CN108028250A - 包含电子电路的led光源 - Google Patents
包含电子电路的led光源 Download PDFInfo
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Abstract
本发明提出了一种电致发光光源,其包括布置在由硅制成的基板上的发光二极管。光源集成了执行控制发光二极管所必需的功能的电子电路。
Description
技术领域
本发明涉及尤其用于机动车辆的照明和光信号的领域。
背景技术
在用于机动车辆的照明和光信号的领域中,使用基于发光半导体部件(例如发光二极管,LED)的光源变得越来越普遍。当具有至少等于阈值的值的电压(被称为直流电压)施加到其端子时,LED部件发射光线。
以已知的方式,用于机动车辆的照明模块的一个或多个LED经由包括转换器电路的电源控制装置被供电。电源控制装置被配置为将例如由诸如电池的机动车辆的电流源输送的第一强度的电流转换成具有与第一强度不同的第二强度的负载电流。控制装置典型地由专用印刷电路板(PCB)上的表面安装元件SMD(“表面安装装置”)形成,该专用印刷电路板相对于包括LED的PCB的位置是远程的。控制装置通过合适的布线与LED电连接。
已知的构造因此涉及多个印刷电路板,这些印刷电路板在设计用于机动车辆的照明模块时会产生难以管理的体积和重量。具体而言,用于容纳这种模块的各种电子部件的空间是有限的,并且减轻重量目前被认为是汽车设计领域的总体目标。
发明内容
本发明的一个目的是提出克服上述问题的解决方案。更具体地,本发明的一个目的是提出一种集成了实现控制光源所需的功能的电子电路的LED光源。
本发明的一个主题是一种半导体光源,其包括由硅制成的第一基板和布置在基板上的至少一个发光二极管。光源的特征在于,光源包括旨在执行控制二极管所必需的功能的电子电路。
电子电路可以优选地被植入在源的第一基板上。
源可以优选地包括由硅制成并且附接到第一基板的第二基板,电子电路被植入到第二基板上。源可以包括多个由硅制成并附接到第一基板的第二基板。
第二基板可以优选地在与其上布置有二极管的面相反的面上附接到第一基板。
基板可以优选通过锡焊彼此附接,特别是通过金锡锡焊。
两个基板可以优选地包括旨在用于两个基板的电互连的通孔。
源可以优选地包括多个发光二极管。
发光二极管可以优选为从基板突出的亚毫米尺寸的发光杆的形式。
杆可以优选地布置成矩阵。矩阵可以优选地是规则的,使得在给定对准的两个连续杆之间存在恒定的间隔,或者使得杆以梅花状排列。
杆的高度可以优选地在1微米和10微米之间。
端面的最大尺寸可以优选地小于2微米。
分隔两个直接相邻的杆的最小距离可以优选地等于10微米。
光源的照明表面的面积可以优选地至多为8平方毫米。
由多个发光杆实现的亮度可以为例如至少60Cd/mm2。
可选地,发光二极管可以是薄膜的形式。
二极管可以优选地分布成多个组,每个组的二极管能够发射特定的光。
这些组可以具有彼此不同的形状,尺寸和/或数量的二极管。
优选地,每个组可以独立于其他组而被供电。
每个组可以优选能够发射特定强度和/或颜色的光。
第一基板可以优选地包括旨在通过桥接将其与电流源电连接的键合焊盘。
电子电路可以优选地能够执行以下功能中的至少一个:
存储与发光二极管相关的堆栈信息;
测量发光二极管的温度;
控制对发光二极管的电力供应;
可以在至少两个照明功能之间切换的电路;
能够选择发光二极管的多个组的特定电连接的电路;
保护杆的组和/或限制流过这些组的电流。
该电路可以特别优选地在光源的多组二极管的串联连接和并联连接之间切换。
电子电路可以优选例如通过蚀刻直接集成到源的基板中。
本发明的另一主题是一种照明模块,其包括:
至少一个能够发射光线的光源;
能够接收光线并产生光束的光学装置。
该模块的特征在于光源是根据本发明的光源。
本发明的规定是有利的,因为它们能够获得将光源的第一主要功能,即光线发射的功能与用于电气控制光源的至少一个第二功能聚集在一起的电子部件。与已知部件相比,由于本发明使得可以省去专用于控制光源的印刷电路板,所以节省体积是显而易见的。类似地,本发明引起源/控制装置组件的重量减轻。
附图说明
借助于描述和附图将更好理解本发明的其它特征和优点,其中:
图1是在本发明的一个优选实施例中实施的光源的视图;
图2是根据本发明的一个优选实施例的光源的横截面的示意图;
图3是根据本发明的一个优选实施例的光源的横截面的示意图。
具体实施方式
在以下描述中,通常将使用相似的附图标记来描述本发明的各种实施例中的类似概念。因此,数字001,101,201描述了根据本发明的不同实施例的光源。
除非另外指定,否则针对一个给定实施例详细描述的技术特征可以与在通过非限制性示例描述的其他实施例的上下文中描述的技术特征相结合。
图1示出了根据本发明第一实施例的电致发光光源001。图1说明了光源的基本原理。光源001包括由硅制成的基板010,在基板010上布置有从基板突出的导线020形式的一系列发光二极管或杆。每个杆020的芯部022由n型半导体材料制成,也就是说掺杂有电子的半导体材料,而外壳024由p型半导体材料制成,即掺杂有空穴的半导体材料。在n型和p型半导体材料之间提供复合区域026。然而,特别取决于所选择的技术,可以设想反转半导体材料。
基板有利地由硅制成,并且杆的直径小于1微米。可变地,基板包括掺杂有空穴的半导体材料层,并且线具有在100nm和500nm之间的直径。掺杂有电子和空穴的形成二极管的半导体材料可以有利地为氮化镓(GaN)或氮化镓铟(InGaN)。杆的高度通常在1微米至10微米之间,而端面的最大尺寸小于2微米。根据一个优选实施例,杆以规则分布排列成矩阵。两个杆之间的距离是恒定的并且等于至少10微米。杆可以以梅花形排列。这种光源的照明表面的面积最多为8平方毫米。光源能够产生至少60Cd/mm2的亮度。
参照图1,基板010包括有利地由硅制成的主层030,布置在主层的与杆020相对的面上的第一电极或阴极040以及布置在包括杆020的面上的第二电极或阳极050。阳极050与形成杆020的外壳024并在基板010的相应面上延伸的p型半导体材料接触,以在所述外壳024和阳极050之间形成导电层。杆的芯部或中心022就其本身而言与半导体主层030接触并因此与阴极040电接触。
当在阳极和阴极之间施加电压时,n型半导体材料的电子与p型半导体材料的空穴复合并发射光子。大部分复合是辐射性复合。杆的发射面是p区,因为这是最具辐射性的。
根据本发明的一些实施例,光源001包括连接到不同阳极的多组发光杆。因此每个组都可以独立于其他组而被供电。每组的杆有利地全部是相同类型的,也就是说以相同的光谱发射并且以相同的强度发射。这些组有利地是相同的并且表现出共同的直流电压。因此每个组优选地包括基本上相同数量的发光杆。可选地,每个组可以呈现不同的几何形状,并且这些组可以具有不同的大小。根据本发明的原理,旨在执行控制杆所需功能的电子电路被集成到这样的光源中。
在专利文献EP2223348A1中描述了用于在由硅制成的基板上获得发光二极管光源的替代技术。例如由氮化镓GaN制成的有源层沉积在由蓝宝石制成的基板上,然后将有源层转移到由硅制成的基板或晶片上,该组装例如使用金锡锡焊被执行。所得到的二极管通常被称为薄膜发光二极管。根据本发明,光源可以包括多组这种类型的发光二极管,每个组可以独立于其他组而被供电。每个组的二极管有利地全部是相同的类型,也就是说以相同的光谱发射并以共同的强度发射。根据本发明的原理,旨在执行控制二极管所必需的功能的电子电路被集成到这样的光源中。
在优选实施例2和3中示出了示例性集成。图2示出了包括由硅制成的基板110和布置在基板上的至少一个薄膜发光二极管120的电致发光光源101。可选地,如关于图1所描述的,发光二极管可以是微米线或纳米线的形式。该源还包括电子电路130,该电子电路130旨在执行控制二极管120所需的功能。基板110由硅制成,由此使得可以例如通过蚀刻将电路130直接集成到基板110中。直接植入电子电路130使得有可能省去电路130和二极管120之间的外部互连装置。电流通过基板110的表面处的共用连接提供给二极管120和电路130。在图示的示例中,键合焊盘150连接电路130,电路130连接二极管120。到机动车辆的电流源的连接通过经由金属线(“引线键合”)或经由金属条带(“带状键合”)的桥接152实现。根据本发明的配置使得可以在基板110上将多个功能组合在一起。例如,电子电路130可以执行以下功能之一,其实现方式在本领域技术人员的范围内:
