JP5465043B2 - 粘着テープの貼着装置及び貼着方法 - Google Patents

粘着テープの貼着装置及び貼着方法 Download PDF

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Publication number
JP5465043B2
JP5465043B2 JP2010046913A JP2010046913A JP5465043B2 JP 5465043 B2 JP5465043 B2 JP 5465043B2 JP 2010046913 A JP2010046913 A JP 2010046913A JP 2010046913 A JP2010046913 A JP 2010046913A JP 5465043 B2 JP5465043 B2 JP 5465043B2
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Prior art keywords
chuck
release tape
adhesive tape
tape
pair
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JP2010046913A
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Japanese (ja)
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JP2011181838A5 (enExample
JP2011181838A (ja
Inventor
治雄 森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2010046913A priority Critical patent/JP5465043B2/ja
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Publication of JP2011181838A5 publication Critical patent/JP2011181838A5/ja
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tape Dispensing Devices (AREA)
JP2010046913A 2010-03-03 2010-03-03 粘着テープの貼着装置及び貼着方法 Active JP5465043B2 (ja)

Priority Applications (1)

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JP2010046913A JP5465043B2 (ja) 2010-03-03 2010-03-03 粘着テープの貼着装置及び貼着方法

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JP2010046913A JP5465043B2 (ja) 2010-03-03 2010-03-03 粘着テープの貼着装置及び貼着方法

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JP2011181838A JP2011181838A (ja) 2011-09-15
JP2011181838A5 JP2011181838A5 (enExample) 2013-04-18
JP5465043B2 true JP5465043B2 (ja) 2014-04-09

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JP2010046913A Active JP5465043B2 (ja) 2010-03-03 2010-03-03 粘着テープの貼着装置及び貼着方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101514995B1 (ko) 2013-07-29 2015-04-24 정태열 절연테이프 부착장치 및 부착방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4616521B2 (ja) * 2001-07-06 2011-01-19 アスリートＦａ株式会社 異方性導電体貼り付け装置および異方性導電体貼り付け方法
JP5003182B2 (ja) * 2007-01-31 2012-08-15 パナソニック株式会社 電子部品実装方法およびテープ貼付装置

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JP2011181838A (ja) 2011-09-15

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