TWI620351B - Uv led package structure, uv lighting unit, and manufacturing method of uv lighting unit - Google Patents

Abstract

An ultraviolet light emitting unit comprises a carrier plate, an ultraviolet light emitting diode chip mounted on the carrier plate, a side lens, and a waterproof layer. The ultraviolet light emitting diode chip has a top surface and a ring side surface adjacent to the top surface, and the top surface has a central area and a peripheral area surrounding the central area and connected to the side surface of the ring. The side lens is disposed on the carrier plate, and the ring side of the ultraviolet light emitting diode chip is covered by the side lens. The waterproof layer is coated on the outer surface of the side lens and the peripheral area of the top surface of the ultraviolet light emitting diode chip. Accordingly, the present invention provides an ultraviolet light emitting unit having better luminous efficiency and reliability. In addition, the present invention also discloses an ultraviolet light emitting diode package structure and a method of manufacturing the ultraviolet light emitting unit.

Description

Ultraviolet light emitting diode package structure, ultraviolet light emitting unit, and ultraviolet light emitting single Yuan manufacturing method

The invention relates to a light emitting unit, in particular to an ultraviolet light emitting diode package structure, an ultraviolet light emitting unit and a manufacturing method thereof.

Since the ultraviolet light emitting diode chip has low luminous efficiency and low reliability, how is the existing ultraviolet light emitting unit (or the existing ultraviolet light emitting diode package structure) including the above ultraviolet light emitting diode chip? The structure other than the ultraviolet light emitting diode chip is improved (because the present invention does not modify the wafer, but the structure other than the wafer, such as the package structure outside the wafer), so that it has better luminous efficiency and reliability. Has become one of the main topics in this field.

Accordingly, the inventors believe that the above-mentioned defects can be improved, and that the invention has been studied with great interest and with the use of scientific principles, and finally proposes a present invention which is rational in design and effective in improving the above-mentioned defects.

The embodiments of the present invention provide a method for manufacturing an ultraviolet light emitting diode package structure, an ultraviolet light emitting unit, and an ultraviolet light emitting unit, which are used to effectively improve the defects that may be generated by the existing ultraviolet light emitting unit.

The embodiment of the invention discloses an ultraviolet light emitting unit, comprising: a carrier plate; an ultraviolet light emitting diode chip mounted on the carrier plate, and the ultraviolet light emitting diode chip has a top surface and a side of the ring adjacent to the top surface, The top mask has a central area and a peripheral area surrounding the central area and connected to the side of the ring; a side lens disposed on the carrier plate and the ultraviolet light emitting diode chip The side surface of the ring is covered by the side lens; and a waterproof layer covering an outer surface of the side lens and the peripheral area of the top surface of the ultraviolet light emitting diode chip; The water vapor permeability of the water repellent layer is less than the water vapor permeability of the side lens, and the ratio of the water vapor permeability of the side lens to the water repellent layer is at least greater than 10.

The embodiment of the invention also discloses an ultraviolet light emitting diode package structure, comprising: an ultraviolet light emitting unit comprising: a carrier plate; an ultraviolet light emitting diode chip mounted on the carrier plate, and The ultraviolet light emitting diode chip has a top surface and a ring side surface adjacent to the top surface, the top mask has a central area and a peripheral area surrounding the central area and connected to the side of the ring; a side lens made of a fluorocarbon polymer or polydimethyl siloxane, the side lens is disposed on the carrier plate, and the ring side surface of the ultraviolet light emitting diode chip is a side lens covering; and a waterproof layer made of a fluorine polymer or an inorganic cerium oxide film, the waterproof layer covering an outer surface of the side lens and the ultraviolet light emitting diode The peripheral region of the top surface of the wafer, the water vapor permeability of the water repellent layer is smaller than the water vapor permeability of the side lens, and the side lens and the water of the waterproof layer The ratio of gas permeability is at least greater than 10; a substrate, the ultraviolet light emitting unit is fixed on the substrate; a side wall connected to the substrate and surrounding an outer side of the ultraviolet light emitting unit; and a light transmitting member fixed to the side wall And the light transmissive element, the side wall, and the substrate are surrounded by a closed space for accommodating the ultraviolet light emitting unit; and a waterproof film covering the outer edge of the substrate, the An outer edge of the side wall and at least a partial outer edge of the light transmissive element.

The embodiment of the invention further discloses a method for manufacturing an ultraviolet light emitting unit, comprising: mounting a plurality of ultraviolet light emitting diode chips on a carrier plate assembly; and topping each of the ultraviolet light emitting diode chips a central area of the face attached with a protection a sheet; the carrier plate assembly is attached to a release tape; the carrier plate combination is cut such that the carrier plates are combined to form a plurality of carrier plates, and each of the carrier plates is provided with one of the An ultraviolet light emitting diode chip; a side lens covering a side of the ring of the ultraviolet light emitting diode chip is formed on each of the carrier plates; and a waterproof layer is formed corresponding to each of the side lenses to package Covering the outer surface of the side lens, a peripheral region of the top surface of the adjacent ultraviolet light emitting diode wafer, and the adjacent protective sheet; and removing the plurality of The protective sheet and the release tape are formed to form a plurality of the ultraviolet light emitting units.

In summary, the method for manufacturing an ultraviolet light emitting diode package structure, an ultraviolet light emitting unit, and an ultraviolet light emitting unit disclosed in the embodiments of the present invention is provided by using a fluoropolymer or a polydimethyl group. a side lens made of a siloxane to effectively increase the luminous efficiency of the ultraviolet light emitting unit, and to effectively avoid by providing a waterproof layer (made of a fluorine polymer or an inorganic cerium oxide film) Water vapor invades the ultraviolet light emitting diode chip to enhance the reliability of the ultraviolet light emitting unit.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying claims limit.

1000‧‧‧UV light emitting diode package structure

100‧‧‧UV light-emitting unit

10‧‧‧Bearing board combination

11‧‧‧Loading board

111‧‧‧ first board

112‧‧‧ second board

113‧‧‧ outside edge

12‧‧‧electrode layer

13‧‧‧pad layer

14‧‧‧conductive column

15‧‧‧reflective layer

2‧‧‧Ultraviolet light-emitting diode chip

21‧‧‧ top surface

211‧‧‧Central area

212‧‧‧ peripheral area

22‧‧‧ ring side

3‧‧‧ side lens

31‧‧‧ outer surface

311‧‧‧ plane

312‧‧‧ concave surface

313‧‧‧ convex surface

4‧‧‧Waterproof layer

200‧‧‧ substrate combination

201‧‧‧Substrate

2011‧‧‧ top surface

2012‧‧‧ bottom

2013‧‧‧ outer edge

202‧‧‧Metal pad

203‧‧‧External mat

204‧‧‧Connecting column

300‧‧‧Side wall combination

301‧‧‧ Side wall

3011‧‧‧ outer edge

400‧‧‧Light transmission components

401‧‧‧Lighting components

4011‧‧‧ outer edge

4012‧‧‧ top surface

500‧‧‧Waterproof membrane

600‧‧ ‧ adhesive layer

601‧‧‧colloid

6011‧‧‧ outer edge

700‧‧‧Adhesive layer

701‧‧‧Adhesive

S‧‧‧protection film

T‧‧‧ release tape

W‧‧‧Wall

A‧‧‧ accommodating space

C‧‧‧Outside corner

1 is a schematic diagram of steps S110 to S130 of a method of manufacturing an ultraviolet light emitting unit according to Embodiment 1 of the present invention.

2 is a schematic diagram of steps S140 and S150 of the method for fabricating an ultraviolet light emitting unit according to Embodiment 1 of the present invention.

3 is a schematic view showing a step S160 of a method of manufacturing an ultraviolet light emitting unit according to Embodiment 1 of the present invention.

4 is a schematic diagram of step S170 of the method of manufacturing the ultraviolet light emitting unit according to the first embodiment of the present invention.

FIG. 5 is a schematic perspective view of an ultraviolet light emitting unit according to Embodiment 1 of the present invention.

Figure 6 is an exploded perspective view of Figure 5.

FIG. 7 is a perspective view showing another aspect of an ultraviolet light emitting unit according to Embodiment 1 of the present invention.

Figure 8 is a cross-sectional view of Figure 7 taken along line VIII-VIII.

FIG. 9 is a perspective view showing still another aspect of the ultraviolet light emitting unit according to Embodiment 1 of the present invention.

Figure 10 is a cross-sectional view of Figure 9 taken along line X-X.

FIG. 11 is a schematic diagram of steps S210 to S230 of the method for fabricating the ultraviolet light emitting diode package structure according to the second embodiment of the present invention.

FIG. 12 is a schematic diagram of step S240, step S250, and partial step S260 of the method for fabricating the ultraviolet light emitting diode package structure according to the second embodiment of the present invention.

FIG. 13 is a schematic diagram showing a part of step S260 of the method for fabricating the ultraviolet light emitting diode package structure according to the second embodiment of the present invention.

FIG. 14 is a perspective view of a UV light emitting diode package structure according to Embodiment 2 of the present invention.

Figure 15 is an exploded perspective view of Figure 14.

FIG. 16 is a schematic diagram of steps S310 to S330 of the method for fabricating the ultraviolet light emitting diode package structure according to the third embodiment of the present invention.

FIG. 17 is a schematic diagram showing steps S340 and S350 of the method for fabricating the ultraviolet light emitting diode package structure according to the third embodiment of the present invention.

FIG. 18 is a schematic diagram of step S360 of the method for fabricating the ultraviolet light emitting diode package structure according to the third embodiment of the present invention.

FIG. 19 is a schematic diagram of step S370 of the method for fabricating the ultraviolet light emitting diode package structure according to the third embodiment of the present invention.

20 is a perspective view of a UV light emitting diode package structure according to Embodiment 3 of the present invention.

21 is an exploded perspective view of FIG. 20.

[Example 1]

Referring to FIG. 1 to FIG. 10, it is a first embodiment of the present invention. It should be noted that the related embodiments of the present invention are only used to specifically describe the embodiments of the present invention. The scope of the present invention is not to be construed as limiting the scope of the present invention.

This embodiment discloses an ultraviolet light emitting unit 100 and a manufacturing method thereof. In order to facilitate the description of the above ultraviolet light emitting unit 100, the present embodiment first introduces a manufacturing method of the ultraviolet light emitting unit 100, but the ultraviolet light emitting unit 100 does not The above manufacturing method is limited. As shown in FIG. 1 to FIG. 4, the manufacturing method of the ultraviolet light emitting unit 100 of the present embodiment includes steps S110 to S170, and the specific implementation manner and implementation sequence of the steps S110 to S170 can be according to the designer's requirements. Adjustments are not limited to the following. Moreover, in order to facilitate the method of manufacturing the ultraviolet light emitting unit 100 of the present embodiment, the drawing is only described by making two ultraviolet light emitting units 100.

Step S110: As shown in FIG. 1, a plurality of ultraviolet light-emitting diode chips 2 are mounted on a carrier plate assembly 10 having a substantially plate shape. The ultraviolet light emitting diode chip 2 includes a top surface 21 and a ring side surface 22 adjacent to the top surface 21. The top surface 21 corresponds to the light output of the ultraviolet light emitting diode chip 2 in this embodiment. The face side 22 is connected to the edge of the top surface 21 described above. Furthermore, the top surface 21 includes a central region 211 and a peripheral region 212 surrounding the central region 211 and connected to the ring side surface 22. The shape and size of the central region 211 can be adjusted according to the needs of the designer, and the invention is not limited. For example, the central region 211 can be square and have an area greater than the area of the peripheral region 212 described above.

Step S120: As shown in FIG. 1, a protective sheet S is attached to the central region 211 of the top surface 21 of each of the ultraviolet light-emitting diode chips 2. The central portion 211 of the ultraviolet light emitting diode chip 2 is completely covered by the protective sheet S, and the protective sheet S may be a pyrolytic tape, a heat resistant tape, and a One of the ultraviolet light tapes, but the specific material of the protective sheet S of the present invention is not Limited to this.

Step S130: As shown in FIG. 1, the carrier board assembly 10 is attached to a release tape T. The release tape T may be one of a pyrolysis tape, a heat resistant tape, and an ultraviolet tape in the embodiment, and the release tape T and the protection sheet S are preferably the same. Types (eg, all are UV tape), but the invention is not limited thereto.

Step S140: cutting the carrier board assembly 10 as shown in FIG. 2, so that the carrier board assembly 10 forms a plurality of carrier boards 11, and each of the carrier boards 11 is provided with one of the ultraviolet light emitting diode chips 2 . The carrier board 11 has a first board surface 111 and a second board surface 112 on opposite sides and an outer edge 113 connecting the first board surface 111 and the second board surface 112. The carrier board 11 An electrode layer 12 on the first board surface 111 and a pad layer 13 on the second board surface 112 are disposed, and a plurality of conductive pillars 14 electrically connecting the electrode layer 12 and the pad layer 13 are embedded in the carrier board 11 . The carrier plate 11 is further provided with a reflective layer 15 surrounding the electrode layer 12 and the ultraviolet light emitting diode chip 2, and the ultraviolet light emitting diode chip 2 is electrically connected to the electrode layer 12 and the pad Layer 13.

Step S150: As shown in FIG. 2, a side lens 3 covering the ring side surface 22 of the ultraviolet light emitting diode wafer 2 is formed on each of the carrier sheets 11. The side lens 3 is made of polydimethyl siloxane (PDMS) or a fluoropolymer, and the reflective layer 15 is embedded in the side lens 3. The bottom edge of the outer surface 31 of the side lens 3 is preferably connected to the edge of the carrier plate 11, and the top edge of the outer surface 31 of the side lens 3 is preferably connected to the ultraviolet light emitting diode. The top side of the ring side 22 of the bulk wafer 2, but the invention is not limited thereto.

Step S160, as shown in FIG. 3, a waterproof layer 4 is formed corresponding to each side lens 3 to cover the outer edge 113 of the carrier plate 11, the outer surface 31 of the side lens 3, and the adjacent ultraviolet light emitting light. A peripheral region 212 of the top surface 21 of the polar body wafer 2, and an adjacent protective sheet S. Further, the carrier plate 11 and the ultraviolet light emitting diode chip 2, the protective sheet S, and the side lens 3 are formed in the embodiment. It is preferable to be substantially buried in the waterproof layer 4, that is, the above structure is covered with the waterproof layer 4 except for the bottom surface 112 of the carrier sheet 11, but the present invention is not limited thereto.

Step S170: As shown in FIG. 4, a plurality of the protective sheets S and the release tape T are removed to form a plurality of the ultraviolet light emitting units 100. In the process of removing the protective sheet S and the release tape T, the protective sheet S and the release tape T may be heated and irradiated with ultraviolet light according to the type of the protective sheet S and the release tape T, or Contacting an organic solution (such as acetone, ethyl ketone, or isopropyl alcohol, etc.) to reduce the adhesion of the protective sheet S and the release tape T relative to the ultraviolet light emitting unit 100, thereby facilitating removal of the protective sheet S and the release tape T .

The manufacturing method of the ultraviolet light emitting unit 100 of the present embodiment is substantially as described above, and the specific configuration of the ultraviolet light emitting unit 100 will be described below. Referring to FIG. 4 to FIG. 6 , the ultraviolet light emitting unit 100 includes a carrier board 11 , an ultraviolet light emitting diode chip 2 , a side lens 3 , and a waterproof layer 4 . Hereinafter, a description will be given of the respective component configurations of the ultraviolet light emitting unit 100.

The carrier board 11 includes an electrode layer 12, a pad layer 13, a plurality of conductive pillars 14, and a reflective layer 15. The carrier board 11 has a first board surface 111 and a second board surface 112 on opposite sides. The electrode layer 12 is located on the first board surface 111 of the carrier board 11, and the pad layer 13 It is then located on the second plate surface 112 of the carrier plate 11. The plurality of conductive pillars 14 are embedded in the carrier plate 11, and the two ends of each of the conductive pillars 14 are respectively connected to the electrode layer 12 and the pad layer 13, so that the electrode layer 12 and the pad layer 13 can pass through the conductive pillars. 14 to achieve an electrical connection. The reflective layer 15 is located on the first plate surface 111 of the carrier 11 and surrounds the electrode layer 12, and the reflective layer 15 and the electrode layer 12 are preferably in a sheet-like configuration complementary to each other, but the invention is not limited thereto. . Alternatively, the reflective layer 15 may also be considered to surround the outside of the ultraviolet light emitting diode chip 2.

In more detail, the material of the reflective layer 15 may be nitrided in this embodiment. Aluminum, gold, or aluminum, but is not limited to this. For example, when the material of the reflective layer 15 is aluminum, the reflective layer 15 has a reflectivity of 92% for 280 nm of ultraviolet light, thereby contributing to improving the luminous efficiency of the LED 2 (eg, :+27%). It should be noted that the above-mentioned reflective layer 15 made of aluminum is preferably coated with magnesium fluoride or cerium oxide to avoid oxidation. Moreover, when the material of the reflective layer 15 is gold, the reflective layer 15 has a reflectivity of 38% for the ultraviolet light of 280 nm, thereby contributing to the improvement of the luminous efficiency of the LED 2 (eg: +13.5%). When the material of the reflective layer 15 is aluminum nitride, the reflective layer 15 has a reflectivity of 16% for 280 nm of ultraviolet light.

The ultraviolet light emitting diode chip 2 in the embodiment comprises a multilayer quantum well (such as a multilayer AlxGa1-xN film, wherein x>0.2) disposed on a sapphire substrate, and the ultraviolet light emitting diode The wavelength of the light emitted by the wafer 2 is preferably less than 324 nm, and the light pattern of the ultraviolet light emitting diode chip 2 is a bat wing and has an exit angle of approximately 126.5 degrees, but The ultraviolet light-emitting diode chip 2 of the present invention is not limited thereto. It should be noted that the ultraviolet light emitting unit 100 of the present invention excludes the use of the non-UV light emitting diode chip 2, that is, the light emitting unit that does not use the ultraviolet light emitting diode chip is different. The ultraviolet light emitting unit 100 referred to in the present invention.

Further, the ultraviolet light emitting diode chip 2 has a top surface 21 and a ring side surface 22, and the top surface 21 corresponds to the light emitting surface of the ultraviolet light emitting diode chip 2 in the embodiment, and the ring side surface 22 is connected to the edge of the top surface 21 described above. The top surface 21 includes a central region 211 and a peripheral region 212 surrounding the central region 211 and connected to the ring side surface 22. The shape and size of the central region 211 can be adjusted according to the needs of the designer, and the invention is not limited. For example, the central region 211 can be square and have an area greater than the area of the peripheral region 212 described above.

Furthermore, the ultraviolet light emitting diode chip 2 includes two electrode pads (not labeled) on the bottom side thereof, and the two electrode pads are substantially located in the above embodiment. The central area 211 of the top surface 21 is directly below. That is, the two electrode pads are located away from the top surface 21, and the two electrode pads are orthographically projected toward the top surface 21 to form a projection area that falls within the central area 211, but the present invention is not Limited to this.

The two electrode pads of the ultraviolet light emitting diode chip 2 are soldered to the electrode layer 12 of the carrier plate 11 to electrically connect the ultraviolet light emitting diode chip 2 to the electrode layer 12. When the ultraviolet light emitting diode chip 2 is projected toward a projection area formed by the front projection of the carrier plate 11, the projection area of the ultraviolet light emitting diode chip 2 is substantially located at the center of the reflective layer 15, and the area thereof is relatively Preferably, it is less than half the area of the reflective layer 15.

The side lens 3 is made of polydimethyl siloxane or a fluoropolymer and has a refractive index of approximately 1.4 in this embodiment. The side lens 3 is disposed on the carrier plate 11, and the ring side surface 22 of the ultraviolet light emitting diode chip 2 is covered by the side lens 3 (complete), and the reflective layer 15 is buried in the side lens 3 Inside. That is, the ultraviolet light emitting diode chip 2 has only the top surface 21 exposed outside the side lens 3.

Wherein, the side lens 3 includes an outer surface 31, and the top edge of the outer surface 31 is connected to the edge of the top surface 21 (or the peripheral region 212), and the bottom edge of the outer surface 31 is connected to the carrier board 11 A board surface 111 edge. Further, the side lens 3 is connected to the edge of the top surface 21 and the edge of the first plate surface 111 of the carrier 11 through the top edge and the bottom edge of the side lens 3 during the forming process, so that the side lens 3 is respectively formed by the side lens. The outer surface 31 of the 3 has a surface tension so that the designer can adjust the outer surface shape (e.g., plane, concave curved surface, or convex curved surface) of the side lens 3 according to the requirements of luminous efficiency and light exit angle. The following describes the implementation of the three ultraviolet light emitting units 100.

4 to 6, the outer surface 31 of the side lens 3 includes a plurality of flat surfaces 311, and the top edges of the plurality of planes 311 are connected to the edges of the top surface 21 (or the peripheral region 212). The bottom edge of the plurality of planes 311 is connected to the edge of the carrier plate 11 (or the edge of the first panel surface 111). Accordingly, the ultraviolet light emitting unit 100 shown in FIGS. 4 to 6 can effectively raise the ultraviolet light emitting unit 100 as compared with the case where the side lens 3 is not provided. The luminous efficiency is increased (about +23% to +27%), and the light extraction angle can be controlled to be approximately 115 to 120 degrees.

As shown in FIGS. 7 and 8, the outer surface 31 of the side lens 3 includes a plurality of concave surfaces 312, and the top edges of the plurality of concave curved surfaces 312 are connected to the top surface 21 (or the peripheral area 212). The edge of the plurality of concave curved surfaces 312 is connected to the edge of the carrier plate 11 (or the edge of the first plate surface 111). Accordingly, the ultraviolet light emitting unit 100 shown in FIG. 7 and FIG. 8 can effectively improve the luminous efficiency (about +17% to +23%) and can be improved as compared with the case where the side lens 3 is not provided. The light exit angle is controlled to be approximately 100.9 degrees.

