JP5501985B2 - タッチスクリーンパネル装置 - Google Patents
タッチスクリーンパネル装置 Download PDFInfo
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- JP5501985B2 JP5501985B2 JP2011000714A JP2011000714A JP5501985B2 JP 5501985 B2 JP5501985 B2 JP 5501985B2 JP 2011000714 A JP2011000714 A JP 2011000714A JP 2011000714 A JP2011000714 A JP 2011000714A JP 5501985 B2 JP5501985 B2 JP 5501985B2
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- touch screen
- screen panel
- pad portion
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- 238000001514 detection method Methods 0.000 claims description 99
- 239000000758 substrate Substances 0.000 claims description 97
- 239000010410 layer Substances 0.000 description 16
- 230000001681 protective effect Effects 0.000 description 6
- 239000007772 electrode material Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Position Input By Displaying (AREA)
- Structure Of Printed Boards (AREA)
Description
12a,12b 検出電極
13a,13a’,13b 接続パターン
14 絶縁膜、
15 位置検出ライン、
16 駆動/シールド電極、
20 前面パッド部、
22 背面パッド部、
30 可撓性回路基板、
30a メイン基板部、
30b サブ基板部、
30b1〜30b3 第1ないし第3基板部、
32 第1パッド部、
34 第2パッド部、
36 駆動素子、
38 駆動配線、
39 開口部、
40,50 保護膜、
101 タッチ活性領域、
102 タッチ非活性領域。
Claims (7)
- 透明基板、前記透明基板の一面に形成される複数の検出電極及びこれに接続される前面パッド部、並びに前記透明基板の他面に形成される駆動/シールド電極及びこれに接続される背面パッド部を備えるタッチスクリーンパネルと、
前記タッチスクリーンパネルの前面パッド部に接続される第1パッド部、及び前記タッチスクリーンパネルの背面パッド部に接続される第2パッド部を備え、前記タッチスクリーンパネルの両面に同時に接続される可撓性回路基板と、を備え、
前記可撓性回路基板は、
一端に前記第1パッド部が形成されたメイン基板部と、
前記メイン基板部の一側に延設され、前記タッチスクリーンパネルの一面上に前記第1パッド部と並んで位置し、パッド部を含まず、整列マークを備える第1基板部、前記第1基板部に対向するように配置され、前記第2パッド部を含む第2基板部、並びに前記第1基板部及び前記第2基板部の互いに対応する両側の各々から延び、前記第1基板部と前記第2基板部とを接続し、前記第1及び第2基板部が前記タッチスクリーンパネルの対向する異なる面上に位置するように折り曲げられた状態で実装される複数の第3基板部で構成されるサブ基板部と、を備えることを特徴とするタッチスクリーンパネル装置。 - 前記複数の第3基板部は、互いに対称となるように前記第1及び第2基板部の互いに対応する両側に並んで配列されることを特徴とする請求項1に記載のタッチスクリーンパネル装置。
- 前記サブ基板部は、前記複数の第3基板部の間に形成される開口部を備えることを特徴とする請求項1または2に記載のタッチスクリーンパネル装置。
- 前記複数の第3基板部は、前記第1基板部と前記第2基板部とが互いに重なるように横方向に折り曲げられた状態で実装されることを特徴とする請求項1〜3のいずれか1項に記載のタッチスクリーンパネル装置。
- 前記可撓性回路基板は、前記メイン基板部から引出され、前記複数の第3基板部のうちの1つ以上の第3基板部を経由して前記第2パッド部に接続される1つ以上の駆動配線をさらに備えることを特徴とする請求項1〜4のいずれか1項に記載のタッチスクリーンパネル装置。
- 前記検出電極は、前記透明基板の一面のタッチ活性領域に複数分散して形成され、第1方向または前記第1方向と交差する第2方向に沿って接続されることを特徴とする請求項1〜5のいずれか1項に記載のタッチスクリーンパネル装置。
- 前記駆動/シールド電極は、前記透明基板の他面に全面的に形成されることを特徴とする請求項1〜6のいずれか1項に記載のタッチスクリーンパネル装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100087522A KR101373047B1 (ko) | 2010-09-07 | 2010-09-07 | 연성회로기판 및 이를 구비한 터치스크린패널장치 |
KR10-2010-0087522 | 2010-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012060098A JP2012060098A (ja) | 2012-03-22 |
JP5501985B2 true JP5501985B2 (ja) | 2014-05-28 |
Family
ID=44674408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011000714A Active JP5501985B2 (ja) | 2010-09-07 | 2011-01-05 | タッチスクリーンパネル装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8283567B2 (ja) |
EP (1) | EP2427035B1 (ja) |
JP (1) | JP5501985B2 (ja) |
KR (1) | KR101373047B1 (ja) |
CN (1) | CN102404931B (ja) |
TW (1) | TWI466600B (ja) |
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KR20120080390A (ko) * | 2011-01-07 | 2012-07-17 | 삼성모바일디스플레이주식회사 | 터치 스크린 패널 |
US8711570B2 (en) | 2011-06-21 | 2014-04-29 | Apple Inc. | Flexible circuit routing |
CN106406594B (zh) * | 2011-11-27 | 2019-07-16 | 宸鸿科技(厦门)有限公司 | 触控感测装置及其制造方法 |
KR20130071760A (ko) * | 2011-12-21 | 2013-07-01 | 삼성전기주식회사 | 터치모듈 |
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TWI437934B (zh) | 2012-02-16 | 2014-05-11 | Innocom Tech Shenzhen Co Ltd | 介面模組及其製造方法 |
JP2013171369A (ja) * | 2012-02-20 | 2013-09-02 | Panasonic Liquid Crystal Display Co Ltd | エンベディッド型タッチスクリーン |
JP2013246737A (ja) | 2012-05-28 | 2013-12-09 | Panasonic Liquid Crystal Display Co Ltd | エンベディッド型タッチスクリーン |
KR101400298B1 (ko) * | 2012-06-14 | 2014-06-27 | 삼성디스플레이 주식회사 | 표시 장치 |
KR101400700B1 (ko) * | 2012-07-26 | 2014-05-28 | 이엘케이 주식회사 | 디스플레이용 인터페이스패널 및 그 제조방법 |
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TWI450653B (zh) * | 2012-12-06 | 2014-08-21 | Wintek Corp | 接墊結構 |
US8717325B1 (en) * | 2013-02-18 | 2014-05-06 | Atmel Corporation | Detecting presence of an object in the vicinity of a touch interface of a device |
JP2014222438A (ja) * | 2013-05-14 | 2014-11-27 | 株式会社ジャパンディスプレイ | 電子部品及び電子機器 |
JP6103533B2 (ja) * | 2013-06-12 | 2017-03-29 | アルプス電気株式会社 | 入力装置 |
FR3008809B1 (fr) | 2013-07-18 | 2017-07-07 | Fogale Nanotech | Dispositif accessoire garde pour un appareil electronique et/ou informatique, et appareil equipe d'un tel dispositif accessoire |
FR3013472B1 (fr) | 2013-11-19 | 2016-07-08 | Fogale Nanotech | Dispositif accessoire couvrant pour un appareil portable electronique et/ou informatique, et appareil equipe d'un tel dispositif accessoire |
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KR102321635B1 (ko) * | 2014-08-14 | 2021-11-08 | 삼성디스플레이 주식회사 | 터치 스크린 패널 |
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JP2012060098A (ja) | 2012-03-22 |
EP2427035A1 (en) | 2012-03-07 |
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US8283567B2 (en) | 2012-10-09 |
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TWI466600B (zh) | 2014-12-21 |
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