JP5490890B2 - セラミック材料及び前記セラミック材料の製造方法 - Google Patents
セラミック材料及び前記セラミック材料の製造方法 Download PDFInfo
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- 229910010293 ceramic material Inorganic materials 0.000 title claims description 74
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 claims description 68
- 238000005245 sintering Methods 0.000 claims description 33
- 239000010936 titanium Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 10
- 239000007858 starting material Substances 0.000 claims description 10
- 238000001354 calcination Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052779 Neodymium Inorganic materials 0.000 claims description 6
- 229910052746 lanthanum Inorganic materials 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 4
- 239000002243 precursor Substances 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 3
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 description 15
- 239000000919 ceramic Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Description
Pb1−(m/2)x-z+zMm x(Zr1−yTiy-z+z)O3 + a−zPbTiO3
前記式中、Mは、Nd、La、Ba、Sr、Sb、Bi、K、Naから選択される少なくとも1種の元素を表し、
この場合、0≦x≦0.1;0.3≦y≦0.7;0≦z≦y;0<(a−z)≦0.03が当てはまり、
mは、それぞれの金属Mの原子価に相応して、+1、+2又は+3の値を有する。
方法段階A)として、1−x−zの化学量論的割合でPb、xの化学量論的割合でM、1−yの化学量論的割合でZr及びy−zの化学量論的割合でTiを有する出発材料を準備し、
方法段階B)として、前記出発材料を混合及び予備粉砕し、
方法段階C)として、B)からの混合物をか焼し、
方法段階D)として、aの化学量論的割合でPbTiO3を添加し、
方法段階E)として、D)からの混合物を混合及び後粉砕し、
方法段階F)として、E)からの混合物を焼結して次の一般式によるセラミック材料にする:
Pb1−(m/2)x−z+zMm x(Zr1−yTiy−z+z)O3 + a−zPbTiO3
前記式中、Mは、Nd、La、Ba、Sr、Sb、Bi、K、Naから選択される1種の元素を表し、
この場合、0≦x≦0.1;0.3≦y≦0.7;0≦z≦y;0≦(a−z)≦0.03が当てはまり、
mは、それぞれの金属Mの原子価に相応して、+1、+2又は+3の値を有する。
Pb1−(m/2)x−z+zMm x(Zr1−yTiy−z+z)O3 + a−zPbTiO3
のセラミック材料は、1070℃の温度でも焼結することができるが、それに対して、か焼の後でPbTiO3添加が行われない相応するセラミック材料は、相応する結晶粒成長を達成するために1120℃の焼結温度を必要とする。
Pb1−(m/2)x−z+zMm x(Zr1−yTiy−z+z)O3 + a−zPbTiO3
[式中、Mは、Nd、La、Ba、Sr、Sb、Bi、K、Naから選択される1つの元素を表し、この場合、0≦x≦0.1;0.3≦y≦0.7;0≦z≦y;0≦(a−z)≦0.03が当てはまり、mはそれぞれの金属Mの原子価に相応して+1、+2又は+3の値をとる]のセラミック材料に焼結させる。こうして得られたセラミック材料は、極めて高い温度に加熱される必要がないか又は異種イオンを有する焼結助剤を添加する必要がなく、極めて良好な圧電特性を有する。
Pb1−(m/2)x−z+zMm x(Zr1−yTiy−z+z)O3
のセラミック材料が存在する。
2 セラミック層
3 内部電極
4 外部電極
Claims (15)
- 一般式:
Pb1−(m/2)x M m x(Zr1−yTi y )O3 + a−zPbTiO3
[式中、Mは、Nd、La、Ba、Sr、Sb、Bi、K、Naから選択される少なくとも1つの元素を表し、この場合、0≦x≦0.1;0.3≦y≦0.7;0≦z≦y;0<(a−z)≦0.03が当てはまり、mはそれぞれの金属Mの原子価に相応して+1、+2又は+3の値をとる]で示されるセラミック材料。 - 0.02≦x≦0.03が当てはまる、請求項1に記載のセラミック材料。
- 前記セラミック材料の平均結晶粒径が1μm〜3μmの範囲内である、請求項1又は2に記載のセラミック材料。
- 前記セラミック材料は、7.6〜8.1g/cm3の範囲内の密度を有する、請求項1から3までのいずれか1項に記載のセラミック材料。
- セラミック材料は付加的な焼結助剤を含まない、請求項1から4までのいずれか1項に記載のセラミック材料。
- 次の方法段階:
A) Pbを1−(m/2)x−zの化学量論的割合で、Mをxの化学量論的割合で、Zrを1−yの化学量論的割合で、Tiをy−zの化学量論的割合で有する出発材料を準備する段階、
B) 前記出発材料を混合及び予備粉砕する段階、
C) 前記B)からの混合物をか焼する段階、
D) PbTiO3をaの化学量論的割合で添加する段階、
E) 前記D)からの混合物を混合し、後粉砕する段階、
F) 前記E)からの混合物を焼結して、一般式:
Pb1−(m/2)x M m x(Zr1−yTi y )O3 + a−zPbTiO3
[式中、Mは、Nd、La、Ba、Sr、Sb、Bi、K、Naから選択される1つの元素を表し、この場合、0≦x≦0.1;0.3≦y≦0.7;0≦z≦y;0≦(a−z)≦0.03が当てはまり、mはそれぞれの金属Mの原子価に相応して+1、+2又は+3の値をとる]のセラミック材料にする段階、
を有する、セラミック材料の製造方法。 - さらに、方法段階E)とF)の間に:
E1) 成形品を成形する段階
の方法段階を有する、請求項6に記載の方法。 - a=zが当てはまるため、焼結後に、一般式:
Pb1−(m/2)x M m x(Zr1−yTi y )O3
のセラミック材料が提供される、請求項6又は7に記載の方法。 - 製造後のセラミック材料の平均結晶粒径が、方法段階D)におけるPbTiO3の添加によって高められる、請求項6から8までのいずれか1項に記載の方法。
- 0.01≦z≦0.1が当てはまる、請求項6から9までのいずれか1項に記載の方法。
- 0≦(a−z)<0.01が当てはまる、請求項6から10までのいずれか1項に記載の方法。
- 方法段階A)において、前記出発材料を酸化物として準備する、請求項6から11までのいずれか1項に記載の方法。
- 方法段階A)において、前記出発材料のZr及びTiを、前駆体として、ジルコニウム−チタン−酸化物(ZTO)の形で又はジルコニウム−チタン−水和物(ZTH)の形で準備する、請求項6から11までのいずれか1項に記載の方法。
- 方法段階C)において、前記混合物を、600℃〜950℃の温度でか焼する、請求項6から13までのいずれか1項に記載の方法。
- 方法段階F)において、前記混合物を、900℃〜1200℃の温度で焼結する、請求項6から14までのいずれか1項に記載の方法。
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