9 and 10, the outer surface 31 of the side lens 3 includes a plurality of convex surfaces 313, and the top edges of the plurality of convex curved surfaces 313 are connected to the top surface 21 (or the peripheral area 212). The edge of the plurality of convex curved surfaces 313 is connected to the edge of the carrier plate 11 (or the edge of the first plate surface 111). Accordingly, the ultraviolet light emitting unit 100 shown in FIG. 9 and FIG. 10 can effectively improve the luminous efficiency (about +27% to +33%) compared to the case where the side lens 3 is not provided, and can The light exit angle is controlled to be approximately 123.6 degrees.

Thereby, the ultraviolet light emitting unit 100 effectively increases the luminous efficiency of the ultraviolet light emitting unit 100 by providing the side lens 3 made of polydimethyl siloxane or a fluoropolymer. Furthermore, the outer surface 31 of the side lens 3 can also be shaped according to the requirements of luminous efficiency and light exit angle, thereby meeting different requirements.

As shown in FIG. 4 to FIG. 6 , the waterproof layer 4 is transparent and made of a fluorine polymer or an inorganic cerium oxide film. In the embodiment, the waterproof layer 4 is made of an amorphous fluororesin ( The amorphous fluoropolymer has a refractive index of about 1.35, and the amorphous fluororesin preferably has a terminal functional group of -CONH to Si(OR)n, but the invention is not limited thereto. Wherein, the water-repellent layer 4 having -CONH~Si(OR)n at the end is taken as an example, and the steam permeability is approximately 0.2 g/m2/1 day, and the side lens of polydimethyloxane is used. 3, for example, its water vapor transmission rate is roughly 105g/m2/1day, that is, the water vapor permeability of the waterproof layer 4 is smaller than the water vapor permeability of the side lens 3, and the ratio of the water vapor permeability of the side lens 3 to the waterproof layer 4 is at least greater than 10, It is preferably between 10 and 500.

The waterproof layer 4 is coated on the outer surface 31 of the side lens 3 and the peripheral region 212 of the top surface 21 of the ultraviolet light emitting diode chip 2. In the present embodiment, the waterproof layer 4 is further coated on the outer edge 113 of the carrier 11 (eg, the side of the carrier 11), and the second panel 112 of the carrier 11 is exposed, but the present invention Not limited to this. That is, in the present embodiment, except for the central region 211 of the top surface 21 of the ultraviolet light-emitting diode wafer 2 and the second plate surface 112 of the carrier sheet 11, the rest is covered by the waterproof layer 4.

Thereby, the ultraviolet light emitting unit 100 is provided with the waterproof layer 4 made of a fluorine polymer or an inorganic cerium oxide film, thereby effectively preventing moisture from invading into the ultraviolet light emitting diode chip 2, thereby reducing The probability of damage of the ultraviolet light emitting diode chip 2. Furthermore, the ultraviolet light emitting unit 100 can also be used in the manufacturing steps of the subsequent ultraviolet light emitting diode package structure 1000 by providing the waterproof layer 4 without using nitrogen or vacuum packaging equipment. In order to effectively reduce the investment cost of manufacturing equipment.

[Embodiment 2]

Referring to FIG. 11 to FIG. 15 , which is a second embodiment of the present invention, the present embodiment discloses an ultraviolet light emitting diode package structure 1000 including the ultraviolet light emitting unit 100 of the first embodiment and a manufacturing method thereof. The ultraviolet light emitting unit 100 and the manufacturing method thereof are described in the first embodiment, and the description is not repeated herein.

In addition, in order to facilitate the description of the above-mentioned ultraviolet light emitting diode package structure 1000, this embodiment first introduces a manufacturing method of the ultraviolet light emitting diode package structure 1000, but the ultraviolet light emitting diode package structure 1000 does not The above manufacturing method is limited. The manufacturing method of the ultraviolet light emitting diode package structure 1000 of the embodiment includes steps S210 to S260, and the specific steps of the steps S210 to S260 The manner of implementation and the order of implementation can be adjusted according to the needs of the designer and are not limited to the following. Moreover, in order to facilitate the method of manufacturing the ultraviolet light emitting diode package structure 1000 of the present embodiment, the drawing only illustrates the fabrication of two ultraviolet light emitting diode package structures 1000.

Step S210: As shown in FIG. 11, a substrate assembly 200 in a plate shape and a side wall assembly 300 disposed on the substrate assembly 200 are provided, and the side wall assembly 300 and the substrate assembly 200 are surrounded by a plurality of accommodation spaces. A.

Step S220: As shown in FIG. 11, a plurality of ultraviolet light emitting units 100 are respectively disposed in the plurality of accommodating spaces A and mounted on the substrate assembly 200.

Step S230: As shown in FIG. 11, a plurality of transparent members 401 are fixed on the sidewall assembly 300 by an adhesive layer 700, so that the plurality of the transparent members 401 respectively close a plurality of the accommodating spaces A. . The light transmissive element 401 is preferably a flat quartz glass or a lens, which is not limited herein. It should be noted that the enclosed accommodating space A may be filled with air (non-vacuum), so that the ultraviolet light emitting diode package structure 1000 does not need to use nitrogen or vacuum packaging equipment during the manufacturing process. In order to effectively reduce the investment cost of manufacturing equipment.

Step S240: As shown in FIG. 12, the substrate assembly 200 is attached to a release tape T. The release tape T may be one of a pyrolytic tape, a heat resistant tape, and an ultraviolet tape in the embodiment, but the release tape T type of the present invention is not limited thereto. In addition, a release tape T may be further disposed on the plurality of light transmissive elements 401 to facilitate subsequent formation of the waterproof film 500.

Step S250: as shown in FIG. 12, the adhesive layer 700, the sidewall assembly 300, and the substrate assembly 200 are cut so that the substrate assembly 200 is formed with a plurality of substrates 201, and the sidewall combination 300 is formed separately. A plurality of adhesive layers 701 respectively provided on the plurality of side walls 301 are formed on the plurality of side walls 301 of the plurality of substrates 201 and the adhesive layer 700.

Step S260: As shown in FIG. 12 and FIG. 13, a waterproof film 500 is formed on each of the substrate 201 and the corresponding side wall 301 and the outer edge of the light transmitting element 401. Forming an ultraviolet light emitting diode package structure 1000; thereafter removing the release tape T described above.

The manufacturing method of the ultraviolet light emitting diode package structure 1000 of the present embodiment is substantially as described above, and the specific configuration of the ultraviolet light emitting diode package structure 1000 will be described below. Referring to FIG. 13 to FIG. 15 , the ultraviolet light emitting diode package 1000 includes the ultraviolet light emitting unit 100 , a substrate 201 , a side wall 301 , a light transmitting component 401 , and a first embodiment as described in the first embodiment. Waterproof film 500.

The substrate 201 includes two metal pads 202 , two external pads 203 , and two connection posts 204 . The metal pads 202 are located on the top surface 2011 of the substrate 201 , and the two external pads 203 are located on the substrate 201 . Underside 2012. Two connecting posts 204 are embedded in the substrate 201, and one ends of the two connecting posts 204 are respectively connected to the two metal pads 202, and the other ends of the two connecting posts 204 are respectively connected to the two external pads 203. The two metal pads 202 are electrically connected to the two external pads 203 respectively through the two connecting posts 204.

Further, the ultraviolet light emitting unit 100 is fixed on the substrate 201, and the pad layer 13 of the ultraviolet light emitting unit 100 is fixed on the two metal pads 202 of the substrate 201. The side wall 301 is connected to the substrate 201 and surrounds the outer side of the ultraviolet light emitting unit 100, so that the ultraviolet light emitting unit 100 is located in an accommodating space A formed by the side wall 301 and the substrate 201.

Furthermore, the light-transmitting element 401 is fixed to the side wall 301 by the adhesive 701 and closes the accommodating space A, so that the accommodating space A is closed, and the closed accommodating space A can be It is filled with air (non-vacuum). In other words, the light transmissive element 401, the side wall 301, and the substrate 201 are surrounded by a closed space (ie, the closed accommodating space A) that houses the ultraviolet light emitting unit 100.

The waterproof film 500 covers the outer edge 2013 of the substrate 201, the outer edge 3011 of the sidewall 301, and at least a partial outer edge 4011 of the light transmissive element 401 to prevent moisture from invading into the closed shape. Set space A. Further, this In the ultraviolet light emitting diode package structure 1000 of the embodiment, only the top surface 4012 of the light transmitting element 401 and the bottom surface 2012 of the substrate 201 are exposed outside the waterproof film 500, but the invention is not limited thereto. The waterproof film 500 is made of a fluorocarbon polymer or an inorganic cerium oxide film. In the embodiment, the waterproof film 500 is made of an amorphous fluoropolymer, and the amorphous fluorine is used. The resin has a terminal functional group of -CONH~Si(OR)n, but the invention is not limited thereto.

[Embodiment 3]

Referring to FIG. 16 to FIG. 21, which is a third embodiment of the present invention, the present embodiment discloses an ultraviolet light emitting diode package structure 1000 including the ultraviolet light emitting unit 100 of the first embodiment, and a manufacturing method thereof. The ultraviolet light emitting unit 100 and the manufacturing method thereof are described in the first embodiment, and the description is not repeated herein.

In addition, in order to facilitate the description of the above-mentioned ultraviolet light emitting diode package structure 1000, this embodiment first introduces a manufacturing method of the ultraviolet light emitting diode package structure 1000, but the ultraviolet light emitting diode package structure 1000 does not The above manufacturing method is limited. The manufacturing method of the ultraviolet light emitting diode package structure 1000 of the present embodiment includes steps S310 to S370, and the specific implementation manner and implementation sequence of the steps S310 to S370 can be adjusted according to the designer's requirements, and Limited by the following. Moreover, in order to facilitate the method of manufacturing the ultraviolet light emitting diode package structure 1000 of the present embodiment, the drawing only illustrates the fabrication of two ultraviolet light emitting diode package structures 1000.

Step S310: As shown in FIG. 16, a substrate assembly 200 and a side wall assembly 300 disposed on the substrate assembly 200 are provided, and the side wall assembly 300 and the substrate assembly 200 are surrounded by a plurality of accommodations. Space A.

Step S320: As shown in FIG. 16, a plurality of ultraviolet light emitting units 100 are respectively disposed in the plurality of accommodating spaces A and mounted on the substrate assembly 200.

Step S330: As shown in FIG. 16, a light transmissive component 400 (including a plurality of light transmissive elements 401) is fixed to the side wall assembly 300 through an adhesive layer 700, so as to The light transmissive elements 401 respectively enclose the plurality of accommodating spaces A. The light transmissive element 401 is preferably a convex lens, which is not limited herein. It should be noted that the enclosed accommodation space A may be filled with air (non-vacuum), so that the ultraviolet light emitting diode package structure 1000 is not required to be used in a vacuum or vacuum package during the manufacturing process. Equipment to effectively reduce the investment cost of manufacturing equipment.

Step S340: As shown in FIG. 17, the substrate assembly 200 is attached to a release tape T, and a wall W higher than the side wall combination 300 is disposed on the release tape T, and The fence W is attached to the outer edge 3011 of the side wall assembly 300. The release tape T may be one of a pyrolytic tape, a heat resistant tape, and an ultraviolet tape in the embodiment, but the release tape T type of the present invention is not limited thereto.

Step S350: As shown in FIG. 17, a glue layer 600 made of polydimethyl siloxane is formed on the side wall assembly 300 and next to each of the light transmissive elements 401. Further, the glue layer 600 is formed in a space surrounded by the side wall combination 300, the light transmissive unit 400, and the wall W.

Step S360: cutting the adhesive layer 600, the adhesive layer 700, the sidewall assembly 300, and the substrate assembly 200, as shown in FIG. 18, so that the substrate assembly 200 is formed with a plurality of substrates 201, and the sidewall combination 300. Forming a plurality of sidewall spacers 301 respectively disposed on the plurality of substrates 201, the adhesive layer 700 is formed with a plurality of adhesives 701 respectively disposed on the plurality of sidewall spacers 301, and the adhesive layer 600 is formed to be respectively surrounded by a plurality of colloids 601 of the plurality of light transmissive elements 401.

Step S370: As shown in FIG. 19, a waterproof film 500 is formed on each of the substrate 201 and the corresponding side wall 301, the light transmissive element 401, and the outer edge of the colloid 601 to form an ultraviolet light emitting diode. The package structure 1000; thereafter, the release tape T and the fence W are removed.

The manufacturing method of the ultraviolet light emitting diode package structure 1000 of the present embodiment is substantially as described above, and the specific structure of the ultraviolet light emitting diode package structure 1000 will be described below. Made. Referring to FIG. 19 to FIG. 21, the ultraviolet light emitting diode package 1000 includes the ultraviolet light emitting unit 100, a substrate 201, a side wall 301, a light transmissive element 401, and a colloid as described in the first embodiment. 601, and a waterproof film 500.

The substrate 201 has two metal pads 202 on its top surface 2011, two external pads 203 on the bottom surface 2012 of the substrate 201, and two connection posts 204 embedded in the substrate 201. And one end of the two connecting posts 204 is respectively connected to the two metal pads 202, and the other ends of the two connecting posts 204 are respectively connected to the two external pads 203, thereby making the above two through the two connecting posts 204 The metal pads 202 are electrically connected to the two external pads 203, respectively.

Further, the ultraviolet light emitting unit 100 is fixed on the substrate 201, and the pad layer 13 of the ultraviolet light emitting unit 100 is fixed on the two metal pads 202 of the substrate 201. The side wall 301 is connected to the substrate 201 and surrounds the outer side of the ultraviolet light emitting unit 100, so that the ultraviolet light emitting unit 100 is located in an accommodating space A formed by the side wall 301 and the substrate 201.

Furthermore, the light-transmitting element 401 is fixed to the side wall 301 by the adhesive 701 and closes the accommodating space A, so that the accommodating space A is closed, and the closed accommodating space A can be It is filled with air (non-vacuum). In other words, the light transmissive element 401, the side wall 301, and the substrate 201 are surrounded by a closed space (ie, the closed accommodating space A) that houses the ultraviolet light emitting unit 100. The colloid 601 is made of polydimethyl siloxane, and the colloid 601 is disposed on an annular outer corner C formed by the sidewall 301 and the transparent component 401, thereby reinforcing the transparent component through the colloid 601. The fixing effect between 401 and the side wall 301.

The waterproof film 500 covers the outer edge of the substrate 201, the outer edge 3011 of the side wall 301, the outer edge 6011 of the colloid 601, and at least a partial outer edge 4011 of the light transmissive element 401 to avoid water. The gas invades into the closed accommodation space A. Further, in the ultraviolet light emitting diode package structure 1000 of the present embodiment, only the light transmitting element 401 and the bottom surface 2012 of the substrate 201 are exposed outside the waterproof film 500, but the invention is not limited thereto. Wherein, the waterproof film 500 is high in fluorine The molecular or inorganic cerium oxide film is made of, in the embodiment, the waterproof film 500 is made of an amorphous fluoropolymer, and the amorphous fluororesin has a terminal functional group of -CONH~Si. (OR)n, but the invention is not limited thereto.

[Technical effect of the embodiment of the present invention]

In summary, the ultraviolet light emitting diode package structure, the ultraviolet light emitting unit, and the ultraviolet light emitting unit manufacturing method disclosed in the embodiments of the present invention are set by the polydimethyl methoxy oxane or the fluorocarbon. a side lens made of molecules, thereby effectively improving the luminous efficiency of the ultraviolet light emitting unit, and the water permeability through the waterproof layer is smaller than the water vapor permeability of the side lens, and The ratio of the water vapor permeability of the side lens to the waterproof layer is at least greater than 10, for example, a waterproof layer made of a fluorine polymer or an inorganic cerium oxide film is disposed on the outer surface of the side lens, thereby effectively avoiding Water vapor invades the ultraviolet light emitting diode chip. In addition, the present invention employs a batwing-shaped ultraviolet light-emitting diode wafer. When the side lens is introduced, the light shape changes from a batwing shape to a Lambertian, thereby improving luminous efficiency.

Further, the outer surface of the side lens of the ultraviolet light emitting unit can also adjust the shape according to the requirements of the luminous efficiency and the light exit angle, thereby meeting different requirements. Furthermore, the ultraviolet light emitting unit can also be used in the manufacturing steps of the subsequent ultraviolet light emitting diode package structure (eg, step S230 and step S330) by providing a waterproof layer, and need not be used separately. Nitrogen or vacuum packaging equipment to effectively reduce the investment cost of manufacturing equipment.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. The equivalents and modifications made by the scope of the present invention should fall within the scope of the claims of the present invention. .

