JP5419908B2 - 電力用半導体装置 - Google Patents
電力用半導体装置 Download PDFInfo
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- JP5419908B2 JP5419908B2 JP2011033266A JP2011033266A JP5419908B2 JP 5419908 B2 JP5419908 B2 JP 5419908B2 JP 2011033266 A JP2011033266 A JP 2011033266A JP 2011033266 A JP2011033266 A JP 2011033266A JP 5419908 B2 JP5419908 B2 JP 5419908B2
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Description
図1は、本発明の実施の形態1にかかる電力用半導体装置100の斜視図であり、図2は、図1をI−I方向に見た場合の断面図である。
図11は、本発明の実施の形態2にかかる電力用半導体装置のIGBT13の上面図であり、図12は、図11をXI−XI方向に見た場合の断面図である。図11、12中、図2と同一符号は同一又は相当箇所を示し、他の構造は図2の電力用半導体装置100と同様である。
Claims (2)
- ワイヤで接続された制御チップとパワーチップがモールド樹脂により封止された電力用半導体装置であって、
該パワーチップは、該ワイヤがウエッジボンディングされた接合部と、該接合部の近傍に設けられたバンプとをその表面上に有し、
該バンプは、隣り合って設けられた第1バンプと第2バンプからなり、
該隣り合って設けられたバンプは、対向する位置にそれぞれ傾斜面を有し、該傾斜面の上方を該ワイヤが通り、
該傾斜面は、該ワイヤのループ方向に対して垂直方向の断面形状が、凹面であることを特徴とする電力用半導体装置。 - 上記バンプと上記ワイヤとが異なる材料からなり、該ワイヤの強度は該バンプの材料の強度より大きいことを特徴とする請求項1に記載の電力用半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011033266A JP5419908B2 (ja) | 2011-02-18 | 2011-02-18 | 電力用半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011033266A JP5419908B2 (ja) | 2011-02-18 | 2011-02-18 | 電力用半導体装置 |
Publications (2)
Publication Number | Publication Date |
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JP2012174776A JP2012174776A (ja) | 2012-09-10 |
JP5419908B2 true JP5419908B2 (ja) | 2014-02-19 |
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JP2011033266A Active JP5419908B2 (ja) | 2011-02-18 | 2011-02-18 | 電力用半導体装置 |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US11631623B2 (en) | 2018-09-06 | 2023-04-18 | Mitsubishi Electric Corporation | Power semiconductor device and method of manufacturing the same, and power conversion device |
WO2022176690A1 (ja) * | 2021-02-16 | 2022-08-25 | ローム株式会社 | 半導体装置、半導体装置の設計方法および半導体装置の製造方法 |
WO2024070956A1 (ja) * | 2022-09-29 | 2024-04-04 | ローム株式会社 | 信号伝達装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH03183139A (ja) * | 1989-12-12 | 1991-08-09 | Nippon Steel Corp | ワイヤボンディング方法 |
JP2004273904A (ja) * | 2003-03-11 | 2004-09-30 | Shinkawa Ltd | 半導体装置及びワイヤボンディング方法 |
JP4146785B2 (ja) * | 2003-11-19 | 2008-09-10 | 三菱電機株式会社 | 電力用半導体装置 |
JP2009088083A (ja) * | 2007-09-28 | 2009-04-23 | Toshiba Corp | 積層型半導体装置 |
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