GB1485462A - High voltage semi-conductor lamps - Google Patents
High voltage semi-conductor lampsInfo
- Publication number
- GB1485462A GB1485462A GB437574A GB437574A GB1485462A GB 1485462 A GB1485462 A GB 1485462A GB 437574 A GB437574 A GB 437574A GB 437574 A GB437574 A GB 437574A GB 1485462 A GB1485462 A GB 1485462A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductor
- semi
- jan
- high voltage
- lamps
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Abstract
1485462 Semi-conductor lamps THORN ELECTRICAL INDUSTRIES Ltd 9 Jan 1975 [30 Jan 1974] 04375/74 Heading H1K A semi-conductor lamp comprises a stack of ohmically-contacted P-N junction containing electroluminescent chips 11 connected together in series by a conductive cement such as metalcontaining epoxy cement 12. The chips 11 may be of GaP and/or GaAsP grown by liquid phase epitaxy, the P layer 15 in each case being doped with zinc and oxygen. Each chip carries a gold electrode on its upper face and a tin/gold layered electrode on its lower face. The device may be encapsulated in transparent epoxy.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB437574A GB1485462A (en) | 1975-01-09 | 1975-01-09 | High voltage semi-conductor lamps |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB437574A GB1485462A (en) | 1975-01-09 | 1975-01-09 | High voltage semi-conductor lamps |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1485462A true GB1485462A (en) | 1977-09-14 |
Family
ID=9775988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB437574A Expired GB1485462A (en) | 1975-01-09 | 1975-01-09 | High voltage semi-conductor lamps |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1485462A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3929477A1 (en) * | 1989-09-05 | 1991-03-07 | Siemens Ag | LED module for operation as motor vehicle light source - has several LED chips mechanically combined and electrically in series |
EP1475835A2 (en) * | 2003-04-14 | 2004-11-10 | Epitech Corporation, Ltd. | Color mixing light emitting diode |
US7064354B2 (en) | 2003-01-02 | 2006-06-20 | Epitech Technology Corporation | Color mixing light emitting diode |
DE102006046038A1 (en) * | 2006-09-28 | 2008-04-03 | Osram Opto Semiconductors Gmbh | LED semiconductor body for e.g. vehicle lighting, has radiation-generating active layers adjusted to operating voltage such that voltage dropping at series resistor is larger as voltage dropping at semiconductor body |
WO2008043324A1 (en) * | 2006-09-28 | 2008-04-17 | Osram Opto Semiconductors Gmbh | Led semiconductor element, and use thereof |
-
1975
- 1975-01-09 GB GB437574A patent/GB1485462A/en not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3929477A1 (en) * | 1989-09-05 | 1991-03-07 | Siemens Ag | LED module for operation as motor vehicle light source - has several LED chips mechanically combined and electrically in series |
US7064354B2 (en) | 2003-01-02 | 2006-06-20 | Epitech Technology Corporation | Color mixing light emitting diode |
EP1475835A2 (en) * | 2003-04-14 | 2004-11-10 | Epitech Corporation, Ltd. | Color mixing light emitting diode |
EP1475835A3 (en) * | 2003-04-14 | 2004-12-15 | Epitech Corporation, Ltd. | Color mixing light emitting diode |
DE102006046038A1 (en) * | 2006-09-28 | 2008-04-03 | Osram Opto Semiconductors Gmbh | LED semiconductor body for e.g. vehicle lighting, has radiation-generating active layers adjusted to operating voltage such that voltage dropping at series resistor is larger as voltage dropping at semiconductor body |
WO2008043324A1 (en) * | 2006-09-28 | 2008-04-17 | Osram Opto Semiconductors Gmbh | Led semiconductor element, and use thereof |
US8003974B2 (en) | 2006-09-28 | 2011-08-23 | Osram Opto Semiconductors Gmbh | LED semiconductor element having increased luminance |
US8283684B2 (en) | 2006-09-28 | 2012-10-09 | Osram Opto Semiconductors Gmbh | LED semiconductor body and use of an LED semiconductor body |
US8314431B2 (en) | 2006-09-28 | 2012-11-20 | Osram Opto Semiconductors Gmbh | LED semiconductor element having increased luminance |
DE102006051745B4 (en) | 2006-09-28 | 2024-02-08 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | LED semiconductor body and use of an LED semiconductor body |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |