JPH03126055U - - Google Patents

Info

Publication number
JPH03126055U
JPH03126055U JP1990034352U JP3435290U JPH03126055U JP H03126055 U JPH03126055 U JP H03126055U JP 1990034352 U JP1990034352 U JP 1990034352U JP 3435290 U JP3435290 U JP 3435290U JP H03126055 U JPH03126055 U JP H03126055U
Authority
JP
Japan
Prior art keywords
power module
power
phenolic resin
epoxy resin
overcoated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990034352U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990034352U priority Critical patent/JPH03126055U/ja
Publication of JPH03126055U publication Critical patent/JPH03126055U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990034352U 1990-03-30 1990-03-30 Pending JPH03126055U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990034352U JPH03126055U (enExample) 1990-03-30 1990-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990034352U JPH03126055U (enExample) 1990-03-30 1990-03-30

Publications (1)

Publication Number Publication Date
JPH03126055U true JPH03126055U (enExample) 1991-12-19

Family

ID=31538749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990034352U Pending JPH03126055U (enExample) 1990-03-30 1990-03-30

Country Status (1)

Country Link
JP (1) JPH03126055U (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011086896A1 (ja) * 2010-01-15 2011-07-21 三菱電機株式会社 電力用半導体モジュール
JP2012043875A (ja) * 2010-08-17 2012-03-01 Mitsubishi Electric Corp 電力用半導体装置
WO2013008424A1 (ja) * 2011-07-11 2013-01-17 三菱電機株式会社 電力用半導体モジュール

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011086896A1 (ja) * 2010-01-15 2011-07-21 三菱電機株式会社 電力用半導体モジュール
CN102687270A (zh) * 2010-01-15 2012-09-19 三菱电机株式会社 电力用半导体模块
JPWO2011086896A1 (ja) * 2010-01-15 2013-05-16 三菱電機株式会社 電力用半導体モジュール
EP2525404A4 (en) * 2010-01-15 2014-01-01 Mitsubishi Electric Corp SEMICONDUCTOR POWER MODULE
CN109166833A (zh) * 2010-01-15 2019-01-08 三菱电机株式会社 电力用半导体模块
JP2012043875A (ja) * 2010-08-17 2012-03-01 Mitsubishi Electric Corp 電力用半導体装置
WO2013008424A1 (ja) * 2011-07-11 2013-01-17 三菱電機株式会社 電力用半導体モジュール
CN103650137A (zh) * 2011-07-11 2014-03-19 三菱电机株式会社 功率半导体模块
JPWO2013008424A1 (ja) * 2011-07-11 2015-02-23 三菱電機株式会社 電力用半導体モジュール
EP2733743A4 (en) * 2011-07-11 2015-03-18 Mitsubishi Electric Corp SEMICONDUCTOR POWER MODULE
JP2016167635A (ja) * 2011-07-11 2016-09-15 三菱電機株式会社 電力用半導体モジュール

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