JP2020115799A - Led illumination sheet for raising animals and plants, led illumination module for raising animals and plants, shelf board for raising shelf of animals and plants, raising shelf of animals and plants, and raising factory of animals and plants - Google Patents

Abstract

To provide an LED illumination sheet for raising animals and plants, an LED illumination module for raising animals and plants, a shelf board for raising shelf of animals and plants, a raising shelf of animals and plants, and a raising factory of animals and plants in which LED chips can be protected.SOLUTION: An LED illumination sheet 20 for raising animals and plants comprises: a substrate film 31; a metal wiring part 32 formed on a surface of the substrate film; LED chips 21 mounted on the metal wiring part; and a protection part 35A which covers at least a part of side faces 21b of the LED chips and protects the LED chips.SELECTED DRAWING: Figure 5B

Description

The present disclosure relates to an LED lighting sheet for growing animals and plants, an LED lighting module for growing animals and plants, a shelf board for growing shelves of animals and plants, a growing shelf for animals and plants, and an animal and plant growing factory.

As a lighting device used in an animal and plant growing factory, in recent years, a demand for a lighting device using an LED with low power consumption as a light source has been expanding in place of a conventional fluorescent lamp, a high-pressure sodium lamp, or the like.

As an example of an animal and plant growing factory using a lighting device having an LED as a light source, a plant growing device is known in which a plurality of straight tube type plant growing lamps having an LED as a light source are arranged on a shelf plate of a plant growing shelf. (For example, refer to Patent Document 1).

An LED lighting device for growing plants and animals has also been proposed in which a plurality of LED chips are arranged on a flexible type circuit board to form a planar light source (see, for example, Patent Document 2).

JP, 2008-118957, A JP, 2013-251230, A

The present disclosure provides an LED lighting sheet for growing plants and animals, an LED lighting module for growing plants and animals, a shelf plate for growing shelves of plants and animals, a growing shelf for plants and animals, and a plant and plant growing plant that can protect LED chips. ..

The LED lighting sheet for growing animals and plants according to the present embodiment is an LED lighting sheet for growing animals and plants, and is mounted on a substrate film, a metal wiring portion formed on the surface of the substrate film, and the metal wiring portion. Further, the LED chip is provided, and a protection portion that covers at least a part of a side surface of the LED chip and protects the LED chip is provided.

In the LED lighting sheet for growing plants and animals according to the present embodiment, the LED chip is mounted on the metal wiring part via a solder part, and the solder part extends from the back surface to the side surface of the LED chip, The protection part may cover the solder part located laterally of the LED chip.

In the LED lighting sheet for growing plants and animals according to the present embodiment, the protective portion has a central portion that covers at least a portion of the surface of the LED chip, and a curved portion that covers at least a portion of the side surface of the LED chip, A flat portion formed adjacent to the curved portion may be included.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the central portion may cover the entire surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the thickness of the central portion may be gradually increased toward the central side of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the curved portion may cover the entire area of the side surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the thickness of the curved portion may be gradually increased toward the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, in the cross section orthogonal to the light emitting surface of the LED lighting sheet for growing animals and plants, the curved portion, from the light emitting surface side of the LED lighting sheet for growing animals and plants, It may have a concave shape that is recessed toward the surface opposite to the light emitting surface.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the curved portion may cover the solder portion located laterally of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, in the cross section orthogonal to the light emitting surface of the LED lighting sheet for growing animals and plants, a portion of the solder portion located on the side of the LED chip is the light emission. It may have a curved shape that rises on the surface side.

In the LED lighting sheet for growing animals and plants according to the present embodiment, in the cross section orthogonal to the light emitting surface of the LED lighting sheet for growing animals and plants, the thickest part of the solder portion is on the side surface of the LED chip. It does not have to be in contact.

In the LED lighting sheet for growing animals and plants according to the present embodiment, when viewed from the light emitting surface side of the LED lighting sheet for growing animals and plants, the portion of the solder portion located on the side of the LED chip is It may be formed so as to surround a part of the side surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, a light-reflective insulating protective film is further provided so as to cover the metal wiring portion, and the protective portion covers the light-reflective insulating protective film. May be.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protection section may cover the entire surface and side surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion may have a transparent protective film.

In the LED lighting sheet for growing animals and plants according to the present embodiment, a gap may be formed between the transparent protective film and the side surface of the LED chip.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion may further include an adhesive layer that adheres the LED chip and the transparent protective film.

In the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion may cover the side surface of the LED chip with the adhesive layer.

In the LED lighting sheet for growing animals and plants according to the present embodiment, 10 or more of the LED chips may be arranged in series, and 4 or more rows of the LED chips may be arranged in parallel.

In the LED lighting sheet for growing plants and animals according to the present embodiment, the thickest portion may have a thickness of 5 mm or less.

An LED lighting module for growing animals and plants according to the present embodiment is an LED lighting module for growing animals and plants, wherein the LED lighting sheet for growing animals and plants according to the present embodiment and the LED lighting sheet for growing animals and plants are electrically connected. The control unit is connected externally, and the control unit is externally connected to the LED lighting sheet for growing animals and plants.

In the LED lighting module for growing animals and plants according to the present embodiment, a constant voltage may be applied from the controller to the LED lighting sheet for growing animals and plants.

In the LED lighting module for growing plants and animals according to the present embodiment, the control unit may be capable of controlling dimming of the LED chip.

The shelf board for growing shelves of animals and plants according to the present embodiment is a shelf board for growing shelves of animals and plants, and a substrate and an LED lighting sheet for growing animals and plants according to the present embodiment, which is attached to the board. Alternatively, the LED lighting module for growing animals and plants according to the present embodiment is provided.

The animal and plant growing shelf according to the present embodiment is an animal and plant growing shelf, and includes a shelf board, and the shelf board is attached to the lower surface side of the substrate, and the LED lighting for growing animals and plants according to the present embodiment. The sheet or the LED lighting module for growing animals and plants according to the present embodiment is provided.

In the animal and plant growing shelf according to the present embodiment, the LED lighting sheet for growing animals and plants may be further arranged on the side surface side of the shelf board.

The animal and plant growing plant according to the present embodiment includes a building and the above-mentioned animal and plant growing shelf according to the present embodiment, which is arranged inside the building.

According to this embodiment, the LED chip can be protected.

FIG. 1 is a schematic diagram showing an LED lighting module according to one embodiment. FIG. 2 is a plan view showing an LED lighting sheet according to one embodiment. FIGS. 3A and 3B are plan views showing modified examples of the LED lighting sheet. FIG. 4A is a graph showing the relationship between time and voltage when a constant voltage is applied to the LED lighting sheet from the control unit, and FIG. 4B is a comparative example, in which a pulse is applied to the LED lighting sheet. It is a graph which shows the relationship between time and voltage in the case of being. FIG. 5A is a cross-sectional view (cross-sectional view taken along the line VA-VA in FIG. 2) showing the LED lighting sheet according to the embodiment. FIG. 5B is an enlarged view (enlarged view corresponding to the VB section in FIG. 5A) showing the protection unit of the LED lighting sheet according to the embodiment. FIG. 6 is a plan view (viewed in the direction of arrow VI in FIG. 5A) showing the LED chip of the LED lighting sheet according to the embodiment. 7A to 7I are cross-sectional views showing a method for manufacturing an LED lighting sheet according to an embodiment. FIG. 8 is a schematic perspective view showing a plant growing factory according to one embodiment. FIG. 9 is a schematic perspective view showing a plant growth shelf according to one embodiment. FIGS. 10A and 10B are views showing a modified example of the plant growth shelf. FIG. 11 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment. FIG. 12 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment. FIG. 13 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment. FIG. 14 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment. FIG. 15 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment. FIG. 16 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment. FIG. 17 is a cross-sectional view showing a modified example of the LED lighting sheet according to the embodiment.

The LED lighting sheet for growing animals and plants according to the present embodiment includes a substrate film, a metal wiring portion formed on the surface of the substrate film, an LED chip mounted on the metal wiring portion, and a side surface of the LED chip. And a protection portion which covers at least a part and protects the LED chip.

Since the LED lighting sheet for growing animals and plants according to the present embodiment is a sheet-shaped LED lighting device, the entire thickness can be made thinner than an LED bar light in which a plurality of straight tube LEDs are arranged. Therefore, the vertical spacing between the shelves of the animal and plant growing shelf can be narrowed to improve the yield of the animals and plants to be grown per floor area of the animal and plant growing factory. In addition, since the thickness of the LED chip is smaller than the thickness of the LED straight tube, the LED lighting sheet has an LED straight tube with a height difference between a portion where the LED chip is arranged and a portion where the LED chip is not arranged. It can be made smaller than the height difference between the place where the LED straight tube is placed and the place where the LED straight tube is not placed. Therefore, the shadow on the side of the LED chip is less likely to occur, so that even when the animal or plant grows and comes close to the LED lighting sheet, it is possible to suppress the variation in the light irradiating the animal or plant. In the LED lighting device for growing animals and plants, it is important to suppress variations in the light that irradiates the animals and plants, because it reduces the size and quality of the animals and plants to be grown within a certain standard range and reduces nonconforming products. is there. In the growth of animals and plants, it is important to control the light and heat applied to the animals and plants at the latter stage of growth when the animals and plants grow and photosynthesis becomes active. The LED lighting sheet for growing animals and plants according to the present embodiment can suppress variations in relatively strong light emitted to the animals and plants when the animals and plants are close to each other.