Claims (11)

An ultraviolet light emitting unit comprising: a carrier plate; an ultraviolet light emitting diode chip mounted on the carrier plate, and the ultraviolet light emitting diode chip has a top surface and adjacent to the top surface a side surface of the ring, the top mask has a central area and a peripheral area surrounding the central area and connected to the side of the ring; a side lens disposed on the carrier plate, and the ultraviolet light emitting The ring side of the polar body wafer is covered by the side lens; and a waterproof layer covering an outer surface of the side lens and the periphery of the top surface of the ultraviolet light emitting diode chip a region; wherein a water vapor permeability of the waterproof layer is less than a water vapor permeability of the side lens, and a ratio of water vapor permeability of the side lens to the waterproof layer is at least greater than 10. The ultraviolet light emitting unit of claim 1, wherein the carrier board has a first board surface and a second board surface on opposite sides, and a bottom edge of the outer surface is at least connected to the first board The edge of the board surface, the carrier board further includes: an electrode layer on the first board surface, and the ultraviolet light emitting diode chip is electrically connected to the electrode layer; a pad layer is located at the a second plate surface; a plurality of conductive pillars embedded in the carrier plate, and two ends of each of the conductive posts are respectively connected to the electrode layer and the pad layer; and a reflective layer is located at the The first plate surface surrounds the ultraviolet light emitting diode chip, and the reflective layer is buried in the side lens. The ultraviolet light emitting unit according to claim 1, wherein the ultraviolet light emitting diode chip comprises a multilayer AlxGal-xN film disposed on a sapphire substrate, wherein x>0.2, the ultraviolet light emitting diode chip The wavelength of light that can be emitted is less than 324 nm, and the light pattern of the ultraviolet light emitting diode wafer is batwing (bat wing). The ultraviolet light emitting unit according to claim 1, wherein the outer surface of the side lens includes a plurality of flat surfaces, and a top edge of the plurality of planes is connected to an edge of the top surface And a bottom edge of the plurality of planes is connected to an edge of the carrier plate. The ultraviolet light emitting unit according to claim 1, wherein the outer surface of the side lens includes a plurality of concave surfaces, and a top edge of the plurality of concave curved surfaces is connected to the top surface The edge of the plurality of concave curved surfaces is connected to the edge of the carrier plate. The ultraviolet light emitting unit according to claim 1, wherein the outer surface of the side lens includes a plurality of convex surfaces, and a top edge of the plurality of convex curved surfaces is connected to the top surface The edge of the plurality of convex curved surfaces is connected to the edge of the carrier. The ultraviolet light emitting unit according to claim 1, wherein the waterproof layer is coated on an outer edge of the carrier, the waterproof layer is made of an amorphous fluoropolymer, and the amorphous The fluororesin has a terminal functional group of -CONH~Si(OR)n. The ultraviolet light emitting unit according to claim 1, wherein the side lens is made of a fluoropolymer or a polydimethyl siloxane (PDMS), and the waterproof layer is made of a fluoropolymer or An inorganic ceria film is formed, and the waterproof layer further covers the outer edge of the carrier sheet. An ultraviolet light emitting diode package structure comprising: an ultraviolet light emitting unit comprising: a carrier plate; an ultraviolet light emitting diode chip mounted on the carrier plate, and the ultraviolet light emitting diode The body wafer has a top surface and a ring side surface adjacent to the top surface, the top mask has a central area and a peripheral area surrounding the central area and connected to the side of the ring; a side lens made of a fluorocarbon polymer or polydimethyl methoxy alkane, the side lens is disposed on the carrier plate, and the ring side surface of the ultraviolet light emitting diode chip is The side lens covers; and a waterproof layer made of a fluorine polymer or an inorganic cerium oxide film, the waterproof layer covering an outer surface of the side lens, the ultraviolet light emitting diode The peripheral region of the top surface of the bulk wafer, the water vapor permeability of the waterproof layer is smaller than the water vapor permeability of the side lens, and the side lens and the waterproof layer a water vapor transmission ratio of at least greater than 10; a substrate, the ultraviolet light emitting unit is fixed on the substrate; a side wall connected to the substrate and surrounding the outer side of the ultraviolet light emitting unit; a light transmissive element fixed to the side wall, and the light transmissive element, the side wall, and the substrate are surrounded by a closed space for accommodating the ultraviolet light emitting unit; and a waterproof film, Covering the outer edge of the substrate, the outer edge of the side wall And at least a partial outer edge of the light transmissive element. The ultraviolet light emitting diode package structure according to claim 9, further comprising a colloid made of polydimethyl methoxyoxane, wherein the side wall and the light transmissive element are formed in a ring shape. An outer corner, and the colloid is disposed at the outer corner, and the waterproof film is coated on an outer edge of the colloid. A method for manufacturing an ultraviolet light emitting unit, comprising: mounting a plurality of ultraviolet light emitting diode chips on a carrier board assembly; and attaching to a central area of a top surface of each of the ultraviolet light emitting diode chips Attaching a protective sheet; attaching the carrier plate assembly to a release tape; cutting the carrier plate assembly such that the carrier plates are combined to form a plurality of carrier plates, and each of the carrier plates is provided with a UV light emitting diode chip; Forming, on each of the carrier plates, a side lens covering a side of the ring of the ultraviolet light emitting diode chip; a waterproof layer is formed corresponding to each of the side lenses to cover the side lens An outer surface, a peripheral region of the top surface of the adjacent ultraviolet light emitting diode wafer, and the adjacent protective sheet; and removing the plurality of the protective sheet and the release tape To form a plurality of the ultraviolet light emitting units.