JP5391469B2 - 窒化物半導体発光素子およびその製造方法 - Google Patents
窒化物半導体発光素子およびその製造方法 Download PDFInfo
- Publication number
- JP5391469B2 JP5391469B2 JP2007030961A JP2007030961A JP5391469B2 JP 5391469 B2 JP5391469 B2 JP 5391469B2 JP 2007030961 A JP2007030961 A JP 2007030961A JP 2007030961 A JP2007030961 A JP 2007030961A JP 5391469 B2 JP5391469 B2 JP 5391469B2
- Authority
- JP
- Japan
- Prior art keywords
- cladding layer
- nitride semiconductor
- emitting device
- semiconductor light
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 67
- 150000004767 nitrides Chemical class 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000005253 cladding Methods 0.000 claims description 122
- 239000000463 material Substances 0.000 claims description 67
- 238000000605 extraction Methods 0.000 claims description 51
- 239000002061 nanopillar Substances 0.000 claims description 49
- 238000000034 method Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 19
- 238000003491 array Methods 0.000 claims description 8
- 229910003437 indium oxide Inorganic materials 0.000 claims description 8
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910004140 HfO Inorganic materials 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 6
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052746 lanthanum Inorganic materials 0.000 claims description 6
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 229910052711 selenium Inorganic materials 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 6
- 229910052714 tellurium Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 238000001459 lithography Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 12
- 229910002704 AlGaN Inorganic materials 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000001947 vapour-phase growth Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 208000012868 Overgrowth Diseases 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61H—PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
- A61H39/00—Devices for locating or stimulating specific reflex points of the body for physical therapy, e.g. acupuncture
- A61H39/04—Devices for pressing such points, e.g. Shiatsu or Acupressure
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61H—PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
- A61H15/00—Massage by means of rollers, balls, e.g. inflatable, chains, or roller chains
- A61H15/0092—Massage by means of rollers, balls, e.g. inflatable, chains, or roller chains hand-held
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61H—PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
- A61H15/00—Massage by means of rollers, balls, e.g. inflatable, chains, or roller chains
- A61H2015/0007—Massage by means of rollers, balls, e.g. inflatable, chains, or roller chains with balls or rollers rotating about their own axis
- A61H2015/0014—Massage by means of rollers, balls, e.g. inflatable, chains, or roller chains with balls or rollers rotating about their own axis cylinder-like, i.e. rollers
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61H—PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
- A61H2201/00—Characteristics of apparatus not provided for in the preceding codes
- A61H2201/10—Characteristics of apparatus not provided for in the preceding codes with further special therapeutic means, e.g. electrotherapy, magneto therapy or radiation therapy, chromo therapy, infrared or ultraviolet therapy
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61H—PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
- A61H2201/00—Characteristics of apparatus not provided for in the preceding codes
- A61H2201/16—Physical interface with patient
- A61H2201/1683—Surface of interface
- A61H2201/169—Physical characteristics of the surface, e.g. material, relief, texture or indicia
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
Description
第1クラッド層および第2クラッド層は、同じ物質から形成され、
前記n型クラッド層は前記第2クラッド層をエッチングして露出される領域を有し、
n電極が前記第2クラッド層の露出された領域に形成され、
p電極が前記p型クラッド層上に形成される
ことを特徴とする、窒化物半導体発光素子である。
更に、前記p型クラッド層の形成工程後に、前記第2クラッド層の表面をエッチングして、エッチングされた表面を形成し、前記第2クラッド層のエッチングされた表面上にn電極を形成し、
前記p型クラッド層上にp電極を形成する工程を含み、第1クラッド層および第2クラッド層は、同じ物質から形成されることを特徴とする、窒化物半導体発光素子の製造方法である。
12 第1クラッド層、
14 第2クラッド層、
20 n型クラッド層、
30 透光性物質層、
30a 光抽出層、
40 活性層、
50 p型クラッド層、
100 n電極、
120 p電極。
Claims (24)
- 基板上に順次に積層されたn型クラッド層、活性層、およびp型クラッド層を備え、
前記n型クラッド層は、
第1クラッド層と、
第2クラッド層と、
前記第1クラッド層と前記第2クラッド層との間に配置され、前記活性層内で発生する光を回折、散乱、または回折および散乱させるものであって、複数の円筒状のナノ柱配列を含む光抽出層と、
を備え、
前記第1クラッド層および前記第2クラッド層は、同じ物質から形成され、
前記n型クラッド層は前記第2クラッド層をエッチングして露出される領域を有し、
n電極が前記第2クラッド層の露出された領域に形成され、
p電極が前記p型クラッド層上に形成される
ことを特徴とする、窒化物半導体発光素子。 - 前記ナノ柱は、前記第1クラッド層および第2クラッド層の形成に用いられている物質と異なる屈折率を有する物質から形成されることを特徴とする、請求項1に記載の窒化物半導体発光素子。
- 前記ナノ柱は、屈折率が1ないし2.5である透光性物質から形成されることを特徴とする、請求項2に記載の窒化物半導体発光素子。
- 前記ナノ柱は、200ないし780nmの範囲の波長に対して透光性を有する物質から形成されることを特徴とする、請求項2または3に記載の窒化物半導体発光素子。
- 前記ナノ柱は、SiO2、SiNx、Al2O3、HfO、TiO2、ZrO、およびZnOからなる群から選択される少なくとも1つの物質から形成されるか、またはインジウム酸化物に対して、Mg、Ag、Zn、Sc、Hf、Zr、Te、Se、Ta、W、Nb、Cu、Sn、Si、Ni、Co、Mo、Cr、Mn、Hg、Pr、およびLaからなる群から選択される少なくとも1つの元素が添加された物質から形成されることを特徴とする、請求項2ないし4のいずれか1項に記載の窒化物半導体発光素子。
- 前記ナノ柱の配列周期は、100ないし2000nmであることを特徴とする、請求項1ないし5のいずれか1項に記載の窒化物半導体発光素子。
- 前記ナノ柱の配列周期は、700nmであることを特徴とする、請求項6に記載の窒化物半導体発光素子。
- 前記ナノ柱のそれぞれの高さは、100ないし1000nmであることを特徴とする、請求項1ないし7のいずれか1項に記載の窒化物半導体発光素子。
- 前記ナノ柱のそれぞれの高さは、300nmであることを特徴とする、請求項8に記載の窒化物半導体発光素子。
- 前記ナノ柱のそれぞれの直径は、100ないし1000nmであることを特徴とする請求項1ないし9のいずれか1項に記載の窒化物半導体発光素子。
- 前記第1クラッド層および前記第2クラッド層は、AlInGaN系III−V族窒化物半導体から形成されることを特徴とする、請求項1ないし10のいずれか1項に記載の窒化物半導体発光素子。
- 基板上に順次にn型クラッド層、活性層、およびp型クラッド層を形成する工程を含み、
前記n型クラッド層を形成する工程は、
前記基板上に第1クラッド層を形成する工程と、
前記第1クラッド層上に透光性物質層を形成する工程と、
前記透光性物質層をパターニングして前記活性層内で発生する光を回折、散乱、または回折および散乱させるものであって、複数の円筒状のナノ柱配列を含む光抽出層を形成する工程と、
前記第1クラッド層上に前記光抽出層を埋め込む第2クラッド層を形成する工程と、を含み、
更に、前記p型クラッド層の形成工程後に、前記第2クラッド層の表面をエッチングして、エッチングされた表面を形成し、
前記第2クラッド層のエッチングされた表面上にn電極を形成し、
前記p型クラッド層上にp電極を形成する工程を含み、
前記第1クラッド層および前記第2クラッド層は、同じ物質から形成されることを特徴とする、窒化物半導体発光素子の製造方法。 - 前記透光性物質層のパターニングは、ホログラムによるリソグラフィ法により行われることを特徴とする、請求項12に記載の窒化物半導体発光素子の製造方法。
- 前記透光性物質層は、前記第1クラッド層および前記第2クラッド層の形成に用いられている物質と異なる屈折率を有する物質から形成されることを特徴とする、請求項12または13に記載の窒化物半導体発光素子の製造方法。
- 前記透光性物質層は、屈折率が1ないし2.5である透光性物質から形成されることを特徴とする、請求項14に記載の窒化物半導体発光素子の製造方法。
- 前記透光性物質層は、200ないし780nmの範囲の波長に対して透光性を有する物質から形成されることを特徴とする、請求項15に記載の窒化物半導体発光素子の製造方法。
- 前記透光性物質層は、SiO2、SiNx、Al2O3、HfO、TiO2、ZrO、およびZnOからなる群から選択される少なくとも1つの物質から形成されるか、またはインジウム酸化物にMg、Ag、Zn、Sc、Hf、Zr、Te、Se、Ta、W、Nb、Cu、Sn、Si、Ni、Co、Mo、Cr、Mn、Hg、Pr、およびLaからなる群から選択される少なくとも1つの元素が添加された物質から形成されることを特徴とする、請求項14ないし16のいずれか1項に記載の窒化物半導体発光素子の製造方法。
- 前記ナノ柱の配列周期は、100ないし2000nmであることを特徴とする、請求項12ないし17のいずれか1項に記載の窒化物半導体発光素子の製造方法。
- 前記ナノ柱の配列周期は、700nmであることを特徴とする、請求項18に記載の窒化物半導体発光素子の製造方法。
- 前記ナノ柱のそれぞれの高さは、100ないし1000nmであることを特徴とする、請求項12ないし19のいずれか1項に記載の窒化物半導体発光素子の製造方法。
- 前記ナノ柱のそれぞれの高さは、300nmであることを特徴とする、請求項20に記載の窒化物半導体発光素子の製造方法。
- 前記ナノ柱のそれぞれの直径は、100ないし1000nmであることを特徴とする、請求項12ないし21のいずれか1項に記載の窒化物半導体発光素子の製造方法。
- 前記第1クラッド層および前記第2クラッド層は、AlInGaN系III−V族窒化物半導体から形成されることを特徴とする、請求項12ないし22のいずれか1項に記載の窒化物半導体発光素子の製造方法。
- 請求項12ないし23のいずれか1項に記載の製造方法で製造された、窒化物半導体発光素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0012915 | 2006-02-10 | ||
KR1020060012915A KR20070081184A (ko) | 2006-02-10 | 2006-02-10 | 질화물계 반도체 발광소자 및 그 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007214576A JP2007214576A (ja) | 2007-08-23 |
JP5391469B2 true JP5391469B2 (ja) | 2014-01-15 |
Family
ID=37998504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007030961A Active JP5391469B2 (ja) | 2006-02-10 | 2007-02-09 | 窒化物半導体発光素子およびその製造方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7888694B2 (ja) |
EP (1) | EP1818991A3 (ja) |
JP (1) | JP5391469B2 (ja) |
KR (1) | KR20070081184A (ja) |
CN (1) | CN101017869B (ja) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7964788B2 (en) * | 2006-11-02 | 2011-06-21 | Guardian Industries Corp. | Front electrode for use in photovoltaic device and method of making same |
KR101361029B1 (ko) * | 2007-10-19 | 2014-02-12 | 삼성전자주식회사 | 질화물 반도체 소자 및 그 제조방법 |
KR100905860B1 (ko) * | 2007-12-17 | 2009-07-02 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 그 제조 방법 |
TW200929601A (en) * | 2007-12-26 | 2009-07-01 | Epistar Corp | Semiconductor device |
KR101020961B1 (ko) * | 2008-05-02 | 2011-03-09 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
KR20100030472A (ko) * | 2008-09-10 | 2010-03-18 | 삼성전자주식회사 | 발광 소자 및 발광 장치의 제조 방법, 상기 방법을 이용하여 제조한 발광 소자 및 발광 장치 |
TWM386591U (en) * | 2009-07-30 | 2010-08-11 | Sino American Silicon Prod Inc | Nano patterned substrate and epitaxial structure |
US8963178B2 (en) | 2009-11-13 | 2015-02-24 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed bragg reflector and method of fabricating the same |
US9142715B2 (en) * | 2010-06-24 | 2015-09-22 | Seoul Viosys Co., Ltd. | Light emitting diode |
CN103053036B (zh) | 2010-07-28 | 2015-11-25 | 首尔伟傲世有限公司 | 具有分布式布拉格反射器的发光二极管 |
US20120083060A1 (en) * | 2010-09-30 | 2012-04-05 | Jie Cui | Integration of cluster mocvd and hvpe reactors with other process chambers |
CN102655195B (zh) | 2011-03-03 | 2015-03-18 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光二极管及其制造方法 |
CN102683533B (zh) | 2011-03-14 | 2014-12-10 | 展晶科技(深圳)有限公司 | 发光二极管及其制造方法 |
KR20120116231A (ko) * | 2011-04-12 | 2012-10-22 | (주)버티클 | 반도체 소자 및 그 제조 방법 |
CN102790045A (zh) * | 2011-05-18 | 2012-11-21 | 展晶科技(深圳)有限公司 | 发光二极管阵列及其制造方法 |
DE102011117381A1 (de) * | 2011-10-28 | 2013-05-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
FR2985609B1 (fr) * | 2012-01-05 | 2014-02-07 | Commissariat Energie Atomique | Substrat structure pour leds a forte extraction de lumiere |
DE102012003638A1 (de) * | 2012-02-24 | 2013-08-29 | Limo Patentverwaltung Gmbh & Co. Kg | Leuchtdiode |
US9401453B2 (en) * | 2012-05-24 | 2016-07-26 | The University Of Hong Kong | White nanoLED without requiring color conversion |
EP2722889B1 (en) | 2012-10-18 | 2018-03-21 | LG Innotek Co., Ltd. | Light emitting diode with improved efficiency though current spreading |
TWI565094B (zh) * | 2012-11-15 | 2017-01-01 | 財團法人工業技術研究院 | 氮化物半導體結構 |
