JP5502633B2 - 光通信モジュール - Google Patents
光通信モジュール Download PDFInfo
- Publication number
- JP5502633B2 JP5502633B2 JP2010160211A JP2010160211A JP5502633B2 JP 5502633 B2 JP5502633 B2 JP 5502633B2 JP 2010160211 A JP2010160211 A JP 2010160211A JP 2010160211 A JP2010160211 A JP 2010160211A JP 5502633 B2 JP5502633 B2 JP 5502633B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- optical element
- mounting surface
- communication module
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims description 149
- 238000004891 communication Methods 0.000 title claims description 48
- 239000013307 optical fiber Substances 0.000 claims description 40
- 230000005540 biological transmission Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000835 fiber Substances 0.000 description 26
- 230000008878 coupling Effects 0.000 description 19
- 238000010168 coupling process Methods 0.000 description 19
- 238000005859 coupling reaction Methods 0.000 description 19
- 230000004048 modification Effects 0.000 description 10
- 238000012986 modification Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Description
2…トランシーバ回路部(回路基板部)
3…サブマウント部
4…ファイバスタブ(光接続部材)
5…光ファイバ結合部品
6…実装面
7…基板本体
8…電子部品
9…カードエッジ部
10…接続面
11…下面
12…前面
13…後面
14…側面
15…上面
16…光素子実装面
17…凸部
18〜21…伝送路
22…表面実装用接続部
23…発光素子(光素子)
24…受光素子(光素子)
25…ガイドピン(光軸合わせ手段)
26…側端部
27…前端部
28…光ファイバ
29…スタブ本体
30…短尺の光ファイバ
31…前面
32…後面
33、35…ガイドピン穴(光軸合わせ手段)
34…結合部品本体
36…結合面
37…穴
41、51、61、71…光通信モジュール
42…レンズ部材(光接続部材)
43…凸レンズ
52…固着部材
62…トランシーバ回路部
63…表面実装用リード
72…トランシーバ回路部
73…フロー接続用貫通リード
Claims (2)
- 回路基板部と、
該回路基板部の実装面に実装される略ブロック形状のサブマウント部と、
を備え、
該サブマウント部には、
前記実装面に乗せられる接続面と、
該接続面に設けられ且つ前記実装面の基板側接続部に接触する表面実装用接続部と、
前記接続面に対し略直交方向の面となる光素子実装面と、
該光素子実装面に実装され且つ光軸が前記実装面に対し略平行となる光素子と、
前記接続面及び前記光素子実装面に跨って配線され且つ前記光素子及び前記表面実装用接続部を繋ぐ伝送路と、
を設け、
さらに、前記光素子実装面の前記光素子と該光素子に対応する光ファイバとの間に介在し、前記光ファイバと前記光素子を光接続する光接続部材を備え、
前記光接続部材に対する突き当て用としての凸部を前記光素子実装面に突設し、
前記凸部は、前記光素子実装面を門形に囲うような形状である
ことを特徴とする光通信モジュール。 - 請求項1に記載の光通信モジュールにおいて、
前記凸部には、前記実装面に対して略平行となるように突設されたガイドピンが形成されており、
前記光接続部材には、前記ガイドピンを挿通するガイドピン穴が形成されている
ことを特徴とする光通信モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010160211A JP5502633B2 (ja) | 2010-07-15 | 2010-07-15 | 光通信モジュール |
CN201180034879.6A CN103003952B (zh) | 2010-07-15 | 2011-07-14 | 光通信模块 |
US13/809,709 US8885990B2 (en) | 2010-07-15 | 2011-07-14 | Optical communication module |
EP11806860.0A EP2595195A4 (en) | 2010-07-15 | 2011-07-14 | OPTICAL COMMUNICATION MODULE |
PCT/JP2011/066101 WO2012008530A1 (ja) | 2010-07-15 | 2011-07-14 | 光通信モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010160211A JP5502633B2 (ja) | 2010-07-15 | 2010-07-15 | 光通信モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012023218A JP2012023218A (ja) | 2012-02-02 |
JP5502633B2 true JP5502633B2 (ja) | 2014-05-28 |
Family
ID=45469525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010160211A Expired - Fee Related JP5502633B2 (ja) | 2010-07-15 | 2010-07-15 | 光通信モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US8885990B2 (ja) |
EP (1) | EP2595195A4 (ja) |
JP (1) | JP5502633B2 (ja) |
CN (1) | CN103003952B (ja) |
WO (1) | WO2012008530A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI572928B (zh) * | 2013-01-17 | 2017-03-01 | 鴻海精密工業股份有限公司 | 光通訊模組 |
CN104155728B (zh) * | 2013-05-14 | 2018-05-04 | 爱普迪光通讯科技(深圳)有限公司 | 光电耦合透镜模组 |
KR101725040B1 (ko) * | 2014-11-28 | 2017-04-11 | 주식회사 루셈 | 광소자 설치용 서브마운트를 구비한 광 송수신장치 |
KR101725046B1 (ko) * | 2014-11-28 | 2017-04-11 | 주식회사 루셈 | 삽입 결합에 의해 정렬되는 부품들로 구성된 광 송수신장치 |
KR102015132B1 (ko) | 2016-09-19 | 2019-08-27 | 한국전자통신연구원 | 다채널 광 서브 어셈블리 및 그의 제조방법 |
