JP5474551B2 - 触媒による低温重合 - Google Patents
触媒による低温重合 Download PDFInfo
- Publication number
- JP5474551B2 JP5474551B2 JP2009528683A JP2009528683A JP5474551B2 JP 5474551 B2 JP5474551 B2 JP 5474551B2 JP 2009528683 A JP2009528683 A JP 2009528683A JP 2009528683 A JP2009528683 A JP 2009528683A JP 5474551 B2 JP5474551 B2 JP 5474551B2
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- composition
- polymerization
- catalyst
- weight
- polymerization catalyst
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/0666—Polycondensates containing five-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms
- C08G73/0677—Polycondensates containing five-membered rings, condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyethers (AREA)
- Sealing Material Composition (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06019841 | 2006-09-21 | ||
| EP06019841.3 | 2006-09-21 | ||
| PCT/EP2007/059623 WO2008034753A1 (en) | 2006-09-21 | 2007-09-13 | Catalytic low temperature polymerization |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010504382A JP2010504382A (ja) | 2010-02-12 |
| JP2010504382A5 JP2010504382A5 (enExample) | 2010-11-11 |
| JP5474551B2 true JP5474551B2 (ja) | 2014-04-16 |
Family
ID=38757362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009528683A Active JP5474551B2 (ja) | 2006-09-21 | 2007-09-13 | 触媒による低温重合 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20100016504A1 (enExample) |
| EP (1) | EP2064259B1 (enExample) |
| JP (1) | JP5474551B2 (enExample) |
| CN (1) | CN101516961B (enExample) |
| WO (1) | WO2008034753A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009115488A1 (en) * | 2008-03-19 | 2009-09-24 | Henkel Ag & Co. Kgaa | Copolymerization method |
| KR20120099020A (ko) | 2009-10-22 | 2012-09-06 | 헨켈 아게 운트 코. 카게아아 | 벤족사진 화합물 및 가열-활성 촉매로서 고리 구조를 갖는 술폰산 에스테르를 포함하는 경화성 조성물 |
| TWI445727B (zh) * | 2010-10-21 | 2014-07-21 | Taiwan Union Technology Corp | 樹脂組合物及由其製成之預浸材與印刷電路板 |
| KR20150065751A (ko) * | 2012-09-28 | 2015-06-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 폴리벤족사진 조성물 |
| KR102616984B1 (ko) * | 2015-03-04 | 2023-12-26 | 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 | 벤족사진 저온 경화성 조성물 |
| WO2017196805A1 (en) | 2016-05-10 | 2017-11-16 | Huntsman Advanced Materials Americas Llc | Benzothiazoles as latent catalysts for benzoxazine resins |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5360644A (en) * | 1992-12-15 | 1994-11-01 | Basf Corporation | Chip-resistant composite coating |
| US5476719A (en) * | 1994-08-17 | 1995-12-19 | Trw Inc. | Superconducting multi-layer microstrip structure for multi-chip modules and microwave circuits |
| US6225440B1 (en) * | 1998-06-26 | 2001-05-01 | Edison Polymer Innovation Corporation | Cationic ring-opening polymerization of benzoxazines |
| US6207786B1 (en) * | 1998-11-10 | 2001-03-27 | Edison Polymer Innovation Corporation | Ternary systems of benzoxazine, epoxy, and phenolic resins |
| JP2000191775A (ja) * | 1998-12-24 | 2000-07-11 | Shikoku Chem Corp | 熱硬化性樹脂組成物及びその硬化方法 |
| JP4207101B2 (ja) * | 1999-05-25 | 2009-01-14 | 日立化成工業株式会社 | 半導体封止用樹脂組成物及び樹脂封止型半導体装置 |
| US6376080B1 (en) * | 1999-06-07 | 2002-04-23 | Loctite Corporation | Method for preparing polybenzoxazine |
| KR100419063B1 (ko) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 및 이를 이용한 적층판 |
| JP2002047391A (ja) * | 2000-07-31 | 2002-02-12 | Hitachi Chem Co Ltd | 封止用熱硬化性樹脂組成物および電子部品装置 |
| JP2004103495A (ja) * | 2002-09-12 | 2004-04-02 | Sansho Kako:Kk | 燃料電池用セパレータ、その製造方法および該燃料電池用セパレータを用いた燃料電池 |
| JP2004182974A (ja) * | 2002-11-22 | 2004-07-02 | Mitsubishi Chemicals Corp | ポリエーテルポリオールの製造方法 |
| AU2003280574A1 (en) * | 2002-11-22 | 2004-06-18 | Mitsubishi Chemical Corporation | Method for producing polyether polyol |
| JP3946626B2 (ja) * | 2002-12-03 | 2007-07-18 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 |
| US20070102674A1 (en) * | 2003-07-11 | 2007-05-10 | Ube Industries, Ltd. | Acid-base mixture and ion conductor comprising the same |
| US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
| JP2006233188A (ja) * | 2005-01-31 | 2006-09-07 | Toray Ind Inc | 複合材料用プリプレグ、および複合材料 |
| EP1647576A1 (en) * | 2005-04-01 | 2006-04-19 | Huntsman Advanced Materials (Switzerland) GmbH | Composition comprising benzoxazine and epoxy resin |
| BRPI0717583A2 (pt) * | 2006-09-21 | 2013-10-29 | Henkel Ag & Co. Kgaa | Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. |
-
2007
- 2007-09-13 WO PCT/EP2007/059623 patent/WO2008034753A1/en not_active Ceased
- 2007-09-13 US US12/442,316 patent/US20100016504A1/en not_active Abandoned
- 2007-09-13 CN CN2007800349330A patent/CN101516961B/zh active Active
- 2007-09-13 JP JP2009528683A patent/JP5474551B2/ja active Active
- 2007-09-13 EP EP07820176.1A patent/EP2064259B1/en not_active Not-in-force
-
2012
- 2012-07-25 US US13/557,769 patent/US20130266737A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010504382A (ja) | 2010-02-12 |
| US20130266737A1 (en) | 2013-10-10 |
| EP2064259A1 (en) | 2009-06-03 |
| US20100016504A1 (en) | 2010-01-21 |
| BRPI0717577A2 (pt) | 2013-10-22 |
| WO2008034753A1 (en) | 2008-03-27 |
| EP2064259B1 (en) | 2013-10-23 |
| CN101516961B (zh) | 2012-09-05 |
| CN101516961A (zh) | 2009-08-26 |
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