JP5343494B2 - 感光性シロキサンポリイミド樹脂組成物 - Google Patents

感光性シロキサンポリイミド樹脂組成物 Download PDF

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Publication number
JP5343494B2
JP5343494B2 JP2008252953A JP2008252953A JP5343494B2 JP 5343494 B2 JP5343494 B2 JP 5343494B2 JP 2008252953 A JP2008252953 A JP 2008252953A JP 2008252953 A JP2008252953 A JP 2008252953A JP 5343494 B2 JP5343494 B2 JP 5343494B2
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Japan
Prior art keywords
siloxane
polyimide resin
resin composition
siloxane polyimide
photosensitive
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JP2008252953A
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English (en)
Japanese (ja)
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JP2010083951A (ja
JP2010083951A5 (enExample
Inventor
友康 須永
麻美子 野村
紘希 金谷
淳一 石井
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Dexerials Corp
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Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2008252953A priority Critical patent/JP5343494B2/ja
Priority to HK11112010.8A priority patent/HK1157880B/xx
Priority to CN2009801377695A priority patent/CN102165370B/zh
Priority to PCT/JP2009/063885 priority patent/WO2010038543A1/ja
Priority to TW98127563A priority patent/TWI394777B/zh
Publication of JP2010083951A publication Critical patent/JP2010083951A/ja
Publication of JP2010083951A5 publication Critical patent/JP2010083951A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2008252953A 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物 Active JP5343494B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008252953A JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物
HK11112010.8A HK1157880B (en) 2008-09-30 2009-08-05 Photosensitive siloxane polyimide resin composition
CN2009801377695A CN102165370B (zh) 2008-09-30 2009-08-05 感光性硅氧烷聚酰亚胺树脂组合物
PCT/JP2009/063885 WO2010038543A1 (ja) 2008-09-30 2009-08-05 感光性シロキサンポリイミド樹脂組成物
TW98127563A TWI394777B (zh) 2008-09-30 2009-08-17 Photosensitive siloxane polyimide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008252953A JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物

Publications (3)

Publication Number Publication Date
JP2010083951A JP2010083951A (ja) 2010-04-15
JP2010083951A5 JP2010083951A5 (enExample) 2010-05-27
JP5343494B2 true JP5343494B2 (ja) 2013-11-13

Family

ID=42073320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008252953A Active JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物

Country Status (4)

Country Link
JP (1) JP5343494B2 (enExample)
CN (1) CN102165370B (enExample)
TW (1) TWI394777B (enExample)
WO (1) WO2010038543A1 (enExample)

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JP5417364B2 (ja) * 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
KR101590862B1 (ko) * 2011-09-21 2016-02-02 제이에스알 가부시끼가이샤 렌즈의 형성 방법 및 네거티브형 감광성 조성물
JP5494725B2 (ja) * 2011-09-21 2014-05-21 Ｊｓｒ株式会社 レンズの形成方法、レンズおよびネガ型感光性組成物
CN104066769B (zh) * 2011-11-25 2019-01-15 日产化学工业株式会社 显示器基板用树脂组合物
CN104066768B (zh) * 2011-11-25 2018-03-23 日产化学工业株式会社 显示器基板用树脂组合物
KR101597478B1 (ko) * 2012-01-20 2016-02-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법
JP6252174B2 (ja) * 2012-09-25 2017-12-27 東レ株式会社 ポジ型感光性樹脂組成物、それを用いた硬化膜を含む半導体装置の製造方法
TW201413387A (zh) * 2012-09-26 2014-04-01 Toray Industries 正型感光性樹脂組成物
KR101896268B1 (ko) * 2013-03-18 2018-09-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
CN105295792B (zh) * 2015-08-26 2017-12-29 北京化工大学 一种高性能聚酰亚胺交联改性环氧树脂及其制备方法
KR102652546B1 (ko) * 2018-03-22 2024-04-01 후지필름 가부시키가이샤 여과 장치, 정제 장치, 약액의 제조 방법
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
WO2019208590A1 (ja) * 2018-04-23 2019-10-31 信越化学工業株式会社 ケイ素含有化合物
JP7327983B2 (ja) * 2018-05-16 2023-08-16 旭化成株式会社 ポリイミド前駆体樹脂組成物
CN109100917A (zh) * 2018-07-19 2018-12-28 江苏博砚电子科技有限公司 一种彩色感光性树脂组合物及其制备方法
KR102279081B1 (ko) * 2018-08-20 2021-07-19 주식회사 엘지화학 폴리이미드 필름 및 이를 이용하는 플렉서블 디바이스
CN110441989B (zh) * 2019-08-07 2022-08-23 沧州信联化工有限公司 一种光刻胶组合物
CN111830786B (zh) * 2020-07-17 2023-05-23 波米科技有限公司 一种含硅烷偶联剂的感光性树脂组合物
CN118778355B (zh) * 2023-05-17 2025-05-30 深圳先进电子材料国际创新研究院 一种感光性树脂组合物及其应用
JP7397419B1 (ja) 2023-06-02 2023-12-13 Jsr株式会社 感放射線性組成物、硬化膜及びその製造方法、半導体素子並びに表示素子

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Also Published As

Publication number Publication date
CN102165370A (zh) 2011-08-24
JP2010083951A (ja) 2010-04-15
CN102165370B (zh) 2013-11-20
WO2010038543A1 (ja) 2010-04-08
TW201012850A (en) 2010-04-01
HK1157880A1 (en) 2012-07-06
TWI394777B (zh) 2013-05-01

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