JP2010083951A5 - - Google Patents
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- Publication number
- JP2010083951A5 JP2010083951A5 JP2008252953A JP2008252953A JP2010083951A5 JP 2010083951 A5 JP2010083951 A5 JP 2010083951A5 JP 2008252953 A JP2008252953 A JP 2008252953A JP 2008252953 A JP2008252953 A JP 2008252953A JP 2010083951 A5 JP2010083951 A5 JP 2010083951A5
- Authority
- JP
- Japan
- Prior art keywords
- phr
- polyimide resin
- agent
- resin composition
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008252953A JP5343494B2 (ja) | 2008-09-30 | 2008-09-30 | 感光性シロキサンポリイミド樹脂組成物 |
| HK11112010.8A HK1157880B (en) | 2008-09-30 | 2009-08-05 | Photosensitive siloxane polyimide resin composition |
| CN2009801377695A CN102165370B (zh) | 2008-09-30 | 2009-08-05 | 感光性硅氧烷聚酰亚胺树脂组合物 |
| PCT/JP2009/063885 WO2010038543A1 (ja) | 2008-09-30 | 2009-08-05 | 感光性シロキサンポリイミド樹脂組成物 |
| TW98127563A TWI394777B (zh) | 2008-09-30 | 2009-08-17 | Photosensitive siloxane polyimide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008252953A JP5343494B2 (ja) | 2008-09-30 | 2008-09-30 | 感光性シロキサンポリイミド樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010083951A JP2010083951A (ja) | 2010-04-15 |
| JP2010083951A5 true JP2010083951A5 (enExample) | 2010-05-27 |
| JP5343494B2 JP5343494B2 (ja) | 2013-11-13 |
Family
ID=42073320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008252953A Active JP5343494B2 (ja) | 2008-09-30 | 2008-09-30 | 感光性シロキサンポリイミド樹脂組成物 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5343494B2 (enExample) |
| CN (1) | CN102165370B (enExample) |
| TW (1) | TWI394777B (enExample) |
| WO (1) | WO2010038543A1 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5417364B2 (ja) * | 2011-03-08 | 2014-02-12 | 富士フイルム株式会社 | 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法 |
| KR101590862B1 (ko) * | 2011-09-21 | 2016-02-02 | 제이에스알 가부시끼가이샤 | 렌즈의 형성 방법 및 네거티브형 감광성 조성물 |
| JP5494725B2 (ja) * | 2011-09-21 | 2014-05-21 | Jsr株式会社 | レンズの形成方法、レンズおよびネガ型感光性組成物 |
| CN104066769B (zh) * | 2011-11-25 | 2019-01-15 | 日产化学工业株式会社 | 显示器基板用树脂组合物 |
| CN104066768B (zh) * | 2011-11-25 | 2018-03-23 | 日产化学工业株式会社 | 显示器基板用树脂组合物 |
| KR101597478B1 (ko) * | 2012-01-20 | 2016-02-24 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 수지 조성물, 적층체, 다층 프린트 배선판 및 다층 플렉시블 배선판 및 그 제조 방법 |
| JP6252174B2 (ja) * | 2012-09-25 | 2017-12-27 | 東レ株式会社 | ポジ型感光性樹脂組成物、それを用いた硬化膜を含む半導体装置の製造方法 |
| TW201413387A (zh) * | 2012-09-26 | 2014-04-01 | Toray Industries | 正型感光性樹脂組成物 |
| KR101896268B1 (ko) * | 2013-03-18 | 2018-09-07 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법 |
| CN105295792B (zh) * | 2015-08-26 | 2017-12-29 | 北京化工大学 | 一种高性能聚酰亚胺交联改性环氧树脂及其制备方法 |
| KR102652546B1 (ko) * | 2018-03-22 | 2024-04-01 | 후지필름 가부시키가이샤 | 여과 장치, 정제 장치, 약액의 제조 방법 |
| JP7111031B2 (ja) * | 2018-03-23 | 2022-08-02 | 信越化学工業株式会社 | 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法 |
| WO2019208590A1 (ja) * | 2018-04-23 | 2019-10-31 | 信越化学工業株式会社 | ケイ素含有化合物 |
| JP7327983B2 (ja) * | 2018-05-16 | 2023-08-16 | 旭化成株式会社 | ポリイミド前駆体樹脂組成物 |
| CN109100917A (zh) * | 2018-07-19 | 2018-12-28 | 江苏博砚电子科技有限公司 | 一种彩色感光性树脂组合物及其制备方法 |
| KR102279081B1 (ko) * | 2018-08-20 | 2021-07-19 | 주식회사 엘지화학 | 폴리이미드 필름 및 이를 이용하는 플렉서블 디바이스 |
| CN110441989B (zh) * | 2019-08-07 | 2022-08-23 | 沧州信联化工有限公司 | 一种光刻胶组合物 |
| CN111830786B (zh) * | 2020-07-17 | 2023-05-23 | 波米科技有限公司 | 一种含硅烷偶联剂的感光性树脂组合物 |
| CN118778355B (zh) * | 2023-05-17 | 2025-05-30 | 深圳先进电子材料国际创新研究院 | 一种感光性树脂组合物及其应用 |
| JP7397419B1 (ja) | 2023-06-02 | 2023-12-13 | Jsr株式会社 | 感放射線性組成物、硬化膜及びその製造方法、半導体素子並びに表示素子 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3221756B2 (ja) * | 1992-12-28 | 2001-10-22 | 新日鐵化学株式会社 | プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法 |
| CN101128090B (zh) * | 1998-07-08 | 2010-12-15 | 伊比登株式会社 | 印刷电路板及其制造方法 |
| JP4374840B2 (ja) * | 2002-08-30 | 2009-12-02 | 東レ株式会社 | ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置 |
| TWI262041B (en) * | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| JP2005173027A (ja) * | 2003-12-09 | 2005-06-30 | Kyocera Chemical Corp | ポジ型感光性樹脂組成物及びその硬化物 |
| WO2006103962A1 (ja) * | 2005-03-25 | 2006-10-05 | Sumitomo Bakelite Co., Ltd. | 半導体装置、並びにバッファーコート用樹脂組成物、ダイボンド用樹脂組成物、及び封止用樹脂組成物 |
| JP2008038031A (ja) * | 2006-08-07 | 2008-02-21 | Sony Chemical & Information Device Corp | ポリイミド組成物、フレキシブル配線板及びフレキシブル配線板の製造方法 |
| KR20090075797A (ko) * | 2007-02-09 | 2009-07-09 | 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 | 감광성 폴리이미드 수지 조성물 |
| JP5242958B2 (ja) * | 2007-04-13 | 2013-07-24 | デクセリアルズ株式会社 | ポリイミド組成物及びフレキシブル配線板 |
| WO2009025319A1 (ja) * | 2007-08-22 | 2009-02-26 | Sony Chemical & Information Device Corporation | ポリイミド組成物、フレキシブル配線板、及び、フレキシブル配線板の製造方法 |
| CN101784583B (zh) * | 2007-08-22 | 2013-05-08 | 索尼化学&信息部件株式会社 | 新型聚酰亚胺树脂和感光性聚酰亚胺树脂组合物 |
-
2008
- 2008-09-30 JP JP2008252953A patent/JP5343494B2/ja active Active
-
2009
- 2009-08-05 CN CN2009801377695A patent/CN102165370B/zh active Active
- 2009-08-05 WO PCT/JP2009/063885 patent/WO2010038543A1/ja not_active Ceased
- 2009-08-17 TW TW98127563A patent/TWI394777B/zh active
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