KR101966623B1 (ko) * | 2012-12-11 | 2019-04-09 | 삼성전자주식회사 | 반도체층 형성 방법 및 반도체 발광소자 |
KR101554032B1 (ko) | 2013-01-29 | 2015-09-18 | 삼성전자주식회사 | 나노구조 반도체 발광소자 |
KR102022266B1 (ko) | 2013-01-29 | 2019-09-18 | 삼성전자주식회사 | 나노구조 반도체 발광소자 제조방법 |
KR20140098564A (ko) | 2013-01-31 | 2014-08-08 | 삼성전자주식회사 | 반도체 발광소자 |
CN103178168A (zh) * | 2013-03-19 | 2013-06-26 | 中国科学院半导体研究所 | 植入空气隙光子晶体的氮化镓基发光二极管的制备方法 |
US20200411724A1 (en) * | 2019-06-27 | 2020-12-31 | Lumileds Llc | Nanocone arrays for enhancing light outcoupling and package efficiency |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5779924A (en) * | 1996-03-22 | 1998-07-14 | Hewlett-Packard Company | Ordered interface texturing for a light emitting device |
US6051849A (en) | 1998-02-27 | 2000-04-18 | North Carolina State University | Gallium nitride semiconductor structures including a lateral gallium nitride layer that extends from an underlying gallium nitride layer |
JPH11274642A (ja) * | 1998-03-19 | 1999-10-08 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP4077137B2 (ja) * | 2000-06-15 | 2008-04-16 | 東芝電子エンジニアリング株式会社 | 半導体発光素子及びその製造方法 |
US6363096B1 (en) | 1999-08-30 | 2002-03-26 | Lucent Technologies Inc. | Article comprising a plastic laser |
US6975644B2 (en) * | 2001-04-12 | 2005-12-13 | Sony Corporation | Dual interface wireless IP communication device |
JP2004153089A (ja) | 2002-10-31 | 2004-05-27 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子及びその製造方法 |
US7071494B2 (en) | 2002-12-11 | 2006-07-04 | Lumileds Lighting U.S. Llc | Light emitting device with enhanced optical scattering |
JP4201079B2 (ja) | 2002-12-20 | 2008-12-24 | 昭和電工株式会社 | 発光素子、その製造方法およびledランプ |
US7042150B2 (en) | 2002-12-20 | 2006-05-09 | Showa Denko K.K. | Light-emitting device, method of fabricating the device, and LED lamp using the device |
KR100513316B1 (ko) * | 2003-01-21 | 2005-09-09 | 삼성전기주식회사 | 고효율 반도체 소자 제조방법 |
US7078735B2 (en) | 2003-03-27 | 2006-07-18 | Sanyo Electric Co., Ltd. | Light-emitting device and illuminator |
JP4263121B2 (ja) * | 2003-03-27 | 2009-05-13 | 三洋電機株式会社 | 発光素子および照明装置 |
US6781160B1 (en) | 2003-06-24 | 2004-08-24 | United Epitaxy Company, Ltd. | Semiconductor light emitting device and method for manufacturing the same |
US20050082562A1 (en) * | 2003-10-15 | 2005-04-21 | Epistar Corporation | High efficiency nitride based light emitting device |
KR100580276B1 (ko) | 2003-10-18 | 2006-05-15 | 에피밸리 주식회사 | 질화물 반도체 발광소자 |
JP4557542B2 (ja) | 2003-12-24 | 2010-10-06 | ▲さん▼圓光電股▲ふん▼有限公司 | 窒化物発光装置及び高発光効率窒化物発光装置 |
KR100581831B1 (ko) * | 2004-02-05 | 2006-05-23 | 엘지전자 주식회사 | 발광 다이오드 |
KR101079415B1 (ko) | 2004-02-27 | 2011-11-02 | 엘지전자 주식회사 | 반도체 발광소자 및 그 제조방법 |
KR100568300B1 (ko) | 2004-03-31 | 2006-04-05 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
KR100616596B1 (ko) | 2004-07-09 | 2006-08-28 | 삼성전기주식회사 | 질화물 반도체 소자 및 제조방법 |
JP4511440B2 (ja) * | 2004-10-05 | 2010-07-28 | 三星モバイルディスプレイ株式會社 | 有機発光素子及び有機発光素子の製造方法 |
US7291864B2 (en) | 2005-02-28 | 2007-11-06 | The Regents Of The University Of California | Single or multi-color high efficiency light emitting diode (LED) by growth over a patterned substrate |
US7265374B2 (en) * | 2005-06-10 | 2007-09-04 | Arima Computer Corporation | Light emitting semiconductor device |
-
2006
- 2006-02-10 KR KR1020060012915A patent/KR20070081184A/ko active Search and Examination
- 2006-08-14 EP EP06118864A patent/EP1818991A3/en not_active Withdrawn
- 2006-09-05 CN CN2006101285992A patent/CN101017869B/zh active Active
- 2006-09-22 US US11/525,096 patent/US7888694B2/en active Active
-
2007
- 2007-02-09 JP JP2007030961A patent/JP5391469B2/ja active Active
-
2010
- 2010-03-10 US US12/721,063 patent/US8183068B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101017869A (zh) | 2007-08-15 |
CN101017869B (zh) | 2012-01-04 |
US20100163912A1 (en) | 2010-07-01 |
US8183068B2 (en) | 2012-05-22 |
EP1818991A3 (en) | 2010-03-17 |
JP2007214576A (ja) | 2007-08-23 |
EP1818991A2 (en) | 2007-08-15 |
KR20070081184A (ko) | 2007-08-16 |
US20070187698A1 (en) | 2007-08-16 |
US7888694B2 (en) | 2011-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5391469B2 (ja) | 窒化物半導体発光素子およびその製造方法 | |
JP5037169B2 (ja) | 窒化物系半導体発光素子及びその製造方法 | |
US8847199B2 (en) | Nanorod light emitting device and method of manufacturing the same | |
US8405103B2 (en) | Photonic crystal light emitting device and manufacturing method of the same | |
JP4994758B2 (ja) | 窒化ガリウム系半導体発光素子及びその製造方法 | |
EP2763192B1 (en) | Nitride semiconductor element and method for producing same | |
US10186635B2 (en) | Method of forming a light emitting diode structure and a light diode structure | |
WO2006132013A1 (ja) | 半導体発光素子 | |
KR101125395B1 (ko) | 발광소자 및 그 제조방법 | |
CN105009308B (zh) | 用于创建多孔反射接触件的方法和装置 | |
JP2004179654A (ja) | GaN基の発光装置及びその製造方法 | |
JP2009543372A (ja) | 発光結晶構造体 | |
JP2008153676A (ja) | 窒化ガリウム系半導体発光素子及びその製造方法 | |
JP2007019488A (ja) | 半導体発光素子 | |
JP2005244201A (ja) | 半導体発光素子及びその製造方法 | |
US20130234178A1 (en) | Semiconductor light emitting device and method for manufacturing the same | |
JP2005268601A (ja) | 化合物半導体発光素子 | |
JP2010141331A (ja) | 半導体発光素子及びその製造方法 | |
US20130207147A1 (en) | Uv light emitting diode and method of manufacturing the same | |
JP2008159894A (ja) | 発光素子及び照明装置 | |
KR20110043282A (ko) | 발광소자 및 그 제조방법 | |
JP2020109819A (ja) | 多波長発光ダイオードのエピタキシャル構造 | |
KR20110093006A (ko) | 질화물 반도체 발광소자 | |
KR20090103855A (ko) | 질화물계 반도체 발광소자 및 그 제조방법 | |
JP2007250714A (ja) | 発光素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090908 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20101112 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101227 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20110512 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20110512 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120131 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120418 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120724 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20120813 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121204 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20121212 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130123 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130312 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20130325 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130611 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130702 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130801 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130926 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5391469 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |