JP5492697B2 - Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法 - Google Patents

Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法 Download PDF

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Publication number
JP5492697B2
JP5492697B2 JP2010175321A JP2010175321A JP5492697B2 JP 5492697 B2 JP5492697 B2 JP 5492697B2 JP 2010175321 A JP2010175321 A JP 2010175321A JP 2010175321 A JP2010175321 A JP 2010175321A JP 5492697 B2 JP5492697 B2 JP 5492697B2
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Prior art keywords
crystal
quartz
cut
wafer
main surface
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JP2010175321A
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English (en)
Japanese (ja)
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JP2012039227A5 (https=
JP2012039227A (ja
Inventor
周一 水沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2010175321A priority Critical patent/JP5492697B2/ja
Priority to US13/195,439 priority patent/US8653722B2/en
Publication of JP2012039227A publication Critical patent/JP2012039227A/ja
Publication of JP2012039227A5 publication Critical patent/JP2012039227A5/ja
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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H03H9/02023—Characteristics of piezoelectric layers, e.g. cutting angles consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2010175321A 2010-08-04 2010-08-04 Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法 Active JP5492697B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010175321A JP5492697B2 (ja) 2010-08-04 2010-08-04 Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法
US13/195,439 US8653722B2 (en) 2010-08-04 2011-08-01 At-cut quartz-crystal device and methods for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010175321A JP5492697B2 (ja) 2010-08-04 2010-08-04 Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2012039227A JP2012039227A (ja) 2012-02-23
JP2012039227A5 JP2012039227A5 (https=) 2013-08-15
JP5492697B2 true JP5492697B2 (ja) 2014-05-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010175321A Active JP5492697B2 (ja) 2010-08-04 2010-08-04 Ａｔカット水晶デバイス及びａｔカット水晶デバイスの製造方法

Country Status (2)

Country Link
US (1) US8653722B2 (https=)
JP (1) JP5492697B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060628A (ja) * 2010-08-07 2012-03-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス及びその製造方法
USD674364S1 (en) * 2011-07-08 2013-01-15 Nihon Dempa Kogyo Co., Ltd. Crystal unit
JP5797961B2 (ja) * 2011-07-21 2015-10-21 日本電波工業株式会社 圧電振動片及び圧電デバイス
DE102012202727B4 (de) * 2012-02-22 2015-07-02 Vectron International Gmbh Verfahren zur Verbindung eines ersten elektronischen Bauelements mit einem zweiten Bauelement
JP6645832B2 (ja) * 2014-01-06 2020-02-14 株式会社大真空 圧電振動デバイス、及び圧電振動デバイスと回路基板との接合構造
JP7211081B2 (ja) * 2018-12-28 2023-01-24 セイコーエプソン株式会社 振動デバイス
CN117957768A (zh) * 2021-09-06 2024-04-30 株式会社村田制作所 压电振子
CN115863133B (zh) * 2022-12-07 2026-02-27 拓荆键科(海宁)半导体设备有限公司 一种用于晶圆切割后活化预处理的真空腔室及方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5291673A (en) * 1976-01-29 1977-08-02 Seiko Instr & Electronics Ltd Thickness sliding vibrator
JP3390348B2 (ja) * 1998-08-21 2003-03-24 セイコーインスツルメンツ株式会社 水晶振動子およびその製造方法
JP2003017607A (ja) * 2001-06-28 2003-01-17 Kyocera Corp 撮像素子収納用パッケージ
JP2004328028A (ja) 2003-04-21 2004-11-18 Toyo Commun Equip Co Ltd 圧電デバイスとその製造方法
JP4078606B2 (ja) * 2003-04-25 2008-04-23 銭谷産業株式会社 圧電振動子の構造と製造方法
JP2004357121A (ja) * 2003-05-30 2004-12-16 Seiko Epson Corp 圧電振動片の形成方法およびその方法を用いて製造した圧電デバイス
JP2007258918A (ja) * 2006-03-22 2007-10-04 Epson Toyocom Corp 圧電デバイス
JP4851549B2 (ja) * 2009-02-10 2012-01-11 日本電波工業株式会社 圧電デバイス
IL203642A (en) * 2010-02-01 2014-01-30 Yesaiahu Redler A system and method for optimizing electric current utilization in the control of multiplex motors, and a projectile device containing it
JP2012085253A (ja) * 2010-03-25 2012-04-26 Nippon Dempa Kogyo Co Ltd 表面実装型の水晶デバイス及び水晶デバイスの製造方法
JP2012060628A (ja) * 2010-08-07 2012-03-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス及びその製造方法
JP2012156978A (ja) * 2011-01-05 2012-08-16 Nippon Dempa Kogyo Co Ltd Ａｔカットの水晶振動片、水晶デバイス及び水晶振動片の製造方法
JP5778435B2 (ja) * 2011-02-09 2015-09-16 日本電波工業株式会社 表面実装用の圧電デバイス

Also Published As

Publication number Publication date
US8653722B2 (en) 2014-02-18
JP2012039227A (ja) 2012-02-23
US20120032562A1 (en) 2012-02-09

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