JP5417455B2 - 像を面上に投影するための装置および上記像を動かすための装置 - Google Patents
像を面上に投影するための装置および上記像を動かすための装置 Download PDFInfo
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- JP5417455B2 JP5417455B2 JP2011544022A JP2011544022A JP5417455B2 JP 5417455 B2 JP5417455 B2 JP 5417455B2 JP 2011544022 A JP2011544022 A JP 2011544022A JP 2011544022 A JP2011544022 A JP 2011544022A JP 5417455 B2 JP5417455 B2 JP 5417455B2
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- Prior art keywords
- mask
- lens
- image
- spot
- light beam
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- 239000000463 material Substances 0.000 claims description 15
- 238000004549 pulsed laser deposition Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 13
- 238000010586 diagram Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Physical Vapour Deposition (AREA)
- Lenses (AREA)
Description
光線を生成するための光源と、
上記光線の進路に配置されたマスクと、
上記マスクの像の焦点を面上に合わせるために、上記マスクの後に配置されたレンズとを備え、上記面は上記レンズに平行ではない装置に関する。
Claims (6)
- パルスレーザー堆積に用いる、像を面上に投影するための装置であって、
光線を生成する光源と、
上記光線の進路に配置されたマスクと、
上記マスクの像の焦点を面上に合わせるために、上記マスクの後に配置されたレンズとを備え、上記面は上記レンズに平行ではなく、
上記マスクのエッジに沿ったほぼ全ての位置の各々における上記レンズへの距離v、および、上記マスクの上記像のエッジにおける対応する位置の上記レンズへの距離bが、式1/v+1/b=1/f(fは上記レンズの焦点の長さ)に略対応している装置において、
上記面が、アブレーション可能材料の面であり、上記光線が、上記アブレーション可能材料のプラズマプルームを生成するためのレーザー光線であり、上記アブレーション可能材料の面の向かいに基板が配置されていることを特徴とする装置。 - 請求項1に記載の装置において、
上記面は、フラットであり、かつ、上記レンズに対して角度をもって配置され、上記マスクは、光線が通過する開口を有するフラットプレートであり、上記フラットプレートは、上記レンズに対して角度をもって配置されていることを特徴とする装置。 - 請求項1に記載の装置において、
上記面は、湾曲していて、上記マスクは、上記式1/v+1/b=1/fに適合するように湾曲していることを特徴とする装置。 - 請求項1から3のいずれか1つに記載の装置において、
上記マスクは、複数のマスク部分から構成されていることを特徴とする装置。 - 請求項4に記載の装置において、
各々のマスク部分は、開口を有するフラット要素であることを特徴とする装置。 - 請求項1から5のいずれか1つに記載の装置において、
上記基板が上記アブレーション可能材料の面と平行に配置されていて、上記基板の面は、上記アブレーション可能材料でコーティングされることを特徴とする装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP09150125A EP2204468B1 (en) | 2009-01-06 | 2009-01-06 | Device for projecting an image on a surface and device for moving said image |
EP09150125.4 | 2009-01-06 | ||
PCT/EP2009/067760 WO2010079092A1 (en) | 2009-01-06 | 2009-12-22 | Device for projecting an image on a surface and device for moving said image |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013179753A Division JP2014029030A (ja) | 2009-01-06 | 2013-08-30 | 像を面上に投影するための装置および上記像を動かすための装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012514688A JP2012514688A (ja) | 2012-06-28 |
JP5417455B2 true JP5417455B2 (ja) | 2014-02-12 |
Family
ID=40720481
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011544022A Active JP5417455B2 (ja) | 2009-01-06 | 2009-12-22 | 像を面上に投影するための装置および上記像を動かすための装置 |
JP2013179753A Pending JP2014029030A (ja) | 2009-01-06 | 2013-08-30 | 像を面上に投影するための装置および上記像を動かすための装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013179753A Pending JP2014029030A (ja) | 2009-01-06 | 2013-08-30 | 像を面上に投影するための装置および上記像を動かすための装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8979282B2 (ja) |
EP (1) | EP2204468B1 (ja) |
JP (2) | JP5417455B2 (ja) |
KR (1) | KR101378638B1 (ja) |
CN (1) | CN102308019B (ja) |
WO (1) | WO2010079092A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT2159300E (pt) * | 2008-08-25 | 2012-03-08 | Solmates Bv | Método para depositar um material |
CN102699528A (zh) * | 2012-06-28 | 2012-10-03 | 镒生电线塑料(昆山)有限公司 | 镭射加工装置的改良结构 |
CN102922142A (zh) * | 2012-10-30 | 2013-02-13 | 张立国 | 一种激光加工的方法 |
US20230141594A1 (en) * | 2020-04-09 | 2023-05-11 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Thermal laser evaporation system and method of providing a thermal laser beam at a source |
Family Cites Families (24)
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JPS60240396A (ja) * | 1984-05-15 | 1985-11-29 | Matsushita Electric Ind Co Ltd | パルス発振レ−ザ溶接装置 |
JPS6224219A (ja) * | 1985-07-25 | 1987-02-02 | Toshiba Corp | レ−ザマ−キング装置 |
US5010537A (en) * | 1987-07-27 | 1991-04-23 | Nikon Corporation | Optical disc device with multi-head slider and tracking control |
JP3064628B2 (ja) * | 1992-02-18 | 2000-07-12 | 富士通株式会社 | 内層パターン切断方法及びその装置 |
US5319183A (en) * | 1992-02-18 | 1994-06-07 | Fujitsu Limited | Method and apparatus for cutting patterns of printed wiring boards and method and apparatus for cleaning printed wiring boards |
DE4229399C2 (de) * | 1992-09-03 | 1999-05-27 | Deutsch Zentr Luft & Raumfahrt | Verfahren und Vorrichtung zum Herstellen einer Funktionsstruktur eines Halbleiterbauelements |
JP3255469B2 (ja) * | 1992-11-30 | 2002-02-12 | 三菱電機株式会社 | レーザ薄膜形成装置 |
JPH06224219A (ja) | 1993-01-25 | 1994-08-12 | Fujitsu Ltd | 薄膜トランジスタの製造方法 |
JPH06297176A (ja) * | 1993-04-19 | 1994-10-25 | Omron Corp | レーザ加工装置 |
CN1125411A (zh) * | 1993-06-11 | 1996-06-26 | 博士伦公司 | 使激光蚀刻表面上所形成的衍射槽纹最小化的方法 |
JPH0735999A (ja) * | 1993-07-22 | 1995-02-07 | Nippon Sheet Glass Co Ltd | 光学装置 |
JP3417094B2 (ja) * | 1994-11-18 | 2003-06-16 | 松下電工株式会社 | 立体回路の形成方法 |
JPH08225929A (ja) * | 1995-02-23 | 1996-09-03 | Matsushita Electric Ind Co Ltd | レーザ・アブレーションを用いた薄膜形成法およびレーザ・アブレーション装置 |
EP0738556B1 (en) * | 1995-04-19 | 1997-12-29 | Gerber Garment Technology, Inc. | Laser cutter and method for cutting sheet material |
US5567935A (en) * | 1995-06-02 | 1996-10-22 | The United States Of America As Represented By The Secretary Of The Air Force | Velocity selected laser ablation metal atom source |
JPH09103897A (ja) * | 1995-10-11 | 1997-04-22 | Sanyo Electric Co Ltd | 光加工法 |
JP3473268B2 (ja) * | 1996-04-24 | 2003-12-02 | 三菱電機株式会社 | レーザ加工装置 |
JPH1112723A (ja) * | 1997-06-23 | 1999-01-19 | Murata Mfg Co Ltd | レーザアブレーション成膜装置、および成膜方法 |
JP2001350117A (ja) * | 2000-06-09 | 2001-12-21 | Hamamatsu Kagaku Gijutsu Kenkyu Shinkokai | レーザ光強度分布平坦化マスクおよびそれを用いたレーザメッキ装置ならびにレーザメッキ方法 |
US6951120B2 (en) * | 2002-03-19 | 2005-10-04 | Wisconsin Alumni Research Foundation | Machining of lithium niobate by laser ablation |
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JP2004158803A (ja) * | 2002-11-08 | 2004-06-03 | Toshiba Corp | レーザ加工装置および表示装置の製造方法 |
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JP2007310368A (ja) * | 2006-04-21 | 2007-11-29 | Sumitomo Electric Ind Ltd | ホモジナイザを用いた整形ビームの伝搬方法およびそれを用いたレ−ザ加工光学系 |
-
2009
- 2009-01-06 EP EP09150125A patent/EP2204468B1/en active Active
- 2009-12-22 WO PCT/EP2009/067760 patent/WO2010079092A1/en active Application Filing
- 2009-12-22 US US13/142,546 patent/US8979282B2/en active Active
- 2009-12-22 KR KR1020117018324A patent/KR101378638B1/ko active IP Right Grant
- 2009-12-22 JP JP2011544022A patent/JP5417455B2/ja active Active
- 2009-12-22 CN CN200980156406.6A patent/CN102308019B/zh active Active
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2013
- 2013-08-30 JP JP2013179753A patent/JP2014029030A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN102308019B (zh) | 2015-01-14 |
EP2204468B1 (en) | 2012-10-17 |
WO2010079092A1 (en) | 2010-07-15 |
US8979282B2 (en) | 2015-03-17 |
JP2012514688A (ja) | 2012-06-28 |
CN102308019A (zh) | 2012-01-04 |
KR20110102942A (ko) | 2011-09-19 |
US20110292354A1 (en) | 2011-12-01 |
EP2204468A1 (en) | 2010-07-07 |
JP2014029030A (ja) | 2014-02-13 |
KR101378638B1 (ko) | 2014-03-27 |
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