JP5442171B1 - ワーク粘着チャック装置及びワーク貼り合わせ機 - Google Patents

ワーク粘着チャック装置及びワーク貼り合わせ機 Download PDF

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Publication number
JP5442171B1
JP5442171B1 JP2013539835A JP2013539835A JP5442171B1 JP 5442171 B1 JP5442171 B1 JP 5442171B1 JP 2013539835 A JP2013539835 A JP 2013539835A JP 2013539835 A JP2013539835 A JP 2013539835A JP 5442171 B1 JP5442171 B1 JP 5442171B1
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JP
Japan
Prior art keywords
workpiece
plate
adhesive
peeling
chuck device
Prior art date
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Active
Application number
JP2013539835A
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English (en)
Japanese (ja)
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JPWO2014109018A1 (ja
Inventor
義和 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
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Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
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Publication of JP5442171B1 publication Critical patent/JP5442171B1/ja
Publication of JPWO2014109018A1 publication Critical patent/JPWO2014109018A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Jigs For Machine Tools (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2013539835A 2013-01-09 2013-01-09 ワーク粘着チャック装置及びワーク貼り合わせ機 Active JP5442171B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/050215 WO2014109018A1 (ja) 2013-01-09 2013-01-09 ワーク粘着チャック装置及びワーク貼り合わせ機

Publications (2)

Publication Number Publication Date
JP5442171B1 true JP5442171B1 (ja) 2014-03-12
JPWO2014109018A1 JPWO2014109018A1 (ja) 2017-01-19

Family

ID=50396784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013539835A Active JP5442171B1 (ja) 2013-01-09 2013-01-09 ワーク粘着チャック装置及びワーク貼り合わせ機

Country Status (5)

Country Link
JP (1) JP5442171B1 (zh)
KR (1) KR101944155B1 (zh)
CN (1) CN104904004B (zh)
TW (1) TWI576954B (zh)
WO (1) WO2014109018A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6605730B2 (ja) * 2016-11-10 2019-11-13 アプライド マテリアルズ インコーポレイテッド 基板を保持するための保持装置、保持装置を含むキャリア、キャリアを用いた処理システム、および基板を保持装置から解放する方法
US20220143838A1 (en) * 2019-02-28 2022-05-12 Nitto Denko Corporation Adherent device, transfer equipment using the same, and transfer method
JP6942908B1 (ja) * 2020-11-13 2021-09-29 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796382B2 (ja) * 2005-12-08 2011-10-19 株式会社ディスコ 加工装置のチャックテーブル
CN101379606B (zh) * 2007-01-31 2012-04-18 信越工程株式会社 粘接卡盘装置
KR100953101B1 (ko) 2008-09-29 2010-04-19 (주)아폴로테크 기판척
JP2010126342A (ja) * 2008-12-01 2010-06-10 Advanced Display Process Engineering Co Ltd 基板チャック及びこれを有する基板合着装置
KR20110038995A (ko) * 2009-10-09 2011-04-15 엘아이지에이디피 주식회사 기판척, 이를 포함하는 기판합착장치 및 기판합착장치를 이용한 기판박리방법
JP4785995B1 (ja) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
JP4903906B1 (ja) * 2011-04-07 2012-03-28 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機

Also Published As

Publication number Publication date
JPWO2014109018A1 (ja) 2017-01-19
CN104904004B (zh) 2017-05-31
WO2014109018A1 (ja) 2014-07-17
KR101944155B1 (ko) 2019-01-30
TWI576954B (zh) 2017-04-01
KR20150104191A (ko) 2015-09-14
CN104904004A (zh) 2015-09-09
TW201442140A (zh) 2014-11-01

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