JP5418602B2 - 硬化性樹脂組成物 - Google Patents

硬化性樹脂組成物 Download PDF

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Publication number
JP5418602B2
JP5418602B2 JP2011543172A JP2011543172A JP5418602B2 JP 5418602 B2 JP5418602 B2 JP 5418602B2 JP 2011543172 A JP2011543172 A JP 2011543172A JP 2011543172 A JP2011543172 A JP 2011543172A JP 5418602 B2 JP5418602 B2 JP 5418602B2
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Japan
Prior art keywords
structural unit
formula
resin composition
curable resin
solvent
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Active
Application number
JP2011543172A
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English (en)
Japanese (ja)
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JPWO2011065154A1 (ja
Inventor
義人 田中
崇 金村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
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Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority to JP2011543172A priority Critical patent/JP5418602B2/ja
Publication of JPWO2011065154A1 publication Critical patent/JPWO2011065154A1/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D127/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers
    • C09D127/02—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
    • C09D127/12—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011543172A 2009-11-24 2010-10-19 硬化性樹脂組成物 Active JP5418602B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011543172A JP5418602B2 (ja) 2009-11-24 2010-10-19 硬化性樹脂組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009266363 2009-11-24
JP2009266363 2009-11-24
PCT/JP2010/068330 WO2011065154A1 (fr) 2009-11-24 2010-10-19 Composition de résine durcissable
JP2011543172A JP5418602B2 (ja) 2009-11-24 2010-10-19 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2011065154A1 JPWO2011065154A1 (ja) 2013-04-11
JP5418602B2 true JP5418602B2 (ja) 2014-02-19

Family

ID=44066259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011543172A Active JP5418602B2 (ja) 2009-11-24 2010-10-19 硬化性樹脂組成物

Country Status (2)

Country Link
JP (1) JP5418602B2 (fr)
WO (1) WO2011065154A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100393797C (zh) * 2002-08-13 2008-06-11 大金工业株式会社 含有光固化型含氟聚合物的光学材料及光固化型含氟树脂组合物
JP5223978B2 (ja) * 2011-03-30 2013-06-26 ダイキン工業株式会社 光学素子封止用含フッ素樹脂組成物、及び、硬化物
JP6597639B2 (ja) * 2014-12-25 2019-10-30 Ａｇｃ株式会社 硬化性樹脂組成物
JP7125651B2 (ja) * 2017-04-14 2022-08-25 株式会社スリーボンド 硬化性樹脂組成物、それを用いた燃料電池およびシール方法
JP2023011961A (ja) * 2019-12-27 2023-01-25 Ａｇｃ株式会社 含フッ素重合体、硬化性組成物、硬化物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008044765A1 (fr) * 2006-10-12 2008-04-17 Daikin Industries, Ltd. Composition de polymère fluoré durcissable
WO2008153002A1 (fr) * 2007-06-15 2008-12-18 Dow Corning Toray Co., Ltd. Composition polymère durcissable contenant du fluor
JP2009203475A (ja) * 2008-02-28 2009-09-10 Mitsubishi Chemicals Corp 封止樹脂及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008044765A1 (fr) * 2006-10-12 2008-04-17 Daikin Industries, Ltd. Composition de polymère fluoré durcissable
WO2008153002A1 (fr) * 2007-06-15 2008-12-18 Dow Corning Toray Co., Ltd. Composition polymère durcissable contenant du fluor
JP2009203475A (ja) * 2008-02-28 2009-09-10 Mitsubishi Chemicals Corp 封止樹脂及びその製造方法

Also Published As

Publication number Publication date
WO2011065154A1 (fr) 2011-06-03
JPWO2011065154A1 (ja) 2013-04-11

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