Moreover, in the LED lighting sheet for growing animals and plants according to the present embodiment, the protective portion covers at least a part of the side surface of the LED chip to protect the LED chip. This can prevent the LED chip from peeling off from the LED lighting sheet even when the worker contacts the LED chip. Therefore, it is possible to prevent the LED chip from dropping on the plant to be grown, and to prevent the phosphor of the LED chip from coming into contact with the plant. Therefore, the hygienic condition of the plant to be grown can be kept good.

Further, the LED lighting module for growing animals and plants according to the present embodiment includes an LED lighting sheet for growing animals and plants, and a control unit electrically connected to the LED lighting sheet, and the control unit is the LED It is externally connected to the lighting sheet.

Since the LED lighting module for growing animals and plants according to the present embodiment has an external control unit, it is possible to increase the amount of animals and plants to be grown while suppressing a decrease in the yield of the animals and plants to be grown. In good yield. The heat locally generated in the vicinity of the control unit strongly affects the plants and animals cultivated in the vicinity of the control unit, and has a small influence on the plants and animals cultivated in the place distant from the control unit. Therefore, the growing state of animals and plants may vary, the number of non-conforming products increases, and the yield may decrease. The larger the light quantity of the LED lighting sheet, the larger the heat generated from the control unit. According to the LED lighting module in which the control unit is externally connected to the LED lighting sheet, the control unit can be installed at an arbitrary location, so that variation can be suppressed and good yield can be obtained.

Since the shelf plate for animal and plant growing shelves according to the present embodiment, the animal and plant growing shelf, and the animal and plant growing plant are provided with the LED lighting sheet or module for animal and plant growing according to the above-described present embodiment, a good yield of animals and plants can be obtained. Can be obtained at

An embodiment will be specifically described below with reference to the drawings. Each drawing shown below is a schematic illustration. Therefore, the size and shape of each part are exaggerated as appropriate for easy understanding. In addition, it is possible to appropriately change and implement the embodiments without departing from the technical idea. In the drawings shown below, the same reference numerals are given to the same parts, and detailed description may be partially omitted. Further, the numerical values such as the dimensions of each member and the material names described in the present specification are examples of the embodiments, and the present invention is not limited to these and can be appropriately selected and used. In the present specification, terms that specify a shape or a geometric condition, such as parallel, orthogonal, and vertical terms, mean not only the strict meaning but also substantially the same state. As used herein, an animal or plant means an animal and/or a plant. In the following, for convenience, a case of growing (cultivating) a plant with an LED lighting module will be described as an example, but the present invention can also be applied to a case of growing an animal within a range where no contradiction occurs.

(LED lighting module for growing plants)
The LED lighting module 10 for plant cultivation according to the present embodiment (hereinafter also referred to as the LED lighting module 10) shown in FIG. 1 is provided in a plant cultivation factory 90 (FIG. 8) using artificial light as described later. It is installed and grows plants. Such an LED lighting module 10 includes an LED lighting sheet 20 for plant growth (hereinafter, also referred to as an LED lighting sheet 20) and a control unit 40 electrically connected to the LED lighting sheet 20.

As shown in FIG. 2, the LED lighting sheet 20 has a plurality of LED chips 21 arranged on the light emitting surface 20a side (the side facing the plant direction when in use) of the sheet surface. By using the LED lighting sheet 20 of the direct type as described above, the irradiation light from the LED chip 21 directly passes through the light emitting surface 20a and reaches the plant directly below, so that the amount of light is increased to promote the growth of the plant. In addition, it is possible to reduce the thickness of the entire sheet so that the shadow on the side of the LED chip 21 is less likely to occur. Although FIG. 2 shows an example of the direct type LED lighting sheet 20, the present invention is not limited to this, and an edge type LED lighting sheet having a light guide plate or the like may be used. The edge type LED lighting sheet easily suppresses the variation in the amount of light from the light emitting surface 20a. The LED illumination sheet 20 of FIG. 2 includes a flexible wiring board 30 and a plurality of LED chips 21 regularly arranged on the flexible wiring board 30. By using such a flexible wiring board 30, the LED lighting sheet 20 having a relatively large sheet surface area can be obtained. Generally, in a plant growing factory or a plant growing shelf, a plurality of LED lighting sheets 20 are arranged and used. However, if the positions of the adjacent LED lighting sheets 20 vary, the light quantity varies and the yield of plants increases. May decrease. The LED lighting sheet 20 having a relatively large sheet surface area can reduce the number of LED lighting sheets 20 to be used, so that it is possible to suppress variations in the light amount due to the arrangement of the plurality of LED lighting sheets 20. Although FIG. 2 shows an example of the LED lighting sheet 20 including the flexible wiring board 30, the present invention is not limited to this, and an LED lighting sheet including a rigid wiring board may be used. The LED lighting sheet provided with the rigid wiring board has high resistance to stress and is not easily damaged. Note that, in FIG. 2, the display of the light-reflective insulating protective film 34 and the transparent protective film 35 described later is omitted.

In this case, the LED chips 21 are arranged in the flexible wiring substrate 30 in a grid point shape in a plan view. That is, the LED chips 21 are arranged in a matrix form in multiple stages and multiple rows, and the rows R of M LED chips 21 connected in series are arranged in N rows. For example, in FIG. 2, 14 (M=14) LED chips 21 are connected in series along the first array direction (X direction) of the LED chips 21. Further, the row R having the 14 LED chips 21 is arranged in parallel in 10 rows (N=10) along the second arrangement direction (Y direction) of the LED chips 21. The number of LED chips 21 arranged is not limited to this. Specifically, 10 or more and 14 or less (14≧M≧10) LED chips 21 are arranged in series in the first array direction (X direction), and this row R is the second array of the LED chips 21. It is preferable to arrange them in parallel in the direction (Y direction) from 4 rows to 10 rows (10≧N≧4). By arranging 10 or more LED chips 21 in series, the LED chips 21 can be arranged at short intervals along the first arrangement direction (X direction), and the in-plane variation of the illuminance of the LED lighting sheet 20 can be reduced. It is possible to suppress, and it is possible to suppress variations in the light that irradiates the plant. By arranging 14 or less LED chips 21 in series, power consumption can be reduced and running costs such as utility costs in the plant growing factory 90 can be reduced. Further, by arranging the rows of the LED chips 21 in parallel in four rows or more in the second arrangement direction (Y direction) of the LED chips 21, even if a specific LED chip 21 is damaged, the LED chips 21 of the other rows are arranged. Therefore, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from extremely decreasing. Further, by limiting the range in which the illuminance of the LED lighting sheet 20 is reduced, the range in which an incompatible product may be generated is limited, and the reduction in yield can be suppressed. Further, when the LED lighting sheet 20 is of a direct type, there is a high possibility that the LED chip 21 will be accidentally strongly contacted and damaged during installation or cleaning. Therefore, it is risk management to take measures against the damage. Is important in terms of. Furthermore, by arranging 10 or less rows of the LED chips 21 in parallel, power consumption can be reduced and running costs such as utility costs in the plant growing factory 90 can be reduced.

The LED lighting sheet 20 has a plurality of metal wiring portions 22, and the plurality of metal wiring portions 22 are arranged along the first arrangement direction (X direction). The plurality of metal wiring portions 22 arranged along the first arrangement direction (X direction) correspond to the respective columns R of the LED chips 21. The LED chips 21 are arranged so as to straddle a pair of metal wiring portions 22 adjacent to each other in the X direction. Each terminal (not shown) of the LED chip 21 is electrically connected to the pair of metal wiring portions 22. The plurality of metal wiring portions 22 form a power feeding portion to the LED chips 21, and when the power is supplied to the plurality of metal wiring portions 22, all the LED chips 21 arranged in the row R are turned on. .. The plurality of metal wiring portions 22 form a part of the metal wiring portion 32 described later.

The interval Px between the LED chips 21 in the first array direction (X direction) is preferably 37 mm or more and 50 mm or less. Further, the interval Py between the LED chips 21 in the second arrangement direction (Y direction) is preferably 37 mm or more and 100 mm or less. By setting the interval between the LED chips 21 within the above range, the brightness of the LED lighting sheet 20 is made uniform in the plane, the variation of the light irradiating the plants is suppressed, and the power consumption of the LED lighting sheet 20 is suppressed. You can

The thickness of the thickest part of the LED lighting sheet 20 is preferably 5 mm or less. By thus reducing the thickness of the LED lighting sheet 20, it is possible to narrow the vertical interval between the substrates 81 (FIG. 9) on which the LED lighting sheet 20 is installed, and thus the growing shelf 80 ( The number of substrates 81 per (FIG. 9) can be increased. As a result, the yield of plants per unit area can be increased. Moreover, when the plant and the LED lighting sheet 20 are close to each other, it is possible to further suppress the variation in the relatively strong light with which the plant is irradiated.

The array of the LED chips 21 is not limited to the grid point shape in plan view, and may be arranged in a staggered pattern in plan view as shown in FIG. Further, the LED chips 21 do not have to be evenly arranged in the plane of the LED lighting sheet 20. For example, the density of the LED chips 21 may be increased in the peripheral portion of the LED lighting sheet 20. Specifically, as shown in FIG. 3B, the LED chips 21 are arranged in a grid pattern at the center of the LED lighting sheet 20 (the lower part of FIG. 3B), and the peripheral edge of the LED lighting sheet 20 is arranged. The LED chips 21 may be arranged in a staggered manner (in the upper part of FIG. 3B). Accordingly, it is possible to suppress a decrease in the brightness of the LED lighting sheet 20 in the peripheral portion of the LED lighting sheet 20, make the brightness of the LED lighting sheet 20 uniform in the plane, and suppress the variation of the light that illuminates the plant. ..

The overall shape of the LED lighting sheet 20 is a rectangular shape in plan view, but the size and the planar shape of the LED lighting sheet 20 are not particularly limited. Since the LED illumination sheet 20 has a high degree of freedom in processing the size and shape, it is possible to flexibly meet various demands in this regard. Further, by utilizing its flexibility, it is possible to attach to not only a flat installation surface but also various shapes of installation surfaces.

In FIG. 2, the length Lx of the LED lighting sheet 20 in the first arrangement direction (X direction) is preferably 500 mm or more and 700 mm or less, and more preferably 550 mm or more and 650 mm or less. The length Ly of the LED lighting sheet 20 in the second arrangement direction (Y direction) is preferably 300 mm or more and 500 mm or less, and more preferably 350 mm or more and 450 mm or less. By setting the size of the LED lighting sheet 20 in the above range, the LED lighting sheet 20 can be adapted to the general substrate 81 for growing plants (FIG. 9), and the dead space of the substrate 81 can be reduced. .. Further, since the size of each LED lighting sheet 20 is not excessively large, when a specific LED chip 21 is damaged, it is possible to minimize the influence on other LED chips 21 and to grow plants. It is possible to prevent the illuminance of the entire shelf plate 83 (FIG. 9) for shelves from being extremely reduced and to limit the range in which the illuminance is reduced.

Next, the control unit 40 will be described. As shown in FIG. 1, the control unit 40 supplies electric power to the LED lighting sheet 20 and controls light emission and the like of the LED lighting sheet 20. The control unit 40 is detachably connected to the LED lighting sheet 20 via a first connector 44A provided on the LED lighting sheet 20. That is, the control unit 40 is configured separately from the LED lighting sheet 20, and is externally connected to the LED lighting sheet 20. That is, the control unit 40 is not integrated with the LED lighting sheet 20. As a result, the control unit 40 serving as a heat source can be separated from the LED lighting sheet 20, and the heat from the control unit 40 can be prevented from affecting the growth of plants.

The control unit 40 also includes a power input unit 41, an AC/DC converter (driver) 42, and a PWM control unit 43. Of these, the power input unit 41 is supplied with an alternating voltage having an arbitrary voltage of 100 V to 240 V, for example. The AC/DC converter 42 converts an AC voltage of 100V to 240V into a DC voltage of a constant pressure (for example, 44V). The PWM control unit 43 controls the LED chip 21 of the LED lighting sheet 20 by arbitrarily changing the pulse width of the constant voltage waveform from the AC/DC converter 42. That is, the PWM control unit 43 also serves as a dimming control unit that controls dimming of the LED lighting sheet 20. The constant voltage output from the PWM control unit 43 is applied to the LED lighting sheet 20 via the first connector 44A.

By applying a constant voltage to the LED lighting sheet 20 from the PWM control unit 43 of the control unit 40, unlike the case where the rectified pulse voltage is directly applied to the LED lighting sheet 20, the dimming of the LED chip 21 is performed. It becomes possible to do it. That is, the PWM control unit 43 can arbitrarily control the illuminance of the LED chip 21 by appropriately changing the duty ratio of the DC voltage from the AC/DC converter 42. For example, as shown in FIG. 4A, the PWM control unit 43 suppresses the duty ratio of the constant voltage from the AC/DC converter 42 from 100% (solid line) to 50% (dotted line), so that the LED chip 21 The illuminance of can be reduced.

In this way, by appropriately adjusting the illuminance of the LED chip 21, the illuminance of the LED lighting sheet 20 can be adjusted according to the growth stage of the plant and the degree of growth of the plant can be adjusted. For example, the illuminance of the LED lighting sheet 20 may be lowered in the early stage of growth of small plant leaves, and the illuminance of the LED lighting sheet 20 may be increased in the latter stage of growth of large plant leaves. Alternatively, since the distance between the plant and the LED chip 21 is large in the early growth stage when the plant is short, the illuminance of the LED lighting sheet 20 is increased, and in the latter growth stage when the plant is large in height, the plant and the LED chip 21 are long. The illuminance of the LED illumination sheet 20 may be lowered because the distance from the LED illumination sheet 20 becomes shorter. As another example of adjusting the illuminance of the LED lighting sheet 20, the illuminance may be increased when the type of plant requires high illuminance, and the illuminance may be decreased when the type of plant that can be grown with low illuminance. The illuminance may be increased when the shipping time is desired to be advanced, and the illuminance may be decreased when the shipping time is desired to be delayed.

Further, by applying a constant voltage from the PWM control unit 43 to the LED lighting sheet 20, it is possible to increase the integrated light amount of the light from the LED lighting sheet 20 per unit time. That is, for example, the integrated light amount when the constant voltage is applied to the LED lighting sheet 20 (the area of the shaded portion of FIG. 4A) is the integrated light amount when the voltage is applied by the pulse as a comparative example (FIG. 4(b)). Thereby, the light emission efficiency of the light from the LED lighting sheet 20 can be increased and the plant growth efficiency can be improved.

Referring again to FIG. 1, the LED lighting sheet 20 is provided with the regulator 45. In this case, the regulators 45 are provided corresponding to the respective columns of the LED chips 21, and specifically, the ten regulators 45 are provided corresponding to the 10 columns of the LED chips 21. .. The regulator 45 plays a role of maintaining a constant current flowing through the plurality of LED chips 21 in each column. Accordingly, even if one LED chip 21 is damaged, it is possible to prevent an excessive current from flowing to the LED chips 21 in the other columns and prevent the LED chips 21 in the other columns from being damaged. As a result, it is possible to prevent the illuminance of the entire LED lighting sheet 20 from being extremely reduced, and it is possible to suppress variations in the light that illuminates the plants. Further, the regulator 45 can control the amount of current controlled for each column by the resistance value to be connected. For example, by changing the control resistance value of the first column and the last column, only the peripheral column output is performed. I can give you. Thereby, usually, the aim is to ensure uniformity by laying the LED lighting sheets 20 together without any gaps, but from the viewpoint of cost and ensuring air permeability, it is assumed that the LED lighting sheets 20 are separated by about 5 cm to 10 cm. However, the effect that the seam can be erased can be expected.

Further, the LED lighting sheet 20 is provided with a power supply line 46 branching from the first connector 44A. A second connector 44B is provided on the LED lighting sheet 20. The power supply line 46 is not electrically connected to the LED chip 21 of the LED lighting sheet 20, but is electrically connected to the wiring of another LED lighting sheet 200 having the same configuration as the LED lighting sheet 20. Connected. That is, the power supply line 46 is detachably connected to the wiring of the LED lighting sheet 200 via the second connector 44B and the other first connector 44A provided on the other LED lighting sheet 200. The current from the power supply line 46 is supplied to the other LED lighting sheet 200 via the second connector 44B and the other first connector 44A. Thereby, two LED lighting sheets 20 and 200 can be connected, and these two LED lighting sheets 20 and 200 can be simultaneously controlled by one control part 40. By being able to control a plurality of LED lighting sheets 20 at the same time by one control unit 40, the number of control units 40 that are heat generation sources can be reduced, so that the control unit 40 can improve the growth of plants by heat. Variations are less likely to occur, and a decrease in yield can be suppressed.

(Each member of the LED lighting sheet)
Next, each member constituting the LED lighting sheet 20 will be described. As shown in FIG. 5A, the LED lighting sheet 20 includes a flexible wiring board 30 and a plurality of LED chips 21 arranged on the flexible wiring board 30. Among them, the flexible wiring board 30 has a flexible substrate film 31 and a metal wiring portion 32 formed on the surface of the substrate film 31 (the surface on the light emitting surface 20a side). The metal wiring portion 32 is laminated on the substrate film 31 via the adhesive layer 33.

Each LED chip 21 is mounted on the metal wiring portion 32 in a conductive manner. In the LED lighting sheet 20, the LED chips 21 are mounted on the flexible wiring board 30, so that the plurality of LED chips 21 can be arranged at a desired high density.

A light-reflecting insulating protective film 34 is formed so as to cover a region of the LED lighting sheet 20 where the LED chip 21, the regulator 45 and the connector 44 are provided and a peripheral region thereof. The light-reflective insulating protective film 34 is arranged so as to cover the metal wiring portion 32. The light-reflective insulating protective film 34 is a layer that has both an insulating function that contributes to the improvement of the migration resistance of the LED lighting sheet 20 and a light reflecting function that contributes to the improvement of the light environment created by the LED lighting sheet 20. This layer is formed of an insulating resin composition containing a white pigment. A structure without the light-reflective insulating protective film 34 is also possible when the migration resistance and the light reflection function are obtained only by the metal wiring portion 32 and the transparent protective film 35 described later.

Further, a protective portion 35A that covers the light reflective insulating protective film 34 and the LED chip 21 and protects the LED chip 21 is provided. The protective portion 35A has a transparent protective film 35. The transparent protective film 35 is a resin film mainly formed on the outermost surface (the surface located closest to the light emitting surface 20a side) of the LED lighting sheet 20 in order to ensure waterproofness. The transparent protective film 35 according to the present embodiment is formed by, for example, a method of spraying a transparent resin composition by spraying (hereinafter referred to as “spray coating method”) or a method of forming by a curtain coating method. Good.

A solder portion 36 is provided on the metal wiring portion 32. Each LED chip 21 is electrically connected to the metal wiring portion 32 via the solder portion 36. Each LED chip 21 may be mounted on the metal wiring portion 32 via a conductive resin.

(Substrate film)
A resin film having flexibility can be used for the substrate film 31 shown in FIG. 5A. In the present specification, "having flexibility" means that "the curvature radius can be bent to at least 1 m or less, preferably 50 cm, more preferably 30 cm, further preferably 10 cm, and particularly preferably 5 cm. That means.

As a material of the substrate film 31, a thermoplastic resin having high heat resistance and high insulation may be used. As such a resin, a polyimide resin (PI) or polyethylene naphthalate (PEN), which has excellent heat resistance, dimensional stability upon heating, mechanical strength, and durability, can be used. Among them, polyethylene naphthalate (PEN) having improved heat resistance and dimensional stability by performing heat resistance improvement treatment such as annealing treatment can be preferably used. Further, polyethylene terephthalate (PET) whose flame retardancy is improved by adding a flame retardant inorganic filler or the like may be used.

The thickness of the substrate film 31 is not particularly limited, but from the viewpoint of not becoming a bottleneck as a heat dissipation path, having heat resistance and insulation, and a balance of manufacturing cost, it is generally 10 μm or more and 500 μm or more. Hereafter, it is preferably 50 μm or more and 250 μm or less. The thickness is preferably within the above range from the viewpoint of maintaining good productivity when the roll-to-roll method is used.

(Adhesive layer)
As the adhesive forming the adhesive layer 33, a known resin-based adhesive can be appropriately used. Among these resin adhesives, urethane-based, polycarbonate-based, silicone-based, acrylic-based or epoxy-based adhesives can be particularly preferably used.

(Metal wiring part)
The metal wiring portion 32 is a wiring pattern formed of a conductive base material such as a metal foil on the surface of the substrate film 31 (the surface on the light emitting surface 20a side). The metal wiring portion 32 is preferably formed on the surface of the substrate film 31 via the adhesive layer 33 by a dry laminating method. The metal wiring part 32 includes the plurality of metal wiring parts 22 described above. The plurality of metal wiring portions 22 include a first metal wiring portion 22A and a second metal wiring portion 22B arranged apart from the first metal wiring portion 22A. The LED chip 21 is mounted on the first metal wiring portion 22A and the second metal wiring portion 22B, and the LED chip 21 is electrically connected to the first metal wiring portion 22A and the second metal wiring portion 22B. Has been done. The LED chip 21 is turned on by the electric power supplied to the first metal wiring portion 22A and the second metal wiring portion 22B.

The metal wiring portion 32 preferably has both high heat dissipation and high electrical conductivity, and for example, a copper foil can be used. In this case, the heat dissipation from the LED chips 21 is stable and an increase in electrical resistance can be prevented, so that the variation in light emission between the LED chips 21 is reduced and stable light emission is possible. In addition, the life of the LED chip 21 is extended. Further, deterioration of peripheral members such as the substrate film 31 due to heat can be prevented, so that the product life of the LED lighting sheet 20 can be extended. Examples of the metal forming the metal wiring portion 32 include metals such as aluminum, gold, and silver in addition to the above copper.

The thickness of the metal wiring portion 32 may be appropriately set according to the magnitude of withstand current required for the flexible wiring board 30. However, the thickness of the metal wiring portion 32 is preferably 10 μm or more in order to suppress the warpage due to the heat shrinkage of the substrate film 31 during the soldering process by the reflow method or the like. On the other hand, the thickness of the metal wiring portion 32 is preferably 50 μm or less, whereby the flexibility of the flexible wiring substrate 30 can be maintained, and deterioration of handling property due to an increase in weight can be suppressed. be able to.

(Solder part)
The solder portion 36 joins the metal wiring portion 32 and the LED chip 21. The soldering can be performed by a reflow method. As shown in FIG. 5B, the solder portion 36 according to the present embodiment extends from the back surface 21c of the LED chip 21 to the side surface 21b. Further, in the cross section orthogonal to the light emitting surface 20a of the LED lighting sheet 20, a portion of the solder portion 36 located on the side of the LED chip 21 has a curved shape that bulges toward the light emitting surface 20a. In the present embodiment, the portion of the solder portion 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape in a cross section orthogonal to the light emitting surface 20a of the LED lighting sheet 20. In addition, in this specification, "a cross section orthogonal to the light emitting surface of the LED lighting sheet" is along a direction (Z direction) orthogonal to the first arrangement direction (X direction) and the second arrangement direction (Y direction). Means a cross section.

Further, as shown in FIGS. 5A and 5B, in the cross section orthogonal to the light emitting surface 20a of the LED lighting sheet 20, the thickest portion A of the solder portion 36 is not in contact with the side surface 21b of the LED chip 21. .. Thereby, as shown in FIG. 5B, the transparent protective film 35 is interposed between the side surface 21b of the LED chip 21 and the solder portion 36. Therefore, the adhesion between the transparent protective film 35 and the LED chip 21 can be improved. As a result, the transparent protective film 35 can effectively protect the LED chip 21. In addition, since the transparent protective film 35 is interposed between the side surface 21b of the LED chip 21 and the solder portion 36, the transparent protective film 35 can be attached to the LED chip 21 even when the worker contacts the LED chip 21. It is possible to absorb the force applied to the LED chip 21 and effectively prevent the LED chip 21 from peeling off from the LED lighting sheet 20.

Further, as shown in FIG. 6, when viewed from the light emitting surface 20a side, the portion of the solder portion 36 located on the side of the LED chip 21 is formed so as to surround a part of the side surface 21b of the LED chip 21. Has been done. Thereby, the bonding strength between the LED chip 21 and the solder portion 36 can be improved. Therefore, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

On the other hand, as shown in FIG. 5B, the portion of the solder portion 36 located on the back surface 21c side of the LED chip 21 extends continuously on the metal wiring portion 32. As will be described later, such a shape of the solder portion 36 is such that the solder 36a (see FIGS. 7G to 7H) is pressed against the LED chip 21 when the solder portion 36 is formed by the reflow method. It is formed by being crushed. Although not shown, the portion of the solder portion 36 located on the back surface 21c side of the LED chip 21 may be composed of a plurality of portions separated from each other. That is, on the back surface 21c side of the LED chip 21, there may be a region where the solder portion 36 is not formed. As described above, when the solder portion 36 is formed, the solder 36a is pressed by the LED chip 21 and crushed. Thereby, the solder 36a is pushed out from the back surface 21c side of the LED chip 21, and a region where the solder portion 36 is not formed can be formed on the back surface 21c side of the LED chip 21. The soldering may be performed by a laser method.

(LED chip)
The LED chip 21 is a light emitting element that utilizes light emission at a PN junction portion in which a P-type semiconductor and an N-type semiconductor are joined. The LED chip 21 may have a structure in which a P-type electrode and an N-type electrode are provided on the upper surface and the lower surface of the element, respectively, and a structure in which both the P-type electrode and the N-type electrode are provided on one surface of the element. May be.

Further, it is preferable to select the LED chip 21 having high luminous efficiency. Specifically, as the LED chip 21, it is preferable to use one having a luminous efficiency of 150 lm/W or more, and further preferable to use one having a luminous efficiency of 180 lm/W or more. By increasing the luminous efficiency of the LED chip 21 to 150 lm/W or more, the number of mounted (density) LED chips 21 can be reduced, and the heat generated by the Joule heat from the LED chips 21 can be reduced. As a result, it is possible to suppress variation in plant growth due to the above, and to suppress a decrease in yield.

As described above, the LED lighting sheet 20 is one in which the LED chip 21 is directly mounted on the metal wiring portion 32 that can exhibit high heat dissipation. As a result, even when the LED chips 21 are arranged at a high density, excessive heat generated when the LED chips 21 are turned on is quickly diffused through the metal wiring portion 32, and the outside of the LED lighting sheet 20 through the substrate film 31. The heat can be sufficiently radiated to the plant, variation in plant growth due to the heat from the LED chip 21 is less likely to occur, and a decrease in yield can be suppressed.

