JP5386471B2 - 無電解めっき装置及び無電解めっき方法 - Google Patents

無電解めっき装置及び無電解めっき方法 Download PDF

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Publication number
JP5386471B2
JP5386471B2 JP2010280396A JP2010280396A JP5386471B2 JP 5386471 B2 JP5386471 B2 JP 5386471B2 JP 2010280396 A JP2010280396 A JP 2010280396A JP 2010280396 A JP2010280396 A JP 2010280396A JP 5386471 B2 JP5386471 B2 JP 5386471B2
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plating
metal
tank
copper
plating solution
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JP2012126967A (ja
JP2012126967A5 (enExample
Inventor
兼元　　大
利則 川村
晴夫 赤星
智行 宮崎
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Hitachi Ltd
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Hitachi Ltd
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JP2010280396A 2010-12-16 2010-12-16 無電解めっき装置及び無電解めっき方法 Expired - Fee Related JP5386471B2 (ja)

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JP2010280396A JP5386471B2 (ja) 2010-12-16 2010-12-16 無電解めっき装置及び無電解めっき方法

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JP2010280396A JP5386471B2 (ja) 2010-12-16 2010-12-16 無電解めっき装置及び無電解めっき方法

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JP2012126967A JP2012126967A (ja) 2012-07-05
JP2012126967A5 JP2012126967A5 (enExample) 2013-04-11
JP5386471B2 true JP5386471B2 (ja) 2014-01-15

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JP2010280396A Expired - Fee Related JP5386471B2 (ja) 2010-12-16 2010-12-16 無電解めっき装置及び無電解めっき方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114516655B (zh) * 2022-02-09 2023-07-04 广州科城环保科技有限公司 一种线路板废物生产氢氧化铜的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0633254A (ja) * 1992-07-17 1994-02-08 Nec Corp 無電解銅めっき装置
JP2774905B2 (ja) * 1992-09-03 1998-07-09 松下電工株式会社 無電解メッキ法
JP3809608B2 (ja) * 2002-04-26 2006-08-16 株式会社日立製作所 無電解銅めっき方法とその装置及びその銅補給液の作製方法とその装置
JP3817645B2 (ja) * 2002-05-14 2006-09-06 株式会社日立製作所 無電解銅めっき方法とその装置及びその銅補給装置並びにその無電解銅めっき補給液の作成方法とその装置
JP2007302967A (ja) * 2006-05-12 2007-11-22 Mitsubishi Electric Corp 無電解めっき方法

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