JP5450441B2 - モリブデン含有裏面電極層を有する薄膜太陽電池 - Google Patents
モリブデン含有裏面電極層を有する薄膜太陽電池 Download PDFInfo
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- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 title claims description 37
- 229910052750 molybdenum Inorganic materials 0.000 title claims description 36
- 239000011733 molybdenum Substances 0.000 title claims description 33
- 239000010409 thin film Substances 0.000 title claims description 21
- 239000010410 layer Substances 0.000 claims description 152
- 239000011734 sodium Substances 0.000 claims description 104
- 229910052708 sodium Inorganic materials 0.000 claims description 85
- 150000001875 compounds Chemical class 0.000 claims description 31
- 229910052719 titanium Inorganic materials 0.000 claims description 28
- 229910052721 tungsten Inorganic materials 0.000 claims description 27
- 229910052715 tantalum Inorganic materials 0.000 claims description 23
- 229910052758 niobium Inorganic materials 0.000 claims description 22
- 229910052735 hafnium Inorganic materials 0.000 claims description 20
- 229910052720 vanadium Inorganic materials 0.000 claims description 20
- 229910052726 zirconium Inorganic materials 0.000 claims description 20
- 229910052760 oxygen Inorganic materials 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 238000010521 absorption reaction Methods 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 14
- 239000010408 film Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 239000012535 impurity Substances 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 8
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- -1 0.005 to 15 atomic% Substances 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 5
- 238000005477 sputtering target Methods 0.000 claims description 5
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052951 chalcopyrite Inorganic materials 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- VPQBLCVGUWPDHV-UHFFFAOYSA-N sodium selenide Chemical compound [Na+].[Na+].[Se-2] VPQBLCVGUWPDHV-UHFFFAOYSA-N 0.000 claims description 4
- 229910052979 sodium sulfide Inorganic materials 0.000 claims description 4
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 3
- 150000003388 sodium compounds Chemical class 0.000 claims description 3
- 235000015393 sodium molybdate Nutrition 0.000 claims description 2
- 239000011684 sodium molybdate Substances 0.000 claims description 2
- TVXXNOYZHKPKGW-UHFFFAOYSA-N sodium molybdate (anhydrous) Chemical compound [Na+].[Na+].[O-][Mo]([O-])(=O)=O TVXXNOYZHKPKGW-UHFFFAOYSA-N 0.000 claims description 2
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 claims description 2
- UYLYBEXRJGPQSH-UHFFFAOYSA-N sodium;oxido(dioxo)niobium Chemical compound [Na+].[O-][Nb](=O)=O UYLYBEXRJGPQSH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims 1
- GROMGGTZECPEKN-UHFFFAOYSA-N sodium metatitanate Chemical compound [Na+].[Na+].[O-][Ti](=O)O[Ti](=O)O[Ti]([O-])=O GROMGGTZECPEKN-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 78
- 238000000034 method Methods 0.000 description 39
- 230000008569 process Effects 0.000 description 28
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 21
- 239000010936 titanium Substances 0.000 description 21
- 239000000843 powder Substances 0.000 description 19
- 239000001301 oxygen Substances 0.000 description 17
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 17
- 239000010937 tungsten Substances 0.000 description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 239000010955 niobium Substances 0.000 description 15
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 15
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 15
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 14
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 14
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 14
- 238000004544 sputter deposition Methods 0.000 description 13
- 239000000203 mixture Substances 0.000 description 10
- 229910052783 alkali metal Inorganic materials 0.000 description 8
- 150000001340 alkali metals Chemical class 0.000 description 8
- 238000000151 deposition Methods 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000006096 absorbing agent Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000008595 infiltration Effects 0.000 description 7
- 238000001764 infiltration Methods 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 230000007774 longterm Effects 0.000 description 6
- 229910016001 MoSe Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000001513 hot isostatic pressing Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000011669 selenium Substances 0.000 description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 2
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000011946 reduction process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 238000009924 canning Methods 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000001272 pressureless sintering Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003385 sodium Chemical class 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- WTKKCYNZRWIVKL-UHFFFAOYSA-N tantalum Chemical compound [Ta+5] WTKKCYNZRWIVKL-UHFFFAOYSA-N 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0328—Inorganic materials including, apart from doping materials or other impurities, semiconductor materials provided for in two or more of groups H01L31/0272 - H01L31/032
- H01L31/0336—Inorganic materials including, apart from doping materials or other impurities, semiconductor materials provided for in two or more of groups H01L31/0272 - H01L31/032 in different semiconductor regions, e.g. Cu2X/CdX hetero- junctions, X being an element of Group VI of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
Description
吸収層への一定した十分なNa導入によって一定した高い効率;
高い耐酸化性、耐食性による高い長期安定性;
裏面電極層/吸収層の界面に一定した層厚のMoSx/MoSex層を形成することによる規定されたオーム接触;
隣接材料との良好な層付着;
簡単なプロセス管理による低い製造費
以上の特性を有する薄膜太陽電池を提供することである。
Claims (22)
- 少なくとも1つの基板と1つの裏面電極層と1つのカルコパイライト吸収層と1つの表面接触層とを備え、前記裏面電極層が1つ以上の膜層で構成されている薄膜太陽電池において、前記裏面電極層の少なくとも1つの膜層が、
0.1〜45原子%のTi、Zr、Hf、V、Nb、TaおよびWの群の少なくとも1種の元素と、
0.01〜7.5原子%のNaと、
0〜7.5原子%の、Naとで融点500℃超の化合物を形成する1種以上の元素と、
残り少なくとも50原子%のMoおよび不純物とから成る薄膜太陽電池。 - 含有量はTiが1〜30原子%、Zrが0.5〜10原子%、Hfが0.5〜10原子%、Vが1〜20原子%、Nbが1〜20原子%、Taが1〜15原子%、Wが1〜40原子%である請求項1記載の薄膜太陽電池。
- 含有量はTiが2〜20原子%、Zrが1〜5原子%、Hfが1〜5原子%、Vが2〜10原子%、Nbが2〜10原子%、Taが2〜10原子%、Wが5〜35原子%である請求項2記載の薄膜太陽電池。
- 前記裏面電極層が0.01〜7.5原子%のO、SeおよびSの群の少なくとも1種の元素を含む請求項1ないし3のいずれか1つに記載の薄膜太陽電池。
- 前記裏面電極層が0.05〜2μmの厚さを有する請求項1ないし4のいずれか1つに記載の薄膜太陽電池。
- 前記裏面電極層の少なくとも1つの膜層がNaとTiを含む請求項1ないし5のいずれか1つに記載の薄膜太陽電池。
- 前記裏面電極層の少なくとも1つの膜層がNaとWを含む請求項1ないし6のいずれか1つに記載の薄膜太陽電池。
- 前記裏面電極層が単層で実施されている請求項1ないし7のいずれか1つに記載の薄膜太陽電池。
- 前記裏面電極層が0.5〜2.5原子%のNaを含む請求項8記載の薄膜太陽電池。
- 前記裏面電極層が2層に実施されている請求項1ないし7のいずれか1つに記載の薄膜太陽電池。
- 少なくとも1つの膜層が1.5〜7.5原子%のNaを含む請求項10記載の薄膜太陽電池。
- 製造に起因した不純物の他に0.1〜45原子%のTi、Zr、Hf、V、Nb、TaおよびWの群の少なくとも1種の元素と0.01〜7.5原子%のNaと0〜7.5原子%の、Naとで融点500℃超の化合物を形成する1種以上の元素と残り少なくとも50原子%のMoとから成るスパッタターゲットを用いた、請求項1ないし11のいずれか1つに記載の薄膜太陽電池の裏面電極層。
- 少なくとも50原子%のモリブデン含有量を有する薄膜太陽電池の裏面電極層を製造するためのスパッタターゲットにおいて、0.1〜45原子%のTi、Zr、Hf、V、Nb、TaおよびWの群の少なくとも1種の元素と0.01〜7.5原子%のNaと0.005〜15原子%の、Naとで融点500℃超の化合物を形成する1種以上の元素と残り通常の不純物とから成るスパッタターゲット。
- 前記含有量はTiが1〜30原子%、Zrが0.5〜10原子%、Hfが0.5〜10原子%、Vが1〜20原子%、Nbが1〜20原子%、Taが1〜15原子%、Wが1〜40原子%である請求項13記載のスパッタターゲット。
- 前記含有量はTiが2〜20原子%、Zrが1〜5原子%、Hfが1〜5原子%、Vが2〜10原子%、Nbが2〜10原子%、Taが2〜10原子%、Wが5〜35原子%である請求項14記載のスパッタターゲット。
- 前記Na含有量が0.1〜5原子%である請求項13ないし15のいずれか1つに記載のスパッタターゲット。
- 前記Na含有量が0.5〜2.5原子%である請求項16記載のスパッタターゲット。
- 前記ナトリウム化合物が酸化ナトリウム、混合酸化ナトリウム、セレン化ナトリウム、硫化ナトリウムおよびハロゲン化ナトリウムの群の少なくとも1種の化合物である請求項13ないし17のいずれか1つに記載のスパッタターゲット。
- Ti、Zr、Hf、V、Nb、Ta、Wの群の少なくとも1種の元素が元素としてMoに溶解されて混晶の態様で、またはNa含有化合物の成分として存在する請求項13ないし18のいずれか1つに記載のスパッタターゲット。
- 前記Na含有化合物が2成分系または多成分系混合酸化ナトリウムであり、1成分がNa2Oであり、他の1成分がTi、Zr、Hf、V、Nb、Ta、Cr、Mo、W、SiおよびGeの群の少なくとも1種の元素の酸化物である請求項13ないし19のいずれか1つに記載のスパッタターゲット。
- 前記Na含有化合物がタングステン酸ナトリウム、チタン酸ナトリウム、ニオブ酸ナトリウムおよびモリブデン酸ナトリウムの群の少なくとも1種の化合物である請求項20記載のスパッタターゲット。
- 前記スパッタターゲットがMoから成る母材相、またはTi、Zr、Hf、V、Nb、TaおよびWの群の1種以上の元素で形成されたMo混晶から成る母材相を有し、前記母材相の粒径が0.1〜50μmであり、NaまたはNa含有化合物が母材相の空隙に封入されている請求項13ないし21のいずれか1つに記載のスパッタターゲット。
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