TWI384644B - Ｌｅｄ半導體本體及ｌｅｄ半導體本體之應用 - Google Patents

Ｌｅｄ半導體本體及ｌｅｄ半導體本體之應用 Download PDF

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Publication number
TWI384644B
TWI384644B TW096135846A TW96135846A TWI384644B TW I384644 B TWI384644 B TW I384644B TW 096135846 A TW096135846 A TW 096135846A TW 96135846 A TW96135846 A TW 96135846A TW I384644 B TWI384644 B TW I384644B
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TW
Taiwan
Prior art keywords
semiconductor body
led semiconductor
led
voltage
active layers
Prior art date
Application number
TW096135846A
Other languages
English (en)
Chinese (zh)
Other versions
TW200826326A (en
Inventor
喬治柏納
史提芬葛羅茲契
甘特科克伯格
克勞斯史楚貝
雷納溫迪契
瑞夫渥斯
Original Assignee
歐斯朗奧托半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歐斯朗奧托半導體股份有限公司 filed Critical 歐斯朗奧托半導體股份有限公司
Publication of TW200826326A publication Critical patent/TW200826326A/zh
Application granted granted Critical
Publication of TWI384644B publication Critical patent/TWI384644B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

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  • Led Devices (AREA)
TW096135846A 2006-09-28 2007-09-27 Ｌｅｄ半導體本體及ｌｅｄ半導體本體之應用 TWI384644B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006046038A DE102006046038A1 (de) 2006-09-28 2006-09-28 LED-Halbleiterkörper und Verwendung eines LED-Halbleiterkörpers

Publications (2)

Publication Number Publication Date
TW200826326A TW200826326A (en) 2008-06-16
TWI384644B true TWI384644B (zh) 2013-02-01

Family

ID=39118340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096135846A TWI384644B (zh) 2006-09-28 2007-09-27 Ｌｅｄ半導體本體及ｌｅｄ半導體本體之應用

Country Status (8)

Country Link
US (1) US8283684B2 (https=)
EP (1) EP2062296B1 (https=)
JP (1) JP5479098B2 (https=)
KR (1) KR101421761B1 (https=)
CN (1) CN101563778B (https=)
DE (1) DE102006046038A1 (https=)
TW (1) TWI384644B (https=)
WO (1) WO2008040300A1 (https=)

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KR101332794B1 (ko) * 2008-08-05 2013-11-25 삼성전자주식회사 발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법
DE102008053731B4 (de) * 2008-10-29 2024-10-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip
US7983317B2 (en) * 2008-12-16 2011-07-19 Corning Incorporated MQW laser structure comprising plural MQW regions
DE102010023342A1 (de) 2010-06-10 2011-12-15 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung und Leuchtmittel insbesondere mit solch einer Leuchtdiodenanordnung
CN101902856A (zh) * 2010-07-05 2010-12-01 陆敬仁 又一种用交流电直接驱动普通led的方法
US8809897B2 (en) 2011-08-31 2014-08-19 Micron Technology, Inc. Solid state transducer devices, including devices having integrated electrostatic discharge protection, and associated systems and methods
US9490239B2 (en) * 2011-08-31 2016-11-08 Micron Technology, Inc. Solid state transducers with state detection, and associated systems and methods
US9070613B2 (en) * 2011-09-07 2015-06-30 Lg Innotek Co., Ltd. Light emitting device
EP2618388B1 (en) * 2012-01-20 2019-10-02 OSRAM Opto Semiconductors GmbH Light-emitting diode chip
TWI470826B (zh) * 2012-03-30 2015-01-21 Phostek Inc 發光二極體裝置
JP6071650B2 (ja) * 2013-03-01 2017-02-01 スタンレー電気株式会社 半導体発光装置
US9825088B2 (en) * 2015-07-24 2017-11-21 Epistar Corporation Light-emitting device and manufacturing method thereof
US10784398B2 (en) 2015-12-24 2020-09-22 Vuereal Inc. Vertical solid state devices
US9859470B2 (en) 2016-03-10 2018-01-02 Epistar Corporation Light-emitting device with adjusting element
US11721784B2 (en) 2017-03-30 2023-08-08 Vuereal Inc. High efficient micro devices
US11600743B2 (en) 2017-03-30 2023-03-07 Vuereal Inc. High efficient microdevices
CN110709989B (zh) * 2017-03-30 2023-12-01 维耶尔公司 垂直固态装置
JP7323783B2 (ja) 2019-07-19 2023-08-09 日亜化学工業株式会社 発光装置の製造方法及び発光装置
DE102020001353B3 (de) * 2020-03-03 2020-12-31 Azur Space Solar Power Gmbh Stapelförmiges photonisches lll-V-Halbleiterbauelement und Optokoppler
US11489089B2 (en) 2020-06-19 2022-11-01 Lextar Electronics Corporation Light emitting device with two vertically-stacked light emitting cells
US20230307597A1 (en) * 2020-07-03 2023-09-28 Lg Electronics Inc. Display device using micro led
WO2022178393A1 (en) * 2021-02-22 2022-08-25 The Regents Of The University Of California Monolithic, cascaded, multiple color light-emitting diodes with independent junction control
CN117438516A (zh) * 2023-12-21 2024-01-23 江西兆驰半导体有限公司 一种垂直结构高压Micro LED芯片及其制备方法

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Also Published As

Publication number Publication date
DE102006046038A1 (de) 2008-04-03
US20110240955A1 (en) 2011-10-06
US8283684B2 (en) 2012-10-09
JP2010505251A (ja) 2010-02-18
WO2008040300A1 (de) 2008-04-10
CN101563778A (zh) 2009-10-21
KR101421761B1 (ko) 2014-07-22
CN101563778B (zh) 2014-07-09
EP2062296A1 (de) 2009-05-27
JP5479098B2 (ja) 2014-04-23
TW200826326A (en) 2008-06-16
EP2062296B1 (de) 2017-07-05
KR20090064469A (ko) 2009-06-18

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