JP5345062B2 - イオン注入装置における多方向機械的走査 - Google Patents
イオン注入装置における多方向機械的走査 Download PDFInfo
- Publication number
- JP5345062B2 JP5345062B2 JP2009533926A JP2009533926A JP5345062B2 JP 5345062 B2 JP5345062 B2 JP 5345062B2 JP 2009533926 A JP2009533926 A JP 2009533926A JP 2009533926 A JP2009533926 A JP 2009533926A JP 5345062 B2 JP5345062 B2 JP 5345062B2
- Authority
- JP
- Japan
- Prior art keywords
- axis
- substrate
- drive arm
- drive
- ion beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P30/00—Ion implantation into wafers, substrates or parts of devices
- H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20228—Mechanical X-Y scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20278—Motorised movement
- H01J2237/20285—Motorised movement computer-controlled
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/588,432 | 2006-10-27 | ||
| US11/588,432 US7785060B2 (en) | 2006-10-27 | 2006-10-27 | Multi-directional mechanical scanning in an ion implanter |
| PCT/GB2007/003633 WO2008050079A1 (en) | 2006-10-27 | 2007-09-25 | Multi-directional mechanical scanning in an ion implanter |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010507886A JP2010507886A (ja) | 2010-03-11 |
| JP2010507886A5 JP2010507886A5 (https=) | 2010-10-07 |
| JP5345062B2 true JP5345062B2 (ja) | 2013-11-20 |
Family
ID=39032338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009533926A Expired - Fee Related JP5345062B2 (ja) | 2006-10-27 | 2007-09-25 | イオン注入装置における多方向機械的走査 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7785060B2 (https=) |
| JP (1) | JP5345062B2 (https=) |
| KR (1) | KR101345683B1 (https=) |
| DE (1) | DE112007002570T5 (https=) |
| TW (1) | TWI392053B (https=) |
| WO (1) | WO2008050079A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI910185B (zh) * | 2020-06-17 | 2026-01-01 | 美商艾克塞利斯科技公司 | 用於植入離子至工件中之離子植入系統及用於最小化離子束在工件上的角度分布之方法 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7582883B2 (en) * | 2007-01-12 | 2009-09-01 | Applied Materials, Inc. | Method of scanning a substrate in an ion implanter |
| GB2445959A (en) * | 2007-01-27 | 2008-07-30 | Richard James Taylor | Celestial tracking device |
| US8227768B2 (en) * | 2008-06-25 | 2012-07-24 | Axcelis Technologies, Inc. | Low-inertia multi-axis multi-directional mechanically scanned ion implantation system |
| GB0815876D0 (en) * | 2008-09-01 | 2008-10-08 | Meadwestvaco Packaging Systems | Article handling device |
| US8237135B2 (en) * | 2009-01-22 | 2012-08-07 | Axcelis Technologies, Inc. | Enhanced low energy ion beam transport in ion implantation |
| US8168941B2 (en) * | 2009-01-22 | 2012-05-01 | Axcelis Technologies, Inc. | Ion beam angle calibration and emittance measurement system for ribbon beams |
| US8168962B2 (en) * | 2009-08-11 | 2012-05-01 | Advanced Ion Beam Technology, Inc. | Method and apparatus for uniformly implanting a wafer with an ion beam |
| US8294124B2 (en) * | 2010-01-15 | 2012-10-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Scanning method and system using 2-D ion implanter |
| US20120043712A1 (en) * | 2010-08-17 | 2012-02-23 | Varian Semiconductor Equipment Associates, Inc. | Mechanism and method for aligning a workpiece to a shadow mask |
| US8791430B2 (en) | 2011-03-04 | 2014-07-29 | Tel Epion Inc. | Scanner for GCIB system |
| US9029808B2 (en) | 2011-03-04 | 2015-05-12 | Tel Epion Inc. | Low contamination scanner for GCIB system |
| JP5665679B2 (ja) * | 2011-07-14 | 2015-02-04 | 住友重機械工業株式会社 | 不純物導入層形成装置及び静電チャック保護方法 |
| KR101576348B1 (ko) * | 2013-01-18 | 2015-12-21 | 어드밴스드 이온 빔 테크놀로지 인크. | 스캔 헤드 및 이를 사용하는 스캔 암 |
| US9415508B1 (en) * | 2015-05-15 | 2016-08-16 | Varian Semiconductor Equipment Associates, Inc. | Multi-link substrate scanning device |
| US12334348B2 (en) | 2021-07-21 | 2025-06-17 | Tel Manufacturing And Engineering Of America, Inc. | Substrate scanning apparatus with pendulum and rotatable substrate holder |
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| CN1291445C (zh) * | 2004-06-18 | 2006-12-20 | 清华大学 | 离子注入机中的靶盘角度控制与扫描运动机构 |
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| US7776037B2 (en) * | 2006-07-07 | 2010-08-17 | Covidien Ag | System and method for controlling electrode gap during tissue sealing |
| US20080015575A1 (en) * | 2006-07-14 | 2008-01-17 | Sherwood Services Ag | Vessel sealing instrument with pre-heated electrodes |
| US7744615B2 (en) * | 2006-07-18 | 2010-06-29 | Covidien Ag | Apparatus and method for transecting tissue on a bipolar vessel sealing instrument |
| US20080033428A1 (en) * | 2006-08-04 | 2008-02-07 | Sherwood Services Ag | System and method for disabling handswitching on an electrosurgical instrument |
| US8597297B2 (en) * | 2006-08-29 | 2013-12-03 | Covidien Ag | Vessel sealing instrument with multiple electrode configurations |
| US8070746B2 (en) * | 2006-10-03 | 2011-12-06 | Tyco Healthcare Group Lp | Radiofrequency fusion of cardiac tissue |
-
2006
- 2006-10-27 US US11/588,432 patent/US7785060B2/en active Active
-
2007
- 2007-09-25 DE DE112007002570T patent/DE112007002570T5/de not_active Withdrawn
- 2007-09-25 WO PCT/GB2007/003633 patent/WO2008050079A1/en not_active Ceased
- 2007-09-25 JP JP2009533926A patent/JP5345062B2/ja not_active Expired - Fee Related
- 2007-09-25 KR KR1020097010742A patent/KR101345683B1/ko not_active Expired - Fee Related
- 2007-10-16 TW TW096138734A patent/TWI392053B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI910185B (zh) * | 2020-06-17 | 2026-01-01 | 美商艾克塞利斯科技公司 | 用於植入離子至工件中之離子植入系統及用於最小化離子束在工件上的角度分布之方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080142726A1 (en) | 2008-06-19 |
| WO2008050079A1 (en) | 2008-05-02 |
| DE112007002570T5 (de) | 2009-10-22 |
| US7785060B2 (en) | 2010-08-31 |
| KR101345683B1 (ko) | 2013-12-30 |
| KR20090084893A (ko) | 2009-08-05 |
| JP2010507886A (ja) | 2010-03-11 |
| TW200826228A (en) | 2008-06-16 |
| TWI392053B (zh) | 2013-04-01 |
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