JP5347835B2 - Iii族窒化物半導体結晶の製造方法 - Google Patents

Iii族窒化物半導体結晶の製造方法 Download PDF

Info

Publication number
JP5347835B2
JP5347835B2 JP2009194414A JP2009194414A JP5347835B2 JP 5347835 B2 JP5347835 B2 JP 5347835B2 JP 2009194414 A JP2009194414 A JP 2009194414A JP 2009194414 A JP2009194414 A JP 2009194414A JP 5347835 B2 JP5347835 B2 JP 5347835B2
Authority
JP
Japan
Prior art keywords
recess
sapphire substrate
nitride semiconductor
group iii
iii nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009194414A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011046544A (ja
JP2011046544A5 (cg-RX-API-DMAC10.html
Inventor
義樹 齋藤
浩司 奥野
泰久 牛田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2009194414A priority Critical patent/JP5347835B2/ja
Publication of JP2011046544A publication Critical patent/JP2011046544A/ja
Publication of JP2011046544A5 publication Critical patent/JP2011046544A5/ja
Application granted granted Critical
Publication of JP5347835B2 publication Critical patent/JP5347835B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
JP2009194414A 2009-08-25 2009-08-25 Iii族窒化物半導体結晶の製造方法 Expired - Fee Related JP5347835B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009194414A JP5347835B2 (ja) 2009-08-25 2009-08-25 Iii族窒化物半導体結晶の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009194414A JP5347835B2 (ja) 2009-08-25 2009-08-25 Iii族窒化物半導体結晶の製造方法

Publications (3)

Publication Number Publication Date
JP2011046544A JP2011046544A (ja) 2011-03-10
JP2011046544A5 JP2011046544A5 (cg-RX-API-DMAC10.html) 2011-11-10
JP5347835B2 true JP5347835B2 (ja) 2013-11-20

Family

ID=43833286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009194414A Expired - Fee Related JP5347835B2 (ja) 2009-08-25 2009-08-25 Iii族窒化物半導体結晶の製造方法

Country Status (1)

Country Link
JP (1) JP5347835B2 (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013173641A (ja) * 2012-02-24 2013-09-05 Tokuyama Corp 窒化ガリウム結晶積層基板及びその製造方法
JP6013743B2 (ja) * 2012-02-27 2016-10-25 株式会社トクヤマ 半導体装置の製造方法
WO2014084667A1 (ko) * 2012-11-30 2014-06-05 주식회사 소프트에피 3족 질화물 반도체 적층체
KR101635530B1 (ko) * 2014-06-25 2016-07-04 주식회사 루미스탈 다수의 공극을 갖는 질화물 반도체 결정 성장 방법 및 이를 이용한 질화물 반도체 기판 제조 방법
JP2016100593A (ja) * 2014-11-26 2016-05-30 株式会社Flosfia 結晶性積層構造体
JP7344426B2 (ja) * 2014-11-26 2023-09-14 株式会社Flosfia 結晶性積層構造体
DE102015109761B4 (de) 2015-06-18 2022-01-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Nitrid-Halbleiterbauelements und Nitrid-Halbleiterbauelement
JP7108783B2 (ja) * 2019-03-28 2022-07-28 日本碍子株式会社 半導体膜

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4016062B2 (ja) * 1998-07-31 2007-12-05 シャープ株式会社 窒化物半導体構造とその製造方法および発光素子
JP4513446B2 (ja) * 2004-07-23 2010-07-28 豊田合成株式会社 半導体結晶の結晶成長方法
JP2008110895A (ja) * 2006-10-31 2008-05-15 Mitsubishi Cable Ind Ltd 窒化物半導体結晶の製造方法
JP5353113B2 (ja) * 2008-01-29 2013-11-27 豊田合成株式会社 Iii族窒化物系化合物半導体の製造方法

Also Published As

Publication number Publication date
JP2011046544A (ja) 2011-03-10

Similar Documents

Publication Publication Date Title
US9263258B2 (en) Method for producing group III nitride-based compound semiconductor, wafer, and group III nitride-based compound semiconductor device
JP5573632B2 (ja) Iii族窒化物半導体発光素子
CN101800170B (zh) 制造第ⅲ族氮化物半导体的方法和模板衬底
CN101883881B (zh) Ⅲ族氮化物系化合物半导体的制造方法、包括ⅲ族氮化物系化合物半导体的晶片以及ⅲ族氮化物系化合物半导体器件
JP2011046544A (ja) Iii族窒化物半導体結晶の製造方法、およびiii族窒化物半導体基板
JP2011046544A5 (cg-RX-API-DMAC10.html)
JP5293591B2 (ja) Iii族窒化物半導体の製造方法、およびテンプレート基板
WO2012121154A1 (ja) 下地基板、窒化ガリウム結晶積層基板及びその製造方法
WO2010023846A1 (ja) 半導体基板及びその製造方法
JP6218728B2 (ja) 窒化物半導体素子構造体とその製造方法
US12170200B2 (en) Crystal growth method and a substrate for a semiconductor device
CN102856455B (zh) 氮化物半导体基板
JP5293592B2 (ja) Iii族窒化物半導体の製造方法およびテンプレート基板
HK1216207A1 (zh) 氮化物半导体层、氮化物半导体装置和用於制造氮化物半导体层的方法
JP5557180B2 (ja) 半導体発光素子の製造方法
JP4051892B2 (ja) Iii族窒化物系化合物半導体の製造方法及びiii族窒化物系化合物半導体素子
JP4985579B2 (ja) Iii族窒化物系化合物半導体及び窒化ガリウム自立基板の製造方法
JP5957771B2 (ja) 窒化物半導体積層構造、半導体発光素子および窒化物半導体積層構造を製造する方法
JP5834952B2 (ja) 窒化物半導体基板の製造方法
JP2007317752A (ja) テンプレート基板
JP2007314360A (ja) テンプレート基板
JP2014181170A (ja) 半導体バルク結晶および半導体バルク結晶の製造方法
JP5895908B2 (ja) Iii族窒化物系化合物半導体、iii族窒化物系化合物半導体の形成されたウエハ及びiii族窒化物系化合物半導体素子
JP7090201B2 (ja) 結晶成長方法および半導体素子用基板
JP2013249230A (ja) 周期表第13族金属窒化物半導体基板の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110928

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111124

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121018

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121030

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121226

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130507

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130621

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130723

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130805

R150 Certificate of patent or registration of utility model

Ref document number: 5347835

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees