JP5349291B2 - 結晶ドナーからへき開されたドニー層を使用して厚膜および薄膜デバイスを製造するシステムおよび方法 - Google Patents
結晶ドナーからへき開されたドニー層を使用して厚膜および薄膜デバイスを製造するシステムおよび方法 Download PDFInfo
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- JP5349291B2 JP5349291B2 JP2009504417A JP2009504417A JP5349291B2 JP 5349291 B2 JP5349291 B2 JP 5349291B2 JP 2009504417 A JP2009504417 A JP 2009504417A JP 2009504417 A JP2009504417 A JP 2009504417A JP 5349291 B2 JP5349291 B2 JP 5349291B2
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Description
・例えばメモリ、高速プロセッサおよびサーバ、ビデオ会議システム、直接映画配信およびディスプレイなどの高帯域幅電子機器;
・例えば携帯用コンピュータ、携帯電話、電子手帳、時計、PDAなどの低電圧、低電力CMOS;
・例えば自動制御、電源スイッチ、ディスプレイおよびオーディオの電源などの高電圧、高電力デバイス;および、
・他の用途、例えばスマートセンサおよびコントローラ、MEMS、光エレクトロニクス、放射線硬化デバイス、スマートパワー回路およびイントリンシック・ゲッタリング層である。
次に図面を参照すると、図1は本開示によって製造されたデバイス構造100を示す。高レベルでは、デバイス構造00は結晶「ドニー」層104と、「デバイス」層108と、「ハンドル」112とを備える。以下に詳細に記載するように、ドニー層104は、少なくとも1つのへき開されたドニー層を、より一般的には、本質的に2つ以上のドニー層を提供することができる結晶材料の塊である結晶「ドナー」(図2Aのドナー200を参照)からへき開された結晶層である。本開示はその最も広義において、その原子構造が結晶であること、およびデバイス構造100などのデバイス構造を作製するために使用されるのに適した結晶面116などの結晶面を付与するためにへき開されてもよいこと以外にはドナーに対していかなる限定も行わない。ドナーは自然に出現する鉱物、または人工的に製造される実質的にいかなる結晶塊であってもよい。
B.1.アクティブマトリクスバックプレーン用の可撓性TFT構造
アクティブマトリクス・ディスプレイ駆動方式には典型的には典型的にはダイオード/薄膜トランジスタ(TFT)、または従来の厚膜(基板、CMOS)トランジスタが必要である。これらはさらに以下のように細分化することができる。すなわち、1)(金属−絶縁体−金属ダイオード、リングダイオード、バックツーバックダイオードなどの)2端子薄膜ダイオード、または2)例えばCdSe、アモルファスシリコン、高温ポリシリコン(HTPS)、低温ポリシリコン、超低温ポリシリコン、単結晶シリコン、ポリマーなどから製造される3端子TFTである。TFTはPMOSまたはNMOSの趣向のものでよい。これらは平坦な構造または段状構造を有することができる。これらはボトムゲート/トップゲートでよい。上記から明らかであるように、各々が最適なデバイス性能のために適合された、ほぼ無限の種類のデバイスアーキテクチャが現在使用されている。
高電界の衝突−励起をベースにしたエレクトロルミネセンス(EL)・デバイスには特に、薄膜型EL(TFEL)、厚膜型EL、薄膜・厚膜混成型EL(TDFEL)、反転TFEL(ITFEL)および直立構造などの多くの種類がある。これらのデバイスは単色とカラーの各々を入手することができ、受動マトリクス(PM)または能動マトリクス(AM)方式のいずれかを利用して駆動される。ELデバイスおよびディスプレイは、LCD、OLEDなどの競合するディスプレイ技術に対して多くの利点を有するソリッドステートデバイスである。これらは頑健で動作環境からの影響を受けず、デバイスの寿命が長く、より広い温度範囲で動作可能であり、衝撃耐性があり、一般に通常の摩耗および断裂に対する耐性がある。
上記のへき開/層移設技術は電子産業にも応用できる。前述のTFTおよびELデバイスの製造と同様に、例えばレジスタ、コンデンサ、インダクタ、バス線、電極などの電気回路のほとんどのコンポーネントはCMOS、MOS、FET、MOSFET、BJT、JFETおよびその他の半導体技術を使用して小型化、実現化が可能である。その結果、実質的にいかなる種類の電子デバイスも、本出願に開示されている技術を部分的に使用して製造され得る。これらの技術を使用して製造された電子デバイスにより、これらのデバイスおよび/またはそのコンポーネントがフレキシブルで、電力消費量が低く、より携帯可能/移動可能になる。このような電子デバイスの例には、特に、携帯電話、携帯ビデオカメラ、パーソナルコンピュータ、ヘッドマウントディスプレイ、リアおよびフロント型画像プロジェクタ、ディジタル信号処理装置、個人用携帯情報端末、電子手帳および電子看板が含まれるが、これらに限定されない。’240号出願は、本明細書に開示されている技術を使用して製造できるこれらの、およびその他の電子デバイスの多様なコンポーネントを非網羅的に列挙している。これらのコンポーネントは図1のデバイス構造100、図5のデバイス構造400、または同様の構造および/または従来製造されている構造を有する構造の積層および/またはタイリングされた集塊の形態をとることができる。開示された技術の電子産業への利用可能性は基本的に電子産業自体と同様に広範にわたる。
本開示の技術は、例えば特に可視光線、赤外線、紫外線、x線センサなどのような電磁エネルギー検出器などの可撓性で順応性のあるセンサ/検出器および圧力センサを作製するためにも使用できる。’240号出願は、本開示の技術を使用して製造できる検出器/センサの種類と構成の代表的なリストを含む。一例を説明するため、図10は、各々が図1のデバイス構造100、および図4のデバイス構造400とそれぞれ同様に製造されるピクセル構造1004および増幅器構造1008を含む可撓性で順応性のあるx線検出器1000を示す。図示した実施例では、ピクセル構造1004はドニー層1012と、ピクセルデバイス層1016と、透明ハンドル1020とを含み、また増幅器構造1008はドニー層1024と、増幅器デバイス層1028と、ハンドル1032とを含む。デバイス層1016と増幅器デバイス層1028は各々、このような層を製造するための従来の技術を使用して作製できる。
本明細書に開示されている技術の、上記に例示したディスプレイ、電子素子およびセンサ/検出器産業への多くの用途に加えて、これらの技術は光学および光電子産業での広範な用途にも使用できる。例えば、可撓性基板上に高品質の光学薄膜を有することが望ましいことが多い。しかし、高品質、高性能の膜を実現するには一般に高い基板/成長チャンバ温度が必要である。加えて、フォトニック結晶などのメサ構造は、従来の可撓性基板を使用できないようにする化学物質およびプラズマエッチング液を使用する。高温耐性、エッチ耐性があるドニー層を供給する高温耐性、エッチ耐性があるドナーに関連した本開示の技術を使用することで、従来の技術のこれらの欠点が克服される。
・キャリヤの高い移動性
・キャリヤの移動性および粒子サイズの安定性および反復性
・高品質/最良品質のゲート酸化物
・高品質の透明および不透明電極
加えて、ドニー層は、原子レベルでのへき開の結果として原子レベルの表面粗さが低いことにより高品質の膜およびデバイスをその上に製造するための自然の平坦化層として機能することができる。ドナーは多数回再利用でき、後続の処理の前に研磨を必要としないドニー層がそのつど得られる。本明細書で開示している技術を使用して製造されたデバイスは、よく知られ、よく類別されたデバイス層製造工程およびツールを使用できるので、高い信頼性を有することができる。公開された技術は低温/室温工程を利用する。したがって、デバイス構造には熱応力がまったく、または僅かしか誘発されない。その結果、本明細書に開示した技術により、リソグラフィ中の位置合わせ精度、基板の寸法安定性、パターン、薄型基板の取扱いなどに関連する製造上の問題なく可撓性で順応性のあるデバイスを実現することができる。
本開示の技術は前述のような様々な電子構造を作製することに加えて、従来のシリコン・オン・インシュレータ(SOI)基板とほぼ同様に使用できる広範な半導体材料オン・インシュレータ(SMOI)基板を製造するために使用できる。まさに、本開示の技術は、例えば特にガラス上の結晶シリコン、プラスチック上の結晶シリコン、および金属上の結晶シリコンなどの「何かの上の半導体材料」(SMOA)基板を製造するために使用できる。上記の参照として本明細書に組み込まれている’240号出願は、本開示により製造されたSMOIおよびSMOA基板の多くの変形形態および用例の幾つかを記載している。
Claims (51)
- 層移設による電子的なおよび/または光電子的なデバイス構造の作製方法であって、
(a)第1の自由表面と、互いに間隔を隔てられ且つ前記第1の自由表面とほぼ平行な複数の真性へき開面とを有する結晶ドナーを準備するステップを有し、前記第1の自由表面と前記複数の真性へき開面の一つとが第1のドニー層を画定し、
(b)前記方法はさらに、少なくとも1つのデバイスが前記第1のドニー層とモノリシックになるように、電子式および光電子式のいずれかである前記少なくとも1つのデバイスを含むデバイス層を、前記第1の自由表面上に製造するステップと、
(c)前記第1のドニー層を前記結晶ドナーから遊離させるために、前記第1のドニー層を前記結晶ドナーからへき開するステップとを含む方法。 - ステップ(c)がステップ(b)の前に実行される請求項1に記載の方法。
- ステップ(c)がステップ(b)の後に実行される請求項1に記載の方法。
- ステップ(c)の前に、ステップ(c)を補助するために前記ドニー層にハンドルを取り付けるステップをさらに含む請求項3に記載の方法。
- ステップ(c)が、第1のハンドルを前記第1のドニー層に固着するステップを含み、前記第1のハンドルはステップ(c)の直後に前記第1のドニー層に対して固着状態に保たれる請求項1に記載の方法。
- 前記第1のハンドルを前記第1のドニー層に固着する前記ステップが、前記第1のハンドルを前記デバイス層に取り付けるステップを含む請求項5に記載の方法。
- 前記第1のハンドルを前記第1のドニー層に固着する前記ステップが、前記第1のハンドルを前記第1のドニー層に取り付けるステップを含む請求項5に記載の方法。
- 前記第1のハンドルが細長い部材の一部であり、前記第1のハンドルを前記第1のドニー層に固着する前記ステップがロールツーロール工程によって実行される請求項5に記載の方法。
- ステップ(c)が前記ロールツーロール工程によって実行される請求項8に記載の方法。
- ステップ(b)が前記ロールツーロール工程によって実行される請求項9に記載の方法。
- ステップ(b)が少なくとも1つのトランジスタを製造するステップを含む請求項1に記載の方法。
- ステップ(b)が少なくとも1つの薄膜トランジスタを形成するステップを含む請求項11に記載の方法。
- ステップ(b)が少なくとも1つの厚膜トランジスタを形成するステップを含む請求項11に記載の方法。
- ステップ(b)が少なくとも1つのエレクトロルミネセンス・デバイスを形成するステ
ップを含む請求項1に記載の方法。 - ステップ(b)が、1)センサ、および2)検出器の少なくとも1つを形成するステップを含む請求項1に記載の方法。
- ステップ(a)からステップ(c)が第1のデバイスコンポーネントを形成するために用いられ、方法がさらに、
(d)第2のデバイス層と、前記第2のデバイス層に対して固着された第2のハンドルとを備える第2のデバイスコンポーネントを準備するステップと、
(e)前記第1のデバイスコンポーネントと第2のデバイスコンポーネントとを互いに積層するステップとを含む請求項1に記載の方法。 - ステップ(c)の後に前記第1のドニー層のほぼすべてを除去するステップをさらに含む請求項1に記載の方法。
- ステップ(a)が、複数枚の薄板状シートを含む雲母状/ラメラ状ドナーを準備するステップを含み、前記第1のドニー層が前記複数の薄板状シートの少なくとも1枚である請求項1に記載の方法。
- 前記雲母状/ラメラ状ドナーが複数のフッ素金雲母シートを含む請求項18に記載の方法。
- 前記第1のドニー層が雲母状/ラメラ状材料を含み、ステップ(b)が、前記第1のドニー層上にヘテロエピタキシャル半導体オン・インシュレータ層を形成するステップを含む請求項1に記載の方法。
- 後に超小型電子素子をその上に製造する半導体下地基板の製造方法であって、
(a)表面と、前記表面とほぼ平行な第1のへき開面とを有し、前記表面と前記へき開面との間にドニー層を画定するようにする雲母状/ラメラ状結晶ドナーを準備するステップと、
(b)前記表面と向き合うヘテロエピタキシャル層を形成し、前記ヘテロエピタキシャル層が後に超小型電子素子をその上に製造するように構成されるステップと、
(c)前記ドニー層を前記雲母状/ラメラ状結晶ドナーから除去するように、前記ドニー層を前記雲母状/ラメラ状結晶ドナーからへき開するステップとを含む方法。 - 前記ヘテロエピタキシャル層が自由側を有し、方法がさらに前記自由側のヘテロエピタキシャル層に酸化物層を付加するステップを含む請求項21に記載の方法。
- 前記酸化物層を付加する前記ステップが、前記自由側の直ぐ近傍の前記ヘテロエピタキシャル層の一部を酸化物に転換するステップを含む請求項22に記載の方法。
- 前記酸化物層を付加する前記ステップが前記ヘテロエピタキシャル層上に前記酸化物層を形成するステップを含む請求項22に記載の方法。
- ステップ(b)がステップ(c)の前に実行される請求項21に記載の方法。
- ステップ(c)の前に、ステップ(c)を補助するために前記ドニー層にハンドルを取り付けるステップをさらに含む請求項25に記載の方法。
- 前記ドニー層にハンドルを取り付ける前記ステップが、前記ドニー層に透明ハンドルを
取り付けるステップを含む請求項26に記載の方法。 - ステップ(b)の前にシード層を形成するステップを含みさらに、ステップ(b)が前記シード層の上の前記ヘテロエピタキシャル層を形成するステップを含む請求項21に記載の方法。
- ステップ(b)が、30nm未満の厚さを有するように前記ヘテロエピタキシャル層を形成するステップを含む請求項21に記載の方法。
- ステップ(b)の後のステップ(c)が実行され、方法が、ステップ(b)とステップ(c)との間にステップ(c)を補助するため前記ドニー層の反対側の前記ヘテロエピタキシャル層に対してハンドルを固着するステップをさらに含む請求項21に記載の方法。
- ステップ(c)の後に、前記ドニー層のほぼすべてを除去するステップをさらに含む請求項30に記載の方法。
- 前記ドニー層にハンドルを取り付ける前記ステップが、前記ドニー層に透明ハンドルを取り付けるステップを含む請求項30に記載の方法。
- ステップ(a)が複数の薄板状シートを備えるフッ素金雲母ドナーを準備するステップを含み、前記ドニー層が前記複数の薄板状シートの少なくとも1枚を含む請求項21に記載の方法。
- 電子的なおよび/または光電子的な複数のデバイス構造を製造する方法であって、
(a)複数のドニー層を画定する複数の真性へき開面を有する結晶ドナーを準備するステップと、
(b)前記複数のドニー層の各々の上にデバイス層を形成するステップと、
(c)前記複数のドニー層の1つを前記結晶ドナーから遊離させるために、前記複数の真性へき開面の対応するそれぞれ1つに沿って前記複数のドニー層の各々を前記結晶ドナーから互いに連続的にへき開するステップとを含む方法。 - ステップ(a)が、前記複数のドニー層にそれぞれ対応する複数の薄板状シートを有する雲母状/ラメラ状ドナーを準備するステップを含む請求項34に記載の方法。
- 前記複数のドニー層の1つが前記結晶ドナーからへき開される前に、前記複数のドニー層の各々を細長いハンドルに貼着するステップをさらに含む請求項34に記載の方法。
- 前記複数のドニー層がロールツーロール工程で連続的にへき開される請求項36に記載の方法。
- 前記デバイス層の各々が前記ロールツーロール工程で製造される請求項37に記載の方法。
- 前記複数のドニー層の各々を前記細長いハンドルに貼着する前記ステップが、ステップ(b)の後に実行される請求項36に記載の方法。
- 各々がデバイス層を有する電子構造を製造するシステムであって、
(a)細長いハンドルを繰り出すための第1のロールと、
(b)前記第1のロールの下流に位置し、対応するそれぞれの真性へき開面により分離される複数のドニー層を含む少なくとも1つの結晶ドナーと、
(c)前記第1のロールの下流に作用的に配置され、前記複数のドニー層の各々を前記細長いハンドルに互いに連続的に貼着するために作用的に構成されたドニー層貼着装置と、
(d)前記ドニー層貼着装置に対して作用的に配置され、前記複数のドニー層の各々を、前記複数の真性へき開面の対応するそれぞれ1つに沿って前記結晶ドナーから互いに連続的にへき開するように作用的に構成されたドニー層へき開装置とを備えるシステム。 - 各々のデバイス層の少なくとも一部を前記複数のドニー層の各々の上の製造するように作用的に構成された少なくとも1つの製造装置をさらに備える請求項40に記載のシステム。
- 前記少なくとも1つの結晶ドナーが薄板状シートの雲母状/ラメラ状の塊を含む請求項40に記載のシステム。
- 前記少なくとも1つの結晶ドナーが複数のフッ素金雲母シートを含む請求項42に記載のシステム。
- デバイス構造であって、
前記デバイス構造は第1のコンポーネント層を備え、前記第1のコンポーネント層は、
(a)第1のへき開面と、前記第1のへき開面から間隔を置いた第2の表のへき開面とを有する第1のへき開結晶ドニー層を有し、前記第1のへき開面および第2の表のへき開面の各々は、結晶ドナーの対応する真性へき開面に沿ってへき開することにより形成される、
(b)前記第1のコンポーネント層はさらに、前記第1のへき開面と向き合い、前記第1のへき開結晶ドニー層とモノリシックになるように形成される第1のデバイス層であって、電子式、光電子式、および光学式の少なくとも1つである第1のデバイス層、を含む、デバイス構造。 - 前記第1のへき開結晶ドニー層が雲母状/ラメラ状材料からなる薄板状シートを含む請求項44に記載のデバイス構造。
- 前記第1のデバイス層が少なくとも1つのトランジスタを含む請求項44に記載のデバイス構造。
- 前記少なくとも1つのトランジスタが薄膜トランジスタである請求項46に記載のデバイス構造。
- 前記少なくとも1つのトランジスタが厚膜トランジスタである請求項46に記載のデバイス構造。
- 前記第1のデバイス層が少なくとも1つのエレクトロルミネセンス・デバイスを含む請求項44に記載のデバイス構造。
- 前記第1のデバイス層が少なくとも1つのエネルギーセンサである請求項44に記載のデバイス構造。
- 前記第1のコンポーネント層に取り付けられた第2のコンポーネント層をさらに備え、前記第2のコンポーネント層が、
(a)第2のへき開面と、前記第2のへき開面から間隔を置いた第2の表のへき開面とを有する第2のへき開結晶ドニーと、
(b)前記第2のへき開面と向き合い、前記第2のへき開結晶ドニー層とモノリシックになるように形成される第2のデバイス層とを含む請求項44に記載のデバイス構造。
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Families Citing this family (218)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7687372B2 (en) * | 2005-04-08 | 2010-03-30 | Versatilis Llc | System and method for manufacturing thick and thin film devices using a donee layer cleaved from a crystalline donor |
US7700471B2 (en) * | 2005-12-13 | 2010-04-20 | Versatilis | Methods of making semiconductor-based electronic devices on a wire and articles that can be made thereby |
US7871912B2 (en) * | 2005-12-13 | 2011-01-18 | Versatilis Llc | Methods of making semiconductor-based electronic devices by forming freestanding semiconductor structures |
US7638416B2 (en) * | 2005-12-13 | 2009-12-29 | Versatilis Llc | Methods of making semiconductor-based electronic devices on a wire and articles that can be made using such devices |
US7508012B2 (en) * | 2006-01-18 | 2009-03-24 | Infineon Technologies Ag | Electronic component and method for its assembly |
JP4365832B2 (ja) * | 2006-03-07 | 2009-11-18 | 株式会社日立製作所 | 生化学分析用セル、生化学分析用キット及び生化学分析装置 |
WO2008076756A2 (en) * | 2006-12-13 | 2008-06-26 | Versatilis Llc | Method of making semiconductor-based electronic devices on a wire and by forming freestanding semiconductor structures, and devices that can be made thereby |
US7968382B2 (en) * | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
DE102007056115A1 (de) * | 2007-11-15 | 2009-05-20 | Freiberger Compound Materials Gmbh | Verfahren zum Trennen von Einkristallen |
JP2010027767A (ja) * | 2008-07-17 | 2010-02-04 | Seiko Epson Corp | 薄膜デバイス、薄膜デバイスの製造方法及び電子機器 |
CN101730249B (zh) | 2008-10-31 | 2012-11-21 | 华为技术有限公司 | 一种资源配置的方法、装置和系统 |
KR101026040B1 (ko) * | 2008-11-13 | 2011-03-30 | 삼성전기주식회사 | 박막소자 제조방법 |
US8754533B2 (en) | 2009-04-14 | 2014-06-17 | Monolithic 3D Inc. | Monolithic three-dimensional semiconductor device and structure |
US8669778B1 (en) | 2009-04-14 | 2014-03-11 | Monolithic 3D Inc. | Method for design and manufacturing of a 3D semiconductor device |
US8378715B2 (en) | 2009-04-14 | 2013-02-19 | Monolithic 3D Inc. | Method to construct systems |
US8258810B2 (en) | 2010-09-30 | 2012-09-04 | Monolithic 3D Inc. | 3D semiconductor device |
US8058137B1 (en) | 2009-04-14 | 2011-11-15 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8427200B2 (en) | 2009-04-14 | 2013-04-23 | Monolithic 3D Inc. | 3D semiconductor device |
US8362800B2 (en) | 2010-10-13 | 2013-01-29 | Monolithic 3D Inc. | 3D semiconductor device including field repairable logics |
US7986042B2 (en) | 2009-04-14 | 2011-07-26 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8384426B2 (en) | 2009-04-14 | 2013-02-26 | Monolithic 3D Inc. | Semiconductor device and structure |
US8405420B2 (en) | 2009-04-14 | 2013-03-26 | Monolithic 3D Inc. | System comprising a semiconductor device and structure |
US8395191B2 (en) | 2009-10-12 | 2013-03-12 | Monolithic 3D Inc. | Semiconductor device and structure |
US9577642B2 (en) | 2009-04-14 | 2017-02-21 | Monolithic 3D Inc. | Method to form a 3D semiconductor device |
US8373439B2 (en) | 2009-04-14 | 2013-02-12 | Monolithic 3D Inc. | 3D semiconductor device |
US9509313B2 (en) | 2009-04-14 | 2016-11-29 | Monolithic 3D Inc. | 3D semiconductor device |
US8362482B2 (en) | 2009-04-14 | 2013-01-29 | Monolithic 3D Inc. | Semiconductor device and structure |
US9711407B2 (en) | 2009-04-14 | 2017-07-18 | Monolithic 3D Inc. | Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer |
US8536023B2 (en) | 2010-11-22 | 2013-09-17 | Monolithic 3D Inc. | Method of manufacturing a semiconductor device and structure |
US8581349B1 (en) | 2011-05-02 | 2013-11-12 | Monolithic 3D Inc. | 3D memory semiconductor device and structure |
US8148728B2 (en) | 2009-10-12 | 2012-04-03 | Monolithic 3D, Inc. | Method for fabrication of a semiconductor device and structure |
US8450804B2 (en) | 2011-03-06 | 2013-05-28 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
US11374118B2 (en) | 2009-10-12 | 2022-06-28 | Monolithic 3D Inc. | Method to form a 3D integrated circuit |
US9099424B1 (en) | 2012-08-10 | 2015-08-04 | Monolithic 3D Inc. | Semiconductor system, device and structure with heat removal |
US10366970B2 (en) | 2009-10-12 | 2019-07-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10354995B2 (en) | 2009-10-12 | 2019-07-16 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11984445B2 (en) | 2009-10-12 | 2024-05-14 | Monolithic 3D Inc. | 3D semiconductor devices and structures with metal layers |
US10157909B2 (en) | 2009-10-12 | 2018-12-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10388863B2 (en) | 2009-10-12 | 2019-08-20 | Monolithic 3D Inc. | 3D memory device and structure |
US8742476B1 (en) | 2012-11-27 | 2014-06-03 | Monolithic 3D Inc. | Semiconductor device and structure |
US10910364B2 (en) | 2009-10-12 | 2021-02-02 | Monolitaic 3D Inc. | 3D semiconductor device |
US8476145B2 (en) | 2010-10-13 | 2013-07-02 | Monolithic 3D Inc. | Method of fabricating a semiconductor device and structure |
US11018133B2 (en) | 2009-10-12 | 2021-05-25 | Monolithic 3D Inc. | 3D integrated circuit |
US10043781B2 (en) | 2009-10-12 | 2018-08-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
WO2011072153A2 (en) | 2009-12-09 | 2011-06-16 | Solexel, Inc. | High-efficiency photovoltaic back-contact solar cell structures and manufacturing methods using three-dimensional semiconductor absorbers |
US8492886B2 (en) | 2010-02-16 | 2013-07-23 | Monolithic 3D Inc | 3D integrated circuit with logic |
US8373230B1 (en) | 2010-10-13 | 2013-02-12 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8298875B1 (en) | 2011-03-06 | 2012-10-30 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8541819B1 (en) | 2010-12-09 | 2013-09-24 | Monolithic 3D Inc. | Semiconductor device and structure |
US8461035B1 (en) | 2010-09-30 | 2013-06-11 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US8026521B1 (en) | 2010-10-11 | 2011-09-27 | Monolithic 3D Inc. | Semiconductor device and structure |
US9099526B2 (en) | 2010-02-16 | 2015-08-04 | Monolithic 3D Inc. | Integrated circuit device and structure |
US10115654B2 (en) * | 2010-06-18 | 2018-10-30 | Palo Alto Research Center Incorporated | Buried thermally conductive layers for heat extraction and shielding |
US8642416B2 (en) | 2010-07-30 | 2014-02-04 | Monolithic 3D Inc. | Method of forming three dimensional integrated circuit devices using layer transfer technique |
US9953925B2 (en) | 2011-06-28 | 2018-04-24 | Monolithic 3D Inc. | Semiconductor system and device |
US9219005B2 (en) | 2011-06-28 | 2015-12-22 | Monolithic 3D Inc. | Semiconductor system and device |
US10217667B2 (en) | 2011-06-28 | 2019-02-26 | Monolithic 3D Inc. | 3D semiconductor device, fabrication method and system |
US8901613B2 (en) | 2011-03-06 | 2014-12-02 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
WO2013055307A2 (en) * | 2010-08-05 | 2013-04-18 | Solexel, Inc. | Backplane reinforcement and interconnects for solar cells |
JP6027970B2 (ja) | 2010-09-10 | 2016-11-16 | バーレイス テクノロジーズ エルエルシー | 半導体ドナーから分離された層を使用するオプトエレクトロニクスデバイスの製造方法、およびそれによって製造されたデバイス |
US8273610B2 (en) | 2010-11-18 | 2012-09-25 | Monolithic 3D Inc. | Method of constructing a semiconductor device and structure |
US8163581B1 (en) | 2010-10-13 | 2012-04-24 | Monolith IC 3D | Semiconductor and optoelectronic devices |
US10497713B2 (en) | 2010-11-18 | 2019-12-03 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11482440B2 (en) | 2010-12-16 | 2022-10-25 | Monolithic 3D Inc. | 3D semiconductor device and structure with a built-in test circuit for repairing faulty circuits |
US11600667B1 (en) | 2010-10-11 | 2023-03-07 | Monolithic 3D Inc. | Method to produce 3D semiconductor devices and structures with memory |
US10896931B1 (en) | 2010-10-11 | 2021-01-19 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11469271B2 (en) | 2010-10-11 | 2022-10-11 | Monolithic 3D Inc. | Method to produce 3D semiconductor devices and structures with memory |
US11158674B2 (en) | 2010-10-11 | 2021-10-26 | Monolithic 3D Inc. | Method to produce a 3D semiconductor device and structure |
US11018191B1 (en) | 2010-10-11 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US8114757B1 (en) | 2010-10-11 | 2012-02-14 | Monolithic 3D Inc. | Semiconductor device and structure |
US11257867B1 (en) | 2010-10-11 | 2022-02-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with oxide bonds |
US10290682B2 (en) | 2010-10-11 | 2019-05-14 | Monolithic 3D Inc. | 3D IC semiconductor device and structure with stacked memory |
US11024673B1 (en) | 2010-10-11 | 2021-06-01 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11315980B1 (en) | 2010-10-11 | 2022-04-26 | Monolithic 3D Inc. | 3D semiconductor device and structure with transistors |
US11227897B2 (en) | 2010-10-11 | 2022-01-18 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US11929372B2 (en) | 2010-10-13 | 2024-03-12 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11605663B2 (en) | 2010-10-13 | 2023-03-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11984438B2 (en) | 2010-10-13 | 2024-05-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11855114B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US10833108B2 (en) | 2010-10-13 | 2020-11-10 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US10943934B2 (en) | 2010-10-13 | 2021-03-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US10978501B1 (en) | 2010-10-13 | 2021-04-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US11437368B2 (en) | 2010-10-13 | 2022-09-06 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11163112B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US8379458B1 (en) | 2010-10-13 | 2013-02-19 | Monolithic 3D Inc. | Semiconductor device and structure |
US8283215B2 (en) | 2010-10-13 | 2012-10-09 | Monolithic 3D Inc. | Semiconductor and optoelectronic devices |
US11327227B2 (en) | 2010-10-13 | 2022-05-10 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US11164898B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US10998374B1 (en) | 2010-10-13 | 2021-05-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11855100B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11063071B1 (en) | 2010-10-13 | 2021-07-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US10679977B2 (en) | 2010-10-13 | 2020-06-09 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11404466B2 (en) | 2010-10-13 | 2022-08-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11133344B2 (en) | 2010-10-13 | 2021-09-28 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11043523B1 (en) | 2010-10-13 | 2021-06-22 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11869915B2 (en) | 2010-10-13 | 2024-01-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11694922B2 (en) | 2010-10-13 | 2023-07-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US9197804B1 (en) | 2011-10-14 | 2015-11-24 | Monolithic 3D Inc. | Semiconductor and optoelectronic devices |
US11107721B2 (en) | 2010-11-18 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with NAND logic |
US11211279B2 (en) | 2010-11-18 | 2021-12-28 | Monolithic 3D Inc. | Method for processing a 3D integrated circuit and structure |
US11164770B1 (en) | 2010-11-18 | 2021-11-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US11443971B2 (en) | 2010-11-18 | 2022-09-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11094576B1 (en) | 2010-11-18 | 2021-08-17 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11569117B2 (en) | 2010-11-18 | 2023-01-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11355380B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | Methods for producing 3D semiconductor memory device and structure utilizing alignment marks |
US11735462B2 (en) | 2010-11-18 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11804396B2 (en) | 2010-11-18 | 2023-10-31 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11615977B2 (en) | 2010-11-18 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11862503B2 (en) | 2010-11-18 | 2024-01-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11784082B2 (en) | 2010-11-18 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11031275B2 (en) | 2010-11-18 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11923230B1 (en) | 2010-11-18 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11482439B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors |
US11901210B2 (en) | 2010-11-18 | 2024-02-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11495484B2 (en) | 2010-11-18 | 2022-11-08 | Monolithic 3D Inc. | 3D semiconductor devices and structures with at least two single-crystal layers |
US11610802B2 (en) | 2010-11-18 | 2023-03-21 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes |
US11482438B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11508605B2 (en) | 2010-11-18 | 2022-11-22 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11121021B2 (en) | 2010-11-18 | 2021-09-14 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11854857B1 (en) | 2010-11-18 | 2023-12-26 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11004719B1 (en) | 2010-11-18 | 2021-05-11 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11521888B2 (en) | 2010-11-18 | 2022-12-06 | Monolithic 3D Inc. | 3D semiconductor device and structure with high-k metal gate transistors |
US11355381B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11018042B1 (en) | 2010-11-18 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US8975670B2 (en) | 2011-03-06 | 2015-03-10 | Monolithic 3D Inc. | Semiconductor device and structure for heat removal |
US10388568B2 (en) | 2011-06-28 | 2019-08-20 | Monolithic 3D Inc. | 3D semiconductor device and system |
US20130001710A1 (en) * | 2011-06-29 | 2013-01-03 | Invensense, Inc. | Process for a sealed mems device with a portion exposed to the environment |
US8687399B2 (en) | 2011-10-02 | 2014-04-01 | Monolithic 3D Inc. | Semiconductor device and structure |
US9029173B2 (en) | 2011-10-18 | 2015-05-12 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US9000557B2 (en) | 2012-03-17 | 2015-04-07 | Zvi Or-Bach | Semiconductor device and structure |
US11088050B2 (en) | 2012-04-09 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers |
US11694944B1 (en) | 2012-04-09 | 2023-07-04 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US8557632B1 (en) | 2012-04-09 | 2013-10-15 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
US10600888B2 (en) | 2012-04-09 | 2020-03-24 | Monolithic 3D Inc. | 3D semiconductor device |
US11616004B1 (en) | 2012-04-09 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11881443B2 (en) | 2012-04-09 | 2024-01-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11594473B2 (en) | 2012-04-09 | 2023-02-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11164811B2 (en) | 2012-04-09 | 2021-11-02 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers and oxide-to-oxide bonding |
