JP5479098B2 - Led半導体ボディおよびled半導体ボディの使用方法 - Google Patents
Led半導体ボディおよびled半導体ボディの使用方法 Download PDFInfo
- Publication number
- JP5479098B2 JP5479098B2 JP2009529522A JP2009529522A JP5479098B2 JP 5479098 B2 JP5479098 B2 JP 5479098B2 JP 2009529522 A JP2009529522 A JP 2009529522A JP 2009529522 A JP2009529522 A JP 2009529522A JP 5479098 B2 JP5479098 B2 JP 5479098B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor body
- led semiconductor
- led
- voltage
- active layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006046038A DE102006046038A1 (de) | 2006-09-28 | 2006-09-28 | LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers |
| DE102006046038.3 | 2006-09-28 | ||
| PCT/DE2007/001693 WO2008040300A1 (de) | 2006-09-28 | 2007-09-19 | Led-halbleiterkörper und verwendung eines led-halbleiterkörpers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010505251A JP2010505251A (ja) | 2010-02-18 |
| JP2010505251A5 JP2010505251A5 (https=) | 2011-06-16 |
| JP5479098B2 true JP5479098B2 (ja) | 2014-04-23 |
Family
ID=39118340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009529522A Expired - Fee Related JP5479098B2 (ja) | 2006-09-28 | 2007-09-19 | Led半導体ボディおよびled半導体ボディの使用方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8283684B2 (https=) |
| EP (1) | EP2062296B1 (https=) |
| JP (1) | JP5479098B2 (https=) |
| KR (1) | KR101421761B1 (https=) |
| CN (1) | CN101563778B (https=) |
| DE (1) | DE102006046038A1 (https=) |
| TW (1) | TWI384644B (https=) |
| WO (1) | WO2008040300A1 (https=) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008025160A1 (de) * | 2008-05-26 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Projektor für kleinste Projektionsflächen und Verwendung einer Mehrfarben-LED in einem Projektor |
| KR101332794B1 (ko) * | 2008-08-05 | 2013-11-25 | 삼성전자주식회사 | 발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법 |
| DE102008053731B4 (de) * | 2008-10-29 | 2024-10-31 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| US7983317B2 (en) * | 2008-12-16 | 2011-07-19 | Corning Incorporated | MQW laser structure comprising plural MQW regions |
| DE102010023342A1 (de) | 2010-06-10 | 2011-12-15 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung und Leuchtmittel insbesondere mit solch einer Leuchtdiodenanordnung |
| CN101902856A (zh) * | 2010-07-05 | 2010-12-01 | 陆敬仁 | 又一种用交流电直接驱动普通led的方法 |
| US8809897B2 (en) | 2011-08-31 | 2014-08-19 | Micron Technology, Inc. | Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods |
| US9490239B2 (en) * | 2011-08-31 | 2016-11-08 | Micron Technology, Inc. | Solid state transducers with state detection, and associated systems and methods |
| US9070613B2 (en) * | 2011-09-07 | 2015-06-30 | Lg Innotek Co., Ltd. | Light emitting device |
| EP2618388B1 (en) * | 2012-01-20 | 2019-10-02 | OSRAM Opto Semiconductors GmbH | Light-emitting diode chip |
| TWI470826B (zh) * | 2012-03-30 | 2015-01-21 | Phostek Inc | 發光二極體裝置 |
| JP6071650B2 (ja) * | 2013-03-01 | 2017-02-01 | スタンレー電気株式会社 | 半導体発光装置 |
| US9825088B2 (en) * | 2015-07-24 | 2017-11-21 | Epistar Corporation | Light-emitting device and manufacturing method thereof |
| US10784398B2 (en) | 2015-12-24 | 2020-09-22 | Vuereal Inc. | Vertical solid state devices |
| US9859470B2 (en) | 2016-03-10 | 2018-01-02 | Epistar Corporation | Light-emitting device with adjusting element |
| US11721784B2 (en) | 2017-03-30 | 2023-08-08 | Vuereal Inc. | High efficient micro devices |
| US11600743B2 (en) | 2017-03-30 | 2023-03-07 | Vuereal Inc. | High efficient microdevices |
| CN110709989B (zh) * | 2017-03-30 | 2023-12-01 | 维耶尔公司 | 垂直固态装置 |
| JP7323783B2 (ja) | 2019-07-19 | 2023-08-09 | 日亜化学工業株式会社 | 発光装置の製造方法及び発光装置 |
| DE102020001353B3 (de) * | 2020-03-03 | 2020-12-31 | Azur Space Solar Power Gmbh | Stapelförmiges photonisches lll-V-Halbleiterbauelement und Optokoppler |
| US11489089B2 (en) | 2020-06-19 | 2022-11-01 | Lextar Electronics Corporation | Light emitting device with two vertically-stacked light emitting cells |
| US20230307597A1 (en) * | 2020-07-03 | 2023-09-28 | Lg Electronics Inc. | Display device using micro led |
| WO2022178393A1 (en) * | 2021-02-22 | 2022-08-25 | The Regents Of The University Of California | Monolithic, cascaded, multiple color light-emitting diodes with independent junction control |
| CN117438516A (zh) * | 2023-12-21 | 2024-01-23 | 江西兆驰半导体有限公司 | 一种垂直结构高压Micro LED芯片及其制备方法 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2323971C2 (de) | 1973-05-11 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | Bauelement mit Lumineszenzdiode |
| DE2342298A1 (de) * | 1973-08-22 | 1975-02-27 | Licentia Gmbh | Mehrfach-leuchtdiode |
| GB1485462A (en) * | 1975-01-09 | 1977-09-14 | Thorn Electrical Ind Ltd | High voltage semi-conductor lamps |
| DD219086A3 (de) * | 1982-01-04 | 1985-02-20 | Karl Marx Stadt Tech Hochschul | Wechselspannungsangesteuerte lumineszenzdioden |
| US4939426A (en) * | 1987-03-19 | 1990-07-03 | United States Of America | Light emitting diode array |
| DE3929477A1 (de) * | 1989-09-05 | 1991-03-07 | Siemens Ag | Led-anordnung |
| JP2549205B2 (ja) * | 1990-12-26 | 1996-10-30 | ローム株式会社 | Ledアレイ光源 |
| JP3352840B2 (ja) * | 1994-03-14 | 2002-12-03 | 株式会社東芝 | 逆並列接続型双方向性半導体スイッチ |
| DE9404982U1 (de) * | 1994-03-23 | 1994-06-01 | Siemens AG, 80333 München | Leuchtdiode mit hohem Wirkungsgrad |
| JP2000244020A (ja) * | 1999-02-23 | 2000-09-08 | Matsushita Electric Works Ltd | 光源装置 |
| US6885035B2 (en) * | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
| US6323598B1 (en) * | 2000-09-29 | 2001-11-27 | Aerospace Optics, Inc. | Enhanced trim resolution voltage-controlled dimming led driver |
| US6547249B2 (en) * | 2001-03-29 | 2003-04-15 | Lumileds Lighting U.S., Llc | Monolithic series/parallel led arrays formed on highly resistive substrates |
| WO2003026355A2 (de) * | 2001-08-30 | 2003-03-27 | Osram Opto Semiconductors Gmbh | Elektrolumineszierender körper |
| US6822991B2 (en) * | 2002-09-30 | 2004-11-23 | Lumileds Lighting U.S., Llc | Light emitting devices including tunnel junctions |
| JP4072632B2 (ja) | 2002-11-29 | 2008-04-09 | 豊田合成株式会社 | 発光装置及び発光方法 |
| TW591811B (en) * | 2003-01-02 | 2004-06-11 | Epitech Technology Corp Ltd | Color mixing light emitting diode |
| CN1275337C (zh) * | 2003-09-17 | 2006-09-13 | 北京工大智源科技发展有限公司 | 高效高亮度多有源区隧道再生白光发光二极管 |
| DE102004004765A1 (de) * | 2004-01-29 | 2005-09-01 | Rwe Space Solar Power Gmbh | Aktive Zonen aufweisende Halbleiterstruktur |
| JP2005229037A (ja) | 2004-02-16 | 2005-08-25 | Kankyo Shomei:Kk | 発光ダイオード点灯回路 |
| DE102005007601B4 (de) | 2004-02-20 | 2023-03-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement, Vorrichtung mit einer Mehrzahl optoelektronischer Bauelemente und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| JP3802911B2 (ja) | 2004-09-13 | 2006-08-02 | ローム株式会社 | 半導体発光装置 |
| US7095052B2 (en) * | 2004-10-22 | 2006-08-22 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Method and structure for improved LED light output |
| US7772601B2 (en) * | 2005-02-04 | 2010-08-10 | Seoul Opto Device Co., Ltd. | Light emitting device having a plurality of light emitting cells and method of fabricating the same |
-
2006
- 2006-09-28 DE DE102006046038A patent/DE102006046038A1/de not_active Withdrawn
-
2007
- 2007-09-19 EP EP07817544.5A patent/EP2062296B1/de not_active Not-in-force
- 2007-09-19 KR KR1020097008601A patent/KR101421761B1/ko not_active Expired - Fee Related
- 2007-09-19 US US12/443,155 patent/US8283684B2/en not_active Expired - Fee Related
- 2007-09-19 CN CN200780035954.4A patent/CN101563778B/zh not_active Expired - Fee Related
- 2007-09-19 WO PCT/DE2007/001693 patent/WO2008040300A1/de not_active Ceased
- 2007-09-19 JP JP2009529522A patent/JP5479098B2/ja not_active Expired - Fee Related
- 2007-09-27 TW TW096135846A patent/TWI384644B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE102006046038A1 (de) | 2008-04-03 |
| US20110240955A1 (en) | 2011-10-06 |
| US8283684B2 (en) | 2012-10-09 |
| JP2010505251A (ja) | 2010-02-18 |
| WO2008040300A1 (de) | 2008-04-10 |
| CN101563778A (zh) | 2009-10-21 |
| KR101421761B1 (ko) | 2014-07-22 |
| CN101563778B (zh) | 2014-07-09 |
| EP2062296A1 (de) | 2009-05-27 |
| TWI384644B (zh) | 2013-02-01 |
| TW200826326A (en) | 2008-06-16 |
| EP2062296B1 (de) | 2017-07-05 |
| KR20090064469A (ko) | 2009-06-18 |
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