KR101944155B1 - 워크 점착 척 장치 및 워크 첩합기 - Google Patents

워크 점착 척 장치 및 워크 첩합기 Download PDF

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Publication number
KR101944155B1
KR101944155B1 KR1020157021342A KR20157021342A KR101944155B1 KR 101944155 B1 KR101944155 B1 KR 101944155B1 KR 1020157021342 A KR1020157021342 A KR 1020157021342A KR 20157021342 A KR20157021342 A KR 20157021342A KR 101944155 B1 KR101944155 B1 KR 101944155B1
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KR
South Korea
Prior art keywords
plate
workpiece
peeling
work
adhesive
Prior art date
Application number
KR1020157021342A
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English (en)
Korean (ko)
Other versions
KR20150104191A (ko
Inventor
요시카즈 오오타니
Original Assignee
신에츠 엔지니어링 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 신에츠 엔지니어링 가부시키가이샤 filed Critical 신에츠 엔지니어링 가부시키가이샤
Publication of KR20150104191A publication Critical patent/KR20150104191A/ko
Application granted granted Critical
Publication of KR101944155B1 publication Critical patent/KR101944155B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Jigs For Machine Tools (AREA)
KR1020157021342A 2013-01-09 2013-01-09 워크 점착 척 장치 및 워크 첩합기 KR101944155B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/050215 WO2014109018A1 (ja) 2013-01-09 2013-01-09 ワーク粘着チャック装置及びワーク貼り合わせ機

Publications (2)

Publication Number Publication Date
KR20150104191A KR20150104191A (ko) 2015-09-14
KR101944155B1 true KR101944155B1 (ko) 2019-01-30

Family

ID=50396784

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157021342A KR101944155B1 (ko) 2013-01-09 2013-01-09 워크 점착 척 장치 및 워크 첩합기

Country Status (5)

Country Link
JP (1) JP5442171B1 (zh)
KR (1) KR101944155B1 (zh)
CN (1) CN104904004B (zh)
TW (1) TWI576954B (zh)
WO (1) WO2014109018A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101983674B1 (ko) * 2016-11-10 2019-05-30 어플라이드 머티어리얼스, 인코포레이티드 기판을 홀딩하기 위한 홀딩 어레인지먼트, 홀딩 어레인지먼트를 포함하는 캐리어, 캐리어를 이용하는 프로세싱 시스템, 및 홀딩 어레인지먼트로부터 기판을 릴리스하기 위한 방법
WO2020175401A1 (ja) * 2019-02-28 2020-09-03 日東電工株式会社 接着デバイス、これを用いた移載装置、及び移載方法
CN115552322B (zh) * 2020-11-13 2024-05-31 信越工程株式会社 工件粘附保持盘装置及工件贴合机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100953101B1 (ko) 2008-09-29 2010-04-19 (주)아폴로테크 기판척
JP2010126342A (ja) 2008-12-01 2010-06-10 Advanced Display Process Engineering Co Ltd 基板チャック及びこれを有する基板合着装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4796382B2 (ja) * 2005-12-08 2011-10-19 株式会社ディスコ 加工装置のチャックテーブル
WO2008093408A1 (ja) * 2007-01-31 2008-08-07 Shin-Etsu Engineering Co., Ltd. 粘着チャック装置
KR20110038995A (ko) * 2009-10-09 2011-04-15 엘아이지에이디피 주식회사 기판척, 이를 포함하는 기판합착장치 및 기판합착장치를 이용한 기판박리방법
JP4785995B1 (ja) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
JP4903906B1 (ja) * 2011-04-07 2012-03-28 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100953101B1 (ko) 2008-09-29 2010-04-19 (주)아폴로테크 기판척
JP2010126342A (ja) 2008-12-01 2010-06-10 Advanced Display Process Engineering Co Ltd 基板チャック及びこれを有する基板合着装置

Also Published As

Publication number Publication date
JPWO2014109018A1 (ja) 2017-01-19
TW201442140A (zh) 2014-11-01
CN104904004A (zh) 2015-09-09
TWI576954B (zh) 2017-04-01
CN104904004B (zh) 2017-05-31
KR20150104191A (ko) 2015-09-14
JP5442171B1 (ja) 2014-03-12
WO2014109018A1 (ja) 2014-07-17

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