(Light reflective insulating protective film)
The light-reflective insulating protective film 34 is a layer formed in a region except the region where the LED chip 21 is provided and the peripheral region thereof. The light-reflective insulating protective film 34 is a so-called resist layer that improves the migration resistance of the flexible wiring board 30 by having a sufficient insulating property, and has a light emission luminance of a light environment created by the LED lighting sheet 20. A light reflecting layer having light reflectivity that contributes to improvement.

The light-reflective insulating protective film 34 can be formed of various resin compositions containing urethane resin as a base resin and further containing a white pigment made of an inorganic filler such as titanium oxide. As the base resin of the resin composition used for forming the light-reflective insulating protective film 34, an acrylic polyurethane resin, a polyester resin, a phenol resin, or the like can be appropriately used in addition to the urethane resin. As the base resin of the resin composition forming the light-reflective insulating protective film 34, it is more preferable to use the same or similar resin as the resin composition forming the transparent protective film 35. As for the transparent protective film 35, it is preferable to use an acrylic polyurethane resin as a main material resin, as described later. From this, when the base resin of the resin composition forming the transparent protective film 35 is an acrylic polyurethane resin, the base resin of the resin composition for forming the light reflective insulating protective film 34 is a urethane resin or It is more preferable to use an acrylic polyurethane resin.

As the inorganic filler to be contained as a white pigment in the resin composition forming the light-reflective insulating protective film 34, besides titanium oxide, alumina, barium sulfate, magnesia, aluminum nitride, boron nitride, barium titanate, kaolin, At least one selected from talc, calcium carbonate, zinc oxide, silica, mica powder, powder glass, powder nickel and powder aluminum can be used.

The thickness of the light reflective insulating protective film 34 is 5 μm or more and 50 μm or less, and more preferably 7 μm or more and 20 μm or less. When the thickness of the light-reflective insulating protective film 34 is less than 5 μm, the light-reflective insulating protective film becomes thin particularly at the edge portion of the metal wiring portion 32, and when the metal wiring cannot be covered and is exposed. The risk that insulation cannot be maintained increases. On the other hand, the thickness of the light-reflective insulating protective film 34 is preferably 50 μm or less from the viewpoint of holding the light-reflective insulating protective film 34 from the curvature of the substrate during handling and transportation.

The light-reflecting insulating protective film 34 has a light ray average reflectance at a wavelength of 400 nm to 780 nm both of preferably 65% or more, more preferably 70% or more, and more preferably 80% or more. Is more preferable. In the LED lighting sheet 20, for example, titanium oxide is contained in an amount of 20 parts by mass or more with respect to 100 parts by mass of a urethane-based or acrylic-based polyurethane base resin, so that the thickness of the light-reflective insulating protective film 34 is set to 8 μm. In this case, the light reflectance of the same layer can be 75% or more.

(Transparent protective film)
The transparent protective film 35 is formed on the outermost surface of the LED lighting sheet 20 so as to cover the LED chip 21. The transparent protective film 35 has waterproofness and transparency. The waterproof property of the transparent protective film 35 can prevent water from entering the inside of the device when the LED lighting sheet 20 is used as a light source for growing plants. Further, the transparent protective film 35 can prevent the LED chip 21 from peeling off from the LED lighting sheet 20.

The transparent protective film 35 can be formed of various resin compositions containing an acrylic polyurethane resin or the like as a base resin. For example, the transparent protective film 35 may be formed of a two-component curable acrylic polyurethane resin containing fluorine. Further, as the base resin of the resin composition used for forming the transparent protective film 35, urethane-based resin, polyester-based resin, phenol-based resin and the like can be appropriately used in addition to acrylic polyurethane resin. As the base resin of the resin composition forming the transparent protective film 35, it is preferable to use the same or similar resin as the resin composition forming the light-reflective insulating protective film 34 as the base resin. A preferred specific combination is a combination in which the base resin of the resin composition forming the light-reflective insulating protective film 34 is a urethane resin and the resin forming the transparent protective film 35 is an acrylic polyurethane resin. it can.

Next, referring to FIG. 5B, the transparent protective film 35 according to the present embodiment will be described in more detail. As shown in FIG. 5B, the transparent protective film 35 according to the present embodiment covers the entire surface 21a of the LED chip 21 (the surface on the light emitting surface 20a side) and the side surface 21b. In this case, the transparent protective film 35 is formed adjacent to the central portion 35a that covers the surface 21a of the LED chip 21, the curved portion 35b that is formed around the central portion 35a and covers the side surface 21b of the LED chip 21, and the curved portion 35b. And a flat portion 35c formed by the above. Of these, the central portion 35a covers the entire surface 21a of the LED chip 21. This makes it possible to reliably protect the phosphor 21d, which may be arranged substantially in the center of the surface 21a of the LED chip 21, from the water splashing when growing the plant. In addition, since the central portion 35a covers the entire surface 21a of the LED chip 21, it is possible to prevent the grown plant from coming into contact with the phosphor 21d when the LED lighting sheet 20 is used in a plant growing factory. You can Furthermore, since the central portion 35a covers the entire area of the surface 21a of the LED chip 21, it is possible to prevent the fluorescent substance 21d of the LED chip 21 from falling on the plant to be grown, and the fluorescent substance 21d is a plant. It is possible to suppress contact with the. Therefore, the hygienic condition of the plant to be grown can be kept good.

Further, the thickness of the central portion 35a is formed on the surface 21a of the LED chip 21 so as to gradually increase toward the central side of the LED chip 21. This makes it possible to increase the thickness of the portion of the central portion 35a that covers the phosphor 21d that can be arranged substantially at the center of the surface 21a of the LED chip 21. For this reason, it is possible to more reliably protect the phosphor 21d that can be arranged substantially at the center of the surface 21a of the LED chip 21 from the water splashing when the plant is grown.

The thickness of the thickest portion of the central portion 35a of the transparent protective film 35 is 5 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. Since the thickness of the thickest portion of the central portion 35a is 40 μm or less, good flexibility and thinness of the LED lighting sheet 20, lightness, and good optical characteristics required for plant growing applications. Can be effectively maintained. In addition, since the thickest part of the central portion 35a has a thickness of 10 μm or more, the LED lighting sheet 20 can be provided with sufficient waterproofness required for plant growing applications.

The curved portion 35b of the transparent protective film 35 covers the entire side surface 21b of the LED chip 21. As a result, even when the worker contacts the LED chip 21, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

Further, the thickness of the curved portion 35b is formed so as to gradually increase as it approaches the LED chip 21. Accordingly, even when the worker contacts the LED chip 21, it is possible to prevent a large local force from being locally applied to the joint portion between the LED chip 21 and the solder portion 36, and the LED chip 21 can be suppressed. It is possible to more effectively suppress the peeling from the solder portion 36.

Further, the curved portion 35b has a concave shape that is recessed from the light emitting surface 20a side toward the surface opposite to the light emitting surface 20a in a cross section orthogonal to the light emitting surface 20a of the LED lighting sheet 20. As a result, even if the worker contacts the LED chip 21, it is possible to effectively prevent the transparent protective film 35 from being damaged due to the force applied to the LED chip 21. .. In this case, the radius of curvature r of the concave shape may be, for example, about 200 μm or more and 5000 μm or less.

Further, the curved portion 35b covers the solder portion 36 located on the side of the LED chip 21. As a result, the solder part 36 can be protected from water splashing when growing the plant. Further, since the solder portion 36 is covered with the curved portion 35b of the transparent protective film 35, it is possible to prevent the grown plant from coming into contact with the solder portion 36. Further, since the solder portion 36 is covered with the curved portion 35b, it is possible to prevent the solder portion 36 from peeling off from the LED chip 21. In particular, in the present embodiment, the portion of the solder portion 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape. As a result, the joint area between the portion of the solder portion 36 located on the side of the LED chip 21 and the side surface 21b of the LED chip 21 can be reduced. For this reason, there is a possibility that the joint strength between the portion of the solder portion 36 located on the side of the LED chip 21 and the side surface 21b of the LED chip 21 may be reduced. In the present embodiment, since the solder portion 36 is covered with the curved portion 35b of the transparent protective film 35, the portion of the solder portion 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape. Even if it is, the solder part 36 can be effectively suppressed from peeling off from the LED chip 21. This can prevent the solder from coming into contact with the plant. Therefore, the hygienic condition of the plant to be grown can be kept good.

The flat portion 35c of the transparent protective film 35 has a substantially constant thickness. The thickness of the flat portion 35c is 5 μm or more and 40 μm or less, preferably 15 μm or more and 30 μm or less, and more preferably 20 μm or more and 25 μm or less. When the thickness of the flat portion 35c is 40 μm or less, good flexibility, thinness, and lightness of the LED lighting sheet 20 can be effectively maintained. In addition, since the flat portion 35c has a thickness of 5 μm or more, the LED lighting sheet 20 can be provided with sufficient waterproofness required for plant growing applications.

The surface of the transparent protective film 35 described above may be hydrophilic. Accordingly, when water adheres to the transparent protective film 35, the adhered water is distributed so as to spread along the surface of the transparent protective film 35. Therefore, it is possible to prevent the attached water from remaining in the form of droplets on the surface 21a of the LED chip 21 corresponding to the phosphor 21d. As a result, good optical characteristics of the LED lighting sheet 20 can be effectively maintained.

Further, the water resistance of the LED lighting sheet 20 by the transparent protective film 35 is such that deterioration of the LED chip 21 can be suppressed when water for growing plants is sprayed on the LED lighting sheet 20. There is no particular limitation as long as it exists. Such water resistance is preferably IPX4 or higher in the waterproof/dustproof protection standard established by the IEC (International Electrotechnical Commission). The waterproof property of IPX4 or higher is such that water droplets from all directions do not have a harmful effect on the LED chip 21. Specifically, when water is sprayed from the water spray nozzle at a water amount of 10 L/min for 5 minutes in the entire range of ±180° with respect to the normal direction of the LED lighting sheet 20, the LED chip 21 is adversely affected. It is said that it is not done.

(Method of manufacturing LED lighting sheet)
Next, a method for manufacturing the LED lighting sheet 20 according to the present embodiment will be described with reference to FIGS.

First, the substrate film 31 is prepared (FIG. 7A). Next, on the surface of the substrate film 31, a metal foil 32A such as a copper foil which is a material of the metal wiring portion 32 is laminated (FIG. 7B). The metal foil 32A is adhered to the surface of the substrate film 31 by an adhesive layer 33 such as a urethane-based adhesive agent. Alternatively, the metal foil 32A may be directly formed on the surface of the substrate film 31 by an electrolytic plating method or a vapor deposition method (sputtering, ion plating, electron beam vapor deposition, vacuum vapor deposition, chemical vapor deposition, etc.). Alternatively, the substrate film 31 may be directly welded to the metal foil 32A.

Next, the etching mask 37 patterned into the shape required for the metal wiring portion 32 is formed on the surface of the metal foil 32A (FIG. 7C). The etching mask 37 is provided so that the portion corresponding to the wiring pattern of the metal foil 32A to be the metal wiring portion 32 will not be corroded by the etching liquid. The method for forming the etching mask 37 is not particularly limited, and for example, it may be formed by exposing a photoresist or a dry film through a photomask and then developing it. An etching mask may be formed on the surface.

Next, the metal foil 32A located at a portion not covered with the etching mask 37 is removed with an immersion liquid (FIG. 7(d)). As a result, the portion of the metal foil 32A other than the portion that becomes the metal wiring portion 32 is removed.

After that, the etching mask 37 is removed using an alkaline stripping solution. As a result, the etching mask 37 is removed from the surface of the metal wiring portion 32 (FIG. 7E).

Subsequently, the light-reflective insulating protective film 34 is laminated on the metal wiring portion 32 (FIG. 7F). The formation of the light-reflective insulating protective film 34 is not particularly limited as long as it is a coating means capable of uniformly coating the material resin composition forming the light-reflective insulating protective film 34, and examples thereof include screen printing, offset printing, A method such as a dip coater or brush coating can be used. Alternatively, it may be formed by applying an insulating protective film material having photosensitivity to the entire surface, exposing only a required portion through a photomask, and then developing.

Next, the components of the LED chip 21 and the regulator 45, and the connector 44 are mounted on the metal wiring portion 32 (FIGS. 7G to 7H). Note that, in FIG. 7H and FIG. 7I described later, parts of the regulator 45 are omitted for clarity. In this case, the LED chip 21 is joined to the metal wiring portion 32 by soldering via the solder portion 36. At this time, first, the solder 36a is laminated on the metal wiring portion 32 (FIG. 7G). Next, the LED chip 21 is placed on the solder 36a (FIG. 7(h)). As a result, the solder 36 a is crushed by being pressed by the LED chip 21, and the solder 36 a is formed so as to extend from the back surface 21 c of the LED chip 21 to the side surface 21 b. Next, the LED chip 21 is mounted on the metal wiring portion 32 via the solder portion 36 by heating the solder 36a in a reflow furnace (not shown). In this case, a portion of the solder portion 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape. The joining by the soldering process may be performed by a laser method or a joining with a conductive resin.

Next, the transparent protective film 35 is formed so as to cover the light reflective insulating protective film 34, the components of the LED chip 21 and the regulator 45, and the connector 44 (FIG. 7(i)). The transparent protective film 35 is preferably formed by a spray coating method or a curtain coating method. The transparent protective film 35 is formed by the spray coating method, for example, by spraying a coating liquid for spray coating treatment containing an acrylic polyurethane resin onto a desired area on the flexible wiring board 30 by a spray coating machine. Can be formed. The transparent protective film 35 is formed by the curtain coating method by, for example, applying a curtain coating processing coating liquid containing an acrylic polyurethane resin to a desired area on the flexible wiring substrate 30 by a curtain coating machine. Can be formed. In these cases, the shape of the transparent protective film 35 can be easily made to follow the shape of the LED chip 21 while keeping the thickness of the transparent protective film 35 within a predetermined range. At this time, the transparent protective film 35 including the central portion 35a, the curved portion 35b, and the flat portion 35c is formed by appropriately adjusting the conditions by the spray coating method or the curtain coating method (see FIG. 5B).

The LED lighting sheet 20 according to the present embodiment is not limited to the above-described method, but is a known publicly known flexible wiring board for LED chips and various publicly known LED modules mounted with LED chips mounted thereon. It can also be produced by a method.

(Plant growing factory and plant growing shelf)
FIG. 8: is a figure which shows typically the structure of the plant cultivation factory 90 using the LED lighting sheet 20 by this Embodiment. The plant growing factory 90 includes a building 91 and a plurality of plant growing shelves 80 arranged inside the building 91.

As shown in FIG. 9, the plant growth shelf 80 has a plurality of (four) columns 82, and a plurality of substrates 81 arranged along the columns 82 at intervals in the vertical direction. .. A medium region for cultivating the plant PL is provided on the upper surface of each substrate 81 except the uppermost substrate 81. The lower surface of each substrate 81 except the lowermost substrate 81 constitutes a ceiling surface with respect to the substrate 81 located below the substrate 81, and the LED lighting sheets 20 are arranged in parallel. In this case, the control unit 40 is arranged at a place sufficiently distant from the LED lighting sheet 20. Therefore, there is less possibility that the plant PL located near the control unit 40 and the plant PL located far from the control unit 40 will have uneven growth due to heat from the control unit 40. Further, the substrate 81 and the LED lighting sheet 20 attached to the lower surface side of the substrate 81 constitute a shelf plate 83 for growing shelves of plants. Alternatively, the substrate 81 and the LED lighting module 10 attached to the lower surface side of the substrate 81 constitute a shelf plate 83 for a plant growing shelf. In the present embodiment, such a shelf plate 83 (FIG. 9) for a plant growing shelf, a plant growing shelf 80 (FIG. 9), and a plant growing factory 90 (FIG. 8) provided with the plant growing shelf 80. Also provide.

Since the LED lighting sheet 20 according to the present embodiment is flexible and lightweight, the LED lighting sheet 20 can be attached to the lower surface of each substrate 81 more easily than the conventional straight tube type lighting device. Can be done. Furthermore, since the LED lighting sheet 20 has flexibility, the LED lighting sheet 20 can be attached to the ceiling surface having various sizes and shapes. As a result, the LED lighting sheet 20 according to the present embodiment can be applied to various plant growing shelves 80 and plant growing factories 90.

Further, the LED lighting sheet 20 is made thinner than the conventional straight tube type lighting device. Thereby, the space|interval of the board|substrate 81 of the up-down direction can be narrowed, and the number of the board|substrates 81 contained in the growing shelf 80 of each plant can be increased. As a result, the yield of plant PL per unit area can be increased.

Note that, as shown in FIGS. 10A and 10B, the LED lighting sheet 20 may be arranged not only on the lower surface of the substrate 81 but also on the side surface side of the substrate 81. The LED lighting sheet 20 on the side surface is hung from the board 81 located above to the board 81 located below the board 81. In this case, as shown in FIG. 10A, the LED lighting sheet 20 may reach the substrate 81 located below. Alternatively, as shown in FIG. 10B, the LED lighting sheet 20 may cover only the upper side of the space located between the upper and lower substrates 81 without reaching the substrate 81 located below. In this way, by further disposing the LED lighting sheet 20 on the side surface side of the substrate 81, the amount of light at the peripheral edge of the substrate 81 where the illuminance tends to be weakened is compensated, and the brightness of the LED lighting sheet 20 is made uniform within the surface. be able to. As a result, the growth of plants can be made uniform in the plane, and the yield of plants to be grown can be improved.

As described above, according to the present embodiment, the LED lighting sheet 20 includes the protection portion 35A that covers the side surface 21b of the LED chip 21 and protects the LED chip 21. As a result, even when the worker contacts the LED chip 21, it is possible to prevent the LED chip 21 from peeling off from the LED lighting sheet 20. Therefore, it is possible to prevent the LED chip 21 from dropping on the plant to be grown, and to prevent the phosphor 21d of the LED chip 21 from coming into contact with the plant. Therefore, it is possible to maintain good hygiene of the plant to be cultivated.

Further, according to the present embodiment, the protection portion 35A covers the solder portion 36 located on the side of the LED chip 21. As a result, it is possible to protect the solder portion 36 from the water splashing when growing the plant and prevent the solder portion 36 from being short-circuited by the water. Further, since the solder portion 36 is covered with the protective portion 35A, it is possible to prevent the grown plant from coming into contact with the solder portion 36. Further, since the solder portion 36 is covered with the protection portion 35A, it is possible to prevent the solder portion 36 from peeling off from the LED chip 21. In particular, in the present embodiment, the portion of the solder portion 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape. As a result, the bonding strength between the portion of the solder portion 36 located on the side of the LED chip 21 and the side surface 21b of the LED chip 21 may be reduced. In the present embodiment, since the solder portion 36 is covered with the transparent protective film 35, the portion of the solder portion 36 located on the side of the LED chip 21 is formed in a substantially semicircular shape. Even if there is, the solder portion 36 can be effectively suppressed from peeling off from the LED chip 21. This can prevent the solder from coming into contact with the plant. Therefore, the hygienic condition of the plant to be grown can be kept good.

Further, according to the present embodiment, the central portion 35a covers the entire surface 21a of the LED chip 21. This makes it possible to reliably protect the phosphor 21d, which may be arranged substantially in the center of the surface 21a of the LED chip 21, from the water splashing when growing the plant. In addition, since the central portion 35a covers the entire surface 21a of the LED chip 21, it is possible to prevent the grown plant from coming into contact with the phosphor 21d when the LED lighting sheet 20 is used in a plant growing factory. You can Furthermore, since the central portion 35a covers the entire area of the surface 21a of the LED chip 21, it is possible to prevent the fluorescent substance 21d of the LED chip 21 from falling on the plant to be grown, and the fluorescent substance 21d is a plant. It is possible to suppress contact with the. Therefore, the hygienic condition of the plant to be grown can be kept good.

Further, according to the present embodiment, the thickness of central portion 35a is formed so as to gradually increase toward the central side of LED chip 21. This makes it possible to increase the thickness of the portion of the central portion 35a that covers the phosphor 21d that can be arranged substantially at the center of the surface 21a of the LED chip 21. For this reason, it is possible to more reliably protect the phosphor 21d that can be arranged substantially at the center of the surface 21a of the LED chip 21 from the water splashing when the plant is grown.

Further, according to the present embodiment, the curved portion 35b of the transparent protective film 35 covers the entire side surface 21b of the LED chip 21. As a result, even when the worker contacts the LED chip 21, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

Further, according to the present embodiment, the thickness of the curved portion 35b is formed so as to gradually increase toward the LED chip 21. Accordingly, even when the worker contacts the LED chip 21, it is possible to prevent a large local force from being locally applied to the joint portion between the LED chip 21 and the solder portion 36, and the LED chip 21 can be suppressed. It is possible to more effectively suppress the peeling from the solder portion 36.

Further, according to the present embodiment, the curved portion 35b has a concave shape that is recessed from the light emitting surface 20a side toward the surface opposite to the light emitting surface 20a in the cross section orthogonal to the light emitting surface 20a of the LED lighting sheet 20. have. As a result, even if the worker contacts the LED chip 21, it is possible to effectively prevent the transparent protective film 35 from being damaged due to the force applied to the LED chip 21. ..

Further, according to the present embodiment, the curved portion 35b covers the solder portion 36 located on the side of the LED chip 21. As a result, the solder part 36 can be protected from water splashing when growing the plant. Further, since the solder portion 36 is covered with the curved portion 35b, it is possible to prevent the grown plant from coming into contact with the solder portion 36. Further, since the solder portion 36 is covered with the curved portion 35b, it is possible to prevent the solder portion 36 from peeling off from the LED chip 21. For this reason, it is possible to prevent the solder from coming into contact with the plant, and it is possible to keep the hygienic condition of the plant to be cultivated excellent.

Further, according to the present embodiment, in the cross section orthogonal to the light emitting surface 20a of the LED lighting sheet 20, the thickest portion A of the solder portion 36 does not contact the side surface 21b of the LED chip 21. Thereby, the transparent protective film 35 can be interposed between the side surface 21b of the LED chip 21 and the solder portion 36, and the adhesion between the transparent protective film 35 and the LED chip 21 can be improved. As a result, the transparent protective film 35 can effectively protect the LED chip 21. In addition, since the transparent protective film 35 is interposed between the side surface 21b of the LED chip 21 and the solder portion 36, the transparent protective film 35 can be attached to the LED chip 21 even when the worker contacts the LED chip 21. It is possible to absorb the force applied to the LED chip 21 and effectively prevent the LED chip 21 from peeling off from the LED lighting sheet 20.

Further, according to the present embodiment, when viewed from the light emitting surface 20a side, the portion of the solder portion 36 located on the side of the LED chip 21 is formed so as to surround a part of the side surface 21b of the LED chip 21. Has been done. Thereby, the bonding strength between the LED chip 21 and the solder portion 36 can be improved. Therefore, it is possible to prevent the LED chip 21 from peeling off from the solder portion 36.

Further, according to the present embodiment, the transparent protective film 35 covers the light reflective insulating protective film 34. Thereby, the transparent protective film 35 can protect the light-reflective insulating protective film 34.

Further, according to the present embodiment, the protection portion 35A covers the entire surface 21a and side surface 21b of the LED chip 21. As a result, the LED chip 21 can be surely protected from water splashing when growing the plant. Moreover, since the protection part 35A covers the entire surface 21a of the LED chip 21, the hygienic condition of the plant to be cultivated can be further improved.

Further, according to the present embodiment, ten or more LED chips 21 are arranged in series, and four or more LED chips 21 are arranged in parallel. As a result, the LED chips 21 can be evenly arranged in the plane, the arrays of the LED chips 21 can be arranged in parallel, and the risk when the LED chips 21 are damaged can be dispersed.

Further, according to the present embodiment, since the thickest part of the LED lighting sheet 20 has a thickness of 5 mm or less, the distance between the upper and lower substrates 81 of the plant growth shelf 80 is reduced and the number of the substrates 81 is increased. , Can increase the yield of plants per unit area.

Further, according to the present embodiment, since the control unit 40 is externally connected to the LED lighting sheet 20, the control unit 40 is separated from the LED lighting sheet 20 and the plants are affected by the heat from the control unit 40. Can be kept below.

Further, according to the present embodiment, since a constant voltage is applied to the LED lighting sheet 20 from the control unit 40, it is possible to increase the integrated light amount per unit time from the LED chip 21 and promote the growth of plants.

Further, according to the present embodiment, since the control unit 40 can control the dimming of the LED chip 21, it is possible to adjust the intensity of the light from the LED chip 21 according to the growth stage of the plant. it can.

The example in which the transparent protective film 35 of the protective portion 35A covers the entire surface 21a and side surface 21b of the LED chip 21 has been described, but the present invention is not limited to this. For example, as shown in FIG. 11, the vicinity of the corner 21e of the LED chip 21 may be exposed. In this case, the amount of resin used to form the transparent protective film 35 can be reduced. Also in this case, the effects described above can be obtained.

Further, in the above-described present embodiment, an example in which the transparent protective film 35 is formed by a spray coating method or a curtain coating method has been described, but the present invention is not limited to this. For example, the transparent protective film 35 may be formed by attaching a resin film to the LED chip 21 and the light reflective insulating protective film 34. In this case, as the material of the resin film, vinyl chloride-based or fluorine-based resin, polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyethylene naphthalate (PEN), polyimide (PI), or the like is used. A general resin can be used. Thus, even when the transparent protective film 35 is made of a resin film, the above-described effects can be obtained. As shown in FIG. 12, the resin film may be adhered to the light-reflecting insulating protective film 34 with an adhesive 38, for example. The resin film may be adhered to the light-reflecting insulating protective film 34 via an adhesive, for example. Although not shown, the resin film may be bonded to the light reflective insulating protective film 34 by heat sealing, for example.

Further, in this case, as shown in FIG. 12, a gap G may be formed between the side surface 21 b of the LED chip 21 and the transparent protective film 35. When the gap G is formed between the side surface 21b of the LED chip 21 and the transparent protective film 35, the force applied to the LED chip 21 is caused even when the worker contacts the LED chip 21. Therefore, it is possible to prevent the transparent protective film 35 from being damaged. Further, as shown in FIG. 13, a gap may not be formed between the side surface 21b of the LED chip 21 and the transparent protective film 35. When the gap is not formed between the side surface 21b of the LED chip 21 and the transparent protective film 35, the adhesion between the LED chip 21 and the transparent protective film 35 can be improved, and the LED chip 21 and the solder portion 36 can be removed. It can be protected more effectively. In this case, the transparent protective film 35 may be adhered to the LED chip 21 and the light-reflecting insulating protective film 34 by, for example, a vacuum laminating method.

