, by a method in which a solution containing a resin as a material of the sealing layer 13 is dropped and then the solvent is diffused. In addition, since the dripped solution swells by surface tension, the convex-shaped sealing layer 13 which covers the light emitting element 12 is easily obtained by being dissipated in that state. Depending on the viscosity of the solution to be dropped, the solution may flow and a desired convex shape cannot be obtained. In such a case, the viscosity of the solution may be adjusted, or a means for damming the solution around the light emitting element 12 (such as an enclosure or a depression) may be provided.

  Note that the gradient of the concave shape 142 is such that the optical axis of the lens shape 141 paired with the concave shape 142 and the center of the light emitting element 12 corresponding to the lens shape 141 are opposed to each other at a position opposite to the sealed shape 142. It may be gentler than the convex gradient which is the surface shape of the stop layer 13.

  FIG. 3 is an explanatory view showing a comparison between the light emitting device package 10 of the present embodiment and a conventional light emitting device package 90. 3A and 3B show an example of the light emitting device package 10 of the present embodiment, and FIG. 3C shows an example of a conventional conventional light emitting device package 90. The substrates 11 and 91 are provided with electrodes (not shown) that supply current to the light emitting elements 12 and 92.

  Since the sealing layer 13 is formed in the light emitting element package 10 so as to cover the surface of the light emitting element 12, the lens 14 can be installed in the vicinity of the light emitting element 12, and the lens 14 can be made small (FIG. 3A). (Refer FIG.3 (b)). On the other hand, the light emitting element package 90 is bonded and fixed to the upper part of the reflector 95 provided for reflecting the light emitted from the light emitting element 92 using an appropriate adhesive or the like (see FIG. 3C). ). Therefore, the distance from the light emitting element 92 to the lens 94 is longer than that of the light emitting element package 10, and thus the lens 94 is enlarged. Further, since the light emitting element 92 is not covered with the sealing layer 13, the difference in refractive index between the material of the light emitting element and the air is large, so that the light extraction efficiency is deteriorated.

  As shown in FIG. 3B, the light emitting device package 10 of the present embodiment may be configured to include a reflector 15 that reflects light emitted from the light emitting device 12 outside the lens 14. Good. The provision of the reflector 15 is more preferable because the light extraction efficiency can be further increased. Even in the configuration including the reflector 15, since the sealing layer 13 is provided, the lens 14 can be installed in the vicinity of the light emitting element 12, and the lens 14 can be made small. The substrate 11 may be embedded with a metal or the like for exhausting heat generated from the light emitting element 12.

  In this embodiment, the sealing layer 13 and the lens 14 are formed using a thermoplastic perfluoro resin. The perfluoro resin used preferably has a transmittance of 90% or more with respect to light having a wavelength of 200 to 400 nm. In particular, it is more preferable that the transmittance is 99% or more for light having a wavelength of 250 nm to 270 nm. If the transmittance for light in the ultraviolet region is high, for example, high light resistance can be obtained even if it is used for a light emitting device having a center wavelength of 380 nm or less.

  An example of such a material is Cytop (Asahi Glass (registered trademark)) represented by the following formula (Chemical Formula 1).

  The perfluoro resin used for the material of the sealing layer 13 may have the same composition as the material of the lens 14, but may have a different composition. When using a different composition, the perfluoro resin used for the material of the sealing layer 13 is more preferably a glass transition temperature lower than that of the perfluoro resin used for the material of the lens 14. For example, a perfluoro resin containing allyl vinyl ether may be used.

  Next, a method for manufacturing the light emitting device package 10 of the present embodiment will be described. FIG. 4 is an explanatory diagram showing an example of a method for manufacturing the light emitting device package 10 of the present embodiment. In the example shown in FIG. 4, first, a fluorine-based solution 31 containing a thermoplastic perfluoro resin is dropped on the substrate 11 (FIG. 4A) to which the light emitting element 12 is bonded (FIG. 4B). ) Solution dropping step). At this time, the dropping amount of the solution to be dropped is the concave portion 144 of the lens 14 in which the sum of the volume represented by the product of the dropping amount and the solid content concentration of the solution and the volume of the light emitting element 12 is separately formed by injection molding or the like. It adjusts so that it may become larger than the volume of. In addition, it is preferable that the solution 31 is dropped on the center of the light emitting element 12 so that the shape after dropping is symmetrical with respect to the light emitting element 12. The solution 31 has a nearly spherical shape because the surface energy of the fluorine-based solution is high with respect to the substrate 11 and becomes liquid repellent.

  Thereafter, a sealing layer 13 made of a thermoplastic perfluoro resin is formed through a solvent removal step (FIG. 4C) in which the solvent is diffused by baking or vacuum degassing. Note that the solution dropping step in FIG. 4B and the desolvation step in FIG. 4C may be collectively referred to as a sealing layer forming step. The sealing layer 13 is deposited so that the solvent component in the solution 31 is gradually diffused in the process of removing the solvent, and the solid content surrounds the light emitting element 12. Therefore, when the dropping amount of the solution 31 is appropriate, the shape of the sealing layer 13 finally becomes a mountain shape having a skirt at the periphery although it roughly follows the shape of the light emitting element 12. On the other hand, when the amount of the solution 31 dropped is too small, the shape of the sealing layer 13 remains only to cover the surface of the light emitting element 12, so that it does not have a slope that draws a skirt and is difficult to be integrated with the lens 14. On the other hand, when the dripping amount of the solution 31 is too large, the usage amount of the solution 31 is increased, and the usage amount of the perfluoro resin contained in the solution 31 is increased accordingly.

  When using a calcination method as a method for removing the solvent, it may be maintained for several seconds to several minutes at a temperature equal to or higher than the boiling point of the solvent. For example, the temperature may be controlled in the range of 100 ° C to 200 ° C. In addition, the solvent removal environment is more preferably performed under reduced pressure because the solvent can be diffused at a lower temperature or in a shorter time by lowering the pressure of the atmosphere.

  Next, alignment is performed so that the optical axis of the lens shape 141 of the lens 14 coincides with the center of the light emitting element 12 on the substrate 11 (FIG. 4 (d) alignment step). In this step, for example, the lenses 14 arranged in a tray, a sheet, or the like are taken out by a pick device having a suction terminal and a claw (a tool for taking out), and conveyed to a predetermined position of the light emitting element 12. At this time, it is preferable that the edge portion 143 is formed on the outer peripheral portion of the lens 14 because the edge portion 143 can be held with the tab of the pick device without touching the surface of the lens shape 141.

  After alignment, the lens 14 is laminated on the sealing layer 13 formed on the substrate 11 ((e) optical element lamination step in FIG. 4). In this step, for example, the lens 14 is pressed to a position where the sealing layer 13 and at least the bottom of the concave shape 142 of the lens 14 are in contact with each other. At this time, in order to further increase the adhesion between the sealing layer 13 and the lens 14, as an adhesive solvent for making it difficult to form a gap between the sealing layer 13 and the lens 14 on the sealing layer 13. For example, the lens 14 may be laminated after applying a fluorine solution or a solution in which a perfluoro resin is dissolved.

  Next, the substrate 11 on which the sealing layer 13 is formed is heated using a heater 32 or the like (FIG. 4F) heating step. At this time, the lens 14 is pressed, for example, so that the surface of the lens 14 where the concave shape 142 is formed is in contact with the sealing layer 13 at least in the region where the lens shape 141 is formed. To do. It is more preferable if the entire surface of the lens 14 where the concave shape 142 is formed is in contact with the sealing layer 13. By continuing the state for a predetermined time, the sealing layer 13 and the lens 14 are brought into close contact and integrated. In addition, the optical element lamination process of FIG.4 (e) and the heating process of FIG.4 (f) may be collectively called a contact | adherence process. After heating for a predetermined time, the adherend surface is solidified by leaving or cooling for a predetermined time. The heating means is not limited to the heater 32, and various methods other than the heating means using the heater 32 can be adopted as long as the sealing layer 13 can obtain a desired temperature.

In the heating step, the temperature of the sealing layer 13 is equal to or higher than the glass transition temperature of the perfluororesin that is the material of the sealing layer 13 and the viscosity of the perfluororesin is lower than 1 × 10 ⁴ Pa · s. Thus, it is preferable to set the processing temperature. In order to suppress thermal deformation of the lens 14, in addition to the above, as the upper limit temperature of the lens 14, the temperature of the sealing layer 13 or less or the glass transition temperature of the perfluoro resin that is the material of the lens 14 + 30 ° C. or less. Preferably it is satisfied. The upper limit temperature of the lens 14 is more preferably the glass transition temperature of the perfluoro resin, which is the material of the lens 14, + 20 ° C. or less. For example, when CYTOP (Asahi Glass (registered trademark)) is used as the material of the sealing layer 13 and the material of the lens 14, the temperature of the sealing layer 13 is the temperature of the material of the sealing layer 13 (CYTOP (registered trademark)). )) Which is a glass transition temperature of 108 ° C. or higher, and 170 ° C. or lower which does not exceed 175 ° C. which is a temperature at which the viscosity of the material (Cytop) is 1 × 10 ⁴ Pa · s. In addition, in order to suppress thermal deformation of the lens 14, the temperature of the lens 14 is not less than 108 ° C., which is the glass transition temperature of the material of the lens 14 (Cytop®), and the material (Cytop ( The glass transition temperature of the registered trademark))) is more preferably 130 ° C. or lower with an upper limit of around 20 ° C. Furthermore, in the optical element laminating step, when the bonding solution is applied, the sealing layer 13 and the lens 14 can be brought into close contact with each other at a temperature lower than the above temperature. For example, when a solution in which about 10% of Cytop (registered trademark) is applied as a bonding solution on the sealing layer 13, the processing temperature in the heating step, that is, the sealing layer via the substrate 11 is applied. The heating temperature for the lens 13 and the lens 14 can be set to 60 ° C. or higher and 130 ° C. or lower. As described above, when the processing temperature in the heating step is low, it is preferable because thermal deformation of the lens 14 is suppressed. However, since it takes time to disperse the solvent of the adhesive solution, accuracy and productivity of a predetermined lens shape are required. The temperature may be set based on

