JP5360228B2 - 電子装置および複合電子装置 - Google Patents
電子装置および複合電子装置 Download PDFInfo
- Publication number
- JP5360228B2 JP5360228B2 JP2011543915A JP2011543915A JP5360228B2 JP 5360228 B2 JP5360228 B2 JP 5360228B2 JP 2011543915 A JP2011543915 A JP 2011543915A JP 2011543915 A JP2011543915 A JP 2011543915A JP 5360228 B2 JP5360228 B2 JP 5360228B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling air
- electronic device
- intake
- cooling
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims description 16
- 238000001816 cooling Methods 0.000 claims description 150
- 239000000758 substrate Substances 0.000 claims description 22
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 239000012530 fluid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
- G11B33/1406—Reducing the influence of the temperature
- G11B33/1413—Reducing the influence of the temperature by fluid cooling
- G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
41,42 側板
43 天板
44 コネクタ
51−1〜6 DIMMエリア
52 電源基板
53 演算素子
54 通信素子
61,61−1〜3,61−1a〜3a 吸気孔
62,62−1〜3 排気孔
71〜73 ダクト
74〜76 導風孔
81 水冷ジャケット
82,83 フィン
100 サーバ
101 天板
102 底板
103 側面板
104 側面板
106 キャスター
107 脚部
108a,108b,111 棚
109a,109b,112 ガイドパネル
110 電源装置
113,116 冷却装置
114,117 接続基板
200〜205 システムボード
DA1 吸気ダクトエリア
DA3 排気ダクトエリア
Claims (10)
- 冷却風による空冷の対象となる発熱部品を実装した基板と、
吸気ダクトを介して0度より大きく90度より小さい所定の角度で供給される冷却風を前記基板に導入する吸気孔を有する第1の側板と、
前記基板から前記冷却風を排出する排気孔を有する第2の側板とを備え、
前記第1の側板は、前記第1の側板の延在方向における前記発熱部品の中点に対して、前記延在方向における前記吸気孔の中点が、前記延在方向における前記吸気孔に供給される冷却風の風上側にオフセットした位置に前記吸気孔を有する
ことを特徴とする電子装置。 - 前記発熱部品を前記基板上の複数の領域に分散して配置し、前記複数の領域のうち前記第1の側板側に設けられた領域に対応して吸気孔を複数備えた
ことを特徴とする請求項1に記載の電子装置。 - 前記吸気孔と前記排気孔のうち、すくなくとも前記排気孔に前記冷却風を整流するダクト
をさらに備えたことを特徴とする請求項1に記載の電子装置。 - 前記基板の前記吸気孔側の前記冷却風を集約して前記排気孔側に供給する導風部材
をさらに備えたことを特徴とする請求項1に記載の電子装置。 - 前記発熱部品に比して低温の部品に前記冷却風を接触させるフィン
をさらに備えたことを特徴とする請求項1に記載の電子装置。 - 前記フィンが前記基板に搭載される際の前記第1の側板に対する角度は、前記吸気時における冷却風の前記第1の側板に対する角度に等しい
ことを特徴とする請求項5に記載の電子装置。 - 冷却風による空冷の対象となる発熱部品を実装した基板を有する1または複数の電子装置と、
前記電子装置の第1の側面に設けられた吸気孔に対し、0度より大きく90度より小さい所定の角度で冷却風を供給する吸気ダクトと、
前記電子装置の第2の側面に設けられた排気孔から排出された冷却風を排気する排気ダクトと、
前記電子装置と前記吸気ダクトの間と前記電子装置と前記排気ダクトの間のうち少なくとも一方に設けられ、前記冷却風を形成する冷却装置とを備え、
前記電子装置の前記第1の側板は、当該第1の側板の延在方向における前記発熱部品の中点に対して、前記延在方向における前記吸気孔の中点が、前記延在方向における前記吸気孔に供給される冷却風の風上側にオフセットした位置に前記吸気孔を有する
ことを特徴とする複合電子装置。 - 前記発熱部品を前記基板上の複数の領域に分散して配置し、前記複数の領域のうち前記第1の側板側に設けられた領域に対応して吸気孔を複数備えた
ことを特徴とする請求項7に記載の複合電子装置。 - 前記吸気孔と前記排気孔のうち、すくなくとも前記排気孔に前記冷却風を整流するダクト
をさらに備えたことを特徴とする請求項7に記載の複合電子装置。 - 前記基板の前記吸気孔側の前記冷却風を集約して前記排気孔側に供給する導風部材
をさらに備えたことを特徴とする請求項7に記載の複合電子装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2009/067933 WO2011045866A1 (ja) | 2009-10-16 | 2009-10-16 | 電子装置および複合電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2011045866A1 JPWO2011045866A1 (ja) | 2013-03-04 |
JP5360228B2 true JP5360228B2 (ja) | 2013-12-04 |
Family
ID=43875924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011543915A Expired - Fee Related JP5360228B2 (ja) | 2009-10-16 | 2009-10-16 | 電子装置および複合電子装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8817470B2 (ja) |
EP (1) | EP2490518A4 (ja) |
JP (1) | JP5360228B2 (ja) |
KR (1) | KR101437497B1 (ja) |
CN (1) | CN102577652A (ja) |
WO (1) | WO2011045866A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8842431B2 (en) * | 2007-10-15 | 2014-09-23 | Alcatel Lucent | Horizontal chassis having front to back airflow |
CN101950197A (zh) * | 2010-05-24 | 2011-01-19 | 深圳市傲星泰科技有限公司 | 一种计算机电源 |
WO2014027405A1 (ja) * | 2012-08-15 | 2014-02-20 | 富士通株式会社 | 受熱装置、冷却装置、及び電子装置 |
US9497891B2 (en) | 2014-09-22 | 2016-11-15 | Dell Products, L.P. | Embedded chassis ducting system for parallelizing airflow through components oriented in series |
CN105228428B (zh) * | 2015-11-11 | 2017-11-10 | 佛山市顺德区恒迅电子有限公司 | 一种供气速度可调的电路板装置组件 |
CN105392331A (zh) * | 2015-11-11 | 2016-03-09 | 肖白玉 | 一种带吸尘装置且供气速度可调的电路板装置组件 |
US10184477B2 (en) * | 2016-12-05 | 2019-01-22 | Asia Vital Components Co., Ltd. | Series fan inclination structure |
US10412851B2 (en) | 2017-02-23 | 2019-09-10 | Quanta Computer Inc. | Inclined storage array for improved cooling |
JP6769356B2 (ja) * | 2017-03-13 | 2020-10-14 | 富士通株式会社 | 情報処理装置 |
US10966340B2 (en) | 2018-09-12 | 2021-03-30 | Hewlett Packard Enterprise Development Lp | Tray with memory modules |
US11751364B2 (en) | 2018-11-30 | 2023-09-05 | Sony Interactive Entertainment Inc. | Electronic equipment |
CN110337217B (zh) * | 2019-04-29 | 2020-10-09 | 中磊电子(苏州)有限公司 | 具有倾斜设计的无风扇通信装置 |
JP7275380B2 (ja) | 2020-03-27 | 2023-05-17 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
US11516558B2 (en) * | 2020-09-10 | 2022-11-29 | Ciena Corporation | Angled faceplates for a network element |
US20230040718A1 (en) * | 2021-08-06 | 2023-02-09 | Commscope Technologies Llc | Rack mounting adapter with airflow management |
US20230418345A1 (en) * | 2022-06-22 | 2023-12-28 | Jose Augusto Vullo | Disposal of refrigeration applied in machines or equipment or kits for mining cryptocurrencies and/or for data processing |
Citations (4)
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JPH0252493U (ja) * | 1988-10-07 | 1990-04-16 | ||
JP2004363236A (ja) * | 2003-06-03 | 2004-12-24 | Fujitsu Ltd | 筺体 |
JP2007502027A (ja) * | 2003-05-13 | 2007-02-01 | アメリカン、パワー、コンバージョン、コーポレイション | ラック囲い |
JP2008270374A (ja) * | 2007-04-17 | 2008-11-06 | Fujitsu Ltd | 電子機器収納箱 |
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US8842431B2 (en) * | 2007-10-15 | 2014-09-23 | Alcatel Lucent | Horizontal chassis having front to back airflow |
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-
2009
- 2009-10-16 KR KR1020127009455A patent/KR101437497B1/ko active IP Right Grant
- 2009-10-16 EP EP09850408.7A patent/EP2490518A4/en not_active Withdrawn
- 2009-10-16 CN CN2009801619603A patent/CN102577652A/zh active Pending
- 2009-10-16 WO PCT/JP2009/067933 patent/WO2011045866A1/ja active Application Filing
- 2009-10-16 JP JP2011543915A patent/JP5360228B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-16 US US13/447,515 patent/US8817470B2/en not_active Expired - Fee Related
Patent Citations (4)
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JPH0252493U (ja) * | 1988-10-07 | 1990-04-16 | ||
JP2007502027A (ja) * | 2003-05-13 | 2007-02-01 | アメリカン、パワー、コンバージョン、コーポレイション | ラック囲い |
JP2004363236A (ja) * | 2003-06-03 | 2004-12-24 | Fujitsu Ltd | 筺体 |
JP2008270374A (ja) * | 2007-04-17 | 2008-11-06 | Fujitsu Ltd | 電子機器収納箱 |
Also Published As
Publication number | Publication date |
---|---|
CN102577652A (zh) | 2012-07-11 |
US20120201001A1 (en) | 2012-08-09 |
US8817470B2 (en) | 2014-08-26 |
KR20120053077A (ko) | 2012-05-24 |
EP2490518A4 (en) | 2014-06-11 |
WO2011045866A1 (ja) | 2011-04-21 |
JPWO2011045866A1 (ja) | 2013-03-04 |
EP2490518A1 (en) | 2012-08-22 |
KR101437497B1 (ko) | 2014-09-03 |
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