Further, in the above-described present embodiment, the example in which the protective portion 35A has only the transparent protective film 35 has been described, but the present invention is not limited to this. For example, as shown in FIG. 14, the protective portion 35A may further include an adhesive layer (adhesive layer) 39 that adheres the LED chip 21 and the transparent protective film 35. In this case, it is preferable that the adhesive layer 39 has insulation performance.
As a result, it is possible to suppress the problem that the adhesive layer 39 and the LED chip 21 are short-circuited and the phosphor 21d of the LED chip 21 does not emit light. In the modification shown in FIG. 14, the transparent protective film 35 is bonded to the LED chip 21 via the adhesive layer 39. Even in this case, the effects described above can be obtained.

Further, in this case, as shown in FIG. 14, a gap may not be formed between the side surface 21b of the LED chip 21 and the adhesive layer 39 of the protection portion 35A. When no gap is formed between the side surface 21b of the LED chip 21 and the adhesive layer 39, the adhesion between the LED chip 21 and the transparent protective film 35 can be improved as in the example shown in FIG. The LED chip 21 and the solder part 36 can be protected more effectively. Further, as shown in FIG. 15, a gap G may be formed between the side surface 21b of the LED chip 21 and the adhesive layer 39 of the protective portion 35A. When the gap G is formed between the side surface 21b of the LED chip 21 and the adhesive layer 39, the LED chip may be contacted with the LED chip 21 even if the operator contacts the LED chip 21, as in the example shown in FIG. It is possible to prevent the transparent protective film 35 from being damaged due to the force applied to 21.

Further, as shown in FIG. 16, the adhesive layer 39 may cover the side surface 21b of the LED chip 21. In this case, as shown in FIG. 16, the surface 21a of the LED chip 21 and the surface 39a of the adhesive layer 39 may be flush with each other, or, although not shown, the surface 21a of the LED chip 21 and the surface 21a. The adhesive layer 39 may be interposed between the transparent protective film 35 and the transparent protective film 35. In these cases, the entire surface (light emitting surface 20a) of the LED lighting sheet 20 becomes smooth. As a result, the cushioning property of the LED lighting sheet 20 against external impact can be improved. Further, also in these cases, the effects described above can be obtained.

In addition, in the above-described present embodiment, an example in which the protective portion 35A covers the surface 21a of the LED chip 21 has been described, but the present invention is not limited to this. For example, as shown in FIG. 17, the protection portion 35A may not cover the surface 21a of the LED chip 21. Further, in this case, the protection portion 35A may not cover a part of the light reflective insulating protection film 34. That is, the transparent protective film 35 of the protective portion 35A may not include the central portion 35a and the flat portion 35c. Further, the curved portion 35b of the transparent protective film 35 may be configured to cover at least the solder portion 36 located laterally of the LED chip 21 without covering the entire side surface 21b of the LED chip 21. Even in this case, the curved portion 35b of the transparent protective film 35 covers the solder portion 36 located on the side of the LED chip 21, so that the above-described effect can be obtained.

It is also possible to appropriately combine a plurality of constituent elements disclosed in the above-described embodiments and modifications. Alternatively, some constituent elements may be deleted from all the constituent elements shown in the above-described embodiments and modifications.

10 LED Lighting Module 20 LED Lighting Sheet 20a Light Emitting Surface 21 LED Chip 21a Surface 21b Side 21c Back 21d Phosphor 21e Corner 22 Metal Wiring 30 Flexible Wiring Board 31 Board Film 32 Metal Wiring 33 Adhesive Layer 34 Light Reflective Insulation Protective film 35 Transparent protective film 35a Central part 35b Curved part 35c Flat part 38 Adhesive 39 Adhesive layer 36 Solder part 40 Control part 41 Power input part 42 AC/DC converter 43 PWM control part 44A First connector 44B Second connector 45 Regulator 46 Power supply line 80 Animal and plant growing shelf 81 Substrate 82 Strut 83 Shelf plate for animal and plant growing shelf 90 Animal and plant growing factory 91 Building

Claims (27)

An LED lighting sheet for growing animals and plants,
Substrate film,
A metal wiring portion formed on the surface of the substrate film,
An LED chip mounted on the metal wiring part;
An LED lighting sheet for cultivating animals and plants, comprising: a protection portion that covers at least a part of a side surface of the LED chip and protects the LED chip. The LED chip is mounted on the metal wiring part via a solder part, the solder part extends from a back surface to a side surface of the LED chip, and the protection part is located on a side of the LED chip. The LED lighting sheet for growing animals and plants according to claim 1, which covers the solder portion. The protective portion includes a central portion that covers at least a portion of the surface of the LED chip, a curved portion that covers at least a portion of the side surface of the LED chip, and a flat portion formed adjacent to the curved portion. The LED lighting sheet for growing animals and plants according to claim 2, which contains. The LED lighting sheet for growing plants and animals according to claim 3, wherein the central portion covers the entire surface of the LED chip. The LED lighting sheet for growing plants and animals according to claim 3 or 4, wherein the thickness of the central portion gradually increases toward the central side of the LED chip. The LED lighting sheet for growing animals and plants according to claim 3, wherein the curved portion covers the entire area of the side surface of the LED chip. The LED lighting sheet for growing plants and animals according to any one of claims 3 to 6, wherein the curved portion has a thickness that gradually increases toward the LED chip. In a cross section orthogonal to the light emitting surface of the LED lighting sheet for growing animals and plants, the curved portion is recessed from the light emitting surface side of the LED lighting sheet for growing animal and plant toward a surface opposite to the light emitting surface. The LED lighting sheet for growing plants and animals according to any one of claims 3 to 7, which has a concave shape. 9. The LED lighting sheet for growing plants and animals according to claim 3, wherein the curved portion covers the solder portion located laterally of the LED chip. In a cross section orthogonal to the light emitting surface of the LED lighting sheet for growing animals and plants, a portion of the solder portion that is located laterally of the LED chip has a curved shape that rises toward the light emitting surface side. The LED lighting sheet for growing animals and plants according to any one of 2 to 9. The cross-section orthogonal to the light emitting surface of the LED lighting sheet for growing animals and plants, the thickest portion of the solder portion is not in contact with the side surface of the LED chip, any one of claims 2 to 10. An LED lighting sheet for growing animals and plants according to the item. When viewed from the light emitting surface side of the LED lighting sheet for growing animals and plants, a portion of the solder portion located laterally of the LED chip is formed so as to surround a part of the side surface of the LED chip. The LED lighting sheet for growing animals and plants according to any one of claims 2 to 11. Further comprising a light-reflecting insulating protective film arranged so as to cover the metal wiring portion,
The LED lighting sheet for growing plants and animals according to claim 1, wherein the protective portion covers the light-reflective insulating protective film. The said protection part is the LED lighting sheet for animal and plant growth as described in any one of Claims 1 thru|or 13 which has covered the whole surface of the said LED chip and the side surface. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 14, wherein the protective portion has a transparent protective film. The LED lighting sheet for growing plants and animals according to claim 15, wherein a gap is formed between the transparent protective film and a side surface of the LED chip. The LED lighting sheet for growing animals and plants according to claim 15 or 16, wherein the protective portion further has an adhesive layer that adheres the LED chip and the transparent protective film. The LED lighting sheet for growing animals and plants according to claim 17, wherein the protective portion covers the side surface of the LED chip with the adhesive layer. The LED lighting sheet for animal and plant growth according to any one of claims 1 to 18, wherein 10 or more of the LED chips are arranged in series, and 4 or more rows of the LED chips are arranged in parallel. The LED lighting sheet for growing animals and plants according to any one of claims 1 to 19, wherein the thickest portion has a thickness of 5 mm or less. An LED lighting module for growing animals and plants,
An LED lighting sheet for growing animals and plants according to any one of claims 1 to 20,
A controller electrically connected to the LED lighting sheet for growing animals and plants,
The control unit is an LED lighting module for growing plants and animals, which is externally connected to the LED lighting sheet for growing plants and animals. 22. The LED lighting module for growing plants and animals according to claim 21, wherein a constant voltage is applied from the control unit to the LED lighting sheet for growing plants and animals. The LED lighting module for growing plants and animals according to claim 21 or 22, wherein the control unit can control the dimming of the LED chip. A shelf board for growing shelves of animals and plants,
Board,
The LED lighting sheet for growing animals and plants according to any one of claims 1 to 20 or the LED lighting module for growing animals and plants according to any one of claims 21 to 23, which is attached to the substrate. , Shelf boards for growing shelves of plants and animals. A shelf for growing animals and plants,
Equipped with shelves,
The said shelf board was attached to the lower surface side of the board|substrate, The LED lighting sheet for animal and plant growth of any one of Claims 1 to 20, or the animal and plant growth of any one of Claims 21 to 23. A growing shelf for animals and plants, comprising an LED lighting module. The animal and plant growing rack according to claim 25, wherein the LED lighting sheet for growing plants and animals is further arranged on a side surface of the shelf board. Building,
An animal and plant growing plant, comprising the animal and plant growing shelf according to claim 25 or 26, which is arranged inside the building.

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