存储与发光二极管120有关的堆栈(bin)信息;
测量发光二极管120的温度;
控制对发光二极管120的电力供应;
能够在至少两个照明功能120之间例如在“远光束”功能和“近光束”功能之间切换的电路;
能够选择发光二极管的多个组的特定电连接的电路。该电路尤其可以在光源的多组二极管的串联连接和并联连接之间切换,
保护杆的组和/或限制流过这些组的电流。
本领域技术人员能够设想和实施其他功能,而不会偏离本发明的范围,给出的列表不是穷尽的。
图3的实施例包括电致发光光源201,其包括由硅制成的第一基板210和从基板突出的亚毫米尺寸的发光杆220。可选地,薄膜发光二极管可以布置在基板上。光源还包括由硅制成的第二基板240并且第二基板240容纳旨在执行控制二极管220所必需的功能的电子电路230。
第二基板240被附接到第一基板210。两个基板例如通过金锡锡焊彼此附接。第二基板240在第一基板210的与布置二极管220的面相反的面上附接到第一基板210。由该组件产生的部件是“多芯片封装”类型的,第二基板相对于源的主要功能,即,发出光线的功能,集成附加功能,即与光源的控制相关联的功能。
电流通过基板210的表面处的共用连接提供给二极管220和电路230。在图示的示例中,键合焊盘250连接电路230,电路130连接二极管120。通过桥接252(“引线键合”)实现到机动车辆的电流源的连接。基板210和230之间的电连接例如通过通孔242实现。TSV(“穿硅通孔”)技术使得例如可以通过激光钻孔基板来产生孔。通常通过铜的电化学沉积来使得到的孔金属化。
Claims (14)
1.一种半导体光源,包括:
由硅制成的第一基板;
布置在基板上的至少一个发光二极管;其特征在于:
所述光源包括旨在执行控制二极管所必需的功能的电子电路。
2.根据权利要求1所述的光源,其特征在于,
所述电子电路被植入在所述光源的第一基板上。
3.根据权利要求1所述的光源,其特征在于,
所述光源包括由硅制成并附接到所述第一基板的第二基板,所述电子电路被植入到所述第二基板上。
4.根据权利要求3所述的光源,其特征在于,
所述第二基板在与其上布置有所述二极管的面相反的面上附接到所述第一基板。
5.根据权利要求3和4中任一项所述的光源,其特征在于,
所述基板通过锡焊,特别是通过金锡锡焊彼此附接。
6.根据权利要求3至5中任一项所述的光源,其特征在于,
所述两个基板包括旨在用于两个基板的电互连的通孔。
7.根据权利要求1至6中任一项所述的光源,其特征在于,
所述光源包括多个发光二极管。
8.根据权利要求1至7中任一项所述的光源,其特征在于,
所述发光二极管成从基板突出的亚毫米尺寸的发光杆的形式。
9.根据权利要求1至8中任一项所述的光源,其特征在于,
所述发光二极管成薄膜的形式。
10.根据权利要求1至9中任一项所述的光源,其特征在于,
所述二极管分布成多个组,每个组的二极管能够发射特定的光。
11.根据权利要求10所述的光源,其特征在于,
每个所述组能够发射特定强度和/或颜色的光。
12.根据权利要求1至11中任一项所述的光源,其特征在于,
所述第一基板包括用于通过桥接将其与电流源电连接的键合焊盘。
13.根据权利要求1至12中任一项所述的光源,其特征在于,
所述电子电路旨在执行以下功能中的至少一个:
存储与发光二极管相关的堆栈信息;
测量发光二极管的温度;
控制对发光二极管的电力供应;
电路可以在至少两个照明功能之间切换;
电路能够选择多个组的发光二极管的特定电连接;
保护多个杆组和/或限制流过这些组的电流。
14.一种照明模块,包括:
至少一个能够发射光线的光源(101,201,301,401);
能够接收光线并产生光束的光学装置;
其特征在于,所述光源是根据权利要求1至13中任一项所述的光源。
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WO2017046107A1 (fr) | 2017-03-23 |
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