JP2019184744A (ja) * | 2018-04-05 | 2019-10-24 | 矢崎総業株式会社 | 光コネクタ |
JP7493419B2 (ja) | 2020-09-09 | 2024-05-31 | 株式会社村田製作所 | 光通信モジュール及び積層型コイル部品 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69723630T2 (de) | 1996-08-26 | 2004-04-15 | Sumitomo Electric Industries, Ltd. | Optoelektronisches Modul und Verfahren zu dessen Herstellung |
US7208725B2 (en) | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
JP3230506B2 (ja) * | 1998-12-28 | 2001-11-19 | 日本電気株式会社 | 受光モジュール |
JP3723698B2 (ja) * | 1999-06-30 | 2005-12-07 | 京セラ株式会社 | 光素子キャリア及びその実装構造 |
KR100400081B1 (ko) * | 2001-11-24 | 2003-09-29 | 한국전자통신연구원 | 광전 모듈용 서브마운트 및 이를 이용한 실장 방법 |
JP2003347561A (ja) * | 2002-05-30 | 2003-12-05 | Mitsubishi Electric Corp | 光半導体装置 |
US7665908B2 (en) * | 2006-12-15 | 2010-02-23 | Finisar Corporation | Integrating optoelectronic components into a molded communications module having integrated plastic circuit structures |
JP2009088405A (ja) | 2007-10-02 | 2009-04-23 | Fuji Xerox Co Ltd | 光モジュール |
JP5095575B2 (ja) | 2008-10-14 | 2012-12-12 | 矢崎総業株式会社 | 光素子と光ファイバとの光結合構造 |
US7731433B1 (en) * | 2008-12-05 | 2010-06-08 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optoelectronic surface-mounted device and method for forming an optoelectronic surface-mounted device |
-
2010
- 2010-07-15 JP JP2010160211A patent/JP5502633B2/ja not_active Expired - Fee Related
-
2011
- 2011-07-14 WO PCT/JP2011/066101 patent/WO2012008530A1/ja active Application Filing
- 2011-07-14 US US13/809,709 patent/US8885990B2/en not_active Expired - Fee Related
- 2011-07-14 CN CN201180034879.6A patent/CN103003952B/zh not_active Expired - Fee Related
- 2011-07-14 EP EP11806860.0A patent/EP2595195A4/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
CN103003952A (zh) | 2013-03-27 |
EP2595195A4 (en) | 2014-07-16 |
CN103003952B (zh) | 2015-11-25 |
US20130114925A1 (en) | 2013-05-09 |
EP2595195A1 (en) | 2013-05-22 |
US8885990B2 (en) | 2014-11-11 |
JP2012023218A (ja) | 2012-02-02 |
WO2012008530A1 (ja) | 2012-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5502633B2 (ja) | 光通信モジュール | |
JP4704126B2 (ja) | 光モジュール | |
US8641299B2 (en) | Optical connector | |
JP5184708B1 (ja) | 光モジュール | |
JP2007212564A (ja) | 光コネクタ | |
JP2010122312A (ja) | 送受信レンズブロック及びそれを用いた光モジュール | |
CN101452096A (zh) | 光学互连器件 | |
JP2009260227A (ja) | 光電気変換装置 | |
EP1930758A1 (en) | Optical cable and transmitting/receiving sub-assembly | |
JP4699262B2 (ja) | 光導波路コネクタ及びそれを用いた光接続構造、並びに光導波路コネクタの製造方法 | |
JP4850149B2 (ja) | 光モジュール | |
JP4876830B2 (ja) | 光電気変換装置 | |
JP2007178537A (ja) | 光モジュールおよび光伝送システム | |
JP4114614B2 (ja) | 光送受信装置及び光送受信装置の製造方法 | |
JP2012226384A (ja) | 光導波路保持部材及び光トランシーバ | |
JP4850147B2 (ja) | 光モジュール | |
JP4624071B2 (ja) | 光トランシーバの製造方法 | |
JP5010023B2 (ja) | 光導波路コネクタ及びそれを用いた光接続構造、並びに光導波路コネクタの製造方法 | |
JP2009229601A (ja) | 光モジュール | |
JP2010062087A (ja) | 光電気モジュール | |
JP2009053279A (ja) | 光モジュール | |
JP5094277B2 (ja) | 光モジュール | |
JP4664200B2 (ja) | 光接続装置 | |
JP2013218119A (ja) | 光接続部材及び光モジュール | |
JP2009223346A (ja) | 光トランシーバ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130619 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131029 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140128 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140219 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140311 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140313 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5502633 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |