JP5411192B2 - 圧延銅箔及びその製造方法 - Google Patents

圧延銅箔及びその製造方法 Download PDF

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Publication number
JP5411192B2
JP5411192B2 JP2011067473A JP2011067473A JP5411192B2 JP 5411192 B2 JP5411192 B2 JP 5411192B2 JP 2011067473 A JP2011067473 A JP 2011067473A JP 2011067473 A JP2011067473 A JP 2011067473A JP 5411192 B2 JP5411192 B2 JP 5411192B2
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JP
Japan
Prior art keywords
copper foil
rolling
rolled
rolled copper
less
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Active
Application number
JP2011067473A
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English (en)
Japanese (ja)
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JP2012201926A (ja
Inventor
竜弥 川野
郁也 黒▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
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Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2011067473A priority Critical patent/JP5411192B2/ja
Priority to TW101108438A priority patent/TWI455658B/zh
Priority to KR1020120029337A priority patent/KR101420490B1/ko
Priority to CN201210079447.3A priority patent/CN102691878B/zh
Publication of JP2012201926A publication Critical patent/JP2012201926A/ja
Application granted granted Critical
Publication of JP5411192B2 publication Critical patent/JP5411192B2/ja
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/40Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B37/00Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
    • B21B37/74Temperature control, e.g. by cooling or heating the rolls or the product
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2011067473A 2011-03-25 2011-03-25 圧延銅箔及びその製造方法 Active JP5411192B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011067473A JP5411192B2 (ja) 2011-03-25 2011-03-25 圧延銅箔及びその製造方法
TW101108438A TWI455658B (zh) 2011-03-25 2012-03-13 Rolled copper foil and its manufacturing method
KR1020120029337A KR101420490B1 (ko) 2011-03-25 2012-03-22 압연 동박 및 그 제조 방법
CN201210079447.3A CN102691878B (zh) 2011-03-25 2012-03-23 压延铜箔及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011067473A JP5411192B2 (ja) 2011-03-25 2011-03-25 圧延銅箔及びその製造方法

Publications (2)

Publication Number Publication Date
JP2012201926A JP2012201926A (ja) 2012-10-22
JP5411192B2 true JP5411192B2 (ja) 2014-02-12

Family

ID=46857517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011067473A Active JP5411192B2 (ja) 2011-03-25 2011-03-25 圧延銅箔及びその製造方法

Country Status (4)

Country Link
JP (1) JP5411192B2 (ko)
KR (1) KR101420490B1 (ko)
CN (1) CN102691878B (ko)
TW (1) TWI455658B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822669B2 (ja) 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法
JP5475897B1 (ja) * 2012-05-11 2014-04-16 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2014037577A (ja) * 2012-08-16 2014-02-27 Jx Nippon Mining & Metals Corp グラフェン製造用圧延銅箔、及びグラフェンの製造方法
JP6078024B2 (ja) 2014-06-13 2017-02-08 Jx金属株式会社 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法
KR101942621B1 (ko) * 2015-02-06 2019-01-25 제이엑스금속주식회사 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법
JP6170516B2 (ja) * 2015-03-18 2017-07-26 Jx金属株式会社 圧延銅箔及びその製造方法、銅張積層板、並びにフレキシブルプリント基板及び電子機器
US9673646B1 (en) * 2016-08-19 2017-06-06 Chang Chun Petrochemical Co., Ltd. Surface-treated electrolytic copper foil and method for wireless charging of flexible printed circuit board
JP6611751B2 (ja) * 2017-03-31 2019-11-27 Jx金属株式会社 リチウムイオン電池集電体用圧延銅箔及びリチウムイオン電池
JP6643287B2 (ja) * 2017-08-03 2020-02-12 Jx金属株式会社 フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器
CN116967285B (zh) * 2023-09-22 2023-12-15 江苏铭丰电子材料科技有限公司 一种铜箔压延装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100226299B1 (ko) * 1995-01-21 1999-10-15 에모또 간지 방향성규소 강판의 냉간 압연방법 및 이냉간압연 방법에 사용되는 냉간압연기의 롤러 냉각 제어장치
JP3009383B2 (ja) * 1998-03-31 2000-02-14 日鉱金属株式会社 圧延銅箔およびその製造方法
JP3856581B2 (ja) * 1999-01-18 2006-12-13 日鉱金属株式会社 フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2001152267A (ja) * 1999-11-18 2001-06-05 Kobe Steel Ltd 銅合金圧延箔
JP3911173B2 (ja) * 2002-02-27 2007-05-09 日鉱金属株式会社 銅張積層板用圧延銅箔及びその製造方法(2)
JP3824593B2 (ja) * 2003-02-27 2006-09-20 日鉱金属株式会社 高い伸びを有する圧延銅箔
JP2006283078A (ja) * 2005-03-31 2006-10-19 Nikko Kinzoku Kk 銅張積層板用圧延銅箔及びその製造方法
JP4401998B2 (ja) * 2005-03-31 2010-01-20 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔及びその製造方法
CN101146933B (zh) * 2005-03-31 2010-11-24 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
JP4522972B2 (ja) * 2005-04-28 2010-08-11 日鉱金属株式会社 銅張積層基板用高光沢圧延銅箔
JP4890546B2 (ja) * 2006-06-12 2012-03-07 Jx日鉱日石金属株式会社 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法
JP5588607B2 (ja) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 電解銅箔及びその電解銅箔の製造方法
JP4992940B2 (ja) * 2009-06-22 2012-08-08 日立電線株式会社 圧延銅箔

Also Published As

Publication number Publication date
TWI455658B (zh) 2014-10-01
CN102691878B (zh) 2017-03-01
CN102691878A (zh) 2012-09-26
TW201309121A (zh) 2013-02-16
KR101420490B1 (ko) 2014-08-13
JP2012201926A (ja) 2012-10-22
KR20120109360A (ko) 2012-10-08

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