JP5479321B2 - トランスポートポッドインターフェースおよび分析装置 - Google Patents
トランスポートポッドインターフェースおよび分析装置 Download PDFInfo
- Publication number
- JP5479321B2 JP5479321B2 JP2010504656A JP2010504656A JP5479321B2 JP 5479321 B2 JP5479321 B2 JP 5479321B2 JP 2010504656 A JP2010504656 A JP 2010504656A JP 2010504656 A JP2010504656 A JP 2010504656A JP 5479321 B2 JP5479321 B2 JP 5479321B2
- Authority
- JP
- Japan
- Prior art keywords
- interface
- actuator
- transport pod
- pod
- sealing joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
Description
Claims (10)
- ガス分析装置に接続されるサンプリングプローブと、アクチュエータとを含むトランスポートポッドインターフェースであって、前記アクチュエータが、結合している位置と後退した位置との間でトランスポートポッドインターフェースのオープンスペース内で移動可能に取り付けられ、
結合している位置において、アクチュエータのプレートが、トランスポートポッドのアクセスドアと結合し、
後退した位置において、アクチュエータが、アクチュエータに結合されたアクセスドアをトランスポートポッドインターフェースの基部に向かって移動し、前記基部が、オープンスペースの境界となり、トランスポートポッド内に含まれた分析されるガス量が、アクチュエータの後退した位置におけるサンプリングプローブによってアクセスされることができ、
前記トランスポートポッドインターフェースが、アクチュエータのプレートにおけるアクセスドアが結合された表面と反対側の表面と、基部の少なくとも1つの壁とに常に接触している少なくとも1つのシーリングジョイントを含み、少なくともアクチュエータが後退した位置にある場合、分析されるガス量を隔離するような方法で、アクチュエータと前記基部の間が密閉されることを確実にするように構成された、トランスポートポッドインターフェース。 - シーリングジョイントが、アクチュエータを後退した位置に移動させると少なくとも部分的にシーリングジョイントを圧迫するように構成された、請求項1に記載のインターフェース。
- アクチュエータが、アクセスドアと結合するためのプレートと、アクセスドアに結合されたプレートを移動させるためのジャッキとを含む、請求項1および2のいずれか一項に記載のインターフェース。
- シーリングジョイントがジャッキを取り囲む、請求項3に記載のインターフェース。
- シーリングジョイントが、アクセスドアに結合された表面と反対側のプレートの表面上に固定された、請求項3および4のいずれか一項に記載のインターフェース。
- シーリングジョイントが、基部の少なくとも1つの壁上に固定された、請求項3および4のいずれか一項に記載のインターフェース。
- 周辺シーリングジョイントが、トランスポートポッドのカバーの縁がトランスポートポッドインターフェースと接触している範囲内に配置された、請求項1から6のいずれか一項に記載のインターフェース。
- アクセスドアに結合されたプレートの表面とアクセスドア自体の間に含まれた容積を隔離することが可能な追加のシーリングジョイントを含む、請求項1から7のいずれか一項に記載のインターフェース。
- 少なくとも1つの標準化されたSMIF(標準メカニカルインターフェース)トランスポートポッドまたはFOUP(フロントオープニングユニファイドポッド)トランスポートポッドと結合することが可能な、請求項1から8のいずれか一項に記載のインターフェース。
- 請求項1から9のいずれか一項に記載のインターフェースを含む、分析装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0754852 | 2007-05-04 | ||
FR0754852A FR2915831B1 (fr) | 2007-05-04 | 2007-05-04 | Interface d'enceinte de transport |
PCT/EP2008/054824 WO2008135377A1 (fr) | 2007-05-04 | 2008-04-21 | Interface d'enceinte de transport |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010526428A JP2010526428A (ja) | 2010-07-29 |
JP5479321B2 true JP5479321B2 (ja) | 2014-04-23 |
Family
ID=38472873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010504656A Expired - Fee Related JP5479321B2 (ja) | 2007-05-04 | 2008-04-21 | トランスポートポッドインターフェースおよび分析装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8276432B2 (ja) |
EP (1) | EP2158602B1 (ja) |
JP (1) | JP5479321B2 (ja) |
KR (1) | KR101457731B1 (ja) |
CN (1) | CN101681865B (ja) |
AT (1) | ATE550783T1 (ja) |
FR (1) | FR2915831B1 (ja) |
WO (1) | WO2008135377A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013005363A1 (ja) | 2011-07-06 | 2013-01-10 | 平田機工株式会社 | 容器開閉装置 |
JP5993252B2 (ja) * | 2012-09-06 | 2016-09-14 | 東京エレクトロン株式会社 | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
TWI765789B (zh) * | 2013-01-22 | 2022-05-21 | 美商布魯克斯自動機械美國公司 | 基材運送 |
TWI581504B (zh) * | 2013-06-28 | 2017-05-01 | 富智康(香港)有限公司 | 天線結構及具有該天線結構的無線通訊裝置 |
CN105757712B (zh) * | 2016-05-03 | 2018-03-02 | 徐州徐工筑路机械有限公司 | 一种间歇式尾气检测结构及尾气检测控制系统 |
FR3139904A1 (fr) * | 2022-09-20 | 2024-03-22 | Pfeiffer Vacuum | Dispositif de mesure de la contamination gazeuse d’une enceinte de transport de substrats semi-conducteurs et procédé de mesure associé |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4632624A (en) * | 1984-03-09 | 1986-12-30 | Tegal Corporation | Vacuum load lock apparatus |
US5169272A (en) * | 1990-11-01 | 1992-12-08 | Asyst Technologies, Inc. | Method and apparatus for transferring articles between two controlled environments |
JP3084828B2 (ja) * | 1991-09-20 | 2000-09-04 | 神鋼電機株式会社 | 機械式インターフェース装置 |
JP3175231B2 (ja) * | 1991-10-17 | 2001-06-11 | 神鋼電機株式会社 | 機械式インターフェース装置 |
EP0552756A1 (en) * | 1992-01-21 | 1993-07-28 | Shinko Electric Co. Ltd. | Article storage house in a clean room |
KR100303075B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
JP2850279B2 (ja) * | 1994-02-22 | 1999-01-27 | ティーディーケイ株式会社 | クリーン搬送方法及び装置 |
US5586585A (en) * | 1995-02-27 | 1996-12-24 | Asyst Technologies, Inc. | Direct loadlock interface |
JP2864458B2 (ja) * | 1996-08-07 | 1999-03-03 | ティーディーケイ株式会社 | クリーン搬送方法、クリーンボックス及びクリーン搬送装置 |
JP2001298076A (ja) * | 2000-04-12 | 2001-10-26 | Sony Corp | 基板搬送コンテナ |
JP4516966B2 (ja) * | 2004-09-15 | 2010-08-04 | 株式会社日立国際電気 | 半導体製造装置、基板の装填脱装方法および半導体装置の製造方法 |
FR2883412B1 (fr) * | 2005-03-18 | 2007-05-04 | Alcatel Sa | Procede et dispositif pour le controle de la contamination des plaquettes de substrat |
FR2902235B1 (fr) * | 2006-06-09 | 2008-10-31 | Alcatel Sa | Dispositif de transport, de stockage et de transfert de substrats |
-
2007
- 2007-05-04 FR FR0754852A patent/FR2915831B1/fr not_active Expired - Fee Related
-
2008
- 2008-04-21 KR KR1020097022973A patent/KR101457731B1/ko not_active IP Right Cessation
- 2008-04-21 CN CN2008800186766A patent/CN101681865B/zh not_active Expired - Fee Related
- 2008-04-21 WO PCT/EP2008/054824 patent/WO2008135377A1/fr active Application Filing
- 2008-04-21 JP JP2010504656A patent/JP5479321B2/ja not_active Expired - Fee Related
- 2008-04-21 EP EP08736435A patent/EP2158602B1/fr not_active Not-in-force
- 2008-04-21 AT AT08736435T patent/ATE550783T1/de active
- 2008-05-02 US US12/114,271 patent/US8276432B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2158602A1 (fr) | 2010-03-03 |
US20080276685A1 (en) | 2008-11-13 |
WO2008135377A1 (fr) | 2008-11-13 |
FR2915831A1 (fr) | 2008-11-07 |
JP2010526428A (ja) | 2010-07-29 |
KR101457731B1 (ko) | 2014-11-03 |
FR2915831B1 (fr) | 2009-09-25 |
KR20100016177A (ko) | 2010-02-12 |
CN101681865B (zh) | 2012-04-11 |
EP2158602B1 (fr) | 2012-03-21 |
ATE550783T1 (de) | 2012-04-15 |
US8276432B2 (en) | 2012-10-02 |
CN101681865A (zh) | 2010-03-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100543468C (zh) | 监控对衬底晶片的污染的方法和设备 | |
JP5479321B2 (ja) | トランスポートポッドインターフェースおよび分析装置 | |
KR100959388B1 (ko) | 반도체 웨이퍼 오염물질 측정장치의 vpd유닛과 그도어개폐장치 | |
KR101565091B1 (ko) | 반도체 공정 오염감시용 웨이퍼 이송장치 | |
KR102206505B1 (ko) | 기판 검사 장치 | |
KR102560296B1 (ko) | 기판의 대기 환경 운송 및 저장을 위한 운송 박스의 오염 측정 방법 및 오염 측정 스테이션 | |
US7221176B2 (en) | Vacuum prober and vacuum probe method | |
KR101002950B1 (ko) | 운송 인클로저 내부의 가스 모니터링 시스템 및 방법 | |
JP6531344B2 (ja) | プローブ装置 | |
JPH11297796A (ja) | アライナー | |
WO2020226194A1 (ko) | 프로브 조립체 및 이를 포함하는 마이크로 진공 프로브 스테이션 | |
US6734422B2 (en) | Portable outgas detection apparatus | |
US20070170090A1 (en) | Wafer-transferring pod capable of monitoring processing environment | |
JP4729056B2 (ja) | 真空プローブ装置のための検査ステージ | |
KR102659896B1 (ko) | 프로브 조립체 및 이를 포함하는 마이크로 진공 프로브 스테이션 | |
JP2004095477A (ja) | 荷電粒子線装置 | |
TWM516717U (zh) | 晶舟盒微汙染檢測設備 | |
US10279311B2 (en) | System and method for operating chemical mechanical polishing process | |
JP2005005300A (ja) | 真空プローブ装置のための検査ステージと検査方法 | |
JPH0641124Y2 (ja) | 試料高さ検出機構 | |
JPH01182731A (ja) | 密封容器の気密性能試験方法 | |
JPS63259429A (ja) | 気密封止試験装置 | |
JPH05151922A (ja) | 試料交換装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110418 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120914 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120925 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20121121 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121212 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20130128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130423 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130709 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130717 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130925 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140114 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140212 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5479321 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |