JP5386082B2 - 低収容力のキャリア及びその使用方法 - Google Patents

低収容力のキャリア及びその使用方法 Download PDF

Info

Publication number
JP5386082B2
JP5386082B2 JP2007528083A JP2007528083A JP5386082B2 JP 5386082 B2 JP5386082 B2 JP 5386082B2 JP 2007528083 A JP2007528083 A JP 2007528083A JP 2007528083 A JP2007528083 A JP 2007528083A JP 5386082 B2 JP5386082 B2 JP 5386082B2
Authority
JP
Japan
Prior art keywords
substrate
carrier
casing
load port
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2007528083A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008511142A (ja
JP2008511142A5 (OSRAM
Inventor
ギルクリスト ユリシーズ
マイケル エル． ブファノ
ウィリアム フォスナイト
クリストファー ホフマイスター
ジェラルド エム． フリードマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Azenta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azenta Inc filed Critical Azenta Inc
Publication of JP2008511142A publication Critical patent/JP2008511142A/ja
Publication of JP2008511142A5 publication Critical patent/JP2008511142A5/ja
Application granted granted Critical
Publication of JP5386082B2 publication Critical patent/JP5386082B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2007528083A 2004-08-19 2005-08-19 低収容力のキャリア及びその使用方法 Expired - Lifetime JP5386082B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US60336104P 2004-08-19 2004-08-19
US60/603,361 2004-08-19
US11/207,231 2005-08-19
US11/207,231 US8888433B2 (en) 2004-08-19 2005-08-19 Reduced capacity carrier and method of use
PCT/US2005/029757 WO2006023838A2 (en) 2004-08-19 2005-08-19 Reduced capacity carrier and method of use

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011221201A Division JP2012015550A (ja) 2004-08-19 2011-10-05 低収容キャリアの使用方法

Publications (3)

Publication Number Publication Date
JP2008511142A JP2008511142A (ja) 2008-04-10
JP2008511142A5 JP2008511142A5 (OSRAM) 2013-10-03
JP5386082B2 true JP5386082B2 (ja) 2014-01-15

Family

ID=35968256

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2007528083A Expired - Lifetime JP5386082B2 (ja) 2004-08-19 2005-08-19 低収容力のキャリア及びその使用方法
JP2011221201A Pending JP2012015550A (ja) 2004-08-19 2011-10-05 低収容キャリアの使用方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011221201A Pending JP2012015550A (ja) 2004-08-19 2011-10-05 低収容キャリアの使用方法

Country Status (6)

Country Link
US (2) US8888433B2 (OSRAM)
EP (1) EP1786710A4 (OSRAM)
JP (2) JP5386082B2 (OSRAM)
KR (1) KR101233101B1 (OSRAM)
CN (2) CN101044074B (OSRAM)
WO (1) WO2006023838A2 (OSRAM)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101233101B1 (ko) 2004-08-19 2013-02-14 브룩스 오토메이션 인코퍼레이티드 저용량 캐리어 및 그 사용방법
WO2007056443A2 (en) * 2005-11-07 2007-05-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US8267634B2 (en) * 2005-11-07 2012-09-18 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
US20080107507A1 (en) * 2005-11-07 2008-05-08 Bufano Michael L Reduced capacity carrier, transport, load port, buffer system
US20070140822A1 (en) * 2005-12-16 2007-06-21 Applied Materials, Inc. Methods and apparatus for opening and closing substrate carriers
JP5461760B2 (ja) * 2006-07-26 2014-04-02 株式会社カネカ 半導体製造装置及び半導体製造方法
WO2008024225A2 (en) 2006-08-18 2008-02-28 Brooks Automation, Inc. Reduced capacity carrier, transport, load port, buffer system
KR20090053915A (ko) * 2006-08-18 2009-05-28 브룩스 오토메이션 인코퍼레이티드 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
JP2008060513A (ja) * 2006-09-04 2008-03-13 Tokyo Electron Ltd 処理装置及び処理方法
TWI475627B (zh) 2007-05-17 2015-03-01 Brooks Automation Inc 基板運送機、基板處理裝置和系統、於基板處理期間降低基板之微粒污染的方法，及使運送機與處理機結合之方法
KR20100020968A (ko) * 2007-05-17 2010-02-23 브룩스 오토메이션 인코퍼레이티드 측면 개방형 기판 캐리어 및 로드 포트
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
DE102007035839B4 (de) * 2007-07-31 2017-06-22 Globalfoundries Dresden Module One Limited Liability Company & Co. Kg Verfahren und System zum lokalen Aufbewahren von Substratbehältern in einem Deckentransportsystem zum Verbessern der Aufnahme/Abgabe-Kapazitäten von Prozessanlagen
DE202010017181U1 (de) * 2010-08-04 2011-03-24 Centrotherm Thermal Solutions Gmbh + Co. Kg Vorrichtung zum Schließen und Öffnen einer Be-/Entladeöffnung einer Prozesskammer
JP2013143425A (ja) * 2012-01-10 2013-07-22 Tokyo Electron Ltd 基板処理システム及び基板位置矯正方法
JP6180954B2 (ja) * 2014-02-05 2017-08-16 浜松ホトニクス株式会社 分光器、及び分光器の製造方法
NL2014754B1 (en) * 2014-05-07 2016-05-03 Mapper Lithography Ip Bv Enclosure for a target processing machine.
JP2016178133A (ja) * 2015-03-19 2016-10-06 シンフォニアテクノロジー株式会社 ドア開閉装置、搬送装置、ソータ装置、収納容器のドッキング方法
JP6554872B2 (ja) * 2015-03-31 2019-08-07 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
JP6451453B2 (ja) * 2015-03-31 2019-01-16 Tdk株式会社 ガスパージ装置、ロードポート装置、パージ対象容器の設置台およびガスパージ方法
US11569138B2 (en) * 2015-06-16 2023-01-31 Kla Corporation System and method for monitoring parameters of a semiconductor factory automation system
TWI727562B (zh) * 2015-08-04 2021-05-11 日商昕芙旎雅股份有限公司 裝載埠
TWI746204B (zh) 2015-08-04 2021-11-11 日商昕芙旎雅股份有限公司 門開閉系統及具備門開閉系統之載入埠
JP6544128B2 (ja) * 2015-08-07 2019-07-17 シンフォニアテクノロジー株式会社 収納容器の蓋体及び収納容器
DE102015219564A1 (de) * 2015-10-09 2017-04-13 Robert Bosch Gmbh Werkzeuganalyseeinrichtung und verfahren zur analyse einer bearbeitung eines werkstücks mit einem werkzeug
US10153282B1 (en) 2017-08-11 2018-12-11 Lam Research Corporation Ultra-high vacuum transport and storage
JP6969936B2 (ja) * 2017-08-29 2021-11-24 株式会社ディスコ ウエーハ収容カセット
JP7009194B2 (ja) * 2017-12-12 2022-01-25 株式会社ディスコ ウエーハ生成装置および搬送トレー
JP7164396B2 (ja) * 2018-10-29 2022-11-01 株式会社ディスコ ウエーハ生成装置
US11348817B2 (en) * 2018-11-29 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer transport system and method for transporting wafers
KR102015485B1 (ko) * 2019-02-18 2019-08-28 주식회사 윈텍 오엘이디 제조 챔버 장비용 오토 리드 장치
JP6721852B2 (ja) * 2019-07-16 2020-07-15 シンフォニアテクノロジー株式会社 ロードポート
KR102278078B1 (ko) * 2019-10-17 2021-07-19 세메스 주식회사 기판 반송 장치 및 기판 처리 장치
JP7564475B2 (ja) * 2022-02-08 2024-10-09 シンフォニアテクノロジー株式会社 ロードポート及びロードポートの駆動方法
JP2023128124A (ja) * 2022-03-03 2023-09-14 株式会社ディスコ 搬送治具

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097421A (en) * 1984-12-24 1992-03-17 Asyst Technologies, Inc. Intelligent waxer carrier
JPS61228647A (ja) 1985-04-02 1986-10-11 Mitsubishi Electric Corp ウエハ並べ換え装置
US4724874A (en) * 1986-05-01 1988-02-16 Asyst Technologies Sealable transportable container having a particle filtering system
US4995430A (en) * 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
US5169272A (en) * 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
US5469963A (en) * 1992-04-08 1995-11-28 Asyst Technologies, Inc. Sealable transportable container having improved liner
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
JPH09232407A (ja) * 1996-02-21 1997-09-05 Hitachi Ltd ワーク搬送装置およびそれを用いた半導体製造装置
FR2747111B1 (fr) * 1996-04-03 1998-04-30 Commissariat Energie Atomique Systeme d'accouplement pour un transfert confine d'un objet plat d'une boite de confinement vers une unite de traitement de l'objet
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
JPH10270526A (ja) 1997-03-24 1998-10-09 Canon Inc 基板収納容器および基板搬送装置
US6390754B2 (en) * 1997-05-21 2002-05-21 Tokyo Electron Limited Wafer processing apparatus, method of operating the same and wafer detecting system
JP4253365B2 (ja) * 1997-10-17 2009-04-08 オリンパス株式会社 ウェハ搬送装置
JP3772011B2 (ja) * 1997-12-24 2006-05-10 大日本スクリーン製造株式会社 基板処理装置
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
FR2779421B1 (fr) * 1998-06-08 2000-08-18 Incam Solutions Dispositif adaptateur pour des boites de confinement d'au moins un objet plat sous atmosphere ultrapropre
US6271917B1 (en) 1998-06-26 2001-08-07 Thomas W. Hagler Method and apparatus for spectrum analysis and encoder
US6244812B1 (en) * 1998-07-10 2001-06-12 H-Square Corporation Low profile automated pod door removal system
JP4305988B2 (ja) 1999-01-27 2009-07-29 シンフォニアテクノロジー株式会社 ウエーハキャリア
JP2000286319A (ja) * 1999-03-31 2000-10-13 Canon Inc 基板搬送方法および半導体製造装置
TW461686U (en) 1999-04-06 2001-10-21 Benq Corp Housing decoration cap set
US6612797B1 (en) * 1999-05-18 2003-09-02 Asyst Technologies, Inc. Cassette buffering within a minienvironment
DE19922936B4 (de) 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US8348583B2 (en) * 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
JP3939062B2 (ja) 2000-01-25 2007-06-27 松下電器産業株式会社 基板検出装置
US6633050B1 (en) * 2000-08-15 2003-10-14 Asml Holding Nv. Virtual gauging system for use in lithographic processing
US6901971B2 (en) * 2001-01-10 2005-06-07 Entegris, Inc. Transportable container including an internal environment monitor
US6530736B2 (en) * 2001-07-13 2003-03-11 Asyst Technologies, Inc. SMIF load port interface including smart port door
JP3697478B2 (ja) * 2001-08-20 2005-09-21 ソニー株式会社 基板の移送方法及びロードポート装置並びに基板移送システム
US6745901B2 (en) * 2001-10-12 2004-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cassette equipped with piezoelectric sensors
US20030077153A1 (en) * 2001-10-19 2003-04-24 Applied Materials, Inc. Identification code reader integrated with substrate carrier robot
KR100469360B1 (ko) * 2002-02-22 2005-02-02 엘지.필립스 엘시디 주식회사 액정표시소자의 제조 장비용 진공 합착 장치 및 구동 방법
JP4168642B2 (ja) * 2002-02-28 2008-10-22 東京エレクトロン株式会社 被処理体収納容器体及び処理システム
JP2003264216A (ja) * 2002-03-08 2003-09-19 Murata Mach Ltd 搬送システム
US6691416B2 (en) * 2002-06-26 2004-02-17 Hsiu-Man Yu Chen Cutter for vehicle safety belts or the like
US6719142B1 (en) * 2002-07-16 2004-04-13 Ion Systems, Inc. Apparatus and method for measuring static charge on wafers, disks, substrates, masks, and flat panel displays
US6826451B2 (en) * 2002-07-29 2004-11-30 Asml Holding N.V. Lithography tool having a vacuum reticle library coupled to a vacuum chamber
US7328836B2 (en) * 2004-02-03 2008-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Smart tag holder and cover housing
KR101233101B1 (ko) 2004-08-19 2013-02-14 브룩스 오토메이션 인코퍼레이티드 저용량 캐리어 및 그 사용방법
EP1803151B1 (en) * 2004-08-23 2011-10-05 Murata Machinery, Ltd. Elevator-based tool loading and buffering system
JP2011186366A (ja) 2010-03-11 2011-09-22 Noriko Takamine 香るチラシの作成方法

Also Published As

Publication number Publication date
JP2012015550A (ja) 2012-01-19
US9881825B2 (en) 2018-01-30
CN103771034B (zh) 2016-06-29
JP2008511142A (ja) 2008-04-10
US8888433B2 (en) 2014-11-18
CN103771034A (zh) 2014-05-07
CN101044074B (zh) 2014-04-02
KR101233101B1 (ko) 2013-02-14
CN101044074A (zh) 2007-09-26
WO2006023838A3 (en) 2006-08-17
US20060088272A1 (en) 2006-04-27
WO2006023838A2 (en) 2006-03-02
US20150155192A1 (en) 2015-06-04
EP1786710A2 (en) 2007-05-23
KR20070045322A (ko) 2007-05-02
EP1786710A4 (en) 2011-10-12

Similar Documents

Publication Publication Date Title
JP5386082B2 (ja) 低収容力のキャリア及びその使用方法
US9368382B2 (en) Elevator-based tool loading and buffering system
US20100158643A1 (en) Elevator-based tool loading and buffering system
EP0582016B1 (en) Pressurized sealable transportable containers for storing a semiconductor wafer in a protective gaseous environment
US20200227283A1 (en) Apparatus and method for handling wafer carrier doors
US5788458A (en) Method and apparatus for vertical transfer of a semiconductor wafer cassette
EP0582019B1 (en) Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers
EP0582017B1 (en) Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers
US5382127A (en) Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment
US20030053894A1 (en) Method for transporting substrates and a semiconductor manufacturing apparatus using the method
JP2018110268A (ja) 小容積キャリヤ搬送体、積載ポート、バッファシステム
US20020067981A1 (en) Wafer transport system
CN101189713B (zh) 在多个工作站之间的传送腔室
JP2002261150A (ja) 基板処理装置
TWI788792B (zh) 半導體製造設備系統及其操作方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080819

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110405

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110701

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110708

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111005

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120706

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20120829

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20121026

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130206

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130212

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20130730

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20130806

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20130821

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131007

R150 Certificate of patent or registration of utility model

Ref document number: 5386082

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term