JP2020109819A - 多波長発光ダイオードのエピタキシャル構造 - Google Patents
多波長発光ダイオードのエピタキシャル構造 Download PDFInfo
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- 239000000463 material Substances 0.000 claims abstract description 28
- 239000010410 layer Substances 0.000 claims description 306
- 238000005253 cladding Methods 0.000 claims description 107
- 238000002347 injection Methods 0.000 claims description 12
- 239000007924 injection Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 8
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
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- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 9
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- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
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- 239000002042 Silver nanowire Substances 0.000 description 2
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- 238000005229 chemical vapour deposition Methods 0.000 description 2
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- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
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- NQBRDZOHGALQCB-UHFFFAOYSA-N oxoindium Chemical compound [O].[In] NQBRDZOHGALQCB-UHFFFAOYSA-N 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
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- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
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Abstract
Description
或いは、少なくとも1つの発光素子は、第1クラッド層と第2クラッド層とをさらに備え、第1クラッド層と第2クラッド層は相対的に発光層の両側に設置され、第1クラッド層と第2クラッド層の厚さが同じである。
10:基板
21:第1発光素子
211:第1の第1クラッド層
212:第1発光層
213:第1の第2クラッド層
22:第2発光素子
221:第2の第1クラッド層
222:第2発光層
223:第2の第2クラッド層
23:第3発光素子
231:第3の第1クラッド層
232:第3発光層
233:第3の第2クラッド層
24:第4発光素子
241:第4の第1クラッド層
242:第4発光層
243:第4の第2クラッド層
2N:第N発光素子
2N1:第Nの第1クラッド層
2N2:第N発光層
2N3:第Nの第2クラッド層
50:透明導電性フィルム
60:反射層
70:接着層
W1:光出射面
Claims (11)
- 基板と、
前記基板に積層される少なくとも3つの発光素子と、
を備え、
2つの隣接する発光素子では、光出射面により近い発光素子のエネルギーギャップは、光出射面からより離れる発光素子のエネルギーギャップよりも高いことを特徴とする、多波長発光ダイオードのエピタキシャル構造。 - 前記各発光素子は、多重量子井戸構造を有する発光層を備えることを特徴とする、請求項1に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記発光素子の少なくとも1つは、第1クラッド層と第2クラッド層とをさらに備え、前記第1クラッド層と前記第2クラッド層は前記相対的に前記発光層の両側に設置され、前記第1クラッド層と前記第2クラッド層の厚さが異なることを特徴とする、請求項2に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記発光素子の少なくとも1つは、第1クラッド層と第2クラッド層とをさらに備え、前記第1クラッド層と前記第2クラッド層は前記相対的に前記発光層の両側に設置され、前記第1クラッド層と前記第2クラッド層の厚さが同じであることを特徴とする、請求項2に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記第1クラッド層及び前記第2クラッド層が設置される2つの隣接する発光素子では、前記光出射面により近い前記発光素子における前記第1クラッド層及び前記第2クラッド層の屈折率は、前記光出射面からより離れる前記発光素子における前記第1クラッド層及び前記第2クラッド層の屈折率よりも高く、1つの発光素子の前記第1クラッド層及び前記第2クラッド層では、前記光出射面により近い層の屈折率は、前記光出射面からより離れる他の層の屈折率よりも高いことを特徴とする、請求項3又は4に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記第1クラッド層及び前記第2クラッド層は、電子/正孔注入層、電子/正孔輸送層、電子/正孔阻止層又はそれらの組合せにそれぞれ相当するものであることを特徴とする、請求項3又は4に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記発光層、前記第1クラッド層及び前記第2クラッド層のそれぞれは、アルミニウム(Al)、ガリウム(Ga)、インジウム(In)、窒素(N)、ヒ素(As)及びリン(P)からなる群より選択される材料を含むことを特徴とする、請求項3又は4に記載の多波長発光ダイオードのエピタキシャル構造。
- 一つの前記発光層の前記第1クラッド層と、それと隣接するもう一つの前記発光層の前記第2クラッド層との総厚さが1μm以下であることを特徴とする、請求項3又は4に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記多波長発光ダイオードのエピタキシャル構造の放射光は、紫外光又は赤外光であることを特徴とする、請求項1に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記基板は、転写用基板を含むことを特徴とする、請求項1に記載の多波長発光ダイオードのエピタキシャル構造。
- 前記基板と前記基板に隣接する発光素子との間にはさらに接着層が設置されることを特徴とする、請求項1に記載の多波長発光ダイオードのエピタキシャル構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107147688A TWI676263B (zh) | 2018-12-28 | 2018-12-28 | 多波長發光二極體磊晶結構 |
TW107147688 | 2018-12-28 |
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CN101488542B (zh) * | 2008-01-14 | 2011-05-11 | 晶元光电股份有限公司 | 半导体发光装置和封装结构 |
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