  FIG. 4 shows an example in which the substrate 11 is heated after the lens 14 is laminated on the sealing layer 13. For example, the temperature of the sealing layer 13 is changed to the sealing layer before the alignment step. You may heat the board | substrate 11 so that it may become more than the glass transition temperature of the perfluoro resin which is 13 materials. Then, the lens 14 may be aligned and laminated while the sealing layer 13 is heated. At this time, in order to accelerate the heat conduction to the lens 14, the lens 14 is separately heated to a temperature not lower than 50 ° C. and not higher than the glass transition temperature of the perfluoro resin as the material of the lens 14. May be laminated. By setting the temperature as described above, the space between the light emitting element 12 and the lens 14 can be filled with the sealing resin while preventing the lens shape 141 of the lens 14 from being deformed. Moreover, although the heating time after lamination | stacking shall be until adhesion | attachment is completed, the shorter one is preferable.

  FIG. 5 is an explanatory view showing another example of the method for manufacturing the light emitting element package 10. FIG. 5 shows another process example after the sealing layer forming process. As shown in FIG. 5, after the sealing layer 13 is formed, the lens 14 and the sealing layer 13 may be heated separately (FIG. 5 (g) heating step). When the lens 14 is heated, a mold 33 along the concave shape of the lens 14 may be used. By performing the heating step before lamination, the heating temperature can be made different between the lens 14 and the sealing layer 13, and the temperature of each part can be controlled more finely. Moreover, when apply | coating the solution for adhesion | attachment on the sealing layer 13, the process temperature in the said heating process can be set to a still lower temperature. For example, when a solution in which about 10% of CYTOP (Asahi Glass (registered trademark)) is dropped (applied) as a bonding solution to the sealing layer 13, the heating temperature for the sealing layer 13 is, for example, the above-described temperature. As described above, when the temperature is set in the range of 60 ° C. or higher and 130 ° C. or lower, the lens 14 has a lower temperature, for example, the temperature of the lens 14 is 50 ° C. or higher and the perfluoro resin that is the material of the lens 14 You may heat so that it may become below glass transition temperature. In the heating step, only the sealing layer 13 may be heated.

  Then, after aligning so that the center of the light emitting element 12 and the optical axis of the lens 14 may correspond (FIG. 5 (d ') alignment process), it is heated by the sealing layer 13 with which the heating state is maintained. The lens 14 is laminated (contacted), and the state is continued for a predetermined time, thereby bringing the lens 14 and the sealing layer 13 into close contact with each other (FIG. 5 (e ′) optical element laminating step). Note that the above-described bonding solution may be dropped (applied) onto the sealing layer 13 before the optical element laminating step or before the heating step.

  Thereafter, the heating and the stacked state may be maintained until the close contact is completed (FIG. 4 (f)). In the case of this example, the 1st heating process which is a heating process of Drawing 5 (g), the optical element lamination process of Drawing 5 (e '), and the 2nd heating process which is the heating process of Drawing 4 (f) Are collectively referred to as an adhesion process.

  As described above, according to the present embodiment, the lens 14, which is an optical element having the lens shape 141, can be laminated with high airtightness so as to cover the light emitting element 12. In addition, the amount of perfluoro resin used as the material of the lens 14 can be reduced even if the amount used for sealing is combined. Therefore, a small and high performance light emitting device package can be provided.

  In addition, about the shape of the lens 14 and the sealing layer 13 after a contact | adherence process, as FIG.1 (c) shows, the sealing layer 13 formed by the manufacturing method mentioned above has the shape of the outer peripheral part in planar view. In many cases, the shape does not become a beautiful circle or the like, and an arbitrary shape is obtained by applying a sealing material or removing the solvent. On the other hand, the shape of the outer periphery of the lens 14 formed using a mold can be controlled to a predetermined shape such as a circle or a square. In order to firmly attach the lens 14 to the sealing layer 13, it is preferable to adjust so that the sealing layer 13 protrudes from the outer shape of the lens 14, as shown in FIG. Further, for example, when a lens provided with the edge portion 143 is used as the outer peripheral portion of the lens 14, a step may occur in the vicinity of the edge portion even after the contact process, but the optical characteristics such as light extraction efficiency and light distribution are improved. It doesn't matter because it doesn't have a big impact. In addition, the surface of the lens shape 141 is usually smooth, but the surface roughness of the region of the sealing layer 13 where the lens 14 is not laminated, that is, the outer peripheral region that protrudes from the lens 14 is compared with the surface roughness of the lens shape 141. growing. However, since the outer peripheral area of the sealing layer 13 that protrudes from the lens 14 has little influence on the optical characteristics, there is no problem even if the surface roughness increases (relative to the lens shape 141).

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described. In the present embodiment, a light emitting element package including a plurality of light emitting elements 12 will be described. FIG. 6 is a configuration diagram illustrating an example of the light emitting device package of the present embodiment. FIG. 6A is a schematic cross-sectional view showing the main part of the light emitting device package 20 of the present embodiment. FIG. 6B is a cross-sectional view of the main part of the light emitting device package 20 before the lens array 24 is laminated. FIG. 6C is a top view of the light emitting element package 20. FIG. 6A is a cross-sectional view taken along the line BB ′ of FIG.

  As illustrated in FIG. 6, the light emitting element package 20 of the present embodiment covers at least the substrate 11, the light emitting elements 12 a to 12 d that are the plurality of light emitting elements 12 bonded on the substrate 11, and the light emitting elements 12 a to 12 d. The sealing layer 13 formed as described above and the lens array 24 laminated on the sealing layer 13 are provided. 6 illustrates an example in which the light emitting elements 12 are arranged in a 2 × 2 array, the number and arrangement of the light emitting elements 12 are not limited to this.

  In the present embodiment, the sealing layer 13 is formed so as to seal each light emitting element 12 in a state where each of the light emitting elements 12 a to 12 d is bonded to the substrate 11. In FIG. 6, an example is shown in which each convex shape formed so as to cover each light emitting element 12 is connected on the surface of the substrate 11 as the sealing layer 13. The convex shape may be interrupted between the adjacent light emitting elements 12. Note that when the convex shapes are connected, the surface shape of the sealing layer 13 may not draw a curve that monotonously decreases in the vicinity of an intermediate point between the adjacent light emitting elements 12.

  The lens array 24 of this example is an optical element having a plurality of sets of the lens shape 141 and the concave shape 142. More specifically, the lens array 24 has lens shapes 141a to 141d and concave shapes 142a to 142d formed in pairs with the light emitting elements 12a to 12d. In the lens array 24, in each pair of the lens shape 141 and the concave shape 142, it is preferable that the optical axis of the lens shape 141 and the center of the concave shape 142 coincide with each other as in the first embodiment. That is, the optical axis of the lens shape 141a matches the center of the concave shape 142a, the optical axis of the lens shape 141b matches the center of the concave shape 142b, and the optical axis of the lens shape 141c and the center of the concave shape 142c. And the optical axis of the lens shape 141d and the center of the concave shape 142d are preferably matched. Thereby, the optical axis of each lens shape 141 and the center of the corresponding light emitting element 12 can be matched, so that the light extraction efficiency is increased and a uniform light distribution state without deviation is obtained. The “matching” includes substantially matching within a range of manufacturing errors such as a mounting position error of each light emitting element 12 with respect to the substrate 11 and a positional deviation of the lens shape 141 with respect to each of the light emitting elements 12.

  Further, in the lens array 24, in each pair of the lens shape 141 and the concave shape 142, as in the first embodiment, the center of curvature of the lens, which is the center of a virtual spherical surface obtained by approximating the lens shape 141 to the spherical surface, corresponds to the concave shape. It is preferable that the center of curvature of a minute curved surface at an arbitrary position that can be approximated to a spherical surface in the lens shape 141 is positioned in the concave portion 144.

  Also in this embodiment, each lens shape 141 has a radius of curvature of a virtual spherical surface obtained by approximating the lens shape 141 to a curved surface, which is 2.5 times or less the length of the side (long side) of the corresponding light emitting element 12. Or, the thickness at the optical axis is preferably 1.0 mm or less. Furthermore, from the viewpoint of light extraction efficiency, the radius of curvature is more preferably 2.0 times or more the length of the corresponding side (long side) of the light emitting element 12.

  6 shows an example in which the lens array 24 as one optical component includes a plurality of lens shapes 141 and concave sets. However, when the arrangement interval of the light emitting elements 12 is wide, the lens Each set of the shape 141 and the concave shape 142 may be formed as a different optical component. For example, as shown in FIG. 7, a plurality of lenses 14 of the first embodiment are prepared according to the number of light emitting elements 12 (for example, lenses 14 a to 14 d), and the light emission is performed according to the position of each light emitting element 12. The lens 14 a to 14 d may be stacked on the sealing layer 13 formed so as to cover the element 12. In such a case, the lenses 14a to 14d are collectively referred to as a lens array 24. In the present embodiment, the lens shape 141 or the aggregate of the lens shapes 141 corresponds to a portion excluding the edge portion 145 on the light emitting side surface of the lens array 24 or the lenses 14a to 14d. More specifically, it may be said that the portion of the surface exhibits a predetermined light extraction effect. Further, when the lens shape 141 is connected and formed, a portion where the inclination is discontinuous may be regarded as a boundary of the lens shape 141.

  6 shows an example in which the edge portion 143 is provided between the adjacent lens shapes 141, but the adjacent lens shapes 141 are connected to each other (without the edge portion) as shown in FIG. Also good. 7 and 8 are schematic cross-sectional views showing the main part of the light emitting device package 20 before the lens array 24 is stacked as another example of the light emitting device package 20 of the present embodiment. Further, the lens array 24 is formed by one optical component in a shape in which some of the lens shapes 141 are connected, and is formed by another optical component in a shape in which a part of the other lens shapes 141 is separated. May be. In the lens array 24, the lens shape 141 corresponding to each of the light emitting elements 12 is formed on the sealing layer 13 regardless of how many optical components the lens shape 141 is finally formed of. That's fine.

  Next, a method for manufacturing the light emitting device package 20 of the present embodiment will be described. The manufacturing method of the light emitting device package 20 of the present embodiment may be basically the same as that of the light emitting device package 10 of the first embodiment.

  FIG. 9 is an explanatory diagram illustrating an example of an alignment process in the method for manufacturing the light emitting device package 20 of the present embodiment. In FIG. 9, after the sealing layer 13 is formed on the substrate 11 to which the light emitting elements 12a, 12b, 12c, and 12d arranged in the 2 × 2 array shown in FIG. 6 are bonded, the lens array 24 is aligned. Sectional drawing of the principal part of the light emitting element package 20 in a process is shown.

  In the lens array 24 of this example, lens shapes 141a to 141d and concave shapes 142a to 142d are formed as a set of a lens shape 141 and a concave shape 142 corresponding to the light emitting elements 12a to 12d. Specifically, in the lens array 24, a lens shape 141a and a concave shape 142a are formed according to the position of the light emitting element 12a on the substrate 11, and the lens shape 141b and the concave shape are formed according to the position of the light emitting element 12b. The lens shape 141c and the concave shape 142c are formed according to the position of the light emitting element 12c, and the lens shape 141d and the concave shape 142d are formed according to the position of the light emitting element 12d. In such a case, in the alignment step, the lens array 24 is aligned so that the sum of the deviation amounts between the optical axis of each lens shape 141 of the lens array 24 and the center of the corresponding light emitting element 12 is minimized. Just do it. In addition, when each lens shape 141 is formed as a (separated) different optical component, the optical axis of each lens shape 141 formed in the optical component and the corresponding light emitting element 12 are equal to the number of optical components. The optical component may be aligned so that the sum of the deviation amounts from the center of the optical component becomes the smallest.

  As described above, according to the present embodiment, even when a plurality of light emitting elements 12 are provided, the optical element has the lens shape 141 corresponding to each light emitting element 12 so as to cover each light emitting element 12. The lens array 24 (or the lenses 14a to 14d) can be stacked with high airtightness. Further, even if the amount used for sealing is combined, the amount of perfluoro resin used as the material of the lens array 24 (or lenses 14a to 14d) can be reduced. Therefore, a small and high performance light emitting device package can be provided.

  As for the shape of the lens array 24 (or lenses 14a to 14d) and the sealing layer 13 after the adhesion process, the sealing layer 13 formed by the above-described manufacturing method as shown in FIG. In many cases, the shape of the outer peripheral portion in a plan view does not become a clean circle or the like, and becomes an arbitrary shape depending on the process of applying the sealing material or removing the solvent. On the other hand, optical components having a lens shape 141 such as the lens array 24 shown in FIGS. 6A and 8 and the lenses 14a to 14d shown in FIG. 7 (hereinafter collectively referred to as lens components) formed using a mold. The shape of the outer peripheral portion can be controlled to a predetermined shape such as a circle or a square. Also in this embodiment, as in the first embodiment, in order to firmly attach the lens component to the sealing layer 13, as shown in FIG. 6C, the sealing layer 13 with respect to the outer shape of the lens component. It is preferable to adjust so as to protrude. In addition, for example, when using a lens provided with the edge portion 143, the outer periphery of the lens component may have a step near the edge portion even after the contact process, but the optical characteristics such as the light extraction efficiency and the light distribution are not good. It doesn't matter because it doesn't have a big impact. In addition, the lens shape 141 has a smooth surface, but the surface roughness of the region of the sealing layer 13 where the lens component is not laminated, that is, the outer peripheral region protruding from the lens component, is larger than the surface roughness of the lens shape 141. Become. However, since the outer peripheral area of the sealing layer 13 that protrudes from the lens component has little influence on the optical characteristics, there is no problem even if the surface roughness increases (relative to the lens shape 141).

  Other points are the same as those of the light emitting device package 10 of the first embodiment.

  Next, the optical element, the light emitting element package, and the method for manufacturing the light emitting element package of the present invention will be described using specific examples. In the following examples, in the embodiments of the present invention, “substrate” is “surface mount LED substrate”, “light emitting device” is “LED device”, and “light emitting device package” is “LED package with lens”. May be described.

Example 1.
A lens 14 having a cross section shown in FIG. 2A is produced by injection molding a solid content of Cytop (Asahi Glass (registered trademark)), which is a thermoplastic perfluoro resin. The lens surface is an aspherical surface, the radius of curvature of the approximate spherical surface is 1.0 mm, the thickness of the central portion is 0.8 mm, the length of the side of the circumscribed square of the bottom surface portion 1442 is 0.6 mm, and the circumscribed surface of the surface opening 1441 The length of the side of the square is 0.75 mm, and the thickness of the edge portion 143 is 0.13 mm. The outer shape of the lens 14 including the edge portion 143 is a circle having a diameter of 2.4 mm.

  Next, the produced lens 14 is attached to the surface mount LED substrate 11 by the following process. One LED element 12 that is flip-chip connected is mounted on the surface of the ceramic substrate 11. The LED element 12 has a light emission wavelength of 260 nm, the LED element 12 has a square shape with a side of 0.5 mm, and a thickness of 0.15 mm. Since the LED element 12 is flip-chip connected, there is no connection wire (FIG. 4A).

First, 5 mm ³ of a Cytop (Asahi Glass (registered trademark)) solution having a solid concentration of 9% is dropped from directly above the LED element 12 as a fluorine-based solution 31 containing a thermoplastic perfluoro resin (FIG. 4B). )). Cytop (registered trademark) used for the material of the lens 14 and the sealing layer 13 of this example has a glass transition temperature of solid content of 108 ° C., and the temperature at which the viscosity becomes 1 × 10 ⁴ Pa · s is about 175 ° C. Then, the sealing layer 13 is obtained by baking for 15 minutes at 180 degreeC (FIG.4 (c)). The sealing layer 13 completely covers the LED element 12, and the outer shape is a shape as shown in 13 of FIG.

  Next, the optical axis of the lens shape 141 of the lens 14 coincides with the center of the LED element 12 (more preferably the center normal of the light emitting surface), and the surface having the surface opening 1441 of the concave portion 144 of the lens 14 After positioning so that the surface of the LED element 12 is parallel (FIG. 4D), the lens 14 is moved so that the bottom of the concave portion 144 of the lens 14 and the sealing layer 13 are in contact with each other (FIG. e)). Thereafter, the temperature of the sealing layer 13 is heated to 115 ° C. by the heater 32. The lens 14 and the sealing layer 13 are brought into close contact with each other by pressurizing at 0.2 MPa from above the lens for at least 15 minutes (FIG. 4F). After cooling the heater 32 to 60 ° C. or lower, the pressure is released and the heater 32 is detached from the heater 32 to obtain the lens-equipped LED package 10.

Example 2
A lens 14 having a cross section shown in FIG. 2A is produced by injection molding the solid content of Cytop (Asahi Glass (registered trademark)), which is the same perfluoro resin as in the first embodiment. The lens surface is an aspherical surface, the radius of curvature of the approximate spherical surface is 0.5 mm, the thickness of the central portion is 0.3 mm, the length of the side of the circumscribed square of the bottom surface portion 1442 is 0.6 mm, and the circumscribed surface of the surface opening 1441 The length of the side of the square is 0.75 mm, and the thickness of the edge portion 143 is 0.13 mm. The outer shape of the lens 14 including the edge portion 143 is a circle having a diameter of 1.2 mm.

  Next, the lens 14 is attached to the surface-mounted LED substrate 11 by the following process. One LED element 12 that is flip-chip connected is mounted on the surface of the ceramic substrate 11. The LED element 12 has a light emission wavelength of 260 nm, the LED element 12 has a square shape with a side of 0.5 mm, and a thickness of 0.15 mm. Since the LED element 12 is flip-chip connected, there is no connection wire (FIG. 4A).

First, a CYTOP (Asahi Glass (registered trademark)) solution having a solid content concentration of 9% as in the first embodiment is used as a fluorine-based solution 31 containing a thermoplastic perfluoro resin from directly above the LED element 12 to 5 mm ^3. It is dripped (FIG.4 (b)). Then, the sealing layer 13 is obtained by baking for 15 minutes at 180 degreeC (FIG.4 (c)). The sealing layer 13 completely covers the LED element 12, and the outer shape is a shape as shown in 13 of FIG.

Next, the heater 32 is heated so that the sealing layer 13 is 70 ° C. and the lens 14 is 50 ° C., and a solid content is used as a bonding solvent on the heated sealing layer 13. A Cytop (Asahi Glass (registered trademark)) solution having a concentration of 9% is dropped about 1 mm ³ (FIG. 5 (g)). After that, the optical axis of the lens shape 141 of the lens 14 is aligned with the center of the LED element 12, and the surface of the concave portion 144 of the lens 14 with the surface opening 1441 is parallel to the surface of the LED element 12. (FIG. 5 (d ′)). The lens 14 is moved so that the bottom of the concave portion 144 of the lens 14 is in contact with the sealing layer 13 (FIG. 5 (e ′)). Thereafter, the lens 14 and the sealing layer 13 are brought into close contact with each other by pressurizing at 0.2 MPa from above the lens for at least 15 minutes (FIG. 4F). After cooling until the temperature of the sealing layer 13 is 60 ° C. or lower, the LED package with lens 10 is obtained.

Example 3
A lens array 24 shown in FIG. 6 is produced by injection molding the solid content of Cytop (Asahi Glass (registered trademark)), which is the same perfluoro resin as in the first embodiment. The lens array 24 includes four sets of a lens shape 141 and a concave shape 142, more specifically, a lens shape 141a and a concave shape 142a, a lens shape 141b and a concave shape 142b, a lens shape 141c and a concave shape 142c, and a lens. The lens has a shape 141d and a concave shape 142d, and each set of lens shape and concave shape has a cross section shown in FIG. The distance between adjacent lens shapes 141 is 1.5 mm. Each lens surface is an aspheric surface, the radius of curvature of the approximate spherical surface is 0.5 mm, the thickness of the central portion is 0.3 mm, the length of the side of the circumscribed square of the bottom surface portion 1442 is 0.6 mm, and the surface opening 1441 The length of the side of the circumscribed square is 0.75 mm.

  Next, the lens array 24 is mounted on the surface mount LED substrate 11 by the following process. Flip chip connected LED elements 12a, 12b, 12c and 12d are mounted on the surface of the ceramic substrate 11. The emission wavelength of each LED element is 260 nm, the size of each LED element is a square with a side of 0.5 mm, and the thickness is 0.15 mm. Since each LED element is flip-chip connected, there is no connection wire (FIG. 4A).

First, as a fluorine-based solution 31 containing a thermoplastic perfluoro resin from directly above each of the LED elements 12a to 12d, Cytop (Asahi Glass (registered trademark)) having a solid content concentration of 9% as in the first embodiment. The solution is dropped on each LED element by 5 mm ³ (FIG. 4B). Then, the sealing layer 13 is obtained by baking for 15 minutes at 180 degreeC (FIG.4 (c)). The sealing layer 13 completely covers the LED elements 12a to 12d, and the outer shape is a shape as shown at 13 in FIG.

Next, in a state where the sealing layer 13 is heated to 70 ° C. by the heater 32, the bonding is performed from the position above the heated sealing layer 13 and directly above each of the LED elements 12 a to 12 d. As a solvent, a Cytop (Asahi Glass (registered trademark)) solution having a solid content concentration of 9% is dropped on each LED element at about 1 mm ³ . After that, the optical axis of the lens shapes 141a to 141d of the lens array 24 and the centers of the LED elements 12a to 12d coincide with each other, and the surface of each concave portion 144 of the lens array 24 with the surface opening 1441 and each LED element 12a. It aligns so that the surface of the board | substrate 11 with -12d may become parallel (FIG. 9). Next, the lens array 24 is moved so that the bottom of each concave portion 144 of the lens array 24 is in contact with the sealing layer 13 (FIG. 4E). Thereafter, the lens array 24 and the sealing layer 13 are brought into close contact with each other by pressurizing from above the lens at 0.2 MPa for at least 15 minutes (FIG. 4F). After cooling until the temperature of the sealing layer 13 becomes 60 ° C. or less, the LED package with lens 20 is obtained.

  The present invention is not limited to a light emitting element, and can be suitably applied when it is desired to use an optical element in close contact with a chip-shaped element.

DESCRIPTION OF SYMBOLS 10 Light emitting element package 11 Board | substrate 12 Light emitting element 13 Sealing layer 14 Lens 15 Reflector 24 Lens array 141, 141a-141d Lens shape 142, 142a-142d Concave shape 143 Edge part 144 Concave part 1441 Surface opening part 1442 Bottom part

Claims (14)

Formed using thermoplastic perfluororesin,
Has a lens shape on one surface,
The other surface has a concave shape that makes a pair with the lens shape,
The concave shape is a shape in which the opening area decreases as it goes inward from the surface opening. Having a plurality of sets of the lens shape and the concave shape,
The optical element according to claim 1, wherein, in each set of the lens shape and the concave shape, an optical axis of the lens shape coincides with a center of the concave shape. The optical element according to claim 1, wherein a center of a virtual spherical surface obtained by approximating the lens shape to a spherical surface is located in a concave portion formed by a corresponding concave shape. The optical element according to any one of claims 1 to 3, wherein a thickness of the lens-shaped optical axis is 1.0 mm or less. A substrate,
A light emitting device bonded to the substrate;
A sealing layer for sealing the light emitting element bonded to the substrate;
An optical element laminated on the sealing layer and having a lens shape on one surface;
The sealing layer and the optical element are formed using a thermoplastic perfluoro resin,
At least in the region where the lens shape is formed, the other surface of the optical element and the sealing layer are in close contact with each other. The light-emitting element package according to claim 5, wherein the optical element is the optical element according to claim 1. The light-emitting element package according to claim 5, wherein a composition of a perfluoro resin that is a material of the optical element is different from a composition of a perfluoro resin that is a material of the sealing layer. The glass transition temperature of the perfluoro resin which is the material of the optical element is higher than the glass transition temperature of the perfluoro resin which is the material of the sealing layer. Light emitting device package. The light emitting element package according to any one of claims 5 to 8, wherein the perfluoro resin that is a material of the sealing layer contains allyl vinyl ether. The light emitting device package according to claim 5, wherein a center wavelength of the light emitting device is 380 nm or less. The lens shape of the optical element is paired with the light emitting element,
The light emitting element according to any one of claims 5 to 10, wherein a radius of curvature of a virtual spherical surface that approximates a curved surface of the lens shape is 2.5 times or less of a side length of a corresponding light emitting element. package. A method of manufacturing a light emitting device package comprising a light emitting device bonded to a substrate and an optical device that exhibits a lens effect,
A sealing layer forming step of forming a sealing layer for sealing the light emitting element by dripping a solvent after dripping a solution containing a thermoplastic perfluoro resin from above the light emitting element;
It is formed of a thermoplastic perfluoro resin, and has a lens shape that makes a pair with the light emitting element on one surface, and a concave shape that makes a pair with the lens shape on the other surface and goes inward from the surface opening. An alignment step of performing alignment so that the optical axis of the lens shape of the optical element having a concave shape with a reduced opening area in accordance with the center of the corresponding light emitting element,
The manufacturing method of the light emitting element package characterized by including the contact process which laminates | stacks the said optical element on the said sealing layer, and adhere | attaches the said sealing layer and the said optical element. In the adhesion step, the temperature of the sealing layer in a state where the surface of the optical element having the concave shape is in contact with the surface of the sealing layer is a glass of perfluororesin that is a material of the sealing layer The temperature of the optical element is equal to or lower than the temperature of the sealing layer or the material of the optical element so that the viscosity of the perfluororesin is lower than a temperature lower than 1 × 10 ⁴ Pa · s. The manufacturing method of the light emitting element package of Claim 12 including the process of heating so that it may become 30 degrees C or less higher than the glass transition temperature of a certain perfluoro resin. After the sealing layer forming step, before the step of laminating the optical element, including a step of dropping a solution containing a thermoplastic perfluoro resin from above the sealing layer,
In the adhesion step, the temperature of the optical element is 50 ° C. or higher and the glass transition temperature of the perfluoro resin that is the material of the optical element, and the temperature of the sealing layer is that of the optical element. The manufacturing method of the light emitting element package according to claim 12, comprising a heating step of heating so as to be higher than the temperature.

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