JP5431232B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP5431232B2
JP5431232B2 JP2010083911A JP2010083911A JP5431232B2 JP 5431232 B2 JP5431232 B2 JP 5431232B2 JP 2010083911 A JP2010083911 A JP 2010083911A JP 2010083911 A JP2010083911 A JP 2010083911A JP 5431232 B2 JP5431232 B2 JP 5431232B2
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JP
Japan
Prior art keywords
semiconductor element
protrusion
semiconductor device
support member
insulating resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010083911A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011216691A5 (enExample
JP2011216691A (ja
Inventor
芳央 岡山
恭典 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2010083911A priority Critical patent/JP5431232B2/ja
Priority to US12/980,023 priority patent/US8471289B2/en
Publication of JP2011216691A publication Critical patent/JP2011216691A/ja
Publication of JP2011216691A5 publication Critical patent/JP2011216691A5/ja
Application granted granted Critical
Publication of JP5431232B2 publication Critical patent/JP5431232B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Lasers (AREA)
JP2010083911A 2009-12-28 2010-03-31 半導体装置 Expired - Fee Related JP5431232B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010083911A JP5431232B2 (ja) 2010-03-31 2010-03-31 半導体装置
US12/980,023 US8471289B2 (en) 2009-12-28 2010-12-28 Semiconductor laser device, optical pickup device and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010083911A JP5431232B2 (ja) 2010-03-31 2010-03-31 半導体装置

Publications (3)

Publication Number Publication Date
JP2011216691A JP2011216691A (ja) 2011-10-27
JP2011216691A5 JP2011216691A5 (enExample) 2013-03-21
JP5431232B2 true JP5431232B2 (ja) 2014-03-05

Family

ID=44946131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010083911A Expired - Fee Related JP5431232B2 (ja) 2009-12-28 2010-03-31 半導体装置

Country Status (1)

Country Link
JP (1) JP5431232B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5551135B2 (ja) 2011-09-30 2014-07-16 京セラドキュメントソリューションズ株式会社 後処理装置
JP2014027179A (ja) * 2012-07-27 2014-02-06 Harison Toshiba Lighting Corp 発光装置およびその製造方法、並びにパッケージ部材

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4020624B2 (ja) * 2001-11-08 2007-12-12 三洋電機株式会社 半導体装置の製造方法
JP3782406B2 (ja) * 2003-07-01 2006-06-07 松下電器産業株式会社 固体撮像装置およびその製造方法
JP3993862B2 (ja) * 2003-10-10 2007-10-17 松下電器産業株式会社 光学デバイスおよびその製造方法
JP2006351568A (ja) * 2005-06-13 2006-12-28 Sumitomo Metal Electronics Devices Inc 発光素子搭載パッケージの製造方法
JP4783718B2 (ja) * 2006-11-27 2011-09-28 新光電気工業株式会社 照明装置
JP5013905B2 (ja) * 2007-02-28 2012-08-29 スタンレー電気株式会社 半導体発光装置
JP5061010B2 (ja) * 2008-03-31 2012-10-31 三洋電機株式会社 半導体モジュール
JP5484694B2 (ja) * 2008-07-31 2014-05-07 三洋電機株式会社 半導体モジュールおよび半導体モジュールを備える携帯機器
JP2011165737A (ja) * 2010-02-05 2011-08-25 Denki Kagaku Kogyo Kk 発光素子搭載用基板およびその製造方法

Also Published As

Publication number Publication date
JP2011216691A (ja) 2011-10-27

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