JP5480123B2 - 放熱構造 - Google Patents
放熱構造 Download PDFInfo
- Publication number
- JP5480123B2 JP5480123B2 JP2010283753A JP2010283753A JP5480123B2 JP 5480123 B2 JP5480123 B2 JP 5480123B2 JP 2010283753 A JP2010283753 A JP 2010283753A JP 2010283753 A JP2010283753 A JP 2010283753A JP 5480123 B2 JP5480123 B2 JP 5480123B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat transfer
- heating element
- intermediate material
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
2 冷却用放熱体
3 伝熱用中間材
4 ネジ
21 伝熱用中間材収納部
Claims (2)
- 発熱体と、
この発熱体が取り付けられるとともに、その取り付け接触面に凹状に彫りこまれた伝熱用中間材収納部を有する冷却用放熱体と、
前記伝熱用中間材収納部の形状に合致した形状をなし、前記発熱体と前記冷却用放熱体との両者に接触するように前記伝熱用中間材収納部内に配置された伝熱用中間材とを有し、
前記伝熱用中間材は、その熱膨張率が前記冷却用放熱体の熱膨張率よりも大きく、前記発熱体の発熱時にはこの発熱体からの発熱により前記伝熱用中間材収納部内で膨張して、この発熱体及び前記冷却用放熱体を押圧しながら接触する
ことを特徴とする放熱構造。 - 前記伝熱用中間材はアルミニウムまたはこれを含む合金とし、前記冷却用放熱体は熱伝導性プラスチックとしたことを特徴とする請求項1に記載の放熱構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010283753A JP5480123B2 (ja) | 2010-12-20 | 2010-12-20 | 放熱構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010283753A JP5480123B2 (ja) | 2010-12-20 | 2010-12-20 | 放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012134255A JP2012134255A (ja) | 2012-07-12 |
JP5480123B2 true JP5480123B2 (ja) | 2014-04-23 |
Family
ID=46649528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010283753A Expired - Fee Related JP5480123B2 (ja) | 2010-12-20 | 2010-12-20 | 放熱構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5480123B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018215338B3 (de) * | 2018-09-10 | 2020-01-16 | Dürkopp Adler AG | Kühlvorrichtung für mindestens ein auf einer Leiterplatte montiertes Bauelement |
CN109742057B (zh) * | 2018-09-21 | 2021-05-14 | 华为机器有限公司 | 功率器件及其基底、功率器件组件、射频模块和基站 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0352256A (ja) * | 1989-07-20 | 1991-03-06 | Fujitsu Ltd | 集積回路の放熱構造 |
JP5209856B2 (ja) * | 2006-06-05 | 2013-06-12 | 日本特殊陶業株式会社 | 配線基板 |
TWM302874U (en) * | 2006-07-06 | 2006-12-11 | Cooler Master Co Ltd | Combinative structure of heat radiator |
JP4988609B2 (ja) * | 2008-01-11 | 2012-08-01 | 株式会社日立国際電気 | 配線基板 |
-
2010
- 2010-12-20 JP JP2010283753A patent/JP5480123B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2012134255A (ja) | 2012-07-12 |
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