JP5391162B2 - 電力用半導体装置 - Google Patents

電力用半導体装置 Download PDF

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Publication number
JP5391162B2
JP5391162B2 JP2010182086A JP2010182086A JP5391162B2 JP 5391162 B2 JP5391162 B2 JP 5391162B2 JP 2010182086 A JP2010182086 A JP 2010182086A JP 2010182086 A JP2010182086 A JP 2010182086A JP 5391162 B2 JP5391162 B2 JP 5391162B2
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JP
Japan
Prior art keywords
semiconductor device
power semiconductor
heat
package
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010182086A
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English (en)
Japanese (ja)
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JP2012043875A (ja
JP2012043875A5 (enExample
Inventor
志織 井高
靖 中山
健史 大井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2010182086A priority Critical patent/JP5391162B2/ja
Publication of JP2012043875A publication Critical patent/JP2012043875A/ja
Publication of JP2012043875A5 publication Critical patent/JP2012043875A5/ja
Application granted granted Critical
Publication of JP5391162B2 publication Critical patent/JP5391162B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2010182086A 2010-08-17 2010-08-17 電力用半導体装置 Active JP5391162B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010182086A JP5391162B2 (ja) 2010-08-17 2010-08-17 電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010182086A JP5391162B2 (ja) 2010-08-17 2010-08-17 電力用半導体装置

Publications (3)

Publication Number Publication Date
JP2012043875A JP2012043875A (ja) 2012-03-01
JP2012043875A5 JP2012043875A5 (enExample) 2012-11-29
JP5391162B2 true JP5391162B2 (ja) 2014-01-15

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ID=45899873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010182086A Active JP5391162B2 (ja) 2010-08-17 2010-08-17 電力用半導体装置

Country Status (1)

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JP (1) JP5391162B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014006826T5 (de) 2014-07-18 2017-03-30 Mitsubishi Electric Corporation Fahrzeughilfsleistungsversorgungsvorrichtung
JP6381453B2 (ja) * 2015-01-27 2018-08-29 三菱電機株式会社 半導体装置
CN209150089U (zh) 2016-04-01 2019-07-23 三菱电机株式会社 半导体装置
JP6852513B2 (ja) * 2017-03-30 2021-03-31 株式会社オートネットワーク技術研究所 回路装置
JP6877600B1 (ja) * 2020-01-16 2021-05-26 三菱電機株式会社 半導体装置
US20230073259A1 (en) * 2020-02-18 2023-03-09 Lam Research Corporation High temperature substrate support with heat spreader
JP7840156B2 (ja) * 2022-01-05 2026-04-03 三菱電機株式会社 半導体装置
JP7830242B2 (ja) * 2022-06-15 2026-03-16 Ａｓｔｅｍｏ株式会社 電力変換装置
JPWO2024018810A1 (enExample) * 2022-07-21 2024-01-25
JP7675786B1 (ja) * 2023-11-24 2025-05-13 株式会社東芝 半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03126055U (enExample) * 1990-03-30 1991-12-19
JP3130239B2 (ja) * 1995-08-02 2001-01-31 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP2004095670A (ja) * 2002-08-29 2004-03-25 Toshiba Corp 半導体装置
CN100413060C (zh) * 2003-09-04 2008-08-20 松下电器产业株式会社 半导体装置
JP2008060430A (ja) * 2006-08-31 2008-03-13 Daikin Ind Ltd 電力変換装置
CN102687270A (zh) * 2010-01-15 2012-09-19 三菱电机株式会社 电力用半导体模块

Also Published As

Publication number Publication date
JP2012043875A (ja) 2012-03-01

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