KR100959388B1 - 반도체 웨이퍼 오염물질 측정장치의 vpd유닛과 그도어개폐장치 - Google Patents
반도체 웨이퍼 오염물질 측정장치의 vpd유닛과 그도어개폐장치 Download PDFInfo
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- KR100959388B1 KR100959388B1 KR1020080031128A KR20080031128A KR100959388B1 KR 100959388 B1 KR100959388 B1 KR 100959388B1 KR 1020080031128 A KR1020080031128 A KR 1020080031128A KR 20080031128 A KR20080031128 A KR 20080031128A KR 100959388 B1 KR100959388 B1 KR 100959388B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
Abstract
Description
Claims (3)
- 삭제
- 반도체 웨이퍼 오염물질 측정장치의 VPD유닛 도어개폐장치에 있어서,VPD유닛 본체의 투입구를 개폐하기 위한 도어(114);상기 도어(114)를 전,후진 이동시키도록 실린더로드(113)로 연결된 에어실린더(112)와, 이 에어실린더(112)를 지지하는 플레이트(111)로 이루어진 전,후진부(110); 및상기 전,후진부(110)를 승하강시키기 위하여 상기 플레이트(111)전체와 연결되는 슬라이드블럭(124)와, 이 슬라이드블럭(124)를 상,하 이동시키는 실린더(123)와, 이 실린더(123)의 양측에 위치하여 슬라이드블럭(124)의 상,하이동을 가이드하는 가이드바(125)로 이루어진 승강부(120)를 포함하는 반도체 웨이퍼 오염물질 측정장치의 VPD유닛 도어개폐장치.
- 제 2항에 있어서,상기 슬라이드블럭(124)은 일측에서 보조가이드바(127)로 안내되는 것을 특징으로 하는 반도체 웨이퍼 오염물질 측정장치의 VPD유닛 도어개폐장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080031128A KR100959388B1 (ko) | 2008-04-03 | 2008-04-03 | 반도체 웨이퍼 오염물질 측정장치의 vpd유닛과 그도어개폐장치 |
US12/206,107 US20090249863A1 (en) | 2008-04-03 | 2008-09-08 | Vapor phase decomposition device for semiconductor wafer pollutant measurement apparatus and door opening and closing device |
JP2008265288A JP4903764B2 (ja) | 2008-04-03 | 2008-10-14 | 半導体ウエーハ汚染物質測定装置のvpdユニットとそのドア開閉装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080031128A KR100959388B1 (ko) | 2008-04-03 | 2008-04-03 | 반도체 웨이퍼 오염물질 측정장치의 vpd유닛과 그도어개폐장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090105584A KR20090105584A (ko) | 2009-10-07 |
KR100959388B1 true KR100959388B1 (ko) | 2010-05-24 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020080031128A KR100959388B1 (ko) | 2008-04-03 | 2008-04-03 | 반도체 웨이퍼 오염물질 측정장치의 vpd유닛과 그도어개폐장치 |
Country Status (3)
Country | Link |
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US (1) | US20090249863A1 (ko) |
JP (1) | JP4903764B2 (ko) |
KR (1) | KR100959388B1 (ko) |
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US8710462B2 (en) | 2008-05-22 | 2014-04-29 | Vladimir Balakin | Charged particle cancer therapy beam path control method and apparatus |
US8907309B2 (en) | 2009-04-17 | 2014-12-09 | Stephen L. Spotts | Treatment delivery control system and method of operation thereof |
US9044600B2 (en) | 2008-05-22 | 2015-06-02 | Vladimir Balakin | Proton tomography apparatus and method of operation therefor |
US8718231B2 (en) | 2008-05-22 | 2014-05-06 | Vladimir Balakin | X-ray tomography method and apparatus used in conjunction with a charged particle cancer therapy system |
US8642978B2 (en) | 2008-05-22 | 2014-02-04 | Vladimir Balakin | Charged particle cancer therapy dose distribution method and apparatus |
US8188688B2 (en) | 2008-05-22 | 2012-05-29 | Vladimir Balakin | Magnetic field control method and apparatus used in conjunction with a charged particle cancer therapy system |
US8975600B2 (en) | 2008-05-22 | 2015-03-10 | Vladimir Balakin | Treatment delivery control system and method of operation thereof |
US8129699B2 (en) | 2008-05-22 | 2012-03-06 | Vladimir Balakin | Multi-field charged particle cancer therapy method and apparatus coordinated with patient respiration |