US11735501B1 (en) | 2012-04-09 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11476181B1 (en) | 2012-04-09 | 2022-10-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11410912B2 (en) | 2012-04-09 | 2022-08-09 | Monolithic 3D Inc. | 3D semiconductor device with vias and isolation layers |
GB2505895B (en) * | 2012-09-13 | 2018-03-21 | De La Rue Int Ltd | Method for forming photonic crystal materials |
US8574929B1 (en) | 2012-11-16 | 2013-11-05 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US8686428B1 (en) | 2012-11-16 | 2014-04-01 | Monolithic 3D Inc. | Semiconductor device and structure |
US11309292B2 (en) | 2012-12-22 | 2022-04-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11961827B1 (en) | 2012-12-22 | 2024-04-16 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11784169B2 (en) | 2012-12-22 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US8674470B1 (en) | 2012-12-22 | 2014-03-18 | Monolithic 3D Inc. | Semiconductor device and structure |
US11217565B2 (en) | 2012-12-22 | 2022-01-04 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11967583B2 (en) | 2012-12-22 | 2024-04-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11018116B2 (en) | 2012-12-22 | 2021-05-25 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11916045B2 (en) | 2012-12-22 | 2024-02-27 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11063024B1 (en) | 2012-12-22 | 2021-07-13 | Monlithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US10892169B2 (en) | 2012-12-29 | 2021-01-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11430667B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US10115663B2 (en) | 2012-12-29 | 2018-10-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11087995B1 (en) | 2012-12-29 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10651054B2 (en) | 2012-12-29 | 2020-05-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11177140B2 (en) | 2012-12-29 | 2021-11-16 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11004694B1 (en) | 2012-12-29 | 2021-05-11 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10600657B2 (en) | 2012-12-29 | 2020-03-24 | Monolithic 3D Inc | 3D semiconductor device and structure |
US9871034B1 (en) | 2012-12-29 | 2018-01-16 | Monolithic 3D Inc. | Semiconductor device and structure |
US10903089B1 (en) | 2012-12-29 | 2021-01-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US9385058B1 (en) | 2012-12-29 | 2016-07-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US11430668B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11869965B2 (en) | 2013-03-11 | 2024-01-09 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US11935949B1 (en) | 2013-03-11 | 2024-03-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US8902663B1 (en) | 2013-03-11 | 2014-12-02 | Monolithic 3D Inc. | Method of maintaining a memory state |
US10325651B2 (en) | 2013-03-11 | 2019-06-18 | Monolithic 3D Inc. | 3D semiconductor device with stacked memory |
US11398569B2 (en) | 2013-03-12 | 2022-07-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10840239B2 (en) | 2014-08-26 | 2020-11-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US8994404B1 (en) | 2013-03-12 | 2015-03-31 | Monolithic 3D Inc. | Semiconductor device and structure |
US11088130B2 (en) | 2014-01-28 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11923374B2 (en) | 2013-03-12 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US9117749B1 (en) | 2013-03-15 | 2015-08-25 | Monolithic 3D Inc. | Semiconductor device and structure |
US10224279B2 (en) | 2013-03-15 | 2019-03-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US9021414B1 (en) | 2013-04-15 | 2015-04-28 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11030371B2 (en) | 2013-04-15 | 2021-06-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11487928B2 (en) | 2013-04-15 | 2022-11-01 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11720736B2 (en) | 2013-04-15 | 2023-08-08 | Monolithic 3D Inc. | Automation methods for 3D integrated circuits and devices |
US11574109B1 (en) | 2013-04-15 | 2023-02-07 | Monolithic 3D Inc | Automation methods for 3D integrated circuits and devices |
US11341309B1 (en) | 2013-04-15 | 2022-05-24 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11270055B1 (en) | 2013-04-15 | 2022-03-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US10297586B2 (en) | 2015-03-09 | 2019-05-21 | Monolithic 3D Inc. | Methods for processing a 3D semiconductor device |
US11107808B1 (en) | 2014-01-28 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11031394B1 (en) | 2014-01-28 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11056468B1 (en) | 2015-04-19 | 2021-07-06 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10381328B2 (en) | 2015-04-19 | 2019-08-13 | Monolithic 3D Inc. | Semiconductor device and structure |
US10825779B2 (en) | 2015-04-19 | 2020-11-03 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11011507B1 (en) | 2015-04-19 | 2021-05-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11956952B2 (en) | 2015-08-23 | 2024-04-09 | Monolithic 3D Inc. | Semiconductor memory device and structure |
CN115942752A (zh) | 2015-09-21 | 2023-04-07 | 莫诺利特斯3D有限公司 | 3d半导体器件和结构 |
US11978731B2 (en) | 2015-09-21 | 2024-05-07 | Monolithic 3D Inc. | Method to produce a multi-level semiconductor memory device and structure |
US10522225B1 (en) | 2015-10-02 | 2019-12-31 | Monolithic 3D Inc. | Semiconductor device with non-volatile memory |
US11296115B1 (en) | 2015-10-24 | 2022-04-05 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10418369B2 (en) | 2015-10-24 | 2019-09-17 | Monolithic 3D Inc. | Multi-level semiconductor memory device and structure |
US12016181B2 (en) | 2015-10-24 | 2024-06-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US11991884B1 (en) | 2015-10-24 | 2024-05-21 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US11114464B2 (en) | 2015-10-24 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10847540B2 (en) | 2015-10-24 | 2020-11-24 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11937422B2 (en) | 2015-11-07 | 2024-03-19 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11114427B2 (en) | 2015-11-07 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor processor and memory device and structure |
US9923022B2 (en) | 2016-07-01 | 2018-03-20 | International Business Machines Corporation | Array of optoelectronic structures and fabrication thereof |
US11930648B1 (en) | 2016-10-10 | 2024-03-12 | Monolithic 3D Inc. | 3D memory devices and structures with metal layers |
US11329059B1 (en) | 2016-10-10 | 2022-05-10 | Monolithic 3D Inc. | 3D memory devices and structures with thinned single crystal substrates |
US11869591B2 (en) | 2016-10-10 | 2024-01-09 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
US11251149B2 (en) | 2016-10-10 | 2022-02-15 | Monolithic 3D Inc. | 3D memory device and structure |
US11812620B2 (en) | 2016-10-10 | 2023-11-07 | Monolithic 3D Inc. | 3D DRAM memory devices and structures with control circuits |
US11711928B2 (en) | 2016-10-10 | 2023-07-25 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
CN106772735B (zh) * | 2017-01-03 | 2019-04-05 | 京东方科技集团股份有限公司 | 光栅及其制造方法、显示装置及其控制方法 |
US10388518B2 (en) * | 2017-03-31 | 2019-08-20 | Globalwafers Co., Ltd. | Epitaxial substrate and method of manufacturing the same |
US10923244B2 (en) * | 2017-11-30 | 2021-02-16 | Elbit Systems Of America, Llc | Phosphor screen for MEMS image intensifiers |
US11296106B2 (en) | 2019-04-08 | 2022-04-05 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11158652B1 (en) | 2019-04-08 | 2021-10-26 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11763864B2 (en) | 2019-04-08 | 2023-09-19 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures with bit-line pillars |
US11018156B2 (en) | 2019-04-08 | 2021-05-25 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US10892016B1 (en) | 2019-04-08 | 2021-01-12 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
CN110320581A (zh) * | 2019-05-07 | 2019-10-11 | 京东方科技集团股份有限公司 | 一种光栅结构、显示装置及其显示方法 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5120682A (en) * | 1974-08-14 | 1976-02-19 | Hitachi Ltd | Insb hakumakusakuseihoho |
JPS58135628A (ja) * | 1982-02-08 | 1983-08-12 | Asahi Chem Ind Co Ltd | 化合物半導体薄膜構造体の製造方法 |
JPH0783107B2 (ja) * | 1984-04-19 | 1995-09-06 | 日本電気株式会社 | 電界効果トランジスタ |
WO1990007789A1 (en) * | 1986-04-01 | 1990-07-12 | Masahide Oshita | Thin film of intermetallic compound semiconductor and process for its production |
US5043703A (en) * | 1990-02-12 | 1991-08-27 | Detection Systems, Inc. | Supervision of autodyne microwave motion-detection system |
US5294808A (en) * | 1992-10-23 | 1994-03-15 | Cornell Research Foundation, Inc. | Pseudomorphic and dislocation free heteroepitaxial structures |
JPH06211596A (ja) | 1992-11-30 | 1994-08-02 | Fujitsu Ltd | 高温超伝導薄膜等の薄膜の堆積方法および堆積用基板の保持方法 |
JPH09234375A (ja) * | 1996-03-01 | 1997-09-09 | Mitsubishi Paper Mills Ltd | 光反応性有害物除去材 |
EP0851513B1 (en) * | 1996-12-27 | 2007-11-21 | Canon Kabushiki Kaisha | Method of producing semiconductor member and method of producing solar cell |
JPH10223495A (ja) * | 1997-02-04 | 1998-08-21 | Nippon Telegr & Teleph Corp <Ntt> | 柔軟な構造を有する半導体装置とその製造方法 |
US5981400A (en) * | 1997-09-18 | 1999-11-09 | Cornell Research Foundation, Inc. | Compliant universal substrate for epitaxial growth |
JPH11135882A (ja) * | 1997-10-28 | 1999-05-21 | Sharp Corp | 化合物半導体基板、及び化合物半導体基板の製造方法、並びに発光素子 |
FR2774214B1 (fr) * | 1998-01-28 | 2002-02-08 | Commissariat Energie Atomique | PROCEDE DE REALISATION D'UNE STRUCTURE DE TYPE SEMI-CONDUCTEUR SUR ISOLANT ET EN PARTICULIER SiCOI |
US6086673A (en) * | 1998-04-02 | 2000-07-11 | Massachusetts Institute Of Technology | Process for producing high-quality III-V nitride substrates |
US6372356B1 (en) * | 1998-06-04 | 2002-04-16 | Xerox Corporation | Compliant substrates for growing lattice mismatched films |
US6136141A (en) * | 1998-06-10 | 2000-10-24 | Sky Solar L.L.C. | Method and apparatus for the fabrication of lightweight semiconductor devices |
FR2781925B1 (fr) * | 1998-07-30 | 2001-11-23 | Commissariat Energie Atomique | Transfert selectif d'elements d'un support vers un autre support |
US6144050A (en) * | 1998-08-20 | 2000-11-07 | The United States Of America As Represented By The Secretary Of The Navy | Electronic devices with strontium barrier film and process for making same |
JP4476390B2 (ja) * | 1998-09-04 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP3056467B2 (ja) * | 1998-09-08 | 2000-06-26 | 有限会社デジタル・ウェーブ | 半導体装置製造用基板、その製造方法、及び、光電変換装置、その製造方法 |
US6255198B1 (en) * | 1998-11-24 | 2001-07-03 | North Carolina State University | Methods of fabricating gallium nitride microelectronic layers on silicon layers and gallium nitride microelectronic structures formed thereby |
US6406795B1 (en) * | 1998-11-25 | 2002-06-18 | Applied Optoelectronics, Inc. | Compliant universal substrates for optoelectronic and electronic devices |
US20040229443A1 (en) * | 1998-12-31 | 2004-11-18 | Bower Robert W. | Structures, materials and methods for fabrication of nanostructures by transposed split of ion cut materials |
US6242324B1 (en) * | 1999-08-10 | 2001-06-05 | The United States Of America As Represented By The Secretary Of The Navy | Method for fabricating singe crystal materials over CMOS devices |
US6199748B1 (en) * | 1999-08-20 | 2001-03-13 | Nova Crystals, Inc. | Semiconductor eutectic alloy metal (SEAM) technology for fabrication of compliant composite substrates and integration of materials |
US6340788B1 (en) * | 1999-12-02 | 2002-01-22 | Hughes Electronics Corporation | Multijunction photovoltaic cells and panels using a silicon or silicon-germanium active substrate cell for space and terrestrial applications |
US6746777B1 (en) * | 2000-05-31 | 2004-06-08 | Applied Optoelectronics, Inc. | Alternative substrates for epitaxial growth |
EP1309989B1 (en) * | 2000-08-16 | 2007-01-10 | Massachusetts Institute Of Technology | Process for producing semiconductor article using graded expitaxial growth |
US6472276B1 (en) * | 2001-07-20 | 2002-10-29 | Motorola, Inc. | Using silicate layers for composite semiconductor |
US20040192067A1 (en) * | 2003-02-28 | 2004-09-30 | Bruno Ghyselen | Method for forming a relaxed or pseudo-relaxed useful layer on a substrate |
US6855647B2 (en) * | 2003-04-02 | 2005-02-15 | Hewlett-Packard Development Company, L.P. | Custom electrodes for molecular memory and logic devices |
US7063994B2 (en) * | 2003-07-11 | 2006-06-20 | Organic Vision Inc. | Organic semiconductor devices and methods of fabrication including forming two parts with polymerisable groups and bonding the parts |
JP4651924B2 (ja) * | 2003-09-18 | 2011-03-16 | シャープ株式会社 | 薄膜半導体装置および薄膜半導体装置の製造方法 |
US6967149B2 (en) * | 2003-11-20 | 2005-11-22 | Hewlett-Packard Development Company, L.P. | Storage structure with cleaved layer |
JP4834992B2 (ja) * | 2003-12-26 | 2011-12-14 | ソニー株式会社 | 半導体装置の製造方法 |
FR2864970B1 (fr) * | 2004-01-09 | 2006-03-03 | Soitec Silicon On Insulator | Substrat a support a coefficient de dilatation thermique determine |
US7259106B2 (en) * | 2004-09-10 | 2007-08-21 | Versatilis Llc | Method of making a microelectronic and/or optoelectronic circuitry sheet |
US7687372B2 (en) * | 2005-04-08 | 2010-03-30 | Versatilis Llc | System and method for manufacturing thick and thin film devices using a donee layer cleaved from a crystalline donor |
JP2006344618A (ja) * | 2005-06-07 | 2006-12-21 | Fujifilm Holdings Corp | 機能性膜含有構造体、及び、機能性膜の製造方法 |
JP5028032B2 (ja) * | 2005-06-07 | 2012-09-19 | 富士フイルム株式会社 | 機能性膜パターン形成用構造体、及び、機能性膜の製造方法 |
US7364989B2 (en) * | 2005-07-01 | 2008-04-29 | Sharp Laboratories Of America, Inc. | Strain control of epitaxial oxide films using virtual substrates |
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JP2009533845A (ja) | 2009-09-17 |
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WO2007118081A2 (en) | 2007-10-18 |
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US7687372B2 (en) | 2010-03-30 |
US20100133546A1 (en) | 2010-06-03 |
US20060246267A1 (en) | 2006-11-02 |
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