JP5419583B2 - 配線基板の製造方法 - Google Patents
配線基板の製造方法 Download PDFInfo
- Publication number
- JP5419583B2 JP5419583B2 JP2009180388A JP2009180388A JP5419583B2 JP 5419583 B2 JP5419583 B2 JP 5419583B2 JP 2009180388 A JP2009180388 A JP 2009180388A JP 2009180388 A JP2009180388 A JP 2009180388A JP 5419583 B2 JP5419583 B2 JP 5419583B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wiring
- via hole
- resin
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 239000011347 resin Substances 0.000 claims description 106
- 229920005989 resin Polymers 0.000 claims description 106
- 238000000034 method Methods 0.000 claims description 70
- 238000007747 plating Methods 0.000 claims description 66
- 239000000758 substrate Substances 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 18
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 273
- 238000004544 sputter deposition Methods 0.000 description 22
- 239000002253 acid Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000007772 electroless plating Methods 0.000 description 9
- 239000000654 additive Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 7
- 239000011800 void material Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009180388A JP5419583B2 (ja) | 2009-08-03 | 2009-08-03 | 配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009180388A JP5419583B2 (ja) | 2009-08-03 | 2009-08-03 | 配線基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011035182A JP2011035182A (ja) | 2011-02-17 |
| JP2011035182A5 JP2011035182A5 (enrdf_load_stackoverflow) | 2012-08-09 |
| JP5419583B2 true JP5419583B2 (ja) | 2014-02-19 |
Family
ID=43763960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009180388A Active JP5419583B2 (ja) | 2009-08-03 | 2009-08-03 | 配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5419583B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150024093A (ko) * | 2013-08-26 | 2015-03-06 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판 제조 방법 |
| WO2020027022A1 (ja) | 2018-07-31 | 2020-02-06 | 京セラ株式会社 | 印刷配線板及び印刷配線板の製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3790063B2 (ja) * | 1999-03-08 | 2006-06-28 | 新光電気工業株式会社 | 多層配線基板及びその製造方法並びに半導体装置 |
| JP2001044589A (ja) * | 1999-07-30 | 2001-02-16 | Nitto Denko Corp | 回路基板 |
| JP2001267747A (ja) * | 2000-03-22 | 2001-09-28 | Nitto Denko Corp | 多層回路基板の製造方法 |
| JP4448610B2 (ja) * | 2000-10-18 | 2010-04-14 | 日東電工株式会社 | 回路基板の製造方法 |
| JP2004193520A (ja) * | 2002-12-13 | 2004-07-08 | Sumitomo Bakelite Co Ltd | プリント配線板の製造方法 |
| JP2005109108A (ja) * | 2003-09-30 | 2005-04-21 | Ibiden Co Ltd | ビルドアッププリント配線板及びその製造方法 |
| JP2006049804A (ja) * | 2004-07-07 | 2006-02-16 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
-
2009
- 2009-08-03 JP JP2009180388A patent/JP5419583B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011035182A (ja) | 2011-02-17 |
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