JP5408487B2 - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
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- JP5408487B2 JP5408487B2 JP2009184673A JP2009184673A JP5408487B2 JP 5408487 B2 JP5408487 B2 JP 5408487B2 JP 2009184673 A JP2009184673 A JP 2009184673A JP 2009184673 A JP2009184673 A JP 2009184673A JP 5408487 B2 JP5408487 B2 JP 5408487B2
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- light emitting
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- 239000004065 semiconductor Substances 0.000 title claims description 72
- 238000005253 cladding Methods 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 46
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 22
- 239000010410 layer Substances 0.000 description 410
- 239000000203 mixture Substances 0.000 description 30
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 21
- 239000011777 magnesium Substances 0.000 description 19
- 239000010931 gold Substances 0.000 description 17
- 230000001629 suppression Effects 0.000 description 17
- 239000002019 doping agent Substances 0.000 description 15
- 238000009792 diffusion process Methods 0.000 description 13
- 230000004888 barrier function Effects 0.000 description 12
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- AXAZMDOAUQTMOW-UHFFFAOYSA-N dimethylzinc Chemical compound C[Zn]C AXAZMDOAUQTMOW-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 4
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical group [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 229910052795 boron group element Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 229910000039 hydrogen halide Inorganic materials 0.000 description 1
- 239000012433 hydrogen halide Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052696 pnictogen Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Description
1.第1の実施の形態(p型クラッド層とp側コンタクト層との間に中間層を有する半導体発光素子の一例)
2.変形例(他の中間層の例)
3.第2の実施の形態(他の半導体発光素子の一例)
図1は本発明の第1の実施の形態に係る半導体発光素子の断面構成を模式的に表している。図2は図1に示した積層構造20を構成する各層におけるエネルギーバンドの伝導帯下端の準位を模式的に表している。本実施の形態における半導体発光素子1は、基板10の上に、活性層14を有する積層構造20を備え、積層構造20の上にはp側電極21、基板10の裏面側にはn側電極22がそれぞれ設けられている。この半導体発光素子1は、活性層14から光が発せられるものであり、例えば、発光ダイオードとして用いられるものである。
図3は図1に示した半導体発光素子1の変形例に係るエネルギーバンドの伝導帯下端の準位を模式的に表している。本変形例の半導体発光素子は、中間層16の構成を除き、図1に示した半導体発光素子1と同様の構成を有している。
図4は本発明の第2の実施の形態に係る半導体発光素子2の構成を表すものであり、図4(A)は図4(B)中のII(A)−II(A)線に沿った断面構成を表し、図4(B)は図4(A)のn側電極52の側からみた平面構成を表している。
図4に示した半導体発光素子2を以下の手順により作製した。
中間層35を形成する際にIn組成比aを0.340にしたことを除き、実験例1〜5と同様の手順を経た。なお、実験例6についてもキャップ層36Cの表面モホロジを実験例1〜5と同様に観察したところ、図5(C)に示した結果が得られた。
Claims (4)
- n型クラッド層、活性層、AlGaInPを含むp型クラッド層、中間層およびGaPを含むコンタクト層をこの順で備え、
前記中間層は、Ga1-a Ina P(0.357≦a≦0.382)を含むと共に10nm以上20nm以下の厚さを有する
半導体発光素子。 - 前記n型クラッド層、前記活性層、前記AlGaInPを含むp型クラッド層、前記中間層および前記GaPを含むコンタクト層はGaAs基板上に設けられた
請求項1記載の半導体発光素子。 - n型クラッド層、活性層、AlGaInPを含むp型クラッド層、中間層およびGaPを含むコンタクト層をこの順で備え、
前記中間層は、Ga1-b Inb P(0.357≦b≦0.382)を含有する第1半導体層と、(Alc Ga1-c )1-d Ind P(0.4≦c≦1,0<d<1)を含有する第2半導体層とを含む超格子構造を有し、
前記超格子構造中における前記第1半導体層の合計厚さが10nm以上20nm以下である
半導体発光素子。 - 前記n型クラッド層、前記活性層、前記AlGaInPを含むp型クラッド層、前記中間層および前記GaPを含むコンタクト層はGaAs基板上に設けられた
請求項3記載の半導体発光素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009184673A JP5408487B2 (ja) | 2009-08-07 | 2009-08-07 | 半導体発光素子 |
US12/805,086 US8344414B2 (en) | 2009-08-07 | 2010-07-12 | Semiconductor light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009184673A JP5408487B2 (ja) | 2009-08-07 | 2009-08-07 | 半導体発光素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011040477A JP2011040477A (ja) | 2011-02-24 |
JP5408487B2 true JP5408487B2 (ja) | 2014-02-05 |
Family
ID=43534160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009184673A Expired - Fee Related JP5408487B2 (ja) | 2009-08-07 | 2009-08-07 | 半導体発光素子 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8344414B2 (ja) |
JP (1) | JP5408487B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9269870B2 (en) * | 2011-03-17 | 2016-02-23 | Epistar Corporation | Light-emitting device with intermediate layer |
US9130107B2 (en) * | 2011-08-31 | 2015-09-08 | Epistar Corporation | Light emitting device |
DE102017101637A1 (de) | 2017-01-27 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3635757B2 (ja) * | 1995-12-28 | 2005-04-06 | 昭和電工株式会社 | AlGaInP発光ダイオード |
GB2344458B (en) * | 1998-12-02 | 2000-12-27 | Arima Optoelectronics Corp | Light-emitting diodes |
JP2000307148A (ja) * | 1999-04-16 | 2000-11-02 | Hitachi Cable Ltd | 発光素子用エピタキシャルウエハおよび発光素子 |
JP3986703B2 (ja) * | 1999-04-27 | 2007-10-03 | 日立電線株式会社 | AlGaInP系発光素子用エピタキシャルウェハ及び発光素子 |
JP2001015801A (ja) * | 1999-06-29 | 2001-01-19 | Hitachi Cable Ltd | AlGaInP系発光素子及び発光素子用エピタキシャルウェハ |
JP2001267631A (ja) * | 2000-01-11 | 2001-09-28 | Sharp Corp | 半導体発光素子 |
-
2009
- 2009-08-07 JP JP2009184673A patent/JP5408487B2/ja not_active Expired - Fee Related
-
2010
- 2010-07-12 US US12/805,086 patent/US8344414B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011040477A (ja) | 2011-02-24 |
US8344414B2 (en) | 2013-01-01 |
US20110031528A1 (en) | 2011-02-10 |
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