JP5472344B2 - Ｃｍｐ装置 - Google Patents

Ｃｍｐ装置 Download PDF

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Publication number
JP5472344B2
JP5472344B2 JP2012055615A JP2012055615A JP5472344B2 JP 5472344 B2 JP5472344 B2 JP 5472344B2 JP 2012055615 A JP2012055615 A JP 2012055615A JP 2012055615 A JP2012055615 A JP 2012055615A JP 5472344 B2 JP5472344 B2 JP 5472344B2
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Japan
Prior art keywords
fluororesin
adhesive
group
layer
thermoplastic resin
Prior art date
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Expired - Fee Related
Application number
JP2012055615A
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English (en)
Japanese (ja)
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JP2012106341A5 (enExample
JP2012106341A (ja
Inventor
秀典 尾崎
政二 小森
達也 樋口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP2012055615A priority Critical patent/JP5472344B2/ja
Publication of JP2012106341A publication Critical patent/JP2012106341A/ja
Publication of JP2012106341A5 publication Critical patent/JP2012106341A5/ja
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Publication of JP5472344B2 publication Critical patent/JP5472344B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012055615A 2012-03-13 2012-03-13 Ｃｍｐ装置 Expired - Fee Related JP5472344B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012055615A JP5472344B2 (ja) 2012-03-13 2012-03-13 Ｃｍｐ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012055615A JP5472344B2 (ja) 2012-03-13 2012-03-13 Ｃｍｐ装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006070032A Division JP2007245266A (ja) 2006-03-14 2006-03-14 Ｃｍｐ装置

Publications (3)

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JP2012106341A JP2012106341A (ja) 2012-06-07
JP2012106341A5 JP2012106341A5 (enExample) 2012-11-22
JP5472344B2 true JP5472344B2 (ja) 2014-04-16

Family

ID=46492538

Family Applications (1)

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JP2012055615A Expired - Fee Related JP5472344B2 (ja) 2012-03-13 2012-03-13 Ｃｍｐ装置

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JP (1) JP5472344B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11424138B2 (en) * 2018-08-09 2022-08-23 Ebara Corporation Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7112010B2 (ja) 2020-09-30 2022-08-03 ダイキン工業株式会社 フッ素樹脂、積層体およびチューブ

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3286682B2 (ja) * 1992-10-15 2002-05-27 東ソー株式会社 ポリフェニレンスルフィド樹脂組成物および光反射用成形品
JP2003133270A (ja) * 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
JP2003179021A (ja) * 2001-12-11 2003-06-27 Sony Corp 化学機械研磨装置
JP2005288286A (ja) * 2004-03-31 2005-10-20 Nippon Paper Industries Co Ltd ハードコートフィルムの製造方法及びハードコートフィルム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11424138B2 (en) * 2018-08-09 2022-08-23 Ebara Corporation Substrate cleaning tool, substrate cleaning apparatus, substrate processing apparatus, substrate processing method, and method of manufacturing substrate cleaning tool

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Publication number Publication date
JP2012106341A (ja) 2012-06-07

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