US9095040B2 (en) | 2008-05-22 | 2015-07-28 | Vladimir Balakin | Charged particle beam acceleration and extraction method and apparatus used in conjunction with a charged particle cancer therapy system |
US9628722B2 (en) | 2010-03-30 | 2017-04-18 | Personify, Inc. | Systems and methods for embedding a foreground video into a background feed based on a control input |
US8649592B2 (en) | 2010-08-30 | 2014-02-11 | University Of Illinois At Urbana-Champaign | System for background subtraction with 3D camera |
KR101242246B1 (ko) * | 2011-03-21 | 2013-03-11 | 주식회사 엘지실트론 | 웨이퍼 오염 측정장치 및 웨이퍼의 오염 측정 방법 |
US9414016B2 (en) | 2013-12-31 | 2016-08-09 | Personify, Inc. | System and methods for persona identification using combined probability maps |
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US9916668B2 (en) | 2015-05-19 | 2018-03-13 | Personify, Inc. | Methods and systems for identifying background in video data using geometric primitives |
US9883155B2 (en) | 2016-06-14 | 2018-01-30 | Personify, Inc. | Methods and systems for combining foreground video and background video using chromatic matching |
US9881207B1 (en) | 2016-10-25 | 2018-01-30 | Personify, Inc. | Methods and systems for real-time user extraction using deep learning networks |
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US11800056B2 (en) | 2021-02-11 | 2023-10-24 | Logitech Europe S.A. | Smart webcam system |
US11800048B2 (en) | 2021-02-24 | 2023-10-24 | Logitech Europe S.A. | Image generating system with background replacement or modification capabilities |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060036951A (ko) * | 2004-10-27 | 2006-05-03 | 삼성전자주식회사 | 반도체 장치 제조용 스피너 |
KR20070058797A (ko) * | 2005-12-05 | 2007-06-11 | 삼성전자주식회사 | 반도체 웨이퍼의 오염 분석을 위한 전처리 방법 및 이를이용한 장치 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2229247T3 (es) * | 1995-03-28 | 2005-04-16 | Brooks Automation Gmbh | Estacion de carga y descarga para instalaciones de tratamiento de semiconductores. |
JP3670837B2 (ja) * | 1998-05-01 | 2005-07-13 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100383264B1 (ko) * | 2001-03-21 | 2003-05-09 | 삼성전자주식회사 | 반도체 웨이퍼의 오염물질 포집장치 및 포집방법 |
JP3584262B2 (ja) * | 2001-09-18 | 2004-11-04 | 理学電機工業株式会社 | 蛍光x線分析用試料前処理システムおよびそれを備えた蛍光x線分析システム |
KR100479308B1 (ko) * | 2002-12-23 | 2005-03-28 | 삼성전자주식회사 | 기판상의 불순물을 포집하기 위한 장치 및 이를 이용한불순물 포집방법 |
KR100532200B1 (ko) * | 2003-02-21 | 2005-11-29 | 삼성전자주식회사 | 불순물 포집 장치 및 방법 |
JP2004296506A (ja) * | 2003-03-25 | 2004-10-21 | Dainippon Screen Mfg Co Ltd | 基板処理方法およびその装置 |
JP2005123494A (ja) * | 2003-10-20 | 2005-05-12 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法および分析方法 |
JP2005327996A (ja) * | 2004-05-17 | 2005-11-24 | Sigma Meltec Ltd | 試験液収集装置 |
-
2008
- 2008-04-03 KR KR1020080031128A patent/KR100959388B1/ko active IP Right Grant
- 2008-09-08 US US12/206,107 patent/US20090249863A1/en not_active Abandoned
- 2008-10-14 JP JP2008265288A patent/JP4903764B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20060036951A (ko) * | 2004-10-27 | 2006-05-03 | 삼성전자주식회사 | 반도체 장치 제조용 스피너 |
KR20070058797A (ko) * | 2005-12-05 | 2007-06-11 | 삼성전자주식회사 | 반도체 웨이퍼의 오염 분석을 위한 전처리 방법 및 이를이용한 장치 |
Also Published As
Publication number | Publication date |
---|---|
US20090249863A1 (en) | 2009-10-08 |
JP2009250973A (ja) | 2009-10-29 |
JP4903764B2 (ja) | 2012-03-28 |
KR20090105584A (ko) | 2009-10-07 |
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