JP5353978B2 - 分断装置 - Google Patents
分断装置 Download PDFInfo
- Publication number
- JP5353978B2 JP5353978B2 JP2011192359A JP2011192359A JP5353978B2 JP 5353978 B2 JP5353978 B2 JP 5353978B2 JP 2011192359 A JP2011192359 A JP 2011192359A JP 2011192359 A JP2011192359 A JP 2011192359A JP 5353978 B2 JP5353978 B2 JP 5353978B2
- Authority
- JP
- Japan
- Prior art keywords
- along
- support base
- brittle plate
- support
- main path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011192359A JP5353978B2 (ja) | 2011-09-05 | 2011-09-05 | 分断装置 |
TW101130020A TWI480246B (zh) | 2011-09-05 | 2012-08-17 | 分斷裝置 |
KR1020120091794A KR101359729B1 (ko) | 2011-09-05 | 2012-08-22 | 분단 장치 |
CN201210321691.6A CN102975296B (zh) | 2011-09-05 | 2012-09-03 | 分断装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011192359A JP5353978B2 (ja) | 2011-09-05 | 2011-09-05 | 分断装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013163806A Division JP5566511B2 (ja) | 2013-08-07 | 2013-08-07 | 分断装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013053044A JP2013053044A (ja) | 2013-03-21 |
JP5353978B2 true JP5353978B2 (ja) | 2013-11-27 |
Family
ID=47849788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011192359A Expired - Fee Related JP5353978B2 (ja) | 2011-09-05 | 2011-09-05 | 分断装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5353978B2 (zh) |
KR (1) | KR101359729B1 (zh) |
CN (1) | CN102975296B (zh) |
TW (1) | TWI480246B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105643823B (zh) * | 2016-03-18 | 2017-11-07 | 郑招才 | 一种陶瓷简易切割装置四轴移动机架 |
CN106430935B (zh) * | 2016-12-02 | 2019-06-07 | 台州施特自动化有限公司 | 一种刻度板位置调整设备 |
KR101980606B1 (ko) * | 2017-08-29 | 2019-05-21 | 한국미쯔보시다이아몬드공업(주) | 취성 재료 기판의 경사 타입 분단 장치 및 분단 방법 |
CN107696304B (zh) * | 2017-09-26 | 2019-03-08 | 北龙建设集团有限公司 | 一种能降低建筑施工事故的切砖设备 |
CN110040949B (zh) * | 2019-05-28 | 2021-08-10 | 晶智(上海)光学仪器设备有限公司 | 一种等间距的玻璃切割装置 |
CN110815593A (zh) * | 2019-11-13 | 2020-02-21 | 刘海元 | 一种玻璃加工切割装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11116260A (ja) * | 1997-10-08 | 1999-04-27 | Mitsuboshi Diamond Kogyo Kk | ガラス加工装置 |
JP2001261357A (ja) * | 2000-03-21 | 2001-09-26 | Asahi Glass Co Ltd | ガラス板の加工方法及びその装置 |
KR100832292B1 (ko) * | 2002-02-19 | 2008-05-26 | 엘지디스플레이 주식회사 | 액정 패널의 절단 장치 |
EP1690660A1 (en) * | 2003-12-04 | 2006-08-16 | Mitsuboshi Diamond Industrial Co., Ltd. | Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism |
TW200633808A (en) * | 2004-12-28 | 2006-10-01 | Mitsuboshi Diamond Ind Co Ltd | Method for cutting brittle material substrate and substrate cutting system |
JP2006245263A (ja) * | 2005-03-03 | 2006-09-14 | Sony Corp | 基板ブレイク装置および基板ブレイク方法ならびに半導体装置 |
KR100788199B1 (ko) | 2006-07-18 | 2007-12-26 | 주식회사 에스에프에이 | 기판 절단시스템 및 그 방법 |
JP5349881B2 (ja) * | 2008-09-24 | 2013-11-20 | 三星ダイヤモンド工業株式会社 | スクライブ装置および基板分断システム |
-
2011
- 2011-09-05 JP JP2011192359A patent/JP5353978B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-17 TW TW101130020A patent/TWI480246B/zh not_active IP Right Cessation
- 2012-08-22 KR KR1020120091794A patent/KR101359729B1/ko active IP Right Grant
- 2012-09-03 CN CN201210321691.6A patent/CN102975296B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW201313644A (zh) | 2013-04-01 |
TWI480246B (zh) | 2015-04-11 |
CN102975296A (zh) | 2013-03-20 |
JP2013053044A (ja) | 2013-03-21 |
CN102975296B (zh) | 2015-04-08 |
KR101359729B1 (ko) | 2014-02-06 |
KR20130026381A (ko) | 2